CN212129811U - Heated board bonding mould - Google Patents
Heated board bonding mould Download PDFInfo
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- CN212129811U CN212129811U CN202020332658.3U CN202020332658U CN212129811U CN 212129811 U CN212129811 U CN 212129811U CN 202020332658 U CN202020332658 U CN 202020332658U CN 212129811 U CN212129811 U CN 212129811U
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Abstract
The embodiment of the utility model discloses a bonding mould for an insulation board, which comprises a mould frame, the upper surface of which can be placed on the back surface of the insulation board, a template is arranged inside the mold frame, the template is provided with connecting ribs connected with the inner side of the mold frame, a square frame groove surrounding the outer side of the template is formed between the mould frame and the template, the inner part of the template, which is close to the two sides, is provided with first limit holes which are distributed at equal intervals, the transverse central axis of the template is provided with a second limit hole and a third limit hole, the part of the back surface of the template coated with the adhesive is positioned by the template which covers the heat-insulation board, and bonding points which are distributed at equal intervals can be formed by controlling the distribution quantity and the positions of the circular bonding surface on the back surface of the insulation board, therefore, the heat-insulation board can be adhered by using a point-frame method, the thickness of the adhesive can be guaranteed, and the requirements of different bonding areas can be accurately met.
Description
Technical Field
The embodiment of the utility model provides a relate to building engineering technical field, concretely relates to heated board bonding mould.
Background
The insulation board is a board for providing insulation for a building, when the insulation board is adhered, a polymer adhesive is coated on the back of the insulation board, and the area of the coated polymer adhesive is not less than 40% of the area of the insulation board according to the regulation in relevant standards.
When pasting the heated board on basic unit's wall body, the pasting of heated board should adopt the point frame method to paste, according to the building type of difference, the bonding area is usually not less than 40%, 50% and 60%, and at outer heat retaining job site, generally carry out approximate estimation to the region of paining of heated board by the workman, paint the adhesive comparatively at will, the thickness of not only adhesive is paintd unevenly, and the area of paining of adhesive is inaccurate, the heated board that probably leads to pasting easily drops, and it is slower only to rely on the construction speed of artifical judgement coating volume.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides an heated board bonding mould to thickness and area are paintd to the artifical mode of paining the adhesive of solving among the prior art and are difficult to keep accurate problem.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
the utility model provides an heated board bonding mould, can place the mould frame at the heated board back including the upper surface, the inside of mould frame is equipped with the template, be equipped with in the template with the splice bar that the mould frame inboard is connected, the mould frame with form between the template and encircle "mouth" sub-type frame groove in the template outside, the inside of template is close to the first spacing hole that both sides position was equipped with the equidistance and distributes, be equipped with spacing hole of second and the spacing hole of third on the horizontal the central axis of template.
As a preferred embodiment of the present invention, the first limiting holes, the second limiting holes and the third limiting holes have the same diameter, the number of the first limiting holes is six, and the six first limiting holes are uniformly distributed on two sides of the template; the number of the second limiting holes is two, and the two second limiting holes are distributed at two ends of the template; the two third limiting holes are distributed between the two groups of second limiting holes at equal intervals.
As an optimized scheme of the utility model, the mould frame the template with the thickness of splice bar is the same, first spacing hole the spacing hole of second with the spacing hole of third all link up the template.
As an optimized proposal of the utility model, the width of the frame groove is 80mm-100mm, and the distance between the first limit hole and the second limit hole is 10mm-12mm away from the frame groove.
As a preferred scheme of the utility model, the splice bar is in the intermediate position of template one side, and the width of splice bar is 30mm-32 mm.
The utility model discloses an embodiment has following advantage:
the utility model discloses a template that covers the heated board is fixed a position to its back paint the position of adhesive to circular adhesive surface distribution quantity and position through the control heated board back can form the adhesive point that the equidistance distributes, consequently can use some frame methods to paste the heated board, not only can ensure the thickness of painting the adhesive, can accurately satisfy different bonding area requirements moreover.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is an overall plan view of an embodiment of the present invention;
fig. 2 is a partial side sectional view of an embodiment of the present invention.
In the figure: 1-a mould frame; 2-template; 3-connecting ribs; 4-frame groove; 5-a first limiting hole; 6-a second limiting hole; 7-third limiting hole.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 and 2, the utility model provides an insulation board bonding mould specifically includes that the upper surface can be placed at the mould frame 1 at the insulation board back, and the inside of mould frame 1 is equipped with template 2, is equipped with the splice bar 3 of being connected with 1 inboard of mould frame on the template 2, forms "mouthful" sub-type frame groove 4 around the 2 outsides of template between mould frame 1 and the template 2, and the inside of template 2 is close to the first spacing hole 5 that both sides position was equipped with the equidistance and distributes, is equipped with spacing hole 6 of second and the spacing hole 7 of third on the horizontal the central axis of template 2.
The connecting ribs 3 are arranged at the middle position of one side of the template 2, and the width of the connecting ribs 3 is 30mm-32 mm.
