CN212006363U

CN212006363U - Semiconductor refrigeration refrigerator

Info

Publication number: CN212006363U
Application number: CN202020518459.1U
Authority: CN
Inventors: 梁绍桐; 沈万辉; 张亮; 郎红军
Original assignee: Hefei Hualing Co Ltd; Midea Group Co Ltd; Hefei Midea Refrigerator Co Ltd
Current assignee: Hefei Hualing Co Ltd; Midea Group Co Ltd; Hefei Midea Refrigerator Co Ltd
Priority date: 2020-04-09
Filing date: 2020-04-09
Publication date: 2020-11-24
Anticipated expiration: 2030-04-09

Abstract

The utility model discloses a semiconductor refrigeration refrigerator utilizes radiator unit to provide strong convection heat dissipation for the hot junction device of semiconductor refrigeration piece for the heat dissipation of the hot junction device of semiconductor refrigeration piece. Meanwhile, as the air outlets of the heat dissipation air duct are arranged in a plurality of manners, the air flow entering the heat dissipation air duct through the driving of the heat dissipation assembly is certain, and the air flow discharged from the air outlets is also certain. Compared with the structure that all air flows in the heat dissipation air duct are discharged from a single air outlet, the structure that the air is discharged through the plurality of air outlets is used, the situation that the air pressure near the single air outlet is too large can be avoided, the situation that a large amount of hot air flows to the air inlet from the air outlet due to too large air pressure difference is avoided, the heat dissipation efficiency of the hot end device of the semiconductor is improved, and the refrigeration effect is improved.

Description

Semiconductor refrigeration refrigerator

Technical Field

The utility model relates to a domestic appliance field, in particular to semiconductor refrigeration refrigerator.

Background

In the related technology, the semiconductor refrigeration refrigerator adopts the cooling fan to carry out convection cooling for the hot end of the semiconductor refrigeration piece, and because the structure of the air outlet and the air inlet of the cooling fan is unreasonable, high-temperature airflow flowing out of the air outlet flows back to the air inlet in a large quantity, so that the heat dissipation effect of the hot end of the semiconductor refrigeration piece is poor.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a semiconductor refrigeration refrigerator can improve the radiating efficiency in the hot junction of semiconductor refrigeration piece to promote refrigeration effect.

The embodiment of the utility model provides a pair of semiconductor refrigeration refrigerator, include:

the box body is provided with a heat dissipation air duct, and the heat dissipation air duct is provided with a plurality of air outlets;

the semiconductor refrigeration piece is arranged on the box body and comprises a cold end device at least partially positioned in the inner cavity of the box body and a hot end device at least partially positioned in the heat dissipation air duct;

the water tank is provided with a water outlet, and an opening of the water tank is communicated with the water outlet;

and the heat radiation assembly is used for driving the air flow to flow from the air inlet of the heat radiation air channel to the air outlet of the heat radiation air channel, and the heat radiation air channel is communicated with the opening of the water tank.

The utility model discloses a semiconductor refrigeration refrigerator has following beneficial effect at least: the heat radiation assembly is utilized to provide strong convection heat radiation for the hot end device of the semiconductor refrigeration piece, and the heat radiation of the hot end device of the semiconductor refrigeration piece is accelerated. Meanwhile, as the air outlets of the heat dissipation air duct are arranged in a plurality of manners, the air flow entering the heat dissipation air duct through the driving of the heat dissipation assembly is certain, and the air flow discharged from the air outlets is also certain. Compared with the structure that all air flows in the heat dissipation air duct are discharged from a single air outlet, the structure that the air is discharged through the plurality of air outlets is used, the situation that the air pressure near the single air outlet is too large can be avoided, the situation that a large amount of hot air flows to the air inlet from the air outlet due to too large air pressure difference is avoided, the heat dissipation efficiency of the hot end device of the semiconductor is improved, and the refrigeration effect is improved. Meanwhile, as the heat dissipation air duct is communicated with the opening of the water tank, the condensed water in the water tank is blown by hot air in the heat dissipation air duct to accelerate evaporation, so as to prevent accumulated water or the condensed water in the tank body from overflowing to the ground; meanwhile, the condensed water evaporation also cools the air flow in the heat dissipation air duct, so that the temperature at the air outlet is reduced, hot air is reduced from flowing into the air inlet, the heat dissipation efficiency of the hot end device of the semiconductor is further improved, and the refrigeration effect is improved.

