CN212112396U

CN212112396U - Liquid cooling refitting structure in notebook computer

Info

Publication number: CN212112396U
Application number: CN202021322116.4U
Authority: CN
Inventors: 胡艺
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2020-12-08
Anticipated expiration: 2030-07-08

Abstract

The utility model discloses an internal liquid cooling repacking structure of notebook computer, including notebook computer casing and liquid cooling copper, the inside of notebook computer casing is provided with central processing chip, the top surface coating of central processing chip has the silicone grease, the liquid cooling copper includes lower copper and upper copper, the top surface of lower copper and the bottom surface reflow soldering welded fastening of upper copper, set up the backward flow hole between lower copper and the upper copper, the inside surface of the backward flow hole of lower copper has seted up the microchannel, lower copper covers and fixes the top surface at the silicone grease, the heat radiation fins of notebook computer casing has seted up the mounting groove in the side that is close to central processing chip, the both ends mouth of backward flow hole is all seted up in the side that the liquid cooling copper is close to the mounting groove; through the upper copper plate, the lower copper plate and the backflow holes, the notebook computer can operate without noise under the condition that the original air cooling is not sacrificed, and can operate quietly when the notebook computer is connected with the water feeding pipe and the liquid cooling outer unit at home.

Description

Liquid cooling refitting structure in notebook computer

Technical Field

The utility model belongs to the technical field of the liquid cooling heat dissipation, the inside liquid cooling repacking structure of concretely relates to notebook computer.

Background

The cooling device of the notebook computer in the market at present basically utilizes various fans to carry out heat dissipation and cooling, however, generally speaking, the liquid cooling heat dissipation adopted in engineering can achieve good heat dissipation and cooling effects and can achieve the purpose of saving energy, and the liquid cooling inside the notebook computer in the market at present still has various defects and can not meet the requirements of production and life.

For example, in the conventional liquid cooling modification of the notebook computer, a hollow copper pipe is additionally welded on an original heat pipe, and the defects that the heat pipe does not directly contact the surfaces of cpu and gpu, the heat is taken away, and the heat dissipation is insufficient are solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a structure is reequiped to the inside liquid cooling of notebook computer to solve the current notebook liquid cooling repacking that proposes in the above-mentioned background art and weld on original heat pipe and install hollow copper pipe additional, the shortcoming is for not having direct contact cpu and gpu surface, takes away be the heat pipe heat, the not abundant problem of heat dissipation inadequately.

In order to achieve the above object, the utility model provides a following technical scheme: the liquid cooling refitted structure in the notebook computer comprises a notebook computer shell and a liquid cooling copper plate, wherein a central processing chip is arranged in the notebook computer shell, the top surface of the central processing chip is coated with silicone grease, the liquid cooling copper plate comprises a lower copper plate and an upper copper plate, the top surface of the lower copper plate and the bottom surface of the upper copper plate are welded and fixed in a reflow soldering mode, a reflow hole is formed between the lower copper plate and the upper copper plate, a micro-water channel is formed in the inner surface of the reflow hole of the lower copper plate, the lower copper plate is fixed on the top surface of the silicone grease in a covering mode, a mounting groove is formed in the side face, close to the central processing chip, of each radiating fin of the notebook computer shell, two ports of the reflow hole are formed in the side face, close to the mounting groove, of the liquid cooling copper plate, a water nozzle is fixedly, the pneumatic male head is arranged inside the mounting groove, a water pipe is arranged outside a port of the pneumatic male head, a pneumatic female head is fixedly connected to the end of the water pipe, the pneumatic female head is fixedly connected with the pneumatic male head, and the other end of the water pipe is fixedly connected with an external liquid cooling machine.

Preferably, the inner wall of the port of the water nozzle is fixedly connected with an internal thread, the outer side of the inner end of the pneumatic male head is fixedly connected with an external thread, and the external thread and the internal thread are screwed and sealed.

