CN212136732U - Low cost high frequency electrical connector - Google Patents

Abstract

The utility model provides a low-cost high frequency electric connector, but electric connection chip module to printed circuit board, including insulating pedestal and many spring terminals. The insulating base body is provided with mounting through holes which are equal to the spring terminals in number and are spaced from each other, and the spring terminals are mounted in the mounting through holes; the electroplating layer that keeps contact with the spring terminal in the mounting through-hole is plated out on the pore wall of mounting through-hole, the mounting through-hole contains the macropore section and is located the aperture section of the relative both ends department in macropore section respectively, the spring terminal contains the flexible deformation section that can be elastic deformation and the contact segment that extends respectively by two ends of flexible deformation section, flexible deformation section is located the macropore section, at least one is located the aperture section in two contact segments, remaining is located the macropore section in two contact segments, the both ends pore wall of macropore section blocks spring terminal roll-off mounting through-hole jointly. The utility model discloses a low-cost high frequency electric connector has that overall resistance is low, low-cost and high frequency transmission's advantage.

Description

Low cost high frequency electrical connector

Technical Field

The present invention relates to a high frequency electrical connector, and more particularly to a low cost high frequency electrical connector for electrically connecting a chip module (e.g., an IC circuit) to a Printed Circuit Board (PCB).

Background

As is well known, electronic products are being developed toward miniaturization and high frequency, and accordingly, the overall size of terminals in an electrical connector applied to the electronic products is required to be smaller to meet the demand of miniaturized high frequency 5G electronic products.

Among them, in the existing electric connector for electrically connecting the IC circuit to the printed circuit board, since the conductive terminals for electrically connecting the IC circuit and the printed circuit board are made complicated as they need to satisfy the high frequency requirement; the number of the terminals is large, which makes the cost of the conventional electrical connector too high. Although the cost can be reduced by replacing the conductive terminal with the spring structure, because the manufacturing cost of the spring is low, the spring structure is a spiral structure, which causes a poor high-frequency signal, so that the spring structure cannot meet the high-frequency requirement.

Therefore, there is a need for a low cost high frequency electrical connector that overcomes the above-mentioned drawbacks.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a low-cost high frequency electric connector that has that the bulk resistance is low, low-cost and can satisfy the high frequency transmission needs.

In order to achieve the above object, the present invention provides a low-cost high-frequency electrical connector, which can electrically connect a chip module to a printed circuit board, including an insulating base and a plurality of spring terminals. The insulating base body is provided with mounting through holes which are equal to the spring terminals in number and are spaced from each other, and the spring terminals are mounted in the mounting through holes; the spring terminal installation structure comprises an installation through hole and a spring terminal, wherein an electroplated layer which is in contact with the spring terminal in the installation through hole is electroplated on the hole wall of the installation through hole, the installation through hole comprises a large hole section and small hole sections which are respectively positioned at two opposite ends of the large hole section, the spring terminal comprises a telescopic deformation section which can elastically and telescopically deform and contact sections which respectively extend from two tail ends of the telescopic deformation section, the telescopic deformation section is positioned in the large hole section, at least one of the two contact sections is positioned in the small hole section, the rest of the two contact sections is positioned in the large hole section, and the hole walls of the two end parts of the large hole section commonly block the spring terminal from sliding out of the installation through hole.

Preferably, the mounting through hole penetrates the insulating base body up and down.

Preferably, the insulating base body includes a first insulating base body and a second insulating base body which are stacked and assembled in the up-down direction of the insulating base body, and the joint surface of the first insulating base body and the joint surface of the second insulating base body are cut into the large hole section.

Preferably, the insulating base further includes a fastener and a positioning element, the fastener penetrates through the first insulating base and the second insulating base along the vertical direction of the insulating base, the fastener is further distributed around the spring terminal, and the positioning element penetrates through the first insulating base and the second insulating base along the vertical direction of the insulating base.

Preferably, the spring terminal is of an integral structure.

Preferably, the flexible deformation section is a leaf spring structure.

