CN212162555U - Automatic cooling power distribution cabinet - Google Patents
Automatic cooling power distribution cabinet Download PDFInfo
- Publication number
- CN212162555U CN212162555U CN202020815402.8U CN202020815402U CN212162555U CN 212162555 U CN212162555 U CN 212162555U CN 202020815402 U CN202020815402 U CN 202020815402U CN 212162555 U CN212162555 U CN 212162555U
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- CN
- China
- Prior art keywords
- power distribution
- distribution cabinet
- heat dissipation
- semiconductor heat
- fixedly arranged
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 35
- 239000011521 glass Substances 0.000 claims description 11
- 238000005057 refrigeration Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000012945 sealing adhesive Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005273 aeration Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an automatic cooling switch board, its technical scheme main points are: the power distribution cabinet comprises a power distribution cabinet body, wherein a plurality of fixing supports are fixedly arranged inside the power distribution cabinet body, a plurality of semiconductor heat dissipation devices are fixedly arranged at the outer ends of the fixing supports, clamping devices are slidably arranged at the end parts of two sides of each semiconductor heat dissipation device, a heat dissipation fan is fixedly arranged at the position, corresponding to a lower mounting plate, of the rear end of each semiconductor heat dissipation device, electrical components are arranged inside each semiconductor heat dissipation device, a plurality of temperature sensors are fixedly arranged at the positions, corresponding to the electrical components, of the outer ends of the fixing supports, a control module is fixedly arranged inside the power distribution cabinet body, and the plurality of semiconductor heat dissipation devices and the plurality of temperature sensors are electrically; the utility model discloses a set up a plurality of independent semiconductor heat abstractor and temperature sensor in each electrical components's rear end to control it through control module, the device heat dissipation is fast, and the radiating efficiency is high.
Description
Technical Field
The utility model belongs to the technical field of the switch board technique and specifically relates to an automatic switch board cools down.
Background
The distribution cabinet is a final-stage device of a distribution system. The power distribution cabinet is a general name of a motor control center. The power distribution cabinet is used in the occasions with dispersed loads and less loops; the motor control center is used for occasions with concentrated loads and more loops. They distribute the power of a certain circuit of the upper-level distribution equipment to the nearby loads. This level of equipment should provide protection, monitoring and control of the load.
The cooling of current switch board generally adopts mechanical fan aeration cooling, perhaps opens the purpose that has the louvre to reach the cooling on the cabinet body of switch board, has the heat dissipation slow, the low problem of radiating efficiency.
SUMMERY OF THE UTILITY MODEL
To the problem of mentioning in the background art, the utility model aims at providing an automatic cooling switch board to solve the problem that the current switch board heat dissipation of mentioning in the background art is slow, the radiating efficiency is low.
The above technical purpose of the present invention can be achieved by the following technical solutions:
an automatic cooling power distribution cabinet comprises a power distribution cabinet body, wherein a cabinet door is hinged to the left side of the power distribution cabinet body, a plurality of fixing supports are fixedly arranged inside the power distribution cabinet body and horizontally arranged inside the power distribution cabinet body, a plurality of semiconductor heat dissipation devices are fixedly arranged at the outer ends of the fixing supports and comprise an upper mounting plate and a lower mounting plate which are mutually matched and connected, a circuit board, a hot end module and a refrigeration module are fixedly arranged in the middle of the lower mounting plate, a groove is formed in the middle of the upper mounting plate, a cold end module is fixedly arranged inside the groove, a heat conduction silica gel layer is fixedly attached to the upper end of the cold end module, clamping devices are arranged at the end parts of the two sides of each semiconductor heat dissipation device in a sliding mode and comprise a clamping jaw, a movable rod is fixedly connected to the bottom, the spring is fixed in the semiconductor heat dissipation device, a heat dissipation fan is fixedly arranged at the position, corresponding to the lower mounting plate, of the rear end of the semiconductor heat dissipation device, an electric appliance element is arranged in the semiconductor heat dissipation device, a plurality of temperature sensors are fixedly arranged at the position, corresponding to the electric appliance element, of the outer end of the fixing support, a control module is fixedly arranged in the power distribution cabinet body, and the semiconductor heat dissipation devices and the temperature sensors are all electrically connected with the control module.
