CN212143285U

CN212143285U - Silicon chip processing is with all gluing machine

Info

Publication number: CN212143285U
Application number: CN201921919460.9U
Authority: CN
Inventors: 陈建章
Original assignee: Xuzhou Yema Lithium Technology Co ltd
Current assignee: Xuzhou Yema Lithium Technology Co ltd
Priority date: 2019-11-08
Filing date: 2019-11-08
Publication date: 2020-12-15
Anticipated expiration: 2029-11-08

Abstract

The utility model relates to a semiconductor processing technology field just discloses a silicon chip processing is with all gluing machine, which comprises a bod, the side of organism is rotated and is connected with the dwang, the end connection of dwang has the gear train, the quantity of gear train is two, another the inner wall threaded connection of gear train has the threaded rod, the bottom of threaded rod is rotated and is connected with a rotation section of thick bamboo, the inner wall fixed mounting who rotates a section of thick bamboo has the positioning seat. Through the handle, the cooperation between driving wheel and the rack for spacing clamp can remove different positions, when spacing clamp removed the top, better with the silicon chip centre gripping in the axle center department of sucking disc, make the sucking disc when fixed and rotatory, be circular motion along the axle center of sucking disc all the time, make the silicon chip keep even rotation on the one hand, on the other hand increases the stability of silicon chip when rotatory, has solved the manual skew of placing, and the breathing pipe suction descends, can't stabilize the problem of adsorbing the silicon chip.

Description

Silicon chip processing is with all gluing machine

Technical Field

The utility model relates to a semiconductor processing technology field specifically is a silicon chip processing is with all gluing machine.

Background

The spin coater is a device which drips various glue solutions on a substrate rotating at a high speed, and uniformly coats the glue solution dripped on the substrate by using centrifugal force, wherein the thickness of a film depends on the rotating speed of the spin coater and the viscosity of the glue solution, and a layer of photoresist is mainly coated on the substrate.

The working principle of the existing glue homogenizing machine is that a silicon wafer is prevented from being arranged on a processing table of the glue homogenizing machine, then a glue gun is used for dropping glue on a substrate, then a vacuum pump is started to pump out air in the glue homogenizing machine, then the processing table drives the silicon wafer to rotate, the glue is uniformly coated on the silicon wafer by utilizing the action of centrifugal force, when the existing silicon wafer is installed, most of the existing glue is directly placed on the processing table, then the silicon wafer is adsorbed on the processing table through an air suction pipe on the processing table, the air suction pipe is connected with the vacuum pump, when the silicon wafer rotates, part of redundant glue flows to the bottom of the silicon wafer, the glue is influenced by gravity, and the vacuum pump is always in a working state to generate suction force, so that part of the glue is adsorbed into a pump body through the air suction pipe, a large amount of impurities are contained in the pump body, meanwhile, the suction of the glue is sucked, and after the air suction pipe is blocked, the silicon wafer cannot be firmly adsorbed on the processing table, so that the silicon wafer cannot uniformly do circular motion when rotating, the axis of the processing table is deviated, and in more serious cases, the silicon wafer is directly thrown out of the processing table, the stress damage of the silicon wafer is caused, and the processing of the silicon wafer and the subsequent use of the glue homogenizing machine are influenced.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a silicon chip processing is with all gluing machine possesses the correction silicon chip position, adsorbs stable advantage, has solved the problem that silicon chip skew, silicon chip drop.

The utility model provides a following technical scheme: a silicon wafer processing glue homogenizing machine comprises a machine body, wherein the side face of the machine body is rotatably connected with a rotating rod, the end part of the rotating rod is connected with two gear sets, the other gear set is in threaded connection with a threaded rod, the bottom of the threaded rod is rotatably connected with a rotating cylinder, a positioning seat is fixedly installed on the inner wall of the rotating cylinder, a positioning rod is rotatably connected in the positioning seat, a positioning block is installed on the positioning rod, a sliding block is installed at the end part of the positioning block, a sliding rod is rotatably connected on the sliding block, the end part of the sliding rod penetrates through and extends to the outer part of the machine body, an inflator pump is fixedly connected on the inner wall of the threaded rod, a vertical rod is slidably installed on the inflator pump, a piston is fixedly connected at the end part of the vertical rod, the end part of the inflator is communicated with a sucker.

Preferably, the both sides fixed mounting of organism has the support frame, it installs the handle to rotate on the support frame, install the action wheel that is located the support frame inside on hand, the external tooth meshing of action wheel is connected with the rack, the bottom fixedly connected with bracing piece of rack, the draw-in groove has been seted up with the department of meeting of bracing piece to the support frame, the width of draw-in groove and the width looks adaptation of bracing piece, the length that the bracing piece removed is less than the length of draw-in groove.