In a specific embodiment, the box body further comprises a foaming layer, and the heat dissipation air duct is at least partially formed on the foaming layer.

In a particular embodiment, the heat dissipation assembly comprises at least two heat dissipation fans.

In a particular embodiment, the heat dissipation fan is an axial fan.

In a particular embodiment, the air return opening comprises a plurality of through holes arranged along the length direction of the refrigeration air duct.

In a particular embodiment, the through holes are sized in order of size from larger to smaller.

In a specific embodiment, the through hole is arranged between the cold end device and the inner cavity of the box body.

In a specific embodiment, the air inlet and the air outlet of the heat dissipation air duct are both disposed on an outer surface of the box, wherein at least one of the outer surfaces of the air outlet and the outer surface of the air inlet are oriented in different directions.

In a particular embodiment, the water tank is removably attached to the housing, the water tank forming a portion of the side wall enclosing the heat dissipation duct.

In a specific embodiment, the tank body is further provided with a slot, one end of the water tank is embedded into the slot, and the other end of the water tank is connected with the tank body through a buckle structure/magnet structure/bolt assembly.

In a specific embodiment, the water tank is also provided with a buckle handle.

In a specific embodiment, the water tank further comprises a flow guide pipe, one end of the flow guide pipe is connected with the water outlet, and the other end of the flow guide pipe extends into the water tank.

In a specific embodiment, the air inlet and the air outlet are both provided with a filter screen.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a rear side view of a semiconductor refrigeration refrigerator according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is an enlarged view at A in FIG. 2;

fig. 4 is an elevation view of the inner cavity of the semiconductor refrigerator according to the embodiment of the present invention;

fig. 5 is a bottom view of the semiconductor refrigerator according to the embodiment of the present invention.

Reference numerals;

a box body 100, an inner container 110, an inner cavity 111, a water outlet 112, a foaming layer 120, a shell 130 and a slot 131;

hot side device 210, cold side device 220;

the water tank 300, the handle 310 and the buckle structure 320;

a heat dissipation air duct 400, an air outlet 410, an air inlet 420, and a heat dissipation fan 430;

a cooling air duct 500, an air return opening 510, an air supply opening 520, and a cooling fan 530;

through-holes 540, screen 600.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explanation and should not be construed as limiting the invention.

In the description of the present invention, it should be understood that the positional descriptions, such as the directions or positional relationships indicated above, below, front, rear, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. In the description of the present invention, a plurality means two or more. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

In the related art, a semiconductor refrigeration refrigerator adopts a semiconductor refrigeration sheet as a heat pump, and uses the Peltier effect of semiconductor materials, so that when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be achieved. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability. Herein, the side of the semiconductor refrigeration sheet absorbing heat is referred to as a cold-end device, the side of the semiconductor refrigeration sheet emitting heat is referred to as a hot-end device, and a heat sink is generally disposed on the hot-end device, and a fan is used to provide strong convection for the hot-end device to dissipate heat.

However, since the heat dissipation air duct generally used for dissipating heat of the hot end device is only provided with a single air inlet and a single air outlet, and the air outlet and the air inlet are close to each other, negative pressure is formed at the air inlet of the heat dissipation fan, and surrounding natural airflow flows to the air inlet due to air pressure difference. Meanwhile, hot air in the heat dissipation air duct is exhausted from the same air outlet, so that the air pressure near the air outlet is large, a large air pressure difference is formed between the air outlet and the air inlet, a large amount of hot air paths flow back to the air inlet from the air outlet, and the heat dissipation efficiency of the hot end device is reduced.