During construction, the insulation board is horizontally placed on the ground, the mold is placed on the insulation board, the mold frame 1 is aligned with the outer side of the insulation board, an adhesive is coated in the frame groove 4, then the adhesive is coated in the first limiting hole 5, the second limiting hole 6 and the third limiting hole 7 according to the specific requirements of the insulation board connection area, the insulation board is more easily attached to the wall, and the bonding strength of the insulation board is guaranteed.
In addition, when the heat insulation board coated with the adhesive is attached to a wall, the adhesive forms an air outlet of 30-32 mm at the position of the connecting rib 3, so that the air inside the heat insulation board is conveniently discharged when the heat insulation board is attached, and the heat insulation board is prevented from protruding and cracking the wall surface.
The diameters of the first limiting holes 5, the second limiting holes 6 and the third limiting holes 7 are the same, the number of the first limiting holes 5 is six, and the six first limiting holes 5 are uniformly distributed on two sides of the template 2; the number of the second limiting holes 6 is two, and the two second limiting holes 6 are distributed at two ends of the template 2; the two third limiting holes 7 are distributed between the two groups of second limiting holes 6 at equal intervals.
The thickness of the die frame 1, the thickness of the die plate 2 and the thickness of the connecting rib 3 are the same, and the first limiting hole 5, the second limiting hole 6 and the third limiting hole 7 are all communicated with the die plate 2.
The bonding area is generally not less than 40%, 50% and 60% according to different building types, and the following steps are divided according to the requirement of the bonding area:
(1) when the bonding area is not less than 40%, the adhesive at least fills the frame groove 4 and the two third limiting holes 7;
(2) when the bonding area is required to be not less than 50%, the frame groove 4, the two second limiting holes 6 and the two third limiting holes 7 are at least filled with the adhesive;
(3) when the bonding area is required to be not less than 60%, the adhesive at least needs to fill the frame groove 4, the six first limiting holes 5, the two second limiting holes 6 and the two third limiting holes 7.
The position of smearing the adhesive on the back of the template 2 through covering the insulation board is positioned, and the number and the position of the adhesive surface on the back of the insulation board are controlled, so that the adhesive points distributed at equal intervals can be formed, the insulation board can be pasted by using a point frame method, the thickness of the adhesive can be guaranteed to be smeared, and the requirements of different adhesive areas can be accurately met.
The width of the frame groove 4 is 80mm-100mm, and the distance between the first limiting hole 5 and the second limiting hole 6 and the frame groove is 410mm-12 mm.
Through the adhesive that paints at frame groove 4, can paint the bonding face of encircleing the heated board on the heated board accurately, ensured heated board bonding effect, in addition, the adhesive that paints in the spacing downthehole does not communicate with the adhesive in frame groove 4, has ensured that the heated board can form the tie point connection wall of multipoint formula, has strengthened the joint strength of heated board and wall, has reduced the probability that the heated board dropped.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (5)
1. The utility model provides an heated board bonding mould which characterized in that: can place mould frame (1) at the insulating board back including the upper surface, the inside of mould frame (1) is equipped with template (2), be equipped with on template (2) with splice bar (3) that mould frame (1) inboard is connected, mould frame (1) with form between template (2) and encircle "mouth" sub-type frame groove (4) in template (2) outside, the inside of template (2) is close to the first spacing hole (5) that both sides position was equipped with the equidistance and distributes, be equipped with spacing hole of second (6) and third spacing hole (7) on the horizontal the central axis of template (2).
2. The insulation board bonding die according to claim 1, wherein the first limiting holes (5), the second limiting holes (6) and the third limiting holes (7) have the same diameter, the number of the first limiting holes (5) is six, and the six first limiting holes (5) are uniformly distributed on two sides of the template (2); the number of the second limiting holes (6) is two, and the two second limiting holes (6) are distributed at two ends of the template (2); the two third limiting holes (7) are distributed between the two groups of second limiting holes (6) at equal intervals.
3. The insulation board bonding mold according to claim 1, wherein the mold frame (1), the mold plate (2) and the connecting ribs (3) have the same thickness, and the first limiting hole (5), the second limiting hole (6) and the third limiting hole (7) all penetrate through the mold plate (2).
4. The insulation board bonding mold according to claim 1, wherein the width of the frame groove (4) is 80mm-100mm, and the distance between the first limiting hole (5) and the second limiting hole (6) and the frame groove (4) is 10mm-12 mm.
5. The insulation board bonding mold according to claim 1, wherein the connecting rib (3) is located at a middle position of one side of the template (2), and the width of the connecting rib (3) is 30mm-32 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020332658.3U CN212129811U (en) | 2020-03-17 | 2020-03-17 | Heated board bonding mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020332658.3U CN212129811U (en) | 2020-03-17 | 2020-03-17 | Heated board bonding mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212129811U true CN212129811U (en) | 2020-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020332658.3U Active CN212129811U (en) | 2020-03-17 | 2020-03-17 | Heated board bonding mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212129811U (en) |
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2020
- 2020-03-17 CN CN202020332658.3U patent/CN212129811U/en active Active
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