Preferably, the telescopic deformation section is a wave shape formed by bending and extending a cylindrical wire rod periodically in the same plane by the center line of the wire rod.

Preferably, the contact section is a straight line structure with a center line in the same plane, and the cross section of the contact section is circular.

Preferably, the flexible deformation section is a spiral structure, and at least one of the two contact sections is a straight line structure parallel to the center line of the spiral structure.

Preferably, the flexible deformation section and the contact section are each of a helical structure, and the diameter of the flexible deformation section is greater than that of the contact section.

Compared with the prior art, because the utility model discloses an electroplate out on the pore wall of installation through-hole and the spring terminal in the installation through-hole keeps the plating layer of contact, and the installation through-hole contains the macropore section and is located the aperture section of the relative both ends department of macropore section respectively, the spring terminal contains the flexible deformation section that can do elastic deformation and the contact segment that extends respectively by the both ends of flexible deformation section, flexible deformation section is located the macropore section, at least one in two contact segments is located the aperture section, the rest is located the macropore section in two contact segments, the both ends pore wall of macropore section blocks spring terminal roll-off installation through-hole jointly; therefore, when one contact section is electrically contacted with the chip module and the other contact section is electrically contacted with the printed circuit board, a high-frequency signal is transmitted and guided in through the contact section, then is guided into the other contact section through the electroplated layer, and the high-frequency signal is guided out of the surface of the conductor, so that the flexible deformation section can be avoided, the high-frequency performance is greatly improved, and the requirement of high-frequency signal transmission is met; meanwhile, with the help of the electroplated layer in the mounting through hole, the current transmission paths (namely the number) are increased, and the current transmission distance is shortened, so that the overall resistance is reduced, and the low-resistance-value advantage is achieved; in addition, the adoption of the spring terminal can greatly reduce the cost, because the spring terminal is of an integrated structure, the assembly is not needed, the cost is lower compared with the probe (the needle tube, the needle shaft and the spring need to be assembled together), and the cost of each part of the probe and the assembly cost can be saved.

Drawings

Fig. 1 is a schematic perspective view of the low-cost high-frequency electrical connector of the present invention.

Fig. 2 is a schematic plan view of the low-cost high-frequency electrical connector shown in fig. 1 in a top view.

Fig. 3 is a schematic view of the internal structure of fig. 2 taken along line a-a and after the fastener is concealed.

FIG. 4 is a schematic diagram of the low-cost high-frequency electrical connector shown in FIG. 3 in a state of electrically connecting the IC to the printed circuit board.

Fig. 5 is a schematic perspective view of a spring terminal structure of the low-cost high-frequency electrical connector according to the present invention.

Fig. 6 is a schematic plan view of the spring terminal shown in fig. 5.

Fig. 7 is a schematic plan view of the spring terminal shown in fig. 6 after being projected in the direction indicated by the arrow B in fig. 6.

Fig. 8 is a schematic perspective view of another embodiment of the spring terminal in the low-cost high-frequency electrical connector according to the present invention.

Fig. 9 is a schematic perspective view of another embodiment of a spring terminal in the low-cost high-frequency electrical connector according to the present invention.

Fig. 10 is a schematic perspective view of another embodiment of a spring terminal in the low-cost high-frequency electrical connector according to the present invention.

Detailed Description

In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.

Referring to fig. 1 to 4, the low-cost high-frequency electrical connector 100 of the present invention is used to electrically connect a chip module 200 (for example, but not limited to, an IC circuit) to a printed circuit board 300, so as to electrically connect the chip module 200 and the printed circuit board 300. The low-cost high-frequency electrical connector 100 of the present invention includes an insulating base 10 and a plurality of spring terminals 20, and the number of the spring terminals 20 corresponds to the specification of the low-cost high-frequency electrical connector 100 of the present invention, which is well known in the actual production, and therefore will not be described here.

