CN211957606U - Semiconductor product bearing jig - Google Patents
Semiconductor product bearing jig Download PDFInfo
- Publication number
- CN211957606U CN211957606U CN202020425850.7U CN202020425850U CN211957606U CN 211957606 U CN211957606 U CN 211957606U CN 202020425850 U CN202020425850 U CN 202020425850U CN 211957606 U CN211957606 U CN 211957606U
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- bearing
- main body
- carrier
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses semiconductor product bears tool includes: the semiconductor device comprises a bearing main body, a plurality of semiconductor bearing grooves and a plurality of semiconductor bearing grooves, wherein the bearing main body is regularly provided with the plurality of semiconductor bearing grooves; the first positioning holes are arranged on the upper surface of the bearing main body and used for positioning the bearing main body by equipment; a plurality of discernment positioner sets up bear the main part and go up different in the position of semiconductor bearing groove for the equipment location the position of a plurality of semiconductor bearing grooves, the utility model provides a pair of semiconductor product bear tool's simple structure has satisfied the automatic batch production and the commodity circulation of equipment to single semiconductor product, has improved production efficiency, on the other hand, the utility model provides a pair of semiconductor product bear the tool just can fully organize the automated production of single semiconductor product under the prerequisite that does not reform transform equipment, practiced thrift the equipment transformation cost, improved rate of equipment utilization.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor product bearing jig.
Background
In the semiconductor packaging process, since some semiconductor products still need to be subjected to the processes of printed circuit board, solder coating, surface mounting, reflow soldering, testing, packaging and warehousing and the like after being packaged and cut into single products, the batch production and industrialization cannot be realized by using the existing equipment to produce the single products, the cost for modifying the equipment is overhigh, and the utilization rate of the equipment is reduced.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned defect or not enough among the prior art, this application provides a semiconductor product bears tool, can realize utilizing existing equipment to the batch production of single product, improves production efficiency, can satisfy the demand of the full automatic operation of equipment.
In a first aspect, the utility model provides a semiconductor product bears tool, include: the semiconductor device comprises a bearing main body, a plurality of semiconductor bearing grooves and a plurality of semiconductor bearing grooves, wherein the bearing main body is regularly provided with the plurality of semiconductor bearing grooves;
the first positioning holes are arranged on the upper surface of the bearing main body and used for positioning the bearing main body by equipment;
and the plurality of identification positioning devices are arranged on the bearing main body at positions different from the semiconductor bearing grooves and are used for positioning the plurality of semiconductor bearing grooves by equipment.
Specifically, the semiconductor bearing grooves are arranged on the bearing main body according to a certain rule, for example, in a matrix arrangement manner, an equal-interval arrangement manner, and the like; the semiconductor products are arranged in the semiconductor bearing groove according to a specified direction, then the bearing main body provided with the semiconductor products is placed on equipment, the equipment is positioned on the equipment through the plurality of first positioning holes arranged on the bearing main body, the equipment identifies the information such as the position, the placing direction and the like of the bearing main body through identifying the plurality of identifying and positioning devices, so that the position of each semiconductor product is determined, the equipment automatically finishes the procedures such as printing, mounting and the like, and the aim of automatic operation of the equipment is fulfilled.
The logistics carrying plate is arranged below the carrying main body, a plurality of fixing devices are arranged on the carrying main body, and the carrying main body is fixed on the logistics carrying plate through the fixing devices;
the logistics bearing plate is provided with a plurality of second positioning holes, and the second positioning holes correspond to the plurality of identification positioning devices one to one.
Specifically, will a plurality of discernment positioner with a plurality of second locating holes one-to-one, through fixing device will bear the main part setting and be in on the commodity circulation loading board, on the one hand, the appearance of commodity circulation loading board can be placed with equipment the platform that bears the tool is corresponding, can play the location bear the purpose of tool, on the other hand, when setting up bear after the processing of one process of semiconductor product on the tool is accