CN212181412U - Convection type computer host heat dissipation device - Google Patents
Convection type computer host heat dissipation device Download PDFInfo
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- CN212181412U CN212181412U CN202021084936.4U CN202021084936U CN212181412U CN 212181412 U CN212181412 U CN 212181412U CN 202021084936 U CN202021084936 U CN 202021084936U CN 212181412 U CN212181412 U CN 212181412U
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Abstract
The utility model relates to the technical field of computer hosts, in particular to a convection type computer host heat dissipation device, which comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a limiting block which is clamped with a casing, the inner side of the limiting block is provided with an air blowing mechanism, the top of the inner side of the casing is provided with a heat dissipation mechanism, and the right side of the casing is bolted with a water cooling mechanism, the utility model can cool hot air at the inner side of the casing and then discharge the hot air by arranging the heat dissipation mechanism, thereby accelerating the air flow at the inner side of the casing, further accelerating the air flow in the casing by arranging the air blowing mechanism, improving the heat dissipation efficiency, effectively avoiding the problem of uneven heat dissipation by enabling a heat dissipation fan and a fan to run together, combining the air cooling heat dissipation with the water cooling by arranging the water cooling mechanism, and recycling the, but also saves water source.
Description
Technical Field
The utility model relates to a main frame technical field specifically is a to STREAMING main frame heat abstractor.
Background
The computer is commonly called computer, it is a kind of electronic computer used for high-speed calculation, it can carry on numerical value calculation, can carry on logic calculation, it also has memory function, it can be operated according to the procedure, the modern intelligent electronic equipment of automatic, high-speed processing mass data, it is made up of hardware system and software system, the computer without any software is called bare computer, can be divided into super computer, industrial control computer, network computer, personal computer, embedded computer five kinds, the more advanced computer is biological computer, photon computer, quantum computer, etc., with the development of modern science and technology and the improvement of people's living standard, the computer has been widely used.
The computer case can have the situation that the heat is great when the computer is used for a long time, faults such as blue screen, slow running speed and the like can be caused due to overhigh temperature in the computer host, electronic elements can be damaged seriously, and irreparable damage can be caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a to STREAMING main frame heat abstractor to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a to STREAMING main frame heat abstractor, includes the bottom plate, bottom plate top fixed connection is provided with the stopper with the casing joint, the stopper inboard is provided with blast mechanism, the inboard top of casing is provided with heat dissipation mechanism, casing right side bolted connection is provided with water cooling mechanism.
As a further aspect of the present invention: the heat dissipation mechanism comprises a fixing plate, the fixing plate is fixedly connected with the inner side of the casing, a heat dissipation fan is fixedly connected to the fixing plate, a partition plate fixedly connected with the casing is arranged on the upper side of the heat dissipation fan, air guide pipes are fixedly connected to the top of the left end and the top of the left end of the partition plate and are connected with the input end of a condenser arranged at the top of the partition plate through bolts, and a plurality of heat dissipation holes are formed in the top end of the casing.
As a further aspect of the present invention: the blowing mechanism comprises a fan fixedly connected with the inner side of the limiting block, a filter frame is arranged on the lower side of the fan, the left side and the right side of the filter frame are connected with limiting plates fixedly connected with the limiting block in a clamping mode, a plurality of air outlets fixedly connected with the limiting block are arranged on the upper side of the fan, and a plurality of ventilation openings are formed in the bottom plate.
As a further aspect of the present invention: the limiting block is characterized in that a plurality of clamping blocks are arranged on the left side and the right side of the limiting block in a sliding connection mode, springs are fixedly connected between the clamping blocks and the limiting block, and clamping grooves corresponding to the clamping blocks are formed in the shell wall on the inner side of the shell.
As a further aspect of the present invention: the water-cooling mechanism includes the shell, shell bolted connection is provided with the casing right side, the inboard fixed connection of shell is provided with the water tank, water tank right side fixed connection is provided with inlet tube and outlet pipe, water tank bottom bolted connection is provided with the water pump, the water pump output end passes through the connecting pipe and is connected at the inboard heat absorption union coupling of shell, the heat absorption union coupling output end passes through the connecting pipe and is connected at the cooling tube of water tank upside with the setting, the cooling tube rear side be provided with shell fixed connection's semiconductor refrigeration piece, the cooling tube output is connected with the water tank.
As a further aspect of the present invention: the inner side of the shell wall of the shell is provided with a cavity, and the inner side of the cavity is fixedly connected with a heat absorption pipe.
As a further aspect of the present invention: and a heat absorbing plate is fixedly connected to one side of the shell close to the limiting block.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the heat dissipation mechanism is arranged to cool hot air at the inner side of the shell and then discharge the hot air, so that air flow at the inner side of the shell is accelerated, and meanwhile, the condenser is utilized to prevent the temperature of the air at the outer side of the shell from rising, so that the air entering the inner side of the shell keeps low temperature, and the heat dissipation effect is enhanced;
2. the blowing mechanism is arranged, so that the air flow in the shell can be further accelerated, the heat dissipation efficiency is improved, the problem of uneven heat dissipation is effectively avoided by enabling the heat dissipation fan and the fan to operate together, and the case can be quickly disassembled and assembled by arranging the clamping block and the clamping groove, so that the maintenance of people is facilitated;
3. through setting up water-cooling mechanism, combine together air-cooled heat dissipation and water-cooling heat dissipation, thereby the cold water in the water tank flows along the heat absorption pipe under the effect of water pump and takes away the heat of computer to get into the water tank inside through cooling tube and semiconductor refrigeration piece after cooling down once more, recycle has both improved availability factor, practices thrift the water source again.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device for a convection type computer host.
Fig. 2 is a front view of a heat sink of a convective computer host.
Fig. 3 is an enlarged schematic view of a portion a in fig. 2.
In the figure: 1-machine shell, 2-radiating holes, 3-connecting pipes, 4-shell, 5-water inlet pipes, 6-water outlet pipes, 7-bottom plate, 8-limiting blocks, 9-air outlets, 10-clamping blocks, 11-supporting legs, 12-radiating pipes, 13-semiconductor refrigerating sheets, 14-water tank, 15-water pump, 16-heat absorbing pipes, 17-cavity, 18-fixing plate, 19-radiating fan, 20-partition plate, 21-condenser, 22-fan, 23-heat absorbing plate, 24-clamping groove, 25-spring, 26-limiting plate and 27-filter frame.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
Example 1
Referring to fig. 1-3, in an embodiment of the present invention, a heat dissipation device for a convection type computer host includes a bottom plate 7, a stopper 8 connected to a housing 1 in a clamped manner is provided at a top of the bottom plate 7, an air blowing mechanism is provided at an inner side of the stopper 8, a heat dissipation mechanism is provided at an inner top of the housing 1, and a water cooling mechanism is provided at a bolt on a right side of the housing 1.
Example 2
In this embodiment, heat dissipation mechanism includes fixed plate 18, fixed plate 18 fixed connection sets up at 1 inboard of casing, fixed connection is provided with radiator fan 19 on the fixed plate 18, radiator fan 19 upside is provided with baffle 20 with 1 fixed connection of casing, both ends top fixed connection is provided with the air duct about baffle 20, the air duct sets up the condenser 21 input at baffle 20 top with bolted connection and is connected, 1 top of casing is provided with a plurality of louvres 2, can discharge behind the inboard steam cooling of casing 1 through setting up heat dissipation mechanism to accelerate the inboard air flow of casing 1, utilize condenser 21 to avoid the air temperature in the casing 1 outside to rise simultaneously, make the inboard air that gets into casing 1 keep low temperature, do benefit to and strengthen the radiating effect.
In this embodiment, the mechanism of blowing includes that fixed connection sets up at the inboard fan 22 of stopper 8, fan 22 downside is provided with filter frame 27, the filter frame 27 left and right sides all sets up the limiting plate 26 joint on stopper 8 with fixed connection, fan 22 upside is provided with a plurality of gas outlets 9 with stopper 8 fixed connection, be provided with a plurality of vents on the bottom plate 7, through setting up the mechanism of blowing, can further accelerate the inside air flow of casing 1, improve the radiating efficiency, through making radiator fan 19 and fan 22 operate jointly, effectively avoid the inhomogeneous problem of heat dissipation.
