CN211991327U - Solder heater convenient to change solder - Google Patents

Solder heater convenient to change solder Download PDF

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Publication number
CN211991327U
CN211991327U CN201922426700.8U CN201922426700U CN211991327U CN 211991327 U CN211991327 U CN 211991327U CN 201922426700 U CN201922426700 U CN 201922426700U CN 211991327 U CN211991327 U CN 211991327U
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CN
China
Prior art keywords
solder
handle
bonding tool
heater
conveying pipeline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922426700.8U
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Chinese (zh)
Inventor
张伟平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG GLOBAL JOINING TECHNOLOGY CO LTD
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ZHEJIANG GLOBAL JOINING TECHNOLOGY CO LTD
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Publication date
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Priority to CN201922426700.8U priority Critical patent/CN211991327U/en
Application granted granted Critical
Publication of CN211991327U publication Critical patent/CN211991327U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a solder heater convenient to change solder, including handle, bonding tool and conveying pipeline, the bonding tool is installed on the handle, and the conveying pipeline is installed in the handle, be equipped with defeated material passageway in the conveying pipeline, be equipped with discharging channel in the bonding tool, the bonding tool spiro union is on the handle, defeated material passageway and discharging channel are linked together, be equipped with the material cutting part that is used for cutting off the solder wire on the handle. The utility model discloses when using different types of solder, because the partial easy adhesion is on the discharging channel inner wall of bonding tool behind the solder wire melting, when the solder of another kind type is discharged from discharging channel, two kinds of solders mix easily, the utility model discloses a change the bonding tool in order to prevent the mixture between two kinds of solders, only have a solder to discharge when guaranteeing to weld and be used for the welding.