Preferably, the end portion of the rack is fixedly connected with a fixing block, the outer wall of the fixing block is in sliding connection with the inner wall of the support frame, the other end of the rack is fixedly connected with two magnetic blocks, the other magnetic block is fixedly connected with the side wall of the support frame, and the two magnetic blocks are in different-stage attraction states.

Preferably, the bottom fixedly connected with limit clamp of bracing piece, the inner wall fixed mounting of limit clamp has the elasticity to press from both sides, the shape of limit clamp and elasticity clamp is the arc.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this silicon chip processing is with all machine of gluing, through the handle, the cooperation between initiative wheel and the rack, make spacing clamp can remove different positions, when spacing clamp removed the top, better with the silicon chip centre gripping in the axle center department of sucking disc, make the sucking disc when fixed and rotatory, circular motion is done along the axle center of sucking disc all the time, make the silicon chip keep even rotation on the one hand, on the other hand increases the stability of silicon chip when rotatory, the manual skew of placing has been solved, the breathing pipe suction descends, the problem of the silicon chip of unable stable absorption.

2. This silicon chip processing is with all gluing machine, through the dwang, the cooperation of gear train and threaded rod, make the sucking disc constantly rise, discharge the inside air of sucking disc, thereby fix the below at the sucking disc with the silicon chip, make the silicon chip need not to prevent also fixable at the tip of breathing pipe, stop glue on the one hand and get into the inside of breathing pipe, on the other hand increases the stability of silicon chip when fixed, in the pulling slide bar can make piston promotion gas get into the sucking disc simultaneously, thereby be convenient for droing of sucking disc.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side view of the positioning base;

FIG. 3 is an enlarged schematic view of the inflator;

FIG. 4 is a schematic structural view of the supporting frame;

fig. 5 is a schematic top view of the spacing clip.

In the figure: 1. a body; 2. rotating the rod; 3. a gear set; 4. a threaded rod; 5. a rotating cylinder; 6. positioning seats; 7. positioning a rod; 8. positioning blocks; 9. a slider; 10. a slide bar; 11. an inflator; 12. a vertical rod; 13. a piston; 14. a spring; 15. a suction cup; 16. a support frame; 17. a handle; 18. a driving wheel; 19. A rack; 20. a support bar; 21. a magnetic block; 22. a limiting clamp; 23. an elastic clip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a glue homogenizing machine for processing silicon wafers comprises a machine body 1, wherein a rotating rod 2 is rotatably connected to the side surface of the machine body 1, a gear set 3 is connected to the end of the rotating rod 2, the gear set 3 is a bevel gear, when the rotating rod 2 drives a gear to rotate, the gear on a threaded rod 4 is driven to rotate by meshing of the gear, an internal thread is arranged inside the gear on the threaded rod 4, similar to the screw rod principle, the threaded rod 4 can be driven to move upwards or downwards, the gear on the threaded rod 4 is rotatably connected with the inner wall of the machine body 1, support rings are arranged on two sides of the gear, the contact position of the support rings and the gear is annular, the gear is conveniently fixed, the gear is fixed on the threaded rod 4, the number of the gear sets 3 is two, the threaded rod 4 is connected to the inner wall of the, the diameter of threaded rod 4 is less than the diameter of a rotating cylinder 5, the bottom of threaded rod 4 is installed at the top of a rotating cylinder 5, the inner wall fixed mounting of rotating cylinder 5 has a positioning seat 6, positioning rod 7 is connected in rotation in positioning seat 6, positioning block 8 is installed on positioning rod 7, sliding block 9 is installed at the end of positioning block 8, sliding block 9 is connected in rotation, sliding rod 10 is connected in rotation, the end of sliding rod 10 penetrates through and extends to the outside of machine body 1, the inner wall fixed connection of threaded rod 4 has an inflator 11, a vertical rod 12 is installed on inflator 11 in a sliding manner, the top of vertical rod 12 contacts with the bottom of sliding rod 10, when sliding rod 10 moves, vertical rod 12 keeps synchronous motion, the end fixed connection of vertical rod 12 has a piston 13, a spring 14 is installed between the side of piston 13 and the bottom wall of inflator 11, the end part of the inflator 11 is communicated with a sucker 15, so that the air in the inflator 11 can be conveniently flushed into the sucker 15, and the sucker 15 can be separated from the silicon wafer.

Wherein, the both sides fixed mounting of organism 1 has support frame 16, it installs handle 17 to rotate on the support frame 16, install the action wheel 18 that is located the inside of support frame 16 on the handle 17, the external tooth meshing of action wheel 18 is connected with rack 19, the bottom fixedly connected with bracing piece 20 of rack 19, the draw-in groove has been seted up with the department of meeting of bracing piece 20 to support frame 16, the width of draw-in groove and the width looks adaptation of bracing piece 20, and the length that the bracing piece 20 removed is less than the length of draw-in groove, the removal of the bracing piece 20 of being convenient for bracing piece 20 can remove different positions.

