CN212171076U

CN212171076U - Electronic device

Info

Publication number: CN212171076U
Application number: CN201922422433.7U
Authority: CN
Inventors: 陈树容; 武振生; 夏海兵; 郝宁
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-12-18
Anticipated expiration: 2029-12-27

Abstract

The present disclosure provides an electronic device, including a housing; a display panel disposed within the housing; a glass cover plate arranged in the shell and covering the display panel; and the shell comprises a metal piece and a plastic piece, and the plastic piece is fixed on at least part of the inner surface of the metal piece through a nano injection molding and stamping process.

Description

Electronic device

Technical Field

The present disclosure relates to the field of electronic technologies, and more particularly, to an electronic device.

Background

With the continuous development of new product development technologies, various new technologies are continuously applied to electronic products to improve the user experience.

In the course of implementing the disclosed concept, the inventors found that there are at least the following problems in the prior art: the thickness of the casing of the electronic product cannot meet the requirements of users on light and thin electronic products.

SUMMERY OF THE UTILITY MODEL

One aspect of the present disclosure provides an electronic device having an elegant narrow bezel, including: casing, display panel and glass apron. Wherein, the display panel is arranged in the shell. A glass cover plate is disposed within the housing and overlies the display panel. The shell comprises a metal piece and a plastic piece, and the plastic piece is fixed on at least part of the inner surface of the metal piece through a nano injection molding and stamping process.

Optionally, the metal piece includes a flat plate portion and a side plate portion, and the plastic piece is fixed on at least a part of an inner surface of the side plate portion.

Optionally, the thickness of the flat plate portion is greater than the thickness of the side plate portion.

Optionally, the sum of the thicknesses of the plastic part and the side plate part is less than the finger thickness.

Optionally, the thickness of the plastic part is smaller than that of the side plate part.

Optionally, the display panel is fixed to the inner surface of the flat plate portion by a panel fixing structure.

Optionally, the plastic member covers an inner surface of the side plate portion and a tip end portion of the side plate portion.

Optionally, an upper surface of the glass cover plate is lower than a surface of the plastic member covered on the tip end portion of the side plate portion.

Optionally, an upper surface of the glass cover plate is higher than a surface of a tip end portion of the side plate portion.

Optionally, the electronic device may further include a lower case. Wherein the first side of the housing and the second side of the lower housing are rotatably connected.

Optionally, the metal piece includes a bonding reinforcement layer disposed on a surface of the side plate portion, the bonding reinforcement layer including a non-planar structure. The plastic part comprises a bonding layer and a surface layer, wherein the bonding layer covers the surface of the bonding enhancement layer, and the surface flatness of the bonding layer is greater than that of the bonding enhancement layer. The surface layer is arranged on the surface of the bonding layer, wherein the surface flatness of the surface layer is greater than that of the bonding layer.

Optionally, the non-planar structure comprises a porous structure, and at least part of the bonding layer fills in the porous structure.

Optionally, the flat plate portion comprises a metal plate material prepared by press forming.

Optionally, the material of the non-planar structure is the same as or different from the material of the bonding layer.

Optionally, the material of the surface layer is the same as or different from the material of the bonding layer.

Optionally, the contact surface of the skin layer and the bonding layer comprises a reaction product of the material of the bonding layer and the material of the skin layer.

Optionally, the electronic device includes one or more processors and a computer-readable storage medium.

Drawings

For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

fig. 1 schematically shows an application scenario of an electronic device according to an embodiment of the present disclosure;

fig. 2 schematically shows a schematic structural diagram of a prior art electronic device;

fig. 3 schematically shows a structural schematic diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 4 schematically illustrates a structural schematic of a housing according to an embodiment of the disclosure;

fig. 5-10 schematically illustrate a process schematic of a housing according to an embodiment of the present disclosure;

FIG. 11 schematically illustrates a cross-sectional view of a prior art housing;

FIG. 12 schematically illustrates a cross-sectional view of a housing according to an embodiment of the disclosure;

FIG. 13 schematically illustrates a housing bond strength test point schematic in accordance with an embodiment of the disclosure;

FIG. 14 schematically illustrates a housing deformation test point schematic in accordance with an embodiment of the disclosure; and

FIG. 15 schematically shows a block diagram of an electronic device according to an embodiment of the disclosure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.

Where a convention analogous to "at least one of A, B and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B and C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a convention analogous to "A, B or at least one of C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B or C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).

Embodiments of the present disclosure provide an electronic device, which aims to implement a more compact narrow bezel at a lower cost and meet the requirement of the electronic device on the mechanical strength of a housing.

Fig. 1 schematically shows an application scenario of an electronic device according to an embodiment of the present disclosure. It should be noted that fig. 1 is only an example of a scenario in which the embodiments of the present disclosure may be applied to help those skilled in the art understand the technical content of the present disclosure, but does not mean that the embodiments of the present disclosure may not be applied to other devices, systems, environments or scenarios.