Description

Solder heater convenient to change solder
Technical Field
The utility model relates to a solder heater technical field especially relates to a solder heater convenient to change solder.
Background
In the semiconductor industry, solder is required for fixing transistors, capacitors, chips, and the like. Generally, when soldering, a worker needs to hold the solder with one hand and the soldering device with the other hand, which is inconvenient to operate and sometimes easily burns the hand holding the solder.
Although the internal feeding type welding device is provided in the market, the welding materials in the welding device need to be discharged when different types of welding materials are replaced by the conventional internal feeding type welding device, otherwise the two welding materials are easily mixed together to influence the welding effect, so that the welding cost is greatly increased, and the welding efficiency is influenced.
Disclosure of Invention
The utility model aims at the above-mentioned problem that exists among the prior art, provide a solder heater convenient to change solder that helps practicing thrift solder, reduction welding cost.
The purpose of the utility model can be realized by the following technical proposal: the utility model provides a solder heater convenient to change solder, includes handle, bonding tool and conveying pipeline, the bonding tool is installed on the handle, and the conveying pipeline is installed in the handle, be equipped with defeated material passageway in the conveying pipeline, be equipped with discharging channel in the bonding tool, the bonding tool spiro union is on the handle, defeated material passageway and discharging channel are linked together, be equipped with the material part that cuts off solder wire on the handle.
The utility model discloses a theory of operation: when another kind of welding flux needs to be replaced, the original welding flux wire is cut off through the material cutting component, the welding head is rotated to detach the welding flux wire from the handle, then the welding flux wire needing to be replaced is inserted into the material conveying pipe to eject the previous welding flux wire, a new welding head is replaced, and the replaced welding head is cleaned for standby.
When different types of welding materials are used, the welding wire is easy to adhere to the inner wall of the discharging channel of the welding head after being melted, and when the other type of welding materials are discharged from the discharging channel, the two types of welding materials are easy to mix; the solder wire is cut off through the material cutting component, so that the solder in the conveying pipe can not be crushed along with the twisting of the welding head when the welding head is disassembled, the solder wire passing through the disassembled welding head is pushed out of the solder wire in the conveying pipe, the pushed solder wire can be used, the solder is saved, and the welding cost is reduced.
A cutting gap exists between the conveying pipe and the welding head, a cutting groove communicated with the cutting gap is formed in the handle, the cutting part comprises a welding flux cutter capable of moving back and forth in the cutting gap and the cutting groove, the welding flux cutter extends out of the outer end of the cutting groove and is connected with a pressing plate, the pressing plate is elastically connected with the handle through at least one elastic telescopic column, and the elastic telescopic column is used for driving the pressing plate to move outwards; the operator drives the solder cutter to move towards the solder wire by applying pressure to the pressing plate so as to cut off the solder wire, and after the solder wire is cut off and the operator releases the pressure applied to the pressing plate, the pressing plate can move outwards under the action of the elastic telescopic column so as to realize the reset of the solder cutter.
A microwave generator is arranged in the welding head and surrounds the discharging channel; when in welding, the microwave generator emits microwaves, and the microwaves and the heating head act on the welding flux together, so that the melting temperature of the welding flux can be reduced, and the possibility of damaging welding devices is reduced.
The outer side of the welding head is provided with a circle of temperature-resistant touch layer, an operator can hold the temperature-resistant touch layer after the welding head is used to replace the high-temperature welding head, the replacement efficiency is improved, and the welding head does not need to be replaced after being cooled.
The specific energy-saving nano microporous heat insulation material is selected as the temperature-resistant touch layer, the specific energy-saving nano microporous heat insulation material is special nano-scale inorganic refractory powder, the specific surface area is large, the contact among the nano-particles is extremely small point contact, and the thermal resistance of the point contact is very large, so that the conduction heat transfer effect of the material is very small, and the conduction heat transfer coefficient of the specific energy-saving nano-scale microporous heat insulation material is very small; a large number of nano-scale air holes are formed among the nano-particles, the average size of the nano-scale air holes is 20 nanometers, and the average thermal motion free path of molecules of static air at normal temperature is 60 nanometers, so that the air molecules are locked in the nano-air holes of the powder, the micro-convection heat transfer effect among the molecules of the static air disappears, and the normal-temperature heat conductivity coefficient of the energy-saving nano-microporous heat insulation material is lower than that of the static air; the heat transfer is mainly used for heat radiation at high temperature, and the specific infrared additive is added into the specific energy-saving nano microporous heat insulation material to stop and reflect infrared rays at high temperature, so that the radiation heat transfer effect is reduced to the lowest point, and the radiation heat transfer coefficient of the material at high temperature is reduced to the lowest value.
An observation through groove is formed in the position, corresponding to the handle and the material conveying pipe, of the handle; the observation through groove is communicated with the material conveying channel and the outside, so that an operator can directly observe the solder allowance in the material conveying channel from the outside, and the solder allowance can be timely supplemented when the solder allowance is insufficient.
An observation window is hermetically arranged in the observation through groove; prevent that the steam in the discharging channel from leading to the groove through defeated material passageway and observation and discharging from the side, if not set up the observation window, follow the easy eyeball of burning people that leads to the groove and emit from observing when observing the logical groove and observing the solder surplus from operating personnel.
The observation window is made of antifogging glass; if use ordinary glass, during the use of winter, because outside is cold, the inner wall is because bonding tool temperature is higher, and the great extremely easy fog that produces of difference in temperature between the two to influence operating personnel and observe, antifog glass can prevent effectively that the fog from producing, guarantees that operating personnel can in time look over to inside through the observation window.
Compared with the prior art, the utility model discloses when using different types of solder, because the partial easy adhesion is on the discharging channel inner wall of bonding tool behind the solder wire melting, when the solder of another kind is discharged from discharging channel, two kinds of solders mix easily, the utility model discloses a change the bonding tool in order to prevent the mixture between two kinds of solders, only have a solder to discharge when guaranteeing to weld and be used for the welding.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a cross-sectional view of the present invention;
in the figure, 1, a handle; 2. a welding head; 3. a delivery pipe; 31. a material conveying channel; 21. a discharge channel; 4. a material cutting gap; 5. cutting a cutter groove; 6. welding a cutter; 7. a pressing plate; 8. an elastic telescopic column; 9. a microwave generator; 10. a temperature-resistant touch layer; 11. observing the through groove; 12. and (4) an observation window.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
As shown in fig. 1-2, a solder heater convenient for replacing solder comprises a handle 1, a soldering head 2 and a material conveying pipe 3, wherein the soldering head 2 is installed on the handle 1, the material conveying pipe 3 is installed in the handle 1, a material conveying channel 31 is arranged in the material conveying pipe 3, a material discharging channel 21 is arranged in the soldering head 2, the soldering head 2 is screwed on the handle 1, the material conveying channel 31 is communicated with the material discharging channel 21, and a material cutting component for cutting off solder wires is arranged on the handle 1.
In a further elaboration, there is between conveying pipeline 3 and bonding tool 2 to cut material clearance 4, set up on the handle 1 with cut the cutting knife groove 5 that material clearance 4 communicates, cut the material part including can be cutting the material clearance 4 and cutting the cutting knife groove 5 in the back and forth action solder cutting knife 6, solder cutting knife 6 stretches out and is connected with in cutting the outer end in sword groove 5 and presses the pressure board 7, press the pressure board 7 through at least one elastic expansion post 8 and handle 1 elastic connection, elastic expansion post 8 is used for the drive to press the outside action of pressure board 7.
In further detail, the welding head 2 is internally provided with a microwave generator 9 surrounding the discharge channel 21, and the microwave generator is the prior art and therefore is not described in detail.
In more detail, a circle of temperature-resistant touch layer 10 is arranged on the outer side of the welding head 2, the temperature-resistant touch layer 10 is made of a special energy-saving nano microporous thermal insulation material, the special energy-saving nano microporous thermal insulation material is made of special nano inorganic refractory powder and has a huge specific surface area, the contact among nano particles is a tiny point contact, and the thermal resistance of the point contact is very large, so that the conduction heat transfer effect of the material is very small, and the conduction heat transfer coefficient of the special energy-saving nano microporous thermal insulation material is very small; a large number of nano-scale air holes are formed among the nano-particles, the average size of the nano-scale air holes is 20 nanometers, and the average thermal motion free path of molecules of static air at normal temperature is 60 nanometers, so that the air molecules are locked in the nano-air holes of the powder, the micro-convection heat transfer effect among the molecules of the static air disappears, and the normal-temperature heat conductivity coefficient of the energy-saving nano-microporous heat insulation material is lower than that of the static air; the heat transfer is mainly used for heat radiation at high temperature, and the specific infrared additive is added into the specific energy-saving nano microporous heat insulation material to stop and reflect infrared rays at high temperature, so that the radiation heat transfer effect is reduced to the lowest point, and the radiation heat transfer coefficient of the material at high temperature is reduced to the lowest value.
In a further elaboration, handle 1 and conveying pipeline 3 correspond the position department and have seted up the observation through groove 11, observe through groove 11 intercommunication conveying passageway 31 and outside, and the sealed installation has observation window 12 in the observation through groove 11, and observation window 12 chooses for use antifog glass to make.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Although terms are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims (8)

