CN212013449U - Conductive adhesive film - Google Patents
Conductive adhesive film Download PDFInfo
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- CN212013449U CN212013449U CN201922490680.0U CN201922490680U CN212013449U CN 212013449 U CN212013449 U CN 212013449U CN 201922490680 U CN201922490680 U CN 201922490680U CN 212013449 U CN212013449 U CN 212013449U
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- adhesive film
- electromagnetic wave
- conductive adhesive
- absorbing material
- conductive
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Abstract
The utility model discloses a conductive adhesive film, which comprises a conductive adhesive film body and an electromagnetic wave absorbing material; the conductive adhesive film body is provided with the electromagnetic wave absorption material. The utility model provides a conductive adhesive film can absorb electromagnetic wave signal's electromagnetic wave absorbing material and possess electromagnetic wave interference resistance's ability through the setting to can solve the electromagnetic wave interference problem between two devices through its connection.
Description
Technical Field
The utility model relates to an electron technical field especially relates to a conductive adhesive film.
Background
The conductive adhesive film is a lead-free connecting material, which provides mechanical and electrical connection between the components and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.
At present, the existing conductive adhesive film is generally prepared by mixing a large amount of conductive particles in the adhesive, so that the conductive adhesive film can provide mechanical connection and electrical connection simultaneously; in practical application, the conductive adhesive film is adhered between the conductors, and one surface of the conductive adhesive film is adhered to one of the conductors, and the other surface of the conductive adhesive film is adhered to the other conductor, so that the conduction between the conductors is realized.
However, in the process of implementing the invention, the inventor finds that the prior art has at least the following problems: the existing conductive adhesive film does not have the function of preventing electromagnetic wave interference, so that when the conductive adhesive film is applied, the conductive adhesive film cannot solve the problem of electromagnetic wave interference between two devices connected through the conductive adhesive film. For example, when an element is connected to a wiring board via a conductive film, an electromagnetic wave signal generated on the wiring board may interfere with the element.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a conductive adhesive film, which has the ability of preventing electromagnetic interference by absorbing electromagnetic signals, so as to solve the problem of electromagnetic interference between two devices connected by the conductive adhesive film.
In order to achieve the above object, an embodiment of the present invention provides a conductive adhesive film, which includes a conductive adhesive film body and an electromagnetic wave absorbing material; the conductive adhesive film body is provided with the electromagnetic wave absorption material; the whole conductive adhesive film body provided with the electromagnetic wave absorption material is conductive.
As an improvement of the scheme, the conductive adhesive film body is internally provided with a hole; the electromagnetic wave absorbing material is arranged in the opening.
As an improvement of the above scheme, the opening penetrates through the upper surface and the lower surface of the conductive adhesive film body.
As an improvement of the scheme, the open holes are round holes, square holes, polygonal holes or special-shaped holes.
As an improvement of the scheme, a cavity is arranged in the conductive adhesive film body, and the electromagnetic wave absorption material is arranged in the cavity.
As an improvement of the scheme, the number of the cavities is multiple, and the multiple cavities are uniformly or non-uniformly distributed in the conductive adhesive film body.
As an improvement of the above, the electromagnetic wave absorbing material is in the form of particles.
As a modification of the above, the electromagnetic wave absorbing material has conductivity.
As an improvement of the above scheme, the electromagnetic wave absorbing material is arranged on the surface of the conductive adhesive film body or in the conductive adhesive film body in a layered manner.
As an improvement of the above aspect, the electromagnetic wave absorption rate of the layer structure of the electromagnetic wave absorbing material increases in the first direction; the first direction is a direction from the lower surface of the conductive adhesive film body to the upper surface thereof, or a direction from the upper surface of the conductive adhesive film body to the lower surface thereof.
As an improvement of the above, the layer structure includes at least two electromagnetic wave absorption sublayers laminated in sequence and having different electromagnetic wave absorption rates.
As a modification of the above, the concentration of the electromagnetic wave absorbing material in the layer structure gradually increases in the first direction.
As an improvement of the above scheme, the electromagnetic wave absorbing material is a conductive metal, a conductive sponge, a conductive plastic or a conductive rubber.
As an improvement of the scheme, the electromagnetic wave absorbing material is a carbon-series wave absorbing material, an iron-series wave absorbing material, a ceramic-series wave absorbing material or a composite wave absorbing material.
