CN211966239U

CN211966239U - Dip soldering furnace for integrated circuit

Info

Publication number: CN211966239U
Application number: CN202020121393.2U
Authority: CN
Inventors: 陈水荣
Original assignee: Beijing Wangda Shijia Technology Development Co ltd
Current assignee: Beijing Wangda Shijia Technology Development Co ltd
Priority date: 2020-01-20
Filing date: 2020-01-20
Publication date: 2020-11-20
Anticipated expiration: 2030-01-20

Abstract

The utility model discloses a dip-soldering stove for integrated circuit, including the furnace body, set up the rack that is used for placing circuit board of furnace body upper end both sides is still including setting up the furnace body top is used for fixing the clamping mechanism of dip-soldering to the circuit board, and connects the moving mechanism who is used for removing it of clamping mechanism top, moving mechanism with furnace body coupling is fixed. The utility model discloses a moving mechanism, clamping mechanism's setting make the dip-soldering process of electron plate carry out self-holding, remove, dip-soldering, blowing, have improved work efficiency, have reduced artifical intensity of labour.

Description

Dip soldering furnace for integrated circuit

Technical Field

The utility model relates to a circuit board processing field especially relates to a dip-soldering stove for integrated circuit.

Background

The dip soldering is a multi-point soldering method which is widely applied to a plug-in process and an SMT red glue surface, a large amount of tin is boiled and melted by hands or machines, and a soldering surface is immersed so as to solder a soldering point. At present, the integrated circuit board is mainly placed on the object placing device of the dip soldering furnace through manual work in the dip soldering process, the object placing device integrally moves the circuit board into soldering tin, the circuit board is manually taken out, the operation process is troublesome, the labor intensity of workers is increased, and the production efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a dip soldering stove for integrated circuit just in order to solve above-mentioned problem, the utility model discloses a moving mechanism, clamping mechanism's setting make the dip soldering process of electronic plate carry out self-holding, removal, dip soldering, blowing, have improved work efficiency, have reduced artifical intensity of labour.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

the utility model provides a dip soldering stove for integrated circuit, includes the furnace body, sets up the rack that is used for placing the circuit board of furnace body upper end both sides is still including setting up the furnace body top is used for fixing the clamping mechanism who welds to the circuit board, and connects the moving mechanism who is used for moving it of clamping mechanism top, moving mechanism with the furnace body is connected fixedly.

Further setting: the moving mechanism comprises a supporting column, the supporting column is arranged at the upper end of the furnace body, a cross beam is arranged at the upper end of the supporting column, a longitudinal beam is arranged on the cross beam, a rack is arranged at the lower end of the cross beam, a gear is arranged below the rack, the gear is arranged at the output end of a first servo motor, the first servo motor is arranged at the lower end of the longitudinal beam, an electric telescopic rod is arranged at one end of the cross beam and is far away from the longitudinal beam, the electric telescopic rod is connected with a clamping mechanism, and the gear is meshed with the rack.

So set up, make first servo motor drive gear revolve, with rack toothing rotates, promote longeron removes.

Further setting: the moving mechanism comprises a supporting column, the supporting column is arranged at the upper end of the furnace body, a cross beam is arranged at the upper end of the supporting column, a longitudinal beam is arranged on the cross beam, a lead screw is arranged on the rear side of the cross beam, one end of the lead screw is connected with a second servo motor, the second servo motor is installed on the cross beam, an electric telescopic rod is arranged at one end of the cross beam, which is far away from the longitudinal beam, and is connected with the clamping mechanism, and the lead screw is in threaded connection with the longitudinal beam.

According to the arrangement, the second servo motor drives the lead screw to rotate, so that the lead screw pushes the longitudinal beam to move, and the electric telescopic rod moves the clamping mechanism up and down.