1. A solder heater convenient for replacing solder is characterized in that: including handle (1), bonding tool (2) and conveying pipeline (3), mounting on handle (1) bonding tool (2), installing in handle (1) conveying pipeline (3), be equipped with defeated material passageway (31) in conveying pipeline (3), be equipped with discharging channel (21) in bonding tool (2), bonding tool (2) spiro union is on handle (1), defeated material passageway (31) and discharging channel (21) are linked together, be equipped with the material part that cuts that is used for cutting off solder silk on handle (1).
2. A solder heater for facilitating solder replacement as claimed in claim 1, wherein: there is between conveying pipeline (3) and bonding tool (2) to cut material clearance (4), set up on handle (1) with cut cutting sword groove (5) that material clearance (4) communicate, cut the material part including can be cutting make a round trip to move solder cutting knife (6) in material clearance (4) and cutting sword groove (5), solder cutting knife (6) stretch out and are connected with in cutting sword groove (5) outer end and press pressing plate (7), press pressing plate (7) through at least one flexible post (8) and handle (1) elastic connection, flexible post (8) are used for the drive to press pressing plate (7) outwards to move.
3. A solder heater for facilitating solder replacement as claimed in claim 1, wherein: and the interior of the welding head (2) is provided with a microwave generator (9) surrounding the discharging channel (21).
4. A solder heater for facilitating solder replacement as claimed in claim 1, wherein: and a circle of temperature-resistant touch layer (10) is arranged on the outer side of the welding head (2).
5. A solder heater for facilitating solder replacement as claimed in claim 4, wherein: the temperature-resistant touch layer (10) is made of a solid energy-saving nano microporous heat-insulating material.
6. A solder heater for facilitating solder replacement as claimed in claim 1, wherein: handle (1) and conveying pipeline (3) correspond the position department and have seted up and observe logical groove (11), it leads to groove (11) intercommunication conveying passageway (31) and outside to observe.
7. A solder heater for facilitating solder replacement as claimed in claim 6, wherein: an observation window (12) is hermetically arranged in the observation through groove (11).
8. A solder heater for facilitating solder replacement as claimed in claim 7, wherein: the observation window (12) is made of antifogging glass.
CN201922426700.8U 2019-12-27 2019-12-27 Solder heater convenient to change solder Expired - Fee Related CN211991327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922426700.8U CN211991327U (en) 2019-12-27 2019-12-27 Solder heater convenient to change solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922426700.8U CN211991327U (en) 2019-12-27 2019-12-27 Solder heater convenient to change solder

Publications (1)

Publication Number Publication Date
CN211991327U true CN211991327U (en) 2020-11-24

Family

ID=73428308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922426700.8U Expired - Fee Related CN211991327U (en) 2019-12-27 2019-12-27 Solder heater convenient to change solder

Country Status (1)

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CN (1) CN211991327U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112846510A (en) * 2021-01-25 2021-05-28 上海磬采电力科技开发有限公司 Semiconductor welding head and solder spraying method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112846510A (en) * 2021-01-25 2021-05-28 上海磬采电力科技开发有限公司 Semiconductor welding head and solder spraying method

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201124

Termination date: 20211227

CF01 Termination of patent right due to non-payment of annual fee