Compared with the prior art, the embodiment of the utility model provides a conductive adhesive film, through set up on the conductive adhesive film body the electromagnetic wave absorbing material, like this the electromagnetic wave absorbing material can absorb the arrival the electromagnetic wave signal of conductive adhesive film, like this conductive adhesive film has the electromagnetic wave absorptive capacity to can solve the electromagnetic wave interference problem between two devices through its connection.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, and obviously, the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first conductive adhesive film according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second conductive adhesive film according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a third conductive adhesive film according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fourth conductive adhesive film according to an embodiment of the present invention;
reference is made to the accompanying drawings in which: 1. a conductive adhesive film body; 10. opening a hole; 11. a cavity; 2. an electromagnetic wave absorbing material.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the specification and claims, it is to be understood that the terms "upper", "lower", "inner", "outer", and the like, are used in an orientation or positional relationship based on that shown in the drawings, which is for convenience of description of the embodiments of the present invention, and do not indicate or imply that the referenced devices or components must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present invention.
Referring to fig. 1 to 4, an embodiment of the present invention provides a conductive adhesive film, which includes a conductive adhesive film body 1 and an electromagnetic wave absorbing material 2; the conductive adhesive film body 1 is provided with the electromagnetic wave absorption material 2; wherein the conductive adhesive film body 1 provided with the electromagnetic wave absorbing material 2 has conductivity as a whole. In addition, the electromagnetic wave absorbing material 2 has a function of absorbing electromagnetic waves, which is capable of absorbing electromagnetic wave energy projected to its surface and converting the electromagnetic waves into heat energy or other forms of energy by means of dielectric loss or the like.
The utility model discloses in implementing, through set up on the conductive adhesive film body 1 electromagnetic wave absorbing material 2, like this electromagnetic wave absorbing material 2 can absorb the arrival conductive adhesive film's electromagnetic wave signal, like this conductive adhesive film has the electromagnetic wave absorptive capacity to can solve the electromagnetic wave interference problem between two devices through its connection.
It is understood that the conductive adhesive film body 1 may be made by mixing a large amount of conductive particles in an adhesive. In addition, the electromagnetic wave absorbing material 2 is disposed on the conductive adhesive film body 1 in the following manner: the conductive capability of the conductive adhesive film body 1 is not obviously affected, but the conductive capability of the conductive adhesive film body 1 can meet the conductive requirement between two devices connected through the conductive adhesive film body. For example, if the electromagnetic wave absorbing material 2 has no conductivity, the electromagnetic wave absorbing material is disposed on the conductive adhesive film body 1, which does not make the conductive adhesive film body 1 have no conductivity. As an example, referring to fig. 1, when the electromagnetic wave absorbing material 2 has no electric conductivity and is mixed in the conductive adhesive film body 1 by a dispersed manner, the requirement of the maximum concentration of the electromagnetic wave absorbing material 2 in the conductive adhesive film body 1 is: the conductive adhesive film body 1 does not have the conductive capability.
In this embodiment, the conductive adhesive film body 1 may have a single-layer structure or a multi-layer structure, and is not limited herein.
In the present embodiment, exemplarily referring to fig. 2, as one of the arrangement manners in which the electromagnetic wave absorbing material 2 is arranged in the conductive adhesive film body 1: the conductive adhesive film body 1 is internally provided with an opening 10; the electromagnetic wave absorbing material 2 is disposed in the opening 10.
In the embodiment, the opening 10 is formed on the conductive adhesive film body 1, and the electromagnetic wave absorbing material 2 is disposed (in a filling manner) inside the opening 10, so that the electromagnetic wave absorbing material 2 can be effectively fixed in the conductive adhesive film body 1, and the electromagnetic wave absorbing material 2 can effectively absorb the electromagnetic wave signal reaching the conductive adhesive film body 1.
In addition, the conductive adhesive film of the prior art has a certain thickness and poor air permeability, and when the temperature of the surrounding environment where the conductive adhesive film is located is high, the conductive adhesive film is prone to generate gas (some component materials of the conductive adhesive film generate gas at high temperature), so that the conductive adhesive film is slightly or even seriously deformed, and the conductive connection capability of the conductive adhesive film between two devices is reduced. In this embodiment, the hole 10 is formed in the conductive adhesive film body 1, and the electromagnetic wave absorbing material 2 is disposed in the hole 10, so that the conductive adhesive film body 1 has an electromagnetic wave absorbing capability, and the conductive adhesive film body 1 has a certain air permeability, thereby preventing the conductive adhesive film from being deformed due to gas generated in a high-temperature environment, so as to prevent the conductive adhesive film from being reduced in conductive connection capability between two devices.
For example, referring to fig. 2, the opening 10 penetrates through the upper surface and the lower surface of the conductive adhesive film body 1, and may also penetrate through two opposite side surfaces of the conductive adhesive film.
By way of example, the opening 10 may be a circular hole, a square hole, a polygonal hole, a special-shaped hole, or the like, and is not particularly limited herein.
Illustratively, the openings 10 are uniformly or non-uniformly distributed on the conductive adhesive film body 1.