In this embodiment, the equal sliding connection in stopper 8 left and right sides is provided with a plurality of fixture blocks 10, fixed connection is provided with spring 25 between fixture block 10 and the stopper 8, be provided with the draw-in groove 24 corresponding with fixture block 10 on the 1 inboard conch wall of casing, through setting up fixture block 10 and draw-in groove 24, can carry out quick assembly disassembly to quick-witted case, makes things convenient for people to maintain.
In this embodiment, the water cooling mechanism includes a housing 4, the housing 4 is bolted to the right of the casing 1, the water tank 14 is fixedly connected to the inner side of the housing 4, the water inlet pipe 5 and the water outlet pipe 6 are fixedly connected to the right of the water tank 14, the water pump 15 is bolted to the bottom of the water tank 14, the output end of the water pump 15 is connected to the heat absorbing pipe 16 arranged at the inner side of the casing 1 through the connecting pipe 3, the output end of the heat absorbing pipe 16 is connected to the heat dissipating pipe 12 arranged at the upper side of the water tank 14 through the connecting pipe 3, the semiconductor cooling fin 13 fixedly connected to the housing 4 is arranged at the rear side of the heat dissipating pipe 12, the output end of the heat dissipating pipe 12 is connected to the water tank 14, the air cooling heat dissipating and the water cooling heat dissipating are combined through the water cooling mechanism, and, and the water enters the water tank 14 after being cooled again through the radiating pipe 12 and the semiconductor refrigerating sheet 13, and is recycled, so that the use efficiency is improved, and the water source is saved.
In this embodiment, a cavity 17 is disposed inside the wall of the housing 1, and a heat absorbing pipe 16 is fixedly connected inside the cavity 17.
In this embodiment, a heat absorbing plate 23 is fixedly connected to one side of the casing 1 close to the limiting block 8.
In this embodiment, the bottom of the bottom plate 7 is fixedly connected with a plurality of supporting legs 11.
The heat dissipating device for the convection type computer mainframe can cool hot air at the inner side of the casing 1 and then discharge the hot air, thereby accelerating air flow at the inner side of the casing 1, meanwhile utilizing the condenser 21 to avoid the temperature rise of air at the outer side of the casing 1, keeping the air entering the inner side of the casing 1 at a low temperature, being beneficial to enhancing the heat dissipating effect, further accelerating air flow in the casing 1 by arranging the blowing mechanism, improving the heat dissipating efficiency, effectively avoiding the problem of uneven heat dissipation by enabling the heat dissipating fan 19 and the fan 22 to operate together, and being capable of rapidly assembling and disassembling the casing by arranging the fixture block 10 and the clamp groove 24, facilitating maintenance of people, combining air cooling heat dissipation and water cooling heat dissipation by arranging the water cooling mechanism, cold water in the water tank 14 flows along the heat absorbing pipe 16 under the action of the water pump 15 to take away the heat of the computer, and enters the water tank 14 after being cooled again by the heat dissipating pipe 12, the recycling is realized, the use efficiency is improved, and the water source is saved.
The utility model discloses a theory of operation is: when the device is running, the heat dissipation fan 19 can send the hot air in the machine case 1 into the condenser 21 to be cooled and then discharge the hot air from the heat dissipation hole 2, thereby accelerating the flow of air inside the cabinet 1, the hot air can be cooled by the condenser 21 and discharged out of the cabinet 1, so that the air outside the cabinet 1 is kept at a low temperature, the fan 22 can further accelerate the air flow inside the cabinet 1, the heat dissipation efficiency is improved, by making the heat radiation fan 19 and the fan 22 work together, the problem of uneven heat radiation is effectively avoided, the cold water in the water tank 14 flows along the heat absorption pipe 16 under the action of the water pump 15 so as to take away the heat of the computer, and is cooled again through the radiating pipe 12 and the semiconductor refrigerating sheet 13 and then enters the water tank 14 for recycling, thereby not only improving the use efficiency, but also saving water source, the heat dissipation capacity of the device can be effectively enhanced by combining air cooling heat dissipation and water cooling heat dissipation.
The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (5)
1. A convection type computer host heat dissipation device comprises a bottom plate (7) and is characterized in that a limiting block (8) connected with a shell (1) in a clamping mode is fixedly connected to the top of the bottom plate (7), an air blowing mechanism is arranged on the inner side of the limiting block (8), a heat dissipation mechanism is arranged on the top of the inner side of the shell (1), a water cooling mechanism is arranged on the right side of the shell (1) in a bolt connection mode, the heat dissipation mechanism comprises a fixing plate (18), the fixing plate (18) is fixedly connected to the inner side of the shell (1), a heat dissipation fan (19) is fixedly connected to the fixing plate (18), a partition plate (20) fixedly connected with the shell (1) is arranged on the upper side of the heat dissipation fan (19), air guide pipes are fixedly connected to the tops of the left end and the right end of the partition plate (20), and are connected with the, the top end of the machine shell (1) is provided with a plurality of heat dissipation holes (2), the water cooling mechanism comprises a shell (4), the shell (4) is arranged at the right side of the machine shell (1) in a bolted connection way, a water tank (14) is fixedly connected at the inner side of the shell (4), the right side of the water tank (14) is fixedly connected with a water inlet pipe (5) and a water outlet pipe (6), a water pump (15) is arranged at the bottom of the water tank (14) in a bolted connection mode, the output end of the water pump (15) is connected with a heat absorption pipe (16) arranged on the inner side of the machine shell (1) through a connecting pipe (3), the output end of the heat absorption pipe (16) is connected with a radiating pipe (12) arranged on the upper side of the water tank (14) through a connecting pipe (3), the cooling tube (12) rear side is provided with semiconductor refrigeration piece (13) with shell (4) fixed connection, cooling tube (12) output is connected with water tank (14).
2. A convection type computer host heat sink as claimed in claim 1, wherein the blowing mechanism comprises a fan (22) fixedly connected and disposed at the inner side of the limit block (8), a filter frame (27) is disposed at the lower side of the fan (22), the left and right sides of the filter frame (27) are connected with a limit plate (26) fixedly connected and disposed on the limit block (8), the upper side of the fan (22) is provided with a plurality of air outlets (9) fixedly connected with the limit block (8), and the bottom plate (7) is provided with a plurality of ventilation openings.
3. A convection type computer host heat sink according to claim 2, wherein the left and right sides of the limit block (8) are slidably connected with a plurality of blocks (10), a spring (25) is fixedly connected between the blocks (10) and the limit block (8), and a slot (24) corresponding to the block (10) is arranged on the inner wall of the casing (1).
4. A convection type computer host heat sink as claimed in claim 1, wherein a cavity (17) is provided inside the casing wall of the casing (1), and a heat absorption pipe (16) is fixedly connected inside the cavity (17).
5. A convection type computer host heat sink as claimed in claim 4, wherein the heat absorbing plate (23) is fixedly connected to one side of the casing (1) close to the limiting block (8).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020201887189 | 2020-02-20 | ||
| CN202020188718 | 2020-02-20 |
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| Publication Number | Publication Date |
|---|---|
| CN212181412U true CN212181412U (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021084936.4U Active CN212181412U (en) | 2020-02-20 | 2020-06-12 | Convection type computer host heat dissipation device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163638A (en) * | 2021-01-29 | 2021-07-23 | 深圳市金隆辉科技有限公司 | Novel low-power consumption audio decoder |
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2020
- 2020-06-12 CN CN202021084936.4U patent/CN212181412U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163638A (en) * | 2021-01-29 | 2021-07-23 | 深圳市金隆辉科技有限公司 | Novel low-power consumption audio decoder |
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Effective date of registration: 20210520 Address after: 518000 Room 201, building A, No. 1, Qian Wan Road, Qianhai Shenzhen Hong Kong cooperation zone, Shenzhen, Guangdong (Shenzhen Qianhai business secretary Co., Ltd.) Patentee after: Shenzhen chaote Technology Co.,Ltd. Address before: 437100 Xianning Avenue, Xianning, Hubei 118 Patentee before: XIANNING VOCATIONAL TECHNICAL College |