Preferably, the water injection well choke is at the port outside fixedly connected with sealing rubber pad of backward flow hole, the inner wall fixedly connected with rubber cushion pad of pneumatic public head and mounting groove.

Preferably, the thickness of the liquid-cooled copper plate is 1.6-3 mm, the reflux holes are arranged in an S shape in the liquid-cooled copper plate, and the top surface of the upper copper plate is paved and fixed with the heat pipe.

Compared with the prior art, the beneficial effects of the utility model are that:

through the last copper sheet of design, lower copper and backward flow hole, it installs hollow copper pipe additional to have solved current notebook liquid cooling repacking to weld on original heat pipe, the shortcoming is for not having direct contact cpu and gpu surface, it is the heat pipe heat to take away, the not abundant problem of heat dissipation inadequately, let notebook computer can the noiselessness operation under the condition of not sacrificing original forced air cooling, it just can quiet operation to connect the water-feeding pipe even to go up the outer machine of liquid cooling at home or dormitory, go school or company, can directly pull out the water pipe and just go away, do not lose the advantage of its mobility.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the liquid-cooled copper plate mounting structure of the present invention;

FIG. 3 is a schematic sectional view of the mounting groove of the present invention;

fig. 4 is a schematic view of the water nozzle connection structure of the present invention.

In the figure: 1. a notebook housing; 2. a liquid-cooled external unit; 3. a water pipe; 4. mounting grooves; 5. a water nozzle; 6. a lower copper plate; 7. a return orifice; 8. sealing the rubber pad; 9. a heat pipe; 10. an upper copper plate; 11. silicone grease; 12. a central processing chip; 13. a cushion rubber pad; 14. a pneumatic male head; 15. an external thread; 16. an internal thread.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the liquid cooling refitting structure in the notebook computer comprises a notebook computer shell 1 and a liquid cooling copper plate, wherein a central processing chip 12 is arranged in the notebook computer shell 1, the top surface of the central processing chip 12 is coated with silicone grease 11, the shape of the liquid cooling copper plate is obtained by scanning the internal situation by a 3D scanner and then drawing, the precision of the 3D scanner is 0.05mm, so the size of the thickness depends on whether the internal situation of the notebook computer is compact, the maximum thickness of the copper plate which can be borne by the internal space of the notebook computer can be perfectly obtained by using the accurate drawing scanned by the 3D scanner, the liquid cooling copper plate comprises a lower copper plate 6 and an upper copper plate 10, the top surface of the lower copper plate 6 and the bottom surface of the upper copper plate 10 are fixed in a reflow welding mode, the thickness of the copper plate is 1.6-3 mm, a reflow hole 7 is formed between the lower copper plate 6 and the upper copper plate 10, the inner surface of a return hole 7 of a lower copper plate 6 is provided with a micro water channel, the contact area of water flow and the lower copper plate 6 is effectively increased by the micro water channel, the return hole 7 is arranged in an S shape in the liquid-cooled copper plate, the proportion of the return hole 7 in the liquid-cooled copper plate is increased, the heat dissipation capacity of the liquid-cooled copper plate is improved, the lower copper plate 6 is covered and fixed on the top surface of silicone grease 11, the top surface of an upper copper plate 10 is paved and fixed with a heat pipe 9, the side surface of a heat dissipation fin of a notebook shell 1, which is close to a central processing chip 12, is provided with a mounting groove 4, the shell can be undamaged, the surface has no damage trace, two ports of the return hole 7 are both arranged on the side surface close to the mounting groove 4 of the liquid-cooled copper plate, the outer port of the return hole 7 is fixedly connected with a water nozzle 5, the inner wall, threaded connection is not only good and the cost is lower, water injection well choke 5 is at the outside fixedly connected with sealing rubber pad 8 of port of backward flow hole 7, the pneumatic public head 14 of terminal fixedly connected with of water injection well choke 5, pneumatic public head 14 sets up the inside at mounting groove 4, the inner wall fixedly connected with cushion rubber pad 13 of pneumatic public head 14 and mounting groove 4, the port outside of pneumatic public head 14 is provided with water pipe 3, the pneumatic female head of tip fixedly connected with of water pipe 3, pneumatic female head and the pneumatic public head 14 fixed connection, the outer machine 2 of other end fixedly connected with liquid cooling of water pipe 3.