Based on this, the embodiment of the utility model provides a semiconductor refrigeration refrigerator has set up a plurality of air outlets for the radiating air duct to reduce the atmospheric pressure of every air outlet department, reduced the atmospheric pressure difference between each air outlet and the air intake, reduced hot-blast backward flow air intake, improved the radiating efficiency of the hot junction device of semiconductor refrigeration piece, from having promoted refrigeration effect. Meanwhile, the water tank is arranged for receiving condensed water dripping from the inside of the box body, the heat dissipation air channel is communicated with the opening of the water tank, namely, hot air in the heat dissipation air channel flows through the opening of the water tank to be in contact with the condensed water in the water tank, evaporation of the condensed water in the water tank is accelerated, and an evaporation system is provided for the refrigerator to prevent accumulated water in the box body or water in the water tank from overflowing to the ground. Meanwhile, the temperature of the air flow in the heat dissipation air duct is reduced during water evaporation, which is equivalent to the reduction of the temperature of the air flow at the air outlet, the temperature of the air flow flowing back to the air inlet from the air outlet is reduced, and the heat dissipation efficiency of the hot end device is improved, so that the refrigeration effect is improved.

The following provides many different embodiments or examples for implementing different features of the invention.

The dotted centers with arrows in fig. 1 to 3 indicate the airflow direction in the heat dissipation duct 400; the dotted line with arrows in fig. 2 indicates the direction of air flow in the cooling air duct 500.

Referring to fig. 1 and 2, in one embodiment, there is provided a semiconductor refrigeration refrigerator including: the refrigerator comprises a box body 100, wherein a refrigerating air duct 500 and a heat dissipation air duct 400 are arranged on the box body 100, the refrigerating air duct 500 is provided with an air return opening 510 and an air supply opening 520, and the heat dissipation air duct 400 is provided with an air inlet 420 and a plurality of air outlet 410; the semiconductor refrigeration piece is arranged on the box body 100 and comprises a cold end device 220 at least partially positioned in the refrigeration air duct 500 and a hot end device 210 at least partially positioned in the heat dissipation air duct 400; a water tank 300, wherein a water outlet 112 is arranged on the tank body 100, and the opening of the water tank 300 is communicated with the water outlet 112; and a heat dissipating assembly for driving an air flow from an air inlet 420 of the heat dissipating air duct 400 to an air outlet 410 of the heat dissipating air duct 400, the heat dissipating air duct 400 being communicated with the opening of the water tank 300.

It should be noted that the box 100 includes an inner container 110, a foaming layer 120 wrapped outside the inner container 110, and an outer shell 130 wrapped outside the foaming layer 120, the inner container 110 has an inner cavity 111 (i.e., the inner cavity 111 of the box 100) for accommodating articles to be stored at a low temperature, and the outer shell 130 is used for wrapping the foaming layer 120 and is generally made of a metal or plastic sheet. A refrigerating air duct 500 is arranged in the inner cavity 111 of the box liner, at least part of the cold-end device 220 of the semiconductor refrigerating sheet is positioned in the refrigerating air duct 500, a refrigerating fan 530 is arranged in the refrigerating air duct 500, the refrigerating air duct 500 is communicated with the inner cavity 111 of the liner 110, the refrigerating fan 530 drives the air flow in the inner cavity 111 to enable the air flow to pass through the air return opening 510 and flow through the cold-end device 220, then the air flow is sent out from the air supply opening 520, the transmission of the cold energy in the inner cavity 111 is realized, and the articles needing low-temperature preservation are stored in the inner cavity 111; referring to the refrigeration air duct 500 in fig. 2, a mode that the air return opening 510 is arranged at the lower part and the air supply opening 520 is arranged at the upper part is adopted, the refrigeration air duct 500 sends out the gas with lower temperature after refrigeration exchange from the air supply opening 520, the goods in the inner cavity 111 are refrigerated in the process of sinking the gas, the air return opening 510 sucks in the gas with higher temperature from the lower part, the refrigeration exchange is carried out through the cold end device 220, and then the gas is sent out from the air supply opening 520 to form a circulation passage.