Further setting: the clamping mechanism comprises a connecting plate, hoisting motors are arranged on the front side and the rear side of the upper end of the connecting plate, a hoisting wheel is connected to the output end of the hoisting motor, a first clamping frame and a second clamping frame are connected to the front end and the rear end of the lower side of the connecting plate respectively, tension springs are arranged on the inner sides of the first clamping frame and the second clamping frame, and the hoisting wheel is connected with the first clamping frame and the second clamping frame through stay ropes.

According to the arrangement, the winch motor drives the winch wheel to rotate, the first clamping frame and the second clamping frame are opened, the tension spring tensions the inner sides of the first clamping frame and the second clamping frame, and the electronic board is clamped and fixed.

Further setting: the longitudinal beam with crossbeam sliding connection, the electric telescopic handle stiff end is fixed on the longitudinal beam, and the expansion end passes the longitudinal beam.

So set up, be convenient for the longeron carries out the adjustment of position, right clamping mechanism removes.

Further setting: the first clamping frame is connected with the second clamping frame through a pin shaft, and the first clamping frame and the second clamping frame are respectively connected with the connecting plate in a rotating mode.

So set up, be convenient for first clamping frame, between the second clamping frame and with the rotation between the connecting plate.

Compared with the prior art, the beneficial effects of the utility model are as follows:

through the arrangement of the moving mechanism and the clamping mechanism, the dip soldering process of the electronic board is automatically clamped, moved, dip soldered and discharged, the working efficiency is improved, and the labor intensity of workers is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is an isometric view of embodiment 1 of a dip soldering furnace for integrated circuits according to the present invention;

FIG. 2 is a schematic structural view of a clamping mechanism of a dip soldering furnace for integrated circuits according to the present invention;

fig. 3 is a partial schematic structural view of a moving mechanism of embodiment 1 of a dip soldering furnace for integrated circuits according to the present invention;

FIG. 4 is a schematic view of a first structure of an embodiment 2 of a dip soldering furnace for integrated circuits according to the present invention;

fig. 5 is a second structural diagram of embodiment 2 of a dip soldering furnace for integrated circuits according to the present invention.

The reference numerals are explained below:

1. a furnace body; 2. placing a rack; 3. a moving mechanism; 31. a pillar; 32. a cross beam; 33. a stringer; 34. a first servo motor; 35. a gear; 36. a rack; 37. an electric telescopic rod; 38. a lead screw; 39. a second servo motor; 4. a clamping mechanism; 41. a connecting plate; 42. a hoisting motor; 43. a hoisting wheel; 44. a first clamping frame; 45. a second clamping frame; 46. a tension spring; 47. and pulling a rope.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be further explained with reference to the accompanying drawings:

example 1

As shown in fig. 1-3, a dip soldering furnace for integrated circuits includes a furnace body 1, placing frames 2 disposed on two sides of the upper end of the furnace body 1 and used for placing circuit boards, a clamping mechanism 4 disposed above the furnace body 1 and used for fixing the dip soldering of the circuit boards, and a moving mechanism 3 connected above the clamping mechanism 4 and used for moving the circuit boards, wherein the moving mechanism 3 is fixedly connected with the furnace body 1.