Wherein, the tip fixedly connected with fixed block of rack 19, the outer wall of fixed block and 16 inner wall sliding connection of support frame, 19's the other end fixedly connected with magnetic path 21 of rack, the quantity of magnetic path 21 is two, another the lateral wall fixed connection of magnetic path 21 and support frame 16, two the magnetic path 21 is the different grade looks state of inhaling, increases the stability of rack 19 when removing on the one hand for rack 19 keeps horizontal vertical removal, and on the other hand utilizes the absorptive dynamics of two magnetic paths 21, adsorbs the outside at the silicon chip with stop clip 22, is convenient for fix the silicon chip in the axle center department of sucking disc 15, is convenient for sucking disc 15's absorption.

Wherein, the bottom fixedly connected with limit clamp 22 of bracing piece 20, the inner wall fixed mounting of limit clamp 22 has elastic clamp 23, limit clamp 22 is the arc with elastic clamp 23's shape, and the limit clamp 22 of being convenient for keeps the same radian with elastic clamp 23 and silicon chip to it is fixed with the silicon chip.

The working principle is that a silicon wafer is placed on a sucking disc 15, then a handle 17 is rotated to drive a driving wheel 18 to rotate, then a rack 19 is driven to move inwards, then two magnetic blocks 21 are continuously close to each other and are finally adsorbed together to fix the position of a limiting clamp 22, then the rack 19 gradually drives the limiting clamp 22 and an elastic clamp 23 to clamp the silicon wafer, the silicon wafer is corrected at the axis of the sucking disc 15, at the moment, when a rotating rod 2 is screwed to drive a gear set 3 to rotate, then a gear on a threaded rod 4 rotates, the threaded rod 4 is driven to continuously ascend and move, the sucking disc 15 is driven to gradually extrude the silicon wafer, air in the sucking disc 15 is exhausted, then the handle 17 is rotated reversely, the limiting clamp 22 is separated from the outside of the silicon wafer, after the silicon wafer is processed, a sliding rod 10 is pulled to move outwards, then a positioning block 8 is subjected to pull force to perform axis, thereby driving the piston 13 to extrude the gas in the inflator 11 into the suction cup 15, causing the suction cup 15 to drop the silicon wafer, and then taking out the silicon wafer.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a silicon chip processing is with gluing machine, includes organism (1), its characterized in that: the side of organism (1) is rotated and is connected with dwang (2), the end connection of dwang (2) has gear train (3), the quantity of gear train (3) is two, another the inner wall threaded connection of gear train (3) has threaded rod (4), the bottom of threaded rod (4) is rotated and is connected with a rotary drum (5), the inner wall fixed mounting of rotary drum (5) has positioning seat (6), positioning seat (6) internal rotation is connected with locating lever (7), install locating piece (8) on locating lever (7), sliding block (9) are installed to the tip of locating piece (8), it is connected with slide bar (10) to rotate on sliding block (9), the tip of slide bar (10) runs through and extends to the outside of organism (1), the inner wall fixed connection of threaded rod (4) has gas cylinder (11), slidable mounting has montant (12) on inflator pump (11), the tip fixedly connected with piston (13) of montant (12), install spring (14) between the lateral of piston (13) and the diapire of inflator pump (11), the tip intercommunication of inflator pump (11) has sucking disc (15).

2. The glue spreader for silicon wafer processing according to claim 1, wherein: the utility model discloses a machine body, including organism (1), support frame (16), handle (17) are installed in the rotation on support frame (16), install on handle (17) and be located inside action wheel (18) of support frame (16), the external tooth meshing of action wheel (18) is connected with rack (19), the bottom fixedly connected with bracing piece (20) of rack (19), the draw-in groove has been seted up with the department of meeting of bracing piece (20) in support frame (16), the width of draw-in groove and the width looks adaptation of bracing piece (20), and the length that bracing piece (20) removed is less than the length of draw-in groove.

3. The glue spreader for silicon wafer processing according to claim 2, wherein: the end part of the rack (19) is fixedly connected with a fixing block, the outer wall of the fixing block is in sliding connection with the inner wall of the support frame (16), the other end of the rack (19) is fixedly connected with two magnetic blocks (21), the other magnetic blocks (21) are fixedly connected with the side wall of the support frame (16), and the two magnetic blocks (21) are in different-stage attraction states.

4. The glue spreader for silicon wafer processing according to claim 2, wherein: the bottom end fixedly connected with stop clip (22) of bracing piece (20), the inner wall fixed mounting elasticity of stop clip (22) presss from both sides (23), the shape of stop clip (22) and elasticity clamp (23) is the arc.