It should be noted that the inner container 110 is wrapped with a foaming layer 120 for heat preservation at the periphery of the inner cavity 111, and when the foaming layer 120 grows, an installation space is avoided between the inner container 110 and the outer shell 130, and the semiconductor refrigeration sheet is installed in the installation space. Similarly, a plurality of pipes (not shown) may be disposed in the area where the foam layer 120 grows as a part of the heat dissipation air duct 400, one end of each pipe is connected to the installation space, and the other end of each pipe is connected to the housing 130 as an air outlet 410, and is disposed as far as possible from the air inlet 420 of the heat dissipation air duct 400. For example, when the heat dissipation assembly is also installed in the installation space, the opening of the installation space becomes the air inlet 420 of the heat dissipation air duct 400, and the heat dissipation assembly drives the air flow to blow from the air inlet 420 to the hot end device 210 and then to discharge from each duct.

It should be noted that the heat dissipation assembly may be implemented by a device for driving airflow, such as a cross-flow wind wheel, a vortex fan, and the like.

Since the air flow is liquefied to form condensed water when it is cooled, the condensed water is easily generated in the inner cavity 111, especially when the air flow in the inner cavity 111 enters the cooling air duct 500 and contacts the cold-end device 220. In order to avoid water accumulation in the inner cavity 111, a water outlet 112 is provided at the bottom of the inner container 110, the bottom of the cooling air duct 500 is communicated with the water outlet 112, the cooling air duct 500 and the condensed water in the inner cavity 111 are discharged from the water outlet 112, and a water tank 300 for receiving the dropped condensed water is provided below the water outlet 112. The cooling air duct 500 is connected to the water outlet 112, so that the discharge of the condensed water in the inner cavity 111 is accelerated, and the water accumulation in the inner cavity 111 is avoided.

In order to open the air outlet 410 of the duct forming the heat dissipation air duct 400 to the water tank 300, the water tank 300 is further provided with a through hole communicating with the atmosphere for discharging the water vapor and the air flow of the heat dissipation air duct 400. The evaporation of the condensed water is accelerated by using the hot air of the heat dissipation air duct 400, and the water in the water tank 300 can be prevented from overflowing to the ground.

In this embodiment, the plurality of exhaust ports are provided to reduce the air pressure at each exhaust port, so that the flow rate of hot air flowing back to the air inlet of the heat dissipation air duct 400 from the exhaust port of the heat dissipation air duct 400 is reduced, the heat dissipation efficiency of the hot end device 210 is improved, and the refrigeration effect of the refrigerator is improved.

As shown in fig. 2, in an embodiment of the semiconductor refrigeration refrigerator, the box 100 further includes a foaming layer 120, and the heat dissipation duct 400 is at least partially formed on the foaming layer 120.

It should be noted that the box body 100 is wrapped with a foaming layer 120 for heat preservation at the periphery of the inner cavity 111, and the foaming layer 120 avoids an installation space when growing, and the semiconductor refrigeration piece is installed in the installation space. Similarly, the foaming layer 120 avoids the space of the heat dissipation air channel 400 during growth, the heat dissipation air channel 400 is directly formed on the foaming layer 120, and the housing 130 is provided with a plurality of air outlets 410 communicated with the heat dissipation air channel 400. The heat dissipation assembly is also installed in the installation space, the mouth of the installation space becomes the air inlet 420 of the heat dissipation air duct 400, the heat dissipation assembly drives the air flow to blow from the air inlet 420 to the hot end device 210, and then the air flow is exhausted from the air outlet 410 of the housing 130. The heat dissipation air duct 400 is formed on the foaming layer 120, so that the structure of the refrigerator is simplified, and the production and the manufacture are convenient.

It should be noted that the water tank 300 is a container for receiving condensed water, and the foaming layer 120 avoids a space for installing the water tank 300 when growing, or the space between the water tanks 300 is installed in the heat dissipation air duct 400, so that the condensed water in the water tank 300 is dried by distillation quickly when hot air passes through the water tank 300, and the water in the water tank 300 can be prevented from overflowing to the ground.