As shown in fig. 3 and 4, the insulating base 10 is provided with mounting through holes 11 that are equal to the number of the spring terminals 20 and are spaced apart from each other, preferably, in fig. 1 and 2, the mounting through holes 11 are arranged in a matrix with equal intervals, so that the interval between two adjacent mounting through holes 11 on the insulating base 10 is smaller, but not limited thereto; the spring terminals 20 are mounted in the mounting through holes 11, and preferably, each spring terminal 20 is mounted in a corresponding one of the mounting through holes 11, and the plating layer 30 is plated on the hole wall 111 of the mounting through hole 11 to be in contact with the spring terminal 20 in the mounting through hole 11. As shown in fig. 3 to 7, the mounting through hole 11 includes a large hole section 11a and small hole sections 11b respectively located at two opposite ends of the large hole section 11a, the spring terminal 20 is preferably an integral structure, the spring terminal 20 includes a flexible deformation section 20a capable of elastic flexible deformation and a contact section 20b respectively extending from two ends of the flexible deformation section 20a, the flexible deformation section 20a is located in the large hole section 11a, and the two contact sections 20b are located in the small hole sections 11b, that is, in fig. 3, the upper contact section 20b is located in the upper small hole section 11b, and the lower contact section 20b is located in the lower small hole section 11b, so that the upper contact section 20b and the chip module 200 are kept in tight contact under the action of the flexible deformation section 20a, thereby achieving the purpose of no-welding between the chip module 200 and the upper contact section 20b, and simultaneously, the lower contact section 20b and the printed circuit board 300 are kept in tight contact, the purpose of avoiding soldering between the printed circuit board 300 and the contact section 20b below is achieved; and the hole walls 111a at the two ends of the large hole section 11a commonly prevent the spring terminal 20 from sliding out of the installation through hole 11, specifically, the end of the telescopic deformation section 20a is commonly prevented by the hole walls 111a at the two ends of the large hole section 11a, so as to ensure the working reliability of the spring terminal 20 in the installation through hole 11. Specifically, in fig. 3 and 4, the mounting through hole 11 runs through the insulating base 10 from top to bottom, and the design makes the spring terminal 20 in the mounting through hole 11 electrically connect the chip module 200 to the printed circuit board 300 from top to bottom of the insulating base 10, on the one hand, the utility model discloses a low-cost high-frequency electric connector 100 is made thinner from top to bottom, and on the other hand, improves the utility model discloses a low-cost high-frequency electric connector 100 assembles the ease. It should be noted that, according to the actual requirement, an opening at one end of the mounting through hole 11 may be disposed on the upper end surface or the lower end surface of the insulating base 10, and an opening at the other end is disposed on the side surface of the insulating base 10, and correspondingly, the spring terminal 20 is designed to be "L" shaped, so as to achieve the purpose of electrically connecting the chip module 200 to the printed circuit board 300 by the low-cost high-frequency electrical connector 100 of the present invention; in addition, according to actual needs, the upper contact section 20b can be used for electrically connecting with the printed circuit board 300, and correspondingly, the lower contact section 20b can be used for electrically connecting with the chip module 200, so the description is not limited thereto. More specifically, the following:

as shown in fig. 1, fig. 3 and fig. 4, the insulation base 10 includes a first insulation base 10a and a second insulation base 10b stacked and assembled along the up-down direction of the insulation base 10, and the joint surface 12 of the first insulation base 10a and the second insulation base 10b divides the large hole section 11a, i.e. the joint surface 12 of the first insulation base 10a and the second insulation base 10b divides the large hole section 11a into an upper part and a lower part, so the design has the advantage that the assembly operation of the spring terminal 20 on the insulation base 10 is easier, and the assembly cost of the whole low-cost high-frequency electrical connector 100 is further reduced. Specifically, in fig. 1 and fig. 2, the insulation base 10 further includes a fastening member 10c and a positioning member 10d, the fastening member 10c is simultaneously inserted into the first insulation base 10a and the second insulation base 10b along the vertical direction of the insulation base 10, the fastening member 10c is further distributed on the periphery of the spring terminal 20, on one hand, the fastening member is staggered from the spring terminal 20 to avoid the influence on the arrangement of the spring terminal 20, and on the other hand, the fastening member is used for fixing the first insulation base 10a and the second insulation base 10b together; the positioning element 10d is simultaneously inserted into the first insulating base 10a and the second insulating base 10b along the vertical direction of the insulating base 10, and preferably, the positioning element 10d is located in the middle of two opposite sides of the insulating base 10, so as to improve the assembly accuracy and efficiency by means of the positioning element 10 d. For example, the positioning member 10d and the fastening member 10c may be pin members, but not limited thereto.