Furthermore, the front end of the clamping jaw is fixedly provided with a protruding part.
Further, a hinge is fixedly arranged between the power distribution cabinet body and the cabinet door, a transparent glass window is fixedly arranged in the middle of the cabinet door, a door lock is fixedly arranged inside the cabinet door, and a zero line is fixedly connected between the power distribution cabinet body and the cabinet door.
Furthermore, the edge of the cabinet door is fixedly provided with a door frame adhesive tape corresponding to the matched position of the cabinet door and the power distribution cabinet body, and a glass sealing adhesive tape is fixedly arranged between the cabinet door and the transparent glass window.
Further, the fixed rain-proof baffle that is provided with in upper end of switch board body, the longitudinal section of rain-proof baffle is the font, and the left and right both sides and the rear end of switch board body are fixed and are provided with a plurality of shutters.
Furthermore, a wire outlet hole is formed in the position, corresponding to the upper end of the shutter, on the right side of the power distribution cabinet body.
To sum up, the utility model discloses mainly have following beneficial effect:
1. the utility model discloses a, through the fixed semiconductor heat abstractor that sets up in each electrical components's rear end, when the other temperature sensor of electrical components detected electrical components's temperature and was higher than normal use temperature's scope, control module control semiconductor heat abstractor started, and the refrigeration module through its inside setting adopts semiconductor refrigeration technique to carry out rapid cooling to electrical components, and the device heat dissipation is fast.
2. The utility model discloses a, through setting up a plurality of independent semiconductor heat abstractor and temperature sensor in a plurality of electrical components's rear end, a plurality of independent semiconductor heat abstractor and sensor respectively with control module electric connection, can carry out cooling heat dissipation treatment alone to each electrical component, the radiating efficiency is high.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a front view of the present invention;
fig. 2 is an exploded view of the semiconductor heat sink of the present invention;
fig. 3 is a rear view of the semiconductor heat sink of the present invention;
fig. 4 is a left side view of the semiconductor heat dissipation device of the present invention;
fig. 5 is a right side view of the present invention.
In the figure: 1. a power distribution cabinet body; 2. a cabinet door; 3. fixing a bracket; 4. a semiconductor heat sink; 401. An upper mounting plate; 402. a lower mounting plate; 403. a circuit board; 404. a hot end module; 405. a refrigeration module; 406. a groove; 407. a cold end module; 408. a heat conductive silica gel layer; 5. a clamping device; 501. a clamping jaw; 502. a travel bar; 503. a protrusion; 6. a spring; 7. a heat radiation fan; 8. a hinge; 9. transparent glass; 10. a door lock; 11. connecting a zero line; 12. a doorframe adhesive tape; 13. a glass sealing rubber strip; 14. a rain-proof baffle plate; 15. a blind window; 16. a wire outlet hole; 17. an electrical component; 18. a temperature sensor; 19. and a control module.
Detailed Description
In order to make the objects and technical solutions of the present invention clear and fully described, and the advantages thereof more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1-4, an automatic cooling power distribution cabinet comprises a power distribution cabinet body 1, the power distribution cabinet body 1 is rectangular, a cabinet door 2 is hinged on the left side of the power distribution cabinet body 1, a plurality of fixing brackets 3 are fixedly arranged inside the power distribution cabinet body 1, the plurality of fixing brackets 3 are horizontally arranged inside the power distribution cabinet body 1, a plurality of semiconductor heat dissipation devices 4 are fixedly arranged at the outer ends of the fixing brackets 3, each semiconductor heat dissipation device 4 comprises an upper mounting plate 401 and a lower mounting plate 402, the upper mounting plate 401 and the lower mounting plate 402 are mutually matched and connected, a circuit board 403, a hot end module 404 and a refrigeration module 405 are fixedly arranged in the middle of the lower mounting plate 402, the refrigeration module 405 is a semiconductor refrigeration sheet, a groove 406 is formed in the middle of the upper mounting plate 401, a cold end module 407 is fixedly arranged inside the groove 406, and the hot, the upper end of the cold end module 407 is fixedly attached with a heat-conducting silica gel layer 408, the heat-conducting silica gel layer 408 has good insulation property, the end parts of the two sides of the semiconductor heat dissipation device 4 are slidably provided with a clamping device 5, the clamping device 5 comprises a clamping jaw 501, the bottom of the clamping jaw 501 is fixedly connected with a movable rod 502, one end of the movable rod 502 is fixedly connected with a spring 6, the spring 6 is fixed inside the semiconductor heat dissipation device 4, the movable rod 502 can drive the clamping jaw 501 to telescopically move inside the semiconductor heat dissipation device 4, so as to conveniently fix electrical components 17 with different sizes, a heat dissipation fan 7 is fixedly arranged at the position of the rear end of the semiconductor heat dissipation device 4 corresponding to the lower mounting plate 402, the electrical components 17 are mounted inside the semiconductor heat dissipation device 4, the outer end of the fixing support 3 is fixedly provided with a plurality of temperature sensors 18 at the position corresponding to the electrical components, the inside of switch board body 1 is fixed and is provided with control module 19, and a plurality of semiconductor heat abstractor 4, a plurality of temperature sensor 18 all are connected with control module 19 electric property.