As shown in fig. 2, in one embodiment, a semiconductor refrigeration refrigerator is provided, and the heat dissipation assembly includes at least two heat dissipation fans 430.

It should be noted that the heat dissipation fan 430 may be a cross-flow wind wheel, a vortex fan, or other devices for driving airflow, and more fans may be provided to increase the airflow entering the heat dissipation air duct 400, so as to accelerate the heat removal from the hot end device 210. However, the air pressure at the air inlet 420 of the heat dissipation air duct 400 is also lower, and in order to avoid the further increase of the air pressure difference between the air outlet and the air inlet 420, which causes more hot air to flow back into the heat dissipation air duct 400, more air outlets 410 should be provided and the air outlets 410 should be further away from the air inlet 420.

Further, the heat dissipation fan 430 is an axial flow fan. When the axial flow fan is operated, the blades push air to flow in the same direction as the shaft, so the axial flow fan is called. Compared with a cross-flow wind wheel and a vortex fan, the axial flow fan has larger air volume, so that the heat dissipation of the hot end device 210 can be further accelerated, and the refrigeration effect of the refrigerator is improved.

Further, the return air opening 510 includes a plurality of through holes 540 arranged along the length direction of the cooling air duct 500. In the channel formed by the cooling air duct 500, the flow direction of the whole air flow is the same as the length direction of the cooling air duct 500; since the through holes 540 are arranged in the direction of the flow of the air stream and are more than one in number, more air in the inner cavity 111 can be sucked through the return air opening 510, improving the cold exchange efficiency of the cold-end device 220.

Based on the above-mentioned multi-hole design of the air return openings 510, in one embodiment, the sizes of the through holes 540 are arranged in order from large to small. In this embodiment, the size of the through hole 540 is gradually changed, and the direction of the size change of the through hole 540 may be different according to the requirement of refrigeration, for example, referring to fig. 4, the position of the air supply outlet 520 is higher than that of the air return outlet 510, and based on this design, the size of the through hole 540 is gradually reduced from bottom to top, which is beneficial for the air return outlet 510 to suck more air in the inner cavity 111 with higher temperature, that is, the air in the inner cavity 111 is uniformly sucked at all positions above, in the middle and below the cold-end device 220; for another example, the size of the through hole 540 gradually decreases from the left side to the right side of the refrigerator, and the through hole 540 is arranged at a position across two temperature independent compartments, so that the through hole 540 can consider the cold exchange requirement of the two compartments; the arrangement of the through holes 540 may have more patterns, which are not repeated herein for saving space; it is understood that the shape of the through holes 540 also has various patterns, for example, the through holes 540 are round holes, square holes or special-shaped holes; by adjusting the number and size of the through holes 540, different refrigeration requirements can be met.

In one embodiment, the through hole 540 is disposed between the cold end device 220 and the inner cavity 111 of the box 100. Cold junction device 220 has the cold junction fin that is used for improving cold volume exchange efficiency, the cold junction fin is the heat exchange piece that the polylith is parallel to each other, the cold junction fin is the same with the length direction in refrigeration wind channel 500, thereby do benefit to the cold junction fin of gas flow through, through-hole 540 sets up towards the cold junction fin in fact in this embodiment, air in inner chamber 111 can be through-hole 540 direct contact cold junction fin, realize cold volume quick exchange, set up the design in the cold junction fin lower part for conventional return air inlet, the structure of this embodiment can reduce the difference in temperature in semiconductor refrigeration piece cold and hot side, improve the refrigeration efficiency of semiconductor refrigeration piece, reduce the energy consumption of semiconductor refrigeration piece.

As shown in fig. 1 and 5, in an embodiment, a semiconductor refrigerator is provided, in which an air inlet 420 and an air outlet 410 of a heat dissipation air duct 400 are both disposed on an outer surface of a cabinet 100, wherein at least one air outlet 410 is disposed on an outer surface of the cabinet in a direction different from that of the air inlet 420.