As shown in fig. 5, the telescopic deformation section 20a is a leaf spring, which is designed to: under the same size, the wire diameter can be made thicker, so that the resistance of the material is reduced. Specifically, the telescopic deformation section 20a is a waveform that is formed by a cylindrical wire rod and makes the center line C1 of the wire rod bend and extend periodically in the same plane P, for example, in a period, the waveform includes a semi-arc peak and a semi-arc valley, and the two are combined together to just enclose a complete circle. More specifically, the contact section 20b is a linear structure with the central line C1 in the same plane P, so that the overall shape of the spring terminal 20 is also sheet-shaped, and the transmission and lead-in and lead-out of high-frequency signals are more reliable, and the contact section 20b is easily protruded from the small hole section 11b and is disposed on the insulating base 10, thereby facilitating the electrical contact between the upper contact section 20b and the chip module 200, and the electrical contact between the lower contact section 20b and the printed circuit board 300; for example, the cross section of the contact section 20b is circular, that is, the contact section 20b and the telescopic deformation section 20a are wound by the same cylindrical wire, as shown in fig. 5 and 7, which results in a lower cost, better compression and longer life of the spring terminal 20, but not limited thereto; the waveform is, for example, but not limited to, an "S" shape.

As shown in fig. 8, another embodiment of the spring terminal in the low-cost high-frequency electrical connector of the present invention is shown. In fig. 8, the spring terminal 40 includes a flexible deformation section 40a capable of elastic deformation and a contact section 40b extending from each of two ends of the flexible deformation section 40a, and the flexible deformation section 40a is located in the large hole section 11a, so that the end of the flexible deformation section 40a is blocked by the hole walls 111a of the two end portions of the large hole section 11 a; while each of the two contact sections 40b is located in the well section 11b, i.e. in fig. 8 the upper contact section 40b is located in the upper well section 11b, while the lower contact section 40b is located in the lower well section 11 b. Specifically, the telescopic deformation section 40a is a spiral structure, and the two contact sections 40b are linear structures parallel to the center line C2 of the spiral structure, so that the contact sections 40b can easily extend out of the small hole section 11b and protrude on the insulating base 10, and the transmission and lead-in or transmission and lead-out of the high-frequency signal are more reliable, thereby facilitating the electrical contact between the upper contact section 40b and the chip module 200, and the electrical contact between the lower contact section 40b and the printed circuit board 300; for example, the cross section of the contact section 40a and the contact section 40b are circular, that is, the contact section 40b and the contact section 40a are wound by the same cylindrical wire, which results in a lower cost, a better compression and a longer life of the spring terminal 40, but not limited thereto.

As shown in fig. 9, another embodiment of the spring terminal of the low-cost high-frequency electrical connector of the present invention is shown. In fig. 9, the spring terminal 50 includes a flexible deformation section 50a capable of elastic flexible deformation and a contact section 50b extending from each of two ends of the flexible deformation section 50a, and the flexible deformation section 50a is located in the large hole section 11a, so that the end of the flexible deformation section 50a is blocked by the hole walls 111a of the two end portions of the large hole section 11 a; one of the two contact sections 50b is located in the small hole section 11b, and the other of the two contact sections 50b is located in the large hole section 11a, that is, in fig. 9, the upper contact section 50b is located in the upper small hole section 11b, and the lower contact section 50b is located in the large hole section 11a, so that the upper contact section 50b extends out from the upper small hole section 11b and is protruded above the insulating base 10, and the lower contact section 50b is hidden in the insulating base 10 and is exposed from the lower small hole section 11 b. Specifically, the telescopic deformation section 50a is a spiral structure, one (e.g., the upper) of the two contact sections 50b is a straight line structure parallel to the center line C3 of the spiral structure, so that the upper contact section 50b can easily extend out from the small hole section 11b, and the transmission and the leading-out of the high-frequency signal are more reliable, while the other (e.g., the lower) of the two contact sections 50b can be a spiral structure; for example, the cross section of the contact section 50a and the contact section 50b are circular, that is, the contact section 50b and the contact section 50a are wound by the same cylindrical wire, which results in a lower cost, a better compression and a longer life of the spring terminal 50, but not limited thereto.