The utility model discloses a theory of operation and use flow: after the device installation is accomplished, water pipe 3 cup joints fixedly with pneumatic public head 14, outer machine 2 drive rivers of liquid cooling pass through water pipe 3 and water injection well choke 5 get into inside the backward flow hole 7 of liquid cooling copper, rivers absorb the heat of copper 6 down in the inside circulation of liquid cooling copper through backward flow hole 7, the rivers of absorption heat flow out by another backward flow hole 7 port under the promotion of follow-up rivers, the inside heat of notebook computer is taken away in the inside incessant fast circulation of liquid cooling copper to rivers, let notebook computer can the noiseless operation under the condition of not sacrificing original forced air cooling, it just can the quiet running to connect outer machine of liquid cooling to go on at home or dormitory water-supply line 3, go school or company, can directly pull out water pipe 3 and just go, do not lose its advantage of mobility.

And the water injection well choke of cominging in and going out can install in notebook gap department, also can install in the place (like usb interface, HDMI interface etc.) after dismantling the original interface of notebook.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Inside liquid cooling repacking structure of notebook computer, including notebook casing (1) and liquid cooling copper, its characterized in that: the notebook computer shell comprises a notebook computer shell (1), wherein a central processing chip (12) is arranged inside the notebook computer shell (1), silicone grease (11) is coated on the top surface of the central processing chip (12), the liquid cooling copper plate comprises a lower copper plate (6) and an upper copper plate (10), the top surface of the lower copper plate (6) is fixedly welded with the bottom surface of the upper copper plate (10) in a reflow soldering mode, a reflow hole (7) is formed between the lower copper plate (6) and the upper copper plate (10), a micro water channel is formed in the inner surface of the reflow hole (7) of the lower copper plate (6), the lower copper plate (6) is fixedly covered on the top surface of the silicone grease (11), a mounting groove (4) is formed in the side face, close to the central processing chip (12), of the heat dissipation fins of the notebook computer shell (1), two end ports of the reflow hole (7) are arranged in the side face, close to the mounting groove (4), and a water nozzle (5), the pneumatic water faucet is characterized in that a pneumatic male head (14) is fixedly connected to the tail end of the water faucet (5), the pneumatic male head (14) is arranged inside the mounting groove (4), a water pipe (3) is arranged outside a port of the pneumatic male head (14), a pneumatic female head is fixedly connected to the end portion of the water pipe (3), the pneumatic female head is fixedly connected with the pneumatic male head (14), and the other end of the water pipe (3) is fixedly connected with a liquid cooling outer machine (2).

2. The internal liquid-cooled modified structure of a notebook computer as claimed in claim 1, wherein: the port inner wall fixed connection of water injection well choke (5) has internal thread (16), the inner outside fixed connection of pneumatic public head (14) has external screw thread (15), external screw thread (15) close with internal thread (16) soon and seal.

3. The internal liquid-cooled modified structure of a notebook computer as claimed in claim 1, wherein: the water injection well choke (5) is at the outside fixedly connected with sealing rubber pad (8) of the port of backward flow hole (7), pneumatic public head (14) and the inner wall fixedly connected with cushion rubber pad (13) of mounting groove (4).

4. The internal liquid-cooled modified structure of a notebook computer as claimed in claim 1, wherein: the thickness of the liquid cooling copper plate is 1.6-3 mm, the backflow holes (7) are arranged in the liquid cooling copper plate in an S shape, and the top surface of the upper copper plate (10) is paved and fixed with the heat pipes (9).