In the present embodiment, the refrigerator body 100 includes the inner container 110, the foaming layer 120 wrapped around the inner container 110, and the outer shell 130 wrapped around the foaming layer 120, so that the outer surface of the refrigerator body 100 in the present embodiment is the outer surface of the outer shell 130. The cabinet 100 of the general refrigerator is a hexahedron, and thus six faces of the outer surface of the outer case 130 of the refrigerator face different directions, respectively. Compared with the case that the air inlet 420 and the air outlet 410 of the heat dissipation air duct 400 are both located on the outer surfaces of the housing 130 facing the same direction, when the air inlet 420 and the air outlet 410 of the heat dissipation air duct 400 are respectively located on the outer surfaces facing the two different directions, the distance between the air inlet 420 and the air outlet 410 is increased, and the edge angle formed by connecting the two outer surfaces further hinders the circulation of air flow between the two outer surfaces, so that the probability of hot air flowing back into the heat dissipation air duct 400 is reduced, and the heat dissipation effect is accelerated.

In this embodiment, the air outlet 410 is disposed on the bottom surface of the outer case 130 of the refrigerator, the air inlet 420 is disposed on the rear surface of the outer case 130 of the refrigerator, and the hot air discharged from the air outlet 410 is blocked by the corner formed by the bottom surface and the rear surface, thereby reducing the amount of backflow of the hot air and accelerating the heat dissipation effect.

As shown in fig. 2 and 3, in one embodiment, there is provided a semiconductor refrigerator, in which a water tank 300 is detachably coupled to a case 100, the water tank 300 constituting a portion of a sidewall for enclosing a heat dissipation duct 400.

It should be noted that the water tank 300 is detachably coupled to the tank 100, and particularly, the water tank 300 is detachably coupled to the housing 130 of the tank 100, preventing the accumulation of dirt. When the foaming layer 120 grows between the inner container 110 and the outer shell 130, a space for installing the water tank 300 is avoided, the water tank 300 is detachably connected to the outer shell 130, and the outer shell 130 is positioned at the outermost layer of the box body 100, so that the water tank can be conveniently and directly detached, taken out and cleaned.

When the heat dissipation air duct 400 is molded on the foaming layer 120, the foaming layer 120 is used to enclose the heat dissipation air duct 400, and therefore the foaming layer 120 is also used to enclose a part of the side wall of the heat dissipation air duct 400. When the heat dissipation duct 400 is implemented using a pipe, the pipe is a portion of a sidewall for enclosing the heat dissipation duct 400.

It should be noted that the water tank 300 forms a part of the side wall enclosing the heat dissipation air duct 400, and therefore, a sealing element is disposed in a gap between the water tank 300 and the housing 130, and the sealing element may be a sealing ring or a sealing strip made of rubber or silica gel, so as to prevent the air flow of the heat dissipation air duct 400 from escaping from the gap between the water tank 300 and the housing 130.

As shown in fig. 3, in an embodiment, a semiconductor refrigerator is provided, wherein a slot 131 is further disposed on the refrigerator body 100, one end of the water tank 300 is inserted into the slot 131, and the other end is connected to the refrigerator body 100 through a fastening structure 320/a magnet structure/a bolt assembly.

It should be noted that, for convenience of installation, the housing 130 of the tank 100 is provided with a slot 131, one end of the water tank 300 is inserted into the slot 131, and the other end is installed on the housing 130 by a snap structure 320. Alternatively, a magnet (not shown) is provided on the housing 130, one end of the water tank 300 is inserted into the slot 131, and the other end is fixed to the housing 130 by a magnet or iron. Alternatively, one end of the water tank 300 is inserted into the insertion groove 131, and the other end is fixedly coupled to the housing 130 by a bolt assembly (not shown).

In this embodiment, the slot 131 is disposed on the housing 130, so that the water tank 300 is pre-positioned on the housing 130 when being installed, and then is fixed by the fastening structure 320 or other structures such as a bolt assembly, thereby facilitating the user to disassemble and assemble.