As shown in fig. 10, another embodiment of the spring terminal of the low-cost high-frequency electrical connector of the present invention is shown. In fig. 10, the spring terminal 60 includes a flexible deformation section 60a capable of elastic flexible deformation and a contact section 60b extending from each of two ends of the flexible deformation section 60a, and the flexible deformation section 60a is located in the large hole section 11a, so that the end of the flexible deformation section 60a is blocked by the hole walls 111a of the two end portions of the large hole section 11 a; while each of the two contact sections 60b is located in the bore section 11b, i.e. in fig. 10 the upper contact section 60b is located in the upper bore section 11b and the lower contact section 60b is located in the lower bore section 11 b. Specifically, the telescopic deformation section 60a and the contact section 60b are respectively of a spiral structure, and the spiral diameter of the telescopic deformation section 60a is larger than that of the contact section 60b, so that the contact section 60b is conveniently extended out of the small hole section 11b, and the telescopic deformation section 60a is blocked and limited by hole walls 111a at two ends of the large hole section 11 a; for example, the cross-section of the contact section 60a and the contact section 60b is circular, that is, the contact section 60b and the contact section 60a are wound by the same cylindrical wire, which results in a lower cost, better compression and longer life of the spring terminal 60, but not limited thereto.

Compared with the prior art, because the electroplated layer 30 is electroplated on the hole wall 111 of the installation through hole 11 and keeps contact with the spring terminal 20(40, 50, 60) in the installation through hole 11, and the installation through hole 11 comprises the large hole section 11a and the small hole sections 11b respectively located at two opposite ends of the large hole section 11a, the spring terminal 20(40, 50, 60) comprises the elastic deformation section 20a (40a, 50a, 60b) which can elastically deform, and the contact section 20b (40b, 50b, 60b) respectively extending from two ends of the elastic deformation section 20a (40a, 50a, 60a), the elastic deformation section 20a (40a, 50a, 60a) is located in the large hole section 11a, at least one of the two contact sections 20b (40b, 50b, 60b) is located in the small hole section 11b, and the rest of the two contact sections 20b (40b, 50b, 60b) is located in the large hole section 11a, the hole walls 111a at the two ends of the large hole section 11a jointly prevent the spring terminal 20 from sliding out of the mounting through hole 11; therefore, when one contact section 20b (40b, 50b, 60b) is electrically contacted with the chip module 200 and the other contact section 20b (40b, 50b, 60b) is electrically contacted with the printed circuit board 300, a high-frequency signal is transmitted and guided through the contact section 20b (40b, 50b, 60b), then is guided through the plating layer 30 and finally is guided into the other contact section 20b (40b, 50b, 60b), because the high-frequency signal is guided out of the conductor surface, the flexible deformation section 20b (40b, 50b, 60b) can be avoided, the high-frequency performance is greatly improved, and the requirement of high-frequency signal transmission is met; meanwhile, by the plating layer 30 in the installation through hole 11, the current transmission paths (i.e., the number) are increased, and the current transmission distance is shortened, so that the overall resistance is reduced, and the advantage of low resistance is achieved; further, the spring terminal 20(40, 50, 60) is formed in an integral structure, so that the spring terminal 20(40, 50, 60) does not need to be assembled, and thus the cost is lower than that of a probe (in which a needle tube, a needle shaft and a spring need to be assembled together), and the cost of parts and assembly cost of the probe can be saved.