Preferably: the moving mechanism 3 comprises a pillar 31, the pillar 31 is arranged at the upper end of the furnace body 1, a cross beam 32 is arranged at the upper end of the pillar 31, a longitudinal beam 33 is arranged on the cross beam 32, a rack 36 is arranged at the lower end of the cross beam 32, a gear 35 is arranged below the rack 36, the gear 35 is arranged at the output end of a first servo motor 34, the first servo motor 34 is arranged at the lower end of the longitudinal beam 33, an electric telescopic rod 37 is arranged at one end, far away from the cross beam 32, of the longitudinal beam 33, the electric telescopic rod 37 is welded with a connecting plate 41 of the clamping mechanism 4, and the gear 35 is meshed with the rack 36, so that the first servo motor 34 drives; the clamping mechanism 4 comprises a connecting plate 41, a hoisting motor 42 is arranged on the front side and the rear side of the upper end of the connecting plate 41, a hoisting wheel 43 is connected to the output end of the hoisting motor 42, a first clamping frame 44 and a second clamping frame 45 are respectively connected to the front end and the rear end of the lower side of the connecting plate 41, tension springs 46 are arranged on the inner sides of the first clamping frame 44 and the second clamping frame 45, the hoisting wheel 43 is connected with the first clamping frame 44 and the second clamping frame 45 through a stay cord 47, so that the hoisting motor 42 drives the hoisting wheel 43 to rotate to stretch the first clamping frame 44 and the second clamping frame 45, and the tension springs 46 tension the inner sides of the first clamping frame 44 and the second clamping frame 45 to clamp and fix the electronic board; the longitudinal beam 33 is connected with the cross beam 32 in a sliding manner, the fixed end of the electric telescopic rod 37 is fixed on the longitudinal beam 33, and the movable end penetrates through the longitudinal beam 33, so that the position of the longitudinal beam 33 can be conveniently adjusted, and the clamping mechanism 4 can be moved; the first clamping frame 44 is connected with the second clamping frame 45 through a pin shaft, and the first clamping frame 44 and the second clamping frame 45 are respectively connected with the connecting plate 41 in a rotating mode, so that the first clamping frame 44, the second clamping frame 45 and the connecting plate 41 can rotate conveniently.

Example 2

As shown in fig. 2, 4 and 5, a dip soldering furnace for integrated circuits comprises a furnace body 1, placing frames 2 arranged on two sides of the upper end of the furnace body 1 and used for placing circuit boards, a clamping mechanism 4 arranged above the furnace body 1 and used for fixing dip soldering the circuit boards, and a moving mechanism 3 connected above the clamping mechanism 4 and used for moving the circuit boards, wherein the moving mechanism 3 is fixedly connected with the furnace body 1.

Preferably: the moving mechanism 3 comprises a support column 31, the support column 31 is arranged at the upper end of the furnace body 1, a cross beam 32 is arranged at the upper end of the support column 31, a longitudinal beam 33 is arranged on the cross beam 32, a screw rod 38 is arranged at the rear side of the cross beam 32, one end of the screw rod 38 is connected with a second servo motor 39, the second servo motor 39 is arranged on the cross beam 32, an electric telescopic rod 37 is arranged at one end, far away from the cross beam 32, of the longitudinal beam 33, the electric telescopic rod 37 is welded with a connecting plate 41 of the clamping mechanism 4, the screw rod 38 is in threaded connection with the longitudinal beam 33, the screw rod 38 is driven to rotate through the second servo motor 39, the screw; the clamping mechanism 4 comprises a connecting plate 41, a hoisting motor 42 is arranged on the front side and the rear side of the upper end of the connecting plate 41, a hoisting wheel 43 is connected to the output end of the hoisting motor 42, a first clamping frame 44 and a second clamping frame 45 are respectively connected to the front end and the rear end of the lower side of the connecting plate 41, tension springs 46 are arranged on the inner sides of the first clamping frame 44 and the second clamping frame 45, the hoisting wheel 43 is connected with the first clamping frame 44 and the second clamping frame 45 through a stay cord 47, so that the hoisting motor 42 drives the hoisting wheel 43 to rotate to stretch the first clamping frame 44 and the second clamping frame 45, and the tension springs 46 tension the inner sides of the first clamping frame 44 and the second clamping frame 45 to clamp and fix the electronic board; the longitudinal beam 33 is connected with the cross beam 32 in a sliding manner, the fixed end of the electric telescopic rod 37 is fixed on the longitudinal beam 33, and the movable end penetrates through the longitudinal beam 33, so that the position of the longitudinal beam 33 can be conveniently adjusted, and the clamping mechanism 4 can be moved; the first clamping frame 44 is connected with the second clamping frame 45 through a pin shaft, and the first clamping frame 44 and the second clamping frame 45 are respectively connected with the connecting plate 41 in a rotating mode, so that the first clamping frame 44, the second clamping frame 45 and the connecting plate 41 can rotate conveniently.