Referring to fig. 4, in order to ensure that the semiconductor heat sink 4 can be tightly attached to the electrical component 17, it is required to ensure that the clamping jaws 501 can clamp both ends of the electrical component 17, and a protrusion 503 is fixedly disposed at the front ends of the clamping jaws 501.
Refer to fig. 1, for the convenience open or close cabinet door 2, fixedly between switch board body 1 and cabinet door 2 be provided with hinge 8, need not open cabinet door 2 also can observe the inside condition of switch board body for making operating personnel, the fixed clear glass window 9 that is provided with in middle part of cabinet door 2, the fixed lock 10 that is provided with in inside of cabinet door 2, the electrical equipment in the switch board body 1 probably breaks down and makes the shell have the voltage that threatens personal safety, fixedly connected with connects zero line 11 between switch board body 1 and cabinet door 2, in order to protect personal safety.
Referring to fig. 1, in order to ensure that the cabinet door 2 is closed, the power distribution cabinet body 1 has good sealing performance, a door frame adhesive tape 12 is fixedly arranged at the edge of the cabinet door 2 corresponding to the position where the cabinet door 2 is matched with the power distribution cabinet body 1, and a glass sealing adhesive tape 13 is fixedly arranged between the cabinet door 2 and the transparent glass window 9.
Refer to fig. 1 and fig. 5, in order to make switch board body 1 have rain-proof effect, fixed rain-proof baffle 14 that is provided with in switch board body 1's upper end, rain-proof baffle 14's longitudinal section is human font, rainwater on the rain-proof baffle 14 can be along rain-proof baffle 14's both sides landing to ground, guarantee that the rainwater can not get into switch board body 1's inside, in order to make switch board body 1 have good radiating effect, a left side at switch board body 1, right side both sides and rear end are fixed and are provided with a plurality of shutter 15, shutter 15 is favorable to switch board body 1's radiating effect, the upper end of each window of shutter 15 all is provided with protruding edge simultaneously, guarantee that the rainwater can not get into switch.
Referring to fig. 5, in order to facilitate the electrical connection between the power distribution cabinet body 1 and the external electrical equipment, a wire outlet 16 is formed on the right side of the power distribution cabinet body 1 corresponding to the upper end of the louver 15.