As shown in fig. 3, a handle 310 is further provided on the water tank 300. The handle 310 is provided to facilitate the user's operation when the water tank 300 is disassembled.

In one embodiment, a semiconductor refrigerator is provided, which further comprises a flow guide tube having one end connected to the water discharge port 112 and the other end extending into the water tank 300.

It should be noted that, because the two ends of the drainage port 112 are respectively communicated with the refrigeration air duct 500 and the heat dissipation air duct 400, in order to avoid the damage of the cooling capacity of the refrigeration air duct 500 caused by the wind channeling, the drainage port 112 is connected with the drainage pipe, and the lower end of the drainage pipe extends into the water tank 300, when condensed water is accumulated in the water tank 300, the lower end of the drainage pipe is sealed by the condensed water in the water tank 300, so that the hot air in the heat dissipation air duct 400 is prevented from entering the refrigeration air duct 500 from the drainage port 112, thereby improving the refrigeration effect of the refrigerator, wherein the drainage pipe can be a plastic hose or a plastic hard.

As shown in fig. 1, in one embodiment, a semiconductor refrigerator is provided, in which a filter 600 is installed at each of an air inlet 420 and an air outlet 410.

It should be noted that, in order to avoid large-particle dust or mosquitoes from entering the heat dissipation air duct 400, the air inlet 420 and the air outlet 410 are both provided with the filter screen 600, the filter screen 600 may be a textile fiber filter screen 600, a hardware filter screen 600, or the like, and the filter screen 600 is arranged to keep the heat dissipation air duct 400 clean, so that the refrigerator is convenient to use and maintain.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the knowledge range of those skilled in the art.

Claims

1. Semiconductor refrigeration refrigerator, its characterized in that includes:

the refrigerator comprises a box body, a refrigerating air duct and a radiating air duct, wherein the box body is provided with a return air inlet and an air supply outlet, and the radiating air duct is provided with an air inlet and a plurality of air outlets;

the semiconductor refrigeration piece is arranged on the box body and comprises a cold end device at least partially positioned in the refrigeration air channel and a hot end device at least partially positioned in the heat dissipation air channel;

2. The semiconductor refrigeration refrigerator of claim 1 wherein: the box body further comprises a foaming layer, and at least part of the heat dissipation air duct is formed on the foaming layer.

3. The semiconductor refrigeration refrigerator of claim 1 wherein: the heat dissipation assembly comprises at least two heat dissipation fans.

4. The semiconductor refrigeration refrigerator of claim 1 wherein: the air return opening comprises a plurality of through holes which are arranged along the length direction of the refrigeration air duct.

5. The semiconductor refrigeration refrigerator of claim 4, wherein: the sizes of the through holes are arranged in the order from large to small.

6. The semiconductor refrigeration refrigerator of claim 4 or 5, wherein: the through hole is arranged between the cold end device and the inner cavity of the box body.

7. The semiconductor refrigeration refrigerator of claim 1 wherein: the air inlet and the air outlet of the heat dissipation air duct are both arranged on the outer surface of the box body, wherein at least one of the outer surface where the air outlet is arranged is different from the outer surface where the air inlet is arranged in orientation.

8. The semiconductor refrigeration refrigerator of claim 1 wherein: the water tank is detachably connected to the box body, and the water tank forms a part of the side wall which is used for enclosing the heat dissipation air duct.

9. The semiconductor refrigeration refrigerator of claim 8, wherein: the water tank is characterized in that a slot is further formed in the tank body, one end of the water tank is embedded into the slot, and the other end of the water tank is connected with the tank body through a buckle structure/magnet structure/bolt assembly.

10. The semiconductor refrigeration refrigerator of claim 8 or 9, characterized in that: the water tank is also provided with a buckle.

11. The semiconductor refrigeration refrigerator of claim 1 wherein: the water outlet is connected with one end of the water guide pipe, and the other end of the water guide pipe extends into the water tank.

12. The semiconductor refrigeration refrigerator of claim 1 wherein: the air intake with the filter screen is all installed to the air exit.