CN211978256U

CN211978256U - Vibration testing device for integrated circuit

Info

Publication number: CN211978256U
Application number: CN202020277076.XU
Authority: CN
Inventors: 肖得运
Original assignee: 肖得运
Current assignee: Jiangsu AISI Semiconductor Technology Co.,Ltd.
Priority date: 2020-03-09
Filing date: 2020-03-09
Publication date: 2020-11-20
Anticipated expiration: 2030-03-09

Abstract

The utility model discloses a vibration testing device for integrated circuit, which belongs to the field of integrated circuits and comprises a base, wherein a driving motor is fixedly installed at the top of the base, a driving gear is fixedly sleeved on an output shaft of the driving motor, a gear sleeve is meshed outside the driving gear, a movable rod is fixedly connected to the side surface of the gear sleeve, a supporting plate is sleeved on the outer part of the movable rod in a movable manner, and a supporting rod is fixedly connected to the end part of the movable rod; this integrated circuit is with vibrations testing arrangement through setting up the mounting panel, adjusting bolt, adapter sleeve, fixed plate and slipmat, can be at the in-process of integrated circuit vibrations test, be convenient for adjust fixedly according to integrated circuit's thickness size to it has strengthened the fixed fastness of integrated circuit, has avoided integrated circuit to take place gliding problem because of inertial effect when the test, thereby has improved the stability when integrated circuit vibrations test.

Description

Vibration testing device for integrated circuit

Technical Field

The utility model belongs to the technical field of the integrated circuit, concretely relates to integrated circuit is with vibrations testing arrangement.

Background

An integrated circuit is a miniature electronic device or component, and elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates and then are packaged in a tube shell to form a miniature structure with the required circuit function, and in the production and processing processes of the integrated circuit, in order to test the welding firmness of electric elements on the integrated circuit, the integrated circuit is usually required to be tested by using a vibration device; however, most of existing vibration testing devices are not only inconvenient to adjust and fix according to the thickness of the integrated circuit, but also inconvenient to clamp and fix according to the width of the integrated circuit, so that the stability of the integrated circuit during testing is poor, and meanwhile, the vibration testing device is difficult to adapt to the integrated circuits with different sizes, so that the practicability of the vibration testing device is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a vibrations testing arrangement for integrated circuit to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a vibration testing device for an integrated circuit comprises a base, wherein a driving motor is fixedly mounted at the top of the base, a driving gear is fixedly sleeved on an output shaft of the driving motor, a gear sleeve is meshed outside the driving gear, a movable rod is fixedly connected to the side surface of the gear sleeve, a supporting plate is movably sleeved outside the movable rod, a supporting rod is fixedly connected to the end portion of the movable rod, a placing table is fixedly connected to the top of the supporting rod, the integrated circuit is arranged at the top of the placing table, a mounting plate is fixedly connected to the top of the placing table, an adjusting bolt is sleeved on the top end of the mounting plate in a threaded manner, a connecting sleeve is movably sleeved at the bottom end of the adjusting bolt, a fixing plate is fixedly connected to the bottom of the connecting sleeve, an anti-skid pad is fixedly connected to the bottom of the fixing plate, a baffle is fixedly connected to, the end part of the movable spring is fixedly connected with a clamping plate, the inner thread of the baffle is sleeved with a fixed rod, and the bottom of the clamping plate is fixedly connected with a protection pad.

As a preferred embodiment, the bottom of the supporting plate is fixedly connected with the top of the base, and the number of the supporting plates is two, and the two supporting plates are parallel to each other.

In a preferred embodiment, the external thread of the adjusting bolt is adapted to the internal thread of the mounting plate, and the adjusting bolt is located above the integrated circuit.

As a preferred embodiment, the non-slip mat is made of a rubber material, the bottom of the non-slip mat contacts with the top of the integrated circuit, and non-slip lines are formed on the contact surface of the non-slip mat and the integrated circuit.

In a preferred embodiment, the bottom end of the fixed rod is in contact with the middle of the top end of the clamping plate, and the fixed rod and the movable spring are parallel to each other.

In a preferred embodiment, the protection pad is made of a rubber material, the top of the protection pad is fixedly bonded to the bottom of the clamping plate through an adhesive, and the protection pad is in contact with the integrated circuit.

Compared with the prior art, the beneficial effects of the utility model are that:

according to the vibration testing device for the integrated circuit, by arranging the mounting plate, the adjusting bolt, the connecting sleeve, the fixing plate and the non-slip mat, the integrated circuit can be conveniently adjusted and fixed according to the thickness of the integrated circuit in the vibration testing process of the integrated circuit, the firmness of the fixing of the integrated circuit is enhanced, the problem that the integrated circuit slides due to the inertia effect in the testing process is avoided, and the stability of the integrated circuit in the vibration testing process is improved;

this integrated circuit is with vibrations testing arrangement, through setting up the baffle, the floating spring, splint and dead lever, can be at the in-process of integrated circuit vibrations test, be convenient for press from both sides tightly the fixing to it according to integrated circuit's width size, make this vibrations testing arrangement can be applicable to the integrated circuit of not unidimensional size, thereby improved this vibrations testing arrangement's practicality, and through setting up the protection pad, can press from both sides the fastening at integrated circuit regularly, utilize the elasticity performance of protection pad self, the effect of buffering protection has been played to integrated circuit's side.