The utility model discloses when using, operating personnel installs each electrical component 17 at the front end of fixed bolster 3 and closely cooperates with semiconductor heat abstractor 4, it is fixed to carry out the centre gripping with electrical component 17 through clamping jaw 501, when the other temperature sensor 18 of electrical component 17 detected the temperature of electrical component 17 and is higher than normal use temperature's scope, temperature sensor 18 transmits signal to control module 19, control module 19 controls semiconductor heat abstractor 4 and starts, refrigeration module 405 through its inside setting adopts semiconductor refrigeration technology to carry out rapid cooling to electrical component 17, because each semiconductor heat abstractor 4 sets up the rear end at each electrical component 17 alone, so the device can independently carry out the cooling to each electrical component 17 and handle, the radiating efficiency is high, has better practicality.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides an automatic cooling switch board, includes switch board body (1), its characterized in that: a cabinet door (2) is hinged to the left side of the power distribution cabinet body (1), a plurality of fixing supports (3) are fixedly arranged inside the power distribution cabinet body (1), the fixing supports (3) are horizontally arranged inside the power distribution cabinet body (1), a plurality of semiconductor heat dissipation devices (4) are fixedly arranged at the outer ends of the fixing supports (3), each semiconductor heat dissipation device (4) comprises an upper mounting plate (401) and a lower mounting plate (402), the upper mounting plates (401) and the lower mounting plates (402) are mutually matched and connected, a circuit board (403), a hot end module (404) and a refrigeration module (405) are fixedly arranged in the middle of the lower mounting plate (402), a groove (406) is formed in the middle of the upper mounting plate (401), a cold end module (407) is fixedly mounted inside the groove (406), and a heat-conducting silica gel layer (408) is fixedly attached to the upper end of the cold end module (407), the clamping device (5) is arranged at the end parts of two sides of the semiconductor heat dissipation device (4) in a sliding mode, the clamping device (5) comprises a clamping jaw (501), a moving rod (502) is fixedly connected to the bottom of the clamping jaw (501), a spring (6) is fixedly connected to one end of the moving rod (502), the spring (6) is fixed inside the semiconductor heat dissipation device (4), a heat dissipation fan (7) is fixedly arranged at the position, corresponding to the lower mounting plate (402), of the rear end of the semiconductor heat dissipation device (4), an electric element (17) is installed inside the semiconductor heat dissipation device (4), a plurality of temperature sensors (18) are fixedly arranged at the position, corresponding to the electric element (17), of the outer end of the fixing support (3), a control module (19) is fixedly arranged inside the power distribution cabinet body (1), the semiconductor heat dissipation devices (4) and the temperature sensors (18) are electrically connected with a control module (19).
2. The automatic cooling power distribution cabinet of claim 1, characterized in that: the front end of the clamping jaw (501) is fixedly provided with a protruding part (503).
3. The automatic cooling power distribution cabinet of claim 1, characterized in that: switch board body (1) with fixed hinge (8) of being provided with between cabinet door (2), the fixed clear glass window (9) that is provided with in middle part of cabinet door (2), the inside fixed lock (10) that is provided with of cabinet door (2), switch board body (1) with fixedly connected with connects zero line (11) between cabinet door (2).
4. The automatic cooling power distribution cabinet of claim 3, characterized in that: the edge of the cabinet door (2) is provided with a door frame adhesive tape (12) corresponding to the position where the cabinet door (2) is matched with the power distribution cabinet body (1), and a glass sealing adhesive tape (13) is fixedly arranged between the cabinet door (2) and the transparent glass window (9).
5. The automatic cooling power distribution cabinet of claim 1, characterized in that: the fixed rain-proof baffle (14) that is provided with in upper end of switch board body (1), the longitudinal section of rain-proof baffle (14) is the character form, the left and right both sides and the rear end of switch board body (1) are fixed and are provided with a plurality of shutter (15).
6. The automatic cooling power distribution cabinet of claim 5, characterized in that: and a wire outlet hole (16) is formed in the position, corresponding to the upper end of the shutter (15), on the right side of the power distribution cabinet body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020815402.8U CN212162555U (en) | 2020-05-16 | 2020-05-16 | Automatic cooling power distribution cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020815402.8U CN212162555U (en) | 2020-05-16 | 2020-05-16 | Automatic cooling power distribution cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212162555U true CN212162555U (en) | 2020-12-15 |
Family
ID=73705827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020815402.8U Expired - Fee Related CN212162555U (en) | 2020-05-16 | 2020-05-16 | Automatic cooling power distribution cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212162555U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314993A (en) * | 2021-06-01 | 2021-08-27 | 扬州丰诚电力工程有限公司 | Temperature abnormity alarm device for high-low voltage power distribution cabinet |
-
2020
- 2020-05-16 CN CN202020815402.8U patent/CN212162555U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314993A (en) * | 2021-06-01 | 2021-08-27 | 扬州丰诚电力工程有限公司 | Temperature abnormity alarm device for high-low voltage power distribution cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201215 |