In the present embodiment, exemplarily referring to fig. 3, as another arrangement manner in which the electromagnetic wave absorbing material 2 is disposed in the conductive adhesive film body 1: the conductive adhesive film body 1 is internally provided with a cavity 11, and the electromagnetic wave absorption material 2 is arranged in the cavity 11.
In the embodiment, the cavity 11 is disposed on the conductive adhesive film body 1, and the electromagnetic wave absorbing material 2 is disposed (in a filling manner) inside the cavity, so that the electromagnetic wave absorbing material 2 can be effectively fixed in the conductive adhesive film body 1, and the electromagnetic wave absorbing material 2 can effectively absorb the electromagnetic wave signal reaching the conductive adhesive film body 1. In addition, the air permeability of the conductive adhesive film body 1 can be improved to a certain degree, so that the conductive adhesive film can be prevented from being reduced in conductive connection capacity between two devices due to deformation caused by gas generated under a high-temperature environment to a certain degree.
It is understood that the cavity 11 may be closed, or may be semi-open (i.e. the opening of the cavity 11 may be open to the outside of the conductive adhesive film body 1), and the like, and is not limited in this respect. When the cavity 11 is closed, the electromagnetic wave absorbing material 2 can be stably fixed in the shielding layer, and is not easy to fall off. When the cavity 11 is semi-open, the air permeability of the conductive adhesive film body 1 can be improved. It should be noted that, no matter whether the cavity 11 is closed or semi-open, the air permeability may be better than that of the conductive adhesive film without the cavity 11.
Illustratively, the number of the cavities 11 may be one or more. When the conductive adhesive film body is a plurality of cavities 11, the cavities 11 are uniformly or non-uniformly distributed in the conductive adhesive film body 1.
The electromagnetic wave absorbing material 2 may be disposed in the conductive adhesive film body 1 in other manners, such as: referring to fig. 1, the conductive adhesive film is directly dispersed in the conductive adhesive film body 1.
In the above embodiment, the electromagnetic wave absorbing material 2 is, for example, in the form of particles. This facilitates the electromagnetic wave absorbing material 2 to be provided in the electro-conductive adhesive film body 1. For example, the electromagnetic wave absorbing material 2 is conveniently disposed in the opening 10 or the cavity 11. The granular electromagnetic wave absorbing material 2 may be in the shape of a sphere, a cluster, an ice, a stalactite, a tree, or the like, but is not particularly limited thereto. Of course, the electromagnetic wave absorbing material 2 may be in the form of a hollow tube, a sheet, or the like, in addition to the granular form, and is not particularly limited herein.
In the above embodiment, further, the electromagnetic wave absorbing material 2 has conductivity. Thus, the electromagnetic wave absorbing material 2 is arranged in the conductive adhesive film body 1, which does not affect the conductive capability of the conductive adhesive film and can make the conductive adhesive film have the electromagnetic wave absorbing capability.
As an example, referring to fig. 4, the electromagnetic wave absorbing material 2 is provided in a layered manner on the surface of the conductive adhesive film body 1 or within the conductive adhesive film body 1. This enables the conductive film body 1 to have a better electromagnetic wave absorption capability (for example, compared to the electromagnetic wave material disposed dispersedly), and the conductive capability of the conductive film is not affected, and also facilitates the electromagnetic wave absorbing material 2 to be disposed on the conductive film body 1 (for example, compared to the electromagnetic wave absorbing material 2 disposed dispersedly, it is more convenient to dispose in a layered manner).
The electromagnetic wave absorbing material 2 is disposed on the conductive adhesive film body 1 in a layered manner, and the manner may be: the surface of the conductive adhesive film body 1 is directly coated with a layer of electromagnetic wave absorbing material 2, or a layer of the manufactured electromagnetic wave absorbing material 2 may be placed on the conductive adhesive film body 1, which is not limited herein.
Further, the layer of the electromagnetic wave absorbing material 2 may have a single-layer structure or a multi-layer structure, and is not particularly limited herein. When the electromagnetic wave absorbing material 2 layers have a multilayer structure, the electromagnetic wave absorption rates of the electromagnetic wave absorbing material 2 layers may be the same or different.
Further, the electromagnetic wave absorption rate of the layer structure of the electromagnetic wave absorption material 2 increases in the first direction; the first direction is a direction from the lower surface of the conductive adhesive film body 1 to the upper surface thereof, or a direction from the upper surface of the conductive adhesive film body 1 to the lower surface thereof.
In this embodiment, the electromagnetic wave absorption rate of the layer structure is gradually increased in the first direction, so that the electromagnetic wave signal can be absorbed step by step, the electromagnetic wave signal reaching the conductive adhesive film can be effectively absorbed, and the electromagnetic wave signal is prevented from penetrating through the conductive adhesive film in the vertical direction.
As an example, the layer structure includes at least two electromagnetic wave absorption sub-layers (not shown) that are sequentially stacked and have different electromagnetic wave absorption rates.