Drawings

FIG. 1 is a schematic front view of the structure of the present invention;

FIG. 2 is a top view of the placement table of the present invention;

fig. 3 is a side view of the mounting plate of the present invention;

fig. 4 is a bottom schematic view of the middle mat of the present invention.

In the figure: 1. a base; 2. a drive motor; 3. a drive gear; 4. a gear sleeve; 5. a movable rod; 6. a support plate; 7. a support bar; 8. a placing table; 9. mounting a plate; 10. adjusting the bolt; 11. connecting sleeves; 12. a fixing plate; 13. a non-slip mat; 14. a baffle plate; 15. a movable spring; 16. a splint; 17. fixing the rod; 18. and (6) a protective pad.

Detailed Description

The present invention will be further described with reference to the following examples.

The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention. The condition in the embodiment can be further adjusted according to concrete condition the utility model discloses a it is right under the design prerequisite the utility model discloses a simple improvement of method all belongs to the utility model discloses the scope of claiming.

Referring to fig. 1, the present invention provides a vibration testing device for an integrated circuit, which includes a base 1, in order to provide kinetic energy for the vibration testing device, a driving motor 2 is fixedly installed on the top of the base 1, a driving gear 3 is fixedly sleeved on an output shaft of the driving motor 2, a gear sleeve 4 is engaged with the outside of the driving gear 3, a movable rod 5 is fixedly connected to the side of the gear sleeve 4, a supporting plate 6 is movably sleeved on the outside of the movable rod 5, the bottom of the supporting plate 6 is fixedly connected to the top of the base 1, the number of the supporting plates 6 is two, the two supporting plates 6 are parallel to each other, a supporting rod 7 is fixedly connected to the end of the movable rod 5, a table 8 is fixedly connected to the top of the supporting rod 7, when the driving motor 2 is opened, the driving gear 3 rotates, the gear sleeve 4 is driven to horizontally move back and forth under the engagement of the driving gear, and drives the movable rod 5 to reciprocate in the horizontal direction, thereby providing kinetic energy to the vibration testing device.

Referring to fig. 1, 2 and 3, in order to adjust and fix the thickness of the integrated circuit according to the thickness of the integrated circuit, an integrated circuit can be arranged on the top of the placing table 8, a mounting plate 9 is fixedly connected on the top of the placing table 8, an adjusting bolt 10 is sleeved at the top end of the mounting plate 9 in a threaded manner, the external thread of the adjusting bolt 10 is matched with the internal thread of the mounting plate 9, the adjusting bolt 10 is positioned above the integrated circuit, a connecting sleeve 11 is movably sleeved at the bottom end of the adjusting bolt 10, a fixing plate 12 is fixedly connected at the bottom of the connecting sleeve 11, when the integrated circuit is placed on top of the placing table 8 from below the mounting board 9, and the adjusting pin 10 is rotated, so that the adjusting pin 10 is rotationally moved down, and drives the connecting sleeve 11 to move downwards, so that the fixing plate 12 moves downwards under the driving of the connecting sleeve 11, and gradually approaches the integrated circuit, thereby being convenient for adjusting and fixing the integrated circuit according to the thickness of the integrated circuit.

Referring to fig. 1, 3 and 4, in order to enhance the firmness of the fixing of the integrated circuit, the bottom of the fixing plate 12 may be fixedly connected with the non-slip mat 13, the non-slip mat 13 is made of rubber, the bottom of the non-slip mat 13 is in contact with the top of the integrated circuit, the contact surface between the non-slip mat 13 and the integrated circuit is provided with anti-slip patterns, when the fixing plate 12 moves downward, the non-slip mat 13 is driven to move downward, the bottom of the non-slip mat 13 is in contact with the top of the integrated circuit, and the friction between the non-slip mat 13 and the integrated circuit is increased, thereby enhancing the firmness of the fixing of the integrated circuit.

Referring to fig. 1 and 2, in order to clamp and fix the integrated circuit according to the width of the integrated circuit, a baffle 14 is fixedly connected to the top of the placing table 8, a movable spring 15 is fixedly connected to the inner side of the baffle 14, a clamping plate 16 is fixedly connected to the end of the movable spring 15, a fixing rod 17 is sleeved in the baffle 14 through threads, the bottom end of the fixing rod 17 is in contact with the middle of the top end of the clamping plate 16, the fixing rod 17 and the movable spring 15 are parallel to each other, and when the fixing rod 17 is rotated, the clamping plate 16 moves under the thrust of the fixing rod 17 and gradually approaches the side face of the integrated circuit, so that the integrated circuit is clamped and fixed according to the width of the integrated circuit.