The utility model discloses theory of operation and use flow: the gear 35 and the rack 36 are driven to rotate in a meshed mode through the first servo motor 34, or the lead screw 38 is driven to rotate through the second servo motor 39, the longitudinal beam 33 is made to move, the clamping mechanism 4 is moved to the position above the placing rack 2 for placing the electronic board, the electric telescopic rod 37 extends, meanwhile, the hoisting motor 42 drives the hoisting wheel 43 to rotate, the first clamping frame 44 and the second clamping frame 45 are pulled by the pull rope 47 to open and are placed on two sides of the electronic board, then the hoisting motor 42 rotates reversely, the first clamping frame 44 and the second clamping frame 45 clamp the electronic board under the action of the tension spring 46, the electronic board is moved into soldering liquid, and then the electronic board after being soldered is moved to the placing rack 2 on the other side.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims

1. The utility model provides a dip soldering stove for integrated circuit, includes furnace body (1), sets up rack (2) that are used for placing the circuit board of furnace body (1) upper end both sides, its characterized in that: the dip soldering furnace is characterized by further comprising a clamping mechanism (4) arranged above the furnace body (1) and used for fixing dip soldering of a circuit board, and a moving mechanism (3) connected above the clamping mechanism (4) and used for moving the circuit board, wherein the moving mechanism (3) is fixedly connected with the furnace body (1).

2. A dip soldering furnace for integrated circuits according to claim 1, wherein: moving mechanism (3) are including pillar (31), pillar (31) set up furnace body (1) upper end, pillar (31) upper end is provided with crossbeam (32), be provided with longeron (33) on crossbeam (32), crossbeam (32) lower extreme is provided with rack (36), rack (36) below is provided with gear (35), gear (35) are installed on first servo motor (34) output, install first servo motor (34) longeron (33) lower extreme, keep away from on longeron (33) crossbeam (32) one end is provided with electric telescopic handle (37), electric telescopic handle (37) with clamping mechanism (4) are connected, gear (35) with rack (36) meshing.

3. A dip soldering furnace for integrated circuits according to claim 1, wherein: moving mechanism (3) are including pillar (31), pillar (31) set up furnace body (1) upper end, pillar (31) upper end is provided with crossbeam (32), be provided with longeron (33) on crossbeam (32), crossbeam (32) rear side is provided with lead screw (38), lead screw (38) one end is connected with second servo motor (39), second servo motor (39) are installed on crossbeam (32), keep away from on longeron (33) crossbeam (32) one end is provided with electric telescopic handle (37), electric telescopic handle (37) with clamping mechanism (4) are connected, lead screw (38) with longeron (33) threaded connection.

4. A dip soldering furnace for integrated circuits according to claim 1, wherein: clamping mechanism (4) are including connecting plate (41), both sides are provided with hoist motor (42) around connecting plate (41) upper end, be connected with hoist wheel (43) on hoist motor (42) output, connecting plate (41) downside front and back end is connected with first clamp frame (44), second clamp frame (45) respectively, first clamp frame (44), second clamp frame (45) inboard is provided with extension spring (46), hoist wheel (43) with first clamp frame (44), connect through stay cord (47) between second clamp frame (45).

5. A dip soldering furnace for integrated circuits according to claim 2 or 3, wherein: longeron (33) with crossbeam (32) sliding connection, electric telescopic handle (37) stiff end is fixed on longeron (33), and the expansion end passes longeron (33).

6. A dip soldering furnace for integrated circuits according to claim 4, wherein: the first clamping frame (44) is in pin connection with the second clamping frame (45), and the first clamping frame (44) and the second clamping frame (45) are respectively in rotating connection with the connecting plate (41).