It should be noted that, when the installation through hole 11 penetrates the insulation base 10 up and down, the telescopic deformation section 20a (40a, 50a, 60a) is telescopic deformed along the up-down direction of the insulation base 10; when the opening at one end of the installation through hole 11 is disposed on the upper end surface or the lower end surface of the insulation base 10 and the opening at the other end is disposed on the side surface of the insulation base 10, the telescopic deformation section 20a (40a, 50a, 60a) is subjected to telescopic deformation along the direction of "L"; in addition, since the plating layer 30 is used for transmitting high frequency signals, the plating layer 30 is formed of a material having a high frequency signal transmission function, such as, but not limited to, gold, copper, or the like; meanwhile, since the plating layer 30 is provided so as to avoid the transmission of the high-frequency transmission signal to the expansion/contraction deformation section 20a (40a, 50a, 60b), the plating layer 30 is applied to the entire hole wall 111 of the installation through-hole 11, or the plating layer 30 is applied to the entire hole wall 111 of the large hole section 11 a.

The above disclosure is only a preferred embodiment of the present invention, and certainly should not be limited thereto, since the equivalent changes and modifications of the present invention are intended to fall within the scope of the present invention.

Claims (10)

1. A low-cost high-frequency electric connector can electrically connect a chip module to a printed circuit board, and comprises an insulating base body and a plurality of spring terminals, wherein the insulating base body is provided with mounting through holes which are equal to the spring terminals in number and are separated from each other, the spring terminals are mounted in the mounting through holes, and the electric connector is characterized in that an electroplated layer which is in contact with the spring terminals in the mounting through holes is electroplated on the hole wall of the mounting through holes, the mounting through holes comprise large hole sections and small hole sections which are respectively positioned at two opposite ends of the large hole sections, the spring terminals comprise telescopic deformation sections which can elastically and telescopically deform and contact sections which respectively extend from two tail ends of the telescopic deformation sections, the telescopic deformation sections are positioned in the large hole sections, at least one of the two contact sections is positioned in the small hole sections, and the rest of the two contact sections are positioned in the large hole sections, the hole walls of the two end parts of the large hole section commonly prevent the spring terminal from sliding out of the mounting through hole.

2. A low cost, high frequency electrical connector as in claim 1 wherein said mounting through holes extend up and down through said insulative housing.

3. A low cost, high frequency electrical connector according to claim 2, wherein said insulating housing comprises a first insulating housing and a second insulating housing stacked and assembled in a vertical direction of said insulating housing, and a joint surface of said first insulating housing and said second insulating housing cuts said large hole section.

4. A low-cost high-frequency electrical connector according to claim 3, wherein the insulating base further comprises a fastening member and a positioning member, the fastening member is simultaneously inserted into the first insulating base and the second insulating base along the vertical direction of the insulating base, the fastening member is further distributed around the spring terminal, and the positioning member is simultaneously inserted into the first insulating base and the second insulating base along the vertical direction of the insulating base.

5. A low cost, high frequency electrical connector according to claim 1, wherein said spring terminals are of a one-piece construction.

6. A low cost high frequency electrical connector according to claim 1, wherein said telescopically deformable section is a leaf spring structure.

7. A low cost, high frequency electrical connector as claimed in claim 6, wherein said flexible deformation section is a wave shape formed by a cylindrical wire and having its center line bent and extended periodically in the same plane.

8. A low cost, high frequency electrical connector as in claim 7 wherein said contact section is a straight line configuration with a centerline in the same plane, said contact section being circular in cross-section.

9. A low cost, high frequency electrical connector as in claim 1 wherein said flexible deformation section is a helical structure and at least one of said contact sections is a straight line structure parallel to the centerline of said helical structure.

10. The low cost, high frequency electrical connector of claim 1, wherein said flexible deformation section and said contact section are each of a helical configuration, said flexible deformation section having a helical diameter greater than a helical diameter of said contact section.

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