Referring to fig. 2, in order to protect the side of the integrated circuit, a protection pad 18 may be fixedly connected to the bottom of the clamping plate 16, the protection pad 18 is made of a rubber material, the top of the protection pad 18 is fixedly bonded to the bottom of the clamping plate 16 through an adhesive, the protection pad 18 contacts the integrated circuit, when the clamping plate 16 moves under the thrust of the fixing rod 17, the clamping plate 16 drives the protection pad 18 to move, so that the protection pad 18 contacts the side of the integrated circuit, and the elastic performance of the protection pad 18 itself plays a role in buffering and protecting the side of the integrated circuit.

The utility model discloses a theory of operation and use flow: firstly, an integrated circuit is placed at the top of a placing table 8 from the lower part of a mounting plate 9, an adjusting bolt 10 is rotated, the adjusting bolt 10 is rotated and moved downwards, a connecting sleeve 11 is driven to move downwards, a fixing plate 12 is driven by the connecting sleeve 11 to move downwards and gradually approach the integrated circuit, so that the integrated circuit is conveniently adjusted and fixed according to the thickness of the integrated circuit, meanwhile, when the fixing plate 12 moves downwards, an anti-skid pad 13 is driven to move downwards, the bottom of the anti-skid pad 13 is contacted with the top of the integrated circuit, the friction force between the anti-skid pad 13 and the integrated circuit is increased, the firmness of the fixing of the integrated circuit is enhanced, then, a fixing rod 17 is rotated, a clamping plate 16 is moved under the thrust action of the fixing rod 17 and gradually approaches the side of the integrated circuit, so that the integrated circuit is conveniently clamped and fixed according to the width of the integrated circuit, and splint 16 can drive protection pad 18 and take place the motion, make protection pad 18 contact with integrated circuit's side, and utilize the elastic property of protection pad 18 self to play the effect of buffering protection to integrated circuit's side, open driving motor 2 at last, make drive gear 3 take place to rotate, make tooth cover 4 take place horizontal round trip movement under drive gear 3's meshing effect, and drive movable rod 5 round trip movement on the horizontal direction, and movable rod 5 can drive bracing piece 7 and take place the motion, and place platform 8 and can take place the motion under the drive of bracing piece 7, thereby be convenient for to placing integrated circuit on the platform 8 and shake the test.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a vibrations testing arrangement for integrated circuit, includes base (1), its characterized in that: the top fixed mounting of base (1) has driving motor (2), the fixed cover that has connect drive gear (3) on the output shaft of driving motor (2), the outside meshing of drive gear (3) has tooth cover (4), the side fixedly connected with movable rod (5) of tooth cover (4), backup pad (6) have been cup jointed in the outside activity of movable rod (5), and the tip fixedly connected with bracing piece (7) of movable rod (5), the top fixedly connected with of bracing piece (7) places platform (8), the top of placing platform (8) is provided with integrated circuit, and places the top fixedly connected with mounting panel (9) of platform (8), adjusting bolt (10) has been cup jointed to the top screw thread of mounting panel (9), adapter sleeve (11) has been cup jointed in the bottom activity of adjusting bolt (10), the bottom fixedly connected with fixed plate (12) of adapter sleeve (11), the bottom fixedly connected with slipmat (13) of fixed plate (12), place top fixedly connected with baffle (14) of platform (8), the inboard fixedly connected with activity spring (15) of baffle (14), the tip fixedly connected with splint (16) of activity spring (15), the internal thread of baffle (14) has cup jointed dead lever (17), the bottom fixedly connected with protection pad (18) of splint (16).

2. The shock testing apparatus for integrated circuits according to claim 1, wherein: the bottom of backup pad (6) and the top fixed connection of base (1), and the quantity of backup pad (6) is two, two be parallel to each other between backup pad (6).

3. The shock testing apparatus for integrated circuits according to claim 1, wherein: the external thread of the adjusting bolt (10) is matched with the internal thread of the mounting plate (9), and the adjusting bolt (10) is positioned above the integrated circuit.

4. The shock testing apparatus for integrated circuits according to claim 1, wherein: the material of slipmat (13) is rubber materials, and the bottom of slipmat (13) contacts with the top of integrated circuit, the contact surface of slipmat (13) and integrated circuit has seted up anti-skidding line.

5. The shock testing apparatus for integrated circuits according to claim 1, wherein: the bottom end of the fixed rod (17) is contacted with the middle part of the top end of the clamping plate (16), and the fixed rod (17) and the movable spring (15) are parallel to each other.

6. The shock testing apparatus for integrated circuits according to claim 1, wherein: the protection pad (18) is made of rubber materials, the top of the protection pad (18) is fixedly bonded with the bottom of the clamping plate (16) through adhesive, and the protection pad (18) is in contact with the integrated circuit.