As another example, the concentration of the electromagnetic wave absorbing material in the layer structure gradually increases in the first direction.
The electromagnetic wave absorbing material 2 is, for example, a conductive metal, a conductive sponge, a conductive plastic, a conductive rubber, or the like, and is not particularly limited herein.
In the above embodiment, the electromagnetic wave absorbing material 2 may also be composed of an adhesive and a wave absorbing medium. The wave-absorbing medium is composed of any one of a carbon-series wave-absorbing material, an iron-series wave-absorbing material, a ceramic-series wave-absorbing material and a composite wave-absorbing material. It should be noted that the carbon-based wave-absorbing material includes, but is not limited to, graphene, graphite, carbon black, carbon fiber, and carbon nanotube; the iron-based wave absorbing material comprises but is not limited to ferrite, a magnetic iron nano material, Fe-based alloy micro powder and an iron-based amorphous material; the ceramic-series wave-absorbing material comprises but is not limited to silicon carbide; the composite wave-absorbing material comprises but is not limited to a composite material formed by blending reduced graphene oxide/tin dioxide nano composite wave-absorbing material, manganese zinc ferrite/polypyrrole composite material, three-dimensional silver-graphene hybrid foam/epoxy resin composite material, rG0/Fe304@ Si02 composite material and soft magnetic powder and high molecular plastic. In addition, the wave absorbing medium can also be a conductive polymer, a chiral material, a plasma material, a porous hollow iron nanosphere, a self-skinning polyurethane lightweight material, a hollow sandwich microsphere metal sulfide and the like. Of course, the electromagnetic wave absorbing material 2 can also be a carbon-based wave absorbing material, an iron-based wave absorbing material, a ceramic-based wave absorbing material or a composite wave absorbing material.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are all covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (14)
1. A conductive adhesive film is characterized by comprising a conductive adhesive film body and an electromagnetic wave absorption material; the conductive adhesive film body is provided with the electromagnetic wave absorption material; the whole conductive adhesive film body provided with the electromagnetic wave absorption material is conductive.
2. The conductive adhesive film as claimed in claim 1, wherein the conductive adhesive film body has an opening therein; the electromagnetic wave absorbing material is arranged in the opening.
3. The adhesive conductive film as claimed in claim 2, wherein the opening hole penetrates through the upper surface and the lower surface of the adhesive conductive film body.
4. The conductive adhesive film according to claim 2, wherein the opening is a circular hole, a square hole, a polygonal hole or a special-shaped hole.
5. The conductive adhesive film as claimed in claim 1, wherein a cavity is disposed in the conductive adhesive film body, and the electromagnetic wave absorbing material is disposed in the cavity.
6. The conductive adhesive film as claimed in claim 5, wherein the number of the cavities is plural, and the plural cavities are uniformly or non-uniformly distributed in the conductive adhesive film body.
7. The electroconductive adhesive film according to any one of claims 1 to 6, wherein said electromagnetic wave absorbing material is in the form of particles.
8. The electroconductive adhesive film according to any one of claims 1 to 6, wherein said electromagnetic wave absorbing material has electroconductivity.
9. The adhesive conductive film according to claim 8, wherein the electromagnetic wave absorbing material is disposed in a layered manner on a surface of the adhesive conductive film body or in the adhesive conductive film body.
10. The electro-conductive adhesive film according to claim 9, wherein the electromagnetic wave absorption rate of the layer structure of the electromagnetic wave absorbing material increases in a first direction; the first direction is a direction from the lower surface of the conductive adhesive film body to the upper surface thereof, or a direction from the upper surface of the conductive adhesive film body to the lower surface thereof.
11. The conductive adhesive film according to claim 10, wherein the layer structure comprises at least two electromagnetic wave absorption sublayers laminated in sequence and having different electromagnetic wave absorption rates.
12. The electro-conductive adhesive film according to claim 10, wherein the concentration of the electromagnetic wave absorbing material in the layer structure gradually increases in the first direction.
13. The conductive adhesive film according to claim 8, wherein the electromagnetic wave absorbing material is a conductive metal, a conductive sponge, a conductive plastic or a conductive rubber.
14. The conductive adhesive film according to claim 1, wherein the electromagnetic wave absorbing material is a carbon-based absorbing material, an iron-based absorbing material, a ceramic-based absorbing material or a composite absorbing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922490680.0U CN212013449U (en) | 2019-12-30 | 2019-12-30 | Conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922490680.0U CN212013449U (en) | 2019-12-30 | 2019-12-30 | Conductive adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212013449U true CN212013449U (en) | 2020-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922490680.0U Active CN212013449U (en) | 2019-12-30 | 2019-12-30 | Conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212013449U (en) |
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2019
- 2019-12-30 CN CN201922490680.0U patent/CN212013449U/en active Active
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