With the increasingly important role played by mobile terminal devices such as notebooks, tablet computers, smart phones and the like in daily work and life of users, users have raised higher demands on the aspects of portability, beauty and the like of the mobile terminal devices. Embodiments of the present disclosure provide an electronic device that can realize a very narrow bezel and a higher aesthetic case at low cost.

Fig. 2 schematically shows a structural diagram of an electronic device of the prior art.

As shown in fig. 2, the prior art can combine a metal part and a plastic part by using a bonding (bonding) method to satisfy the following requirements: higher mechanical strength, providing a certain buffer for components within the housing, thinner thickness, less deformation, etc. For example, the metal member may comprise an aluminum plate, and the Plastic member may be formed by Injection molding (Plastic Injection).

However, as shown in fig. 2, the electronic device includes a metal member d, a plastic member a, a display panel c, and a glass cover plate b. The thickness of the plastic part a reaches 2.3 mm, and the thickness of the metal part d adjacent to the plastic part a is about 0.8 mm. The distance between the metal part d and the plastic part a is about 0.2 mm. The overall thickness of the metal part d and the plastic part a exceeds 3.3 mm. The case with a thickness of more than 3.3 mm can be applied to a large-sized notebook computer, but in the case of light and thin notebook computers, tablet computers and other electronic devices, the case with a thickness of about 3.3 mm makes the electronic devices too thick to meet the user's requirements.

Fig. 3 schematically shows a structural schematic diagram of an electronic device according to an embodiment of the present disclosure.

As shown in fig. 3, the electronic device may include: a housing 1, a display panel 2 and a glass cover plate 3.

A display panel 2 may be disposed within the housing 1. A glass cover plate 3 may be disposed within the housing 1 and cover the display panel 2. The shell 1 comprises a metal piece 11 and a plastic piece 12, wherein the plastic piece 12 is fixed on at least part of the inner surface of the metal piece 11 through a nano injection molding and stamping process.

The display panel 2 may be enclosed in the housing 1, and therefore, the metal member 11 may include a flat plate portion 111 and a side plate portion 112, and the plastic member 12 is fixed on at least a portion of an inner surface of the side plate portion 112. This allows the plastic member 12 to be user-assisted in fixing the display panel 2 and the glass cover 3.

Such a structure can make the thickness of the housing 1 of the electronic apparatus thin. For example, the sum of the thicknesses of the plastic member 12 and the side plate portion 112 is smaller than the finger thickness. The specified thickness may be greater than the thickness of the side plate portion 112, and less than the sum of the minimum thickness that can be achieved by the nano injection molding process and the thickness of the side plate portion 112, such as 3 mm, 2.5 mm, 2 mm, 1.5 mm, 1.3 mm, 1.2 mm, 1.1 mm, or 1mm, specifically, the thickness of the side plate portion 112 may be about 0.8mm, the thickness of the plastic member inside the side plate portion may be about 0.5 mm, and the side plate portion 112 and the plastic member 12 are attached to each other.

Wherein the thickness of the plastic part 12 is smaller than the thickness of the side plate part 112. Since the side plate portion 112 is used to wrap the side of the display panel 2, the mechanical strength of the side plate portion 112 is sufficient, and therefore, the plastic part 12 can be made thinner.

Specifically, the flat plate portion 111 has a thickness larger than that of the side plate portion 112. Since the flat plate portion 111 needs to provide mechanical support to the entire display panel 2, the requirement for mechanical strength is high, and therefore, the thickness of the flat plate portion 111 can be designed to be thick.

In one embodiment, the display panel 2 is fixed on the inner surface of the flat plate portion by a panel fixing structure (refer to a square structure between the display panel 2 and the flat plate portion 111 in fig. 3). For example, the display panel 2 may be fixed to the flat plate portion 111 by a fixing structure such as an adhesive tape.

In one embodiment, the plastic member 12 covers the inner surface of the side plate 112 and the top end of the side plate 112. This can prevent the exposed edge of the side plate portion 112 from scratching a user or the like.

In order to improve the smoothness between the casing 1 and the glass cover 3 of the electronic device, the upper surface of the glass cover 3 may be lower than the surface of the plastic member 12 covered on the top end portion of the side plate portion 112.

In order to provide better protection, such as higher mechanical strength, to the glass cover 3, the upper surface of the glass cover 3 is higher than the surface of the tip end portion of the side plate portion 112.

Fig. 4 schematically illustrates a structural schematic of a housing according to an embodiment of the disclosure.

As shown in fig. 4, the side plate 112 is schematically illustrated.

The metal piece 11 includes a side plate portion 112 and a bonding reinforcement layer located above the side plate portion 112, the bonding reinforcement layer being provided on an inner surface of the side plate portion 112, the bonding reinforcement layer including a non-planar structure 1121.

The plastic part 12 includes a bonding layer 121 and a surface layer 123. The bonding layer 121 covers the surface of the non-planar structure 1121, and the surface flatness of the bonding layer 121 is greater than that of the non-planar structure 1121. A surface layer 123 is disposed on a surface of the bonding layer 121, wherein a surface flatness of the surface layer 123 is greater than a surface flatness of the bonding layer 121.

In particular, the non-planar structure 1121 comprises a porous structure. The bonding layer 121 is filled in the porous structure. The side plate portion 112 includes a metal plate material prepared by press forming. The combination holding force between the plastic part 12 and the metal part 11 can reach more than 10 kilograms.

In one embodiment, the material of the bond enhancing layer is the same as the material of the side panel portion 112. The material of the bonding reinforcement layer is the same as or different from the material of the bonding layer 121. The material of the surface layer 123 is the same as or different from the material of the bonding layer 121.

Wherein the contact surface of the skin layer 123 and the tie layer 121 comprises a reaction product of the material of the tie layer 121 and the material of the skin layer 123.

The following describes an exemplary process of manufacturing the housing according to the embodiment of the present disclosure with reference to fig. 5 to 10.

Fig. 5-10 schematically illustrate a process of manufacturing a housing according to an embodiment of the present disclosure.

As shown in fig. 5, first, a metal plate or the like may be subjected to at least one of cold rolling, punching, cutting, welding, and the like to form the side plate portion 112.

As shown in fig. 6, a non-planar structure 1121 is formed on the inner surface of the side plate portion 112. The non-planar structure 1121 is formed on the inner surface of the side plate portion 112 by, for example, a chemical etching method. Wherein, the corrosive liquid can adopt an alkaline chemical reagent or a weakly acidic chemical reagent, and the corrosion duration can be determined according to the concentration of the chemical reagent. The height of the non-planar structure 1121 may be on the order of nanometers or sub-millimeters.

As shown in fig. 7, after the non-planar structure 1121 is formed on the inner surface of the side plate portion 112, a plastic material may be filled on the non-planar structure 1121 by a nano injection molding process (NMT) to form the bonding layer 121.

As shown in fig. 8, the skin layer 123 may then be secured to the bonding layer 121 by a stamping process. If the material of the surface layer 123 is the same as that of the bonding layer 121, a structure as shown in fig. 9 may be formed.

It should be noted that, in the bonding strength between the plastic part 12 and the metal part 11, in the residual non-planar structure 1121 (such as an aluminum hole) of the Amine (Amine) component in the processing solution, the Amine component reacts with the ester in the plastic part to cause an anchor bolt effect, so as to improve the bonding force, and ensure the high retention force requirement under the condition that the side plate portion 112 is bonded to the plastic part 12 (without the structural design similar to a dovetail groove).

As shown in fig. 10, the uneven portion of the plastic part 12 may be further removed (if the nano injection molding process does not leave the uneven portion on the surface of the plastic part 12, the step is not required to be performed), so that the inner surface of the housing 1 is a flat surface.

Fig. 11 schematically shows a cross-sectional view of a prior art housing.

As shown in fig. 11, in the case of the prior art, a gap exists between the plastic part a and the metal part d, and the width of the gap is not uniform, so that dirt is easily hidden in the gap, and the visual appearance of the user is not good.

Fig. 12 schematically illustrates a cross-sectional schematic of a housing according to an embodiment of the disclosure.

As shown in fig. 12, in the case 1 according to the embodiment of the disclosure, the plastic part 12 is attached to the side plate part 112 of the metal part 11, and has no gap and high bonding strength, and the thickness can be less than 1.3 mm, so as to meet the requirement of a light and thin notebook computer, and provide a high visual impression to a user.

Fig. 13 schematically illustrates a housing bond strength test point schematic in accordance with an embodiment of the disclosure.

As shown in fig. 13, in order to determine the bonding strength of the case, destructive tests were respectively performed on 10 test points (T1 to T10) as shown in fig. 13 to determine the bonding strength of each test point (T1 to T10).

Wherein, the metal piece is made of Al 5052, and the thickness is 0.8 mm. The material of the injection molding piece is polyphenylene sulfide PPS + 40% glass fiber (G.F). The test results are shown in table 1.

TABLE 1

Wherein symbol C represents metal deformation. Under a tensile force of up to 20 kg, no separation of the plastic part from the metal part occurs.

In addition, in the aspect of finished product deformation control, the width of the plastic is narrowed, the strength of the plastic is weakened to the utmost extent, and the metal deformation caused by plastic shrinkage is reduced, and test data show that the deformation of the shell is within 1mm under the condition of no post-processing shaping, so that the requirement of the notebook on the deformation degree can be met.

Fig. 14 schematically illustrates a shell deformation test point schematic according to an embodiment of the disclosure.

As shown in fig. 14, the test results of the case deformation test performed on 4 test points among the test points (P1 to P4) are shown in table 2.

TABLE 2

	1	4	7	10	13	16	19	22
									P1	0.40	0.40	0.30	0.35	0.30	0.40	0.30	0.40
P2	0.70	0.70	0.60	0.30	0.50	0.60	0.70	0.80
									P3	0.40	0.60	0.30	0.70	0.30	0.40	0.60	0.50
P4	0.70	0.80	0.60	0.90	0.60	0.90	0.70	0.60

Wherein, the deformation degree of the flat plate part 111 before the nano injection molding is less than 0.5 mm, and the test data is obtained in the process of standing for 24 hours after the nano injection molding is carried out on the inner wall of the side plate part 112 during the test data. It can be seen that after the nano-injection molding is performed on the inner wall of the side plate portion 112, the deformation of the flat plate portion is within 1mm, which can meet the requirements of a notebook computer.

In another embodiment, the electronic device further comprises: a lower housing.

Wherein the first side of the housing 1 and the second side of the lower housing are rotatably connected. Wherein, the lower shell can be provided with devices such as a power supply, a central processing unit, a memory, a circuit board, a network card, a sound card and the like.

FIG. 15 schematically shows a block diagram of an electronic device according to an embodiment of the disclosure. The electronic device shown in fig. 15 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present disclosure.

As shown in fig. 15, the electronic apparatus 1500 includes: one or more processors 1510, and a computer-readable storage medium 1520. In particular, the processor 1510 may comprise, for example, a general purpose microprocessor, an instruction set processor and/or related chip set and/or a special purpose microprocessor (e.g., an Application Specific Integrated Circuit (ASIC)), or the like. The processor 1510 may also include onboard memory for caching purposes.

Computer-readable storage media 1520, for example, may be non-volatile computer-readable storage media, specific examples including, but not limited to: magnetic storage devices, such as magnetic tape or Hard Disk Drives (HDDs); optical storage devices, such as compact disks (CD-ROMs); memory such as Random Access Memory (RAM) or flash memory, etc.

The computer-readable storage medium 1520 may include a program 1521, which program 1521 may include code/computer-executable instructions that, when executed by the processor 1510, cause the processor 1510 to perform operations corresponding to the program 1521.

Program 1521 may be configured having, for example, computer program code comprising computer program modules. For example, in an example embodiment, code in program 1521 may include one or more program modules, including, for example, program module 1521A, program module 1521B, … …. It should be noted that the division and number of the program modules are not fixed, and those skilled in the art may use suitable program modules or program module combinations according to actual situations, and when the program modules are executed by the processor 1510, the processor 1510 may execute the operations corresponding to the program 1521.

According to an embodiment of the present disclosure, the processor 1510 may interact with the computer-readable storage medium 1520 to perform the structural elements according to an embodiment of the present disclosure or any variation thereof.

According to embodiments of the present disclosure, the computer-readable storage medium may be a non-volatile computer-readable storage medium, which may include, for example but is not limited to: a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present disclosure, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.

While the disclosure has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Accordingly, the scope of the present disclosure should not be limited to the above-described embodiments, but should be defined not only by the appended claims, but also by equivalents thereof.

Claims

1. An electronic device, comprising:

a housing;

a display panel disposed within the housing; and

a glass cover plate disposed within the housing and covering over the display panel;

the shell comprises a metal piece and a plastic piece, and the plastic piece is fixed on at least part of the inner surface of the metal piece through a nano injection molding and stamping process.

2. The electronic device of claim 1, wherein the metal member comprises a flat plate portion and a side plate portion, and the plastic member is fixed on at least a portion of an inner surface of the side plate portion.

3. The electronic device of claim 2, wherein a thickness of the flat plate portion is greater than a thickness of the side plate portion.

4. The electronic device according to claim 2, wherein a sum of thicknesses of the plastic member and the side plate portion is less than a prescribed thickness.

5. The electronic device of claim 2, wherein the plastic part has a thickness smaller than a thickness of the side plate portion.

6. The electronic device of claim 2, wherein the display panel is secured to the inner surface of the flat plate portion by a panel securing structure.

7. The electronic apparatus according to claim 2, wherein the plastic member covers an inner surface of the side plate portion and a distal end portion of the side plate portion.

8. The electronic apparatus according to claim 7, wherein an upper surface of the glass cover is lower than a surface of the plastic member covered on the tip end portion of the side plate portion.

9. The electronic apparatus according to claim 7, wherein an upper surface of the glass cover plate is higher than a surface of a tip end portion of the side plate portion.

10. The electronic device of claim 1, further comprising:

a lower housing, wherein the first side of the housing and the second side of the lower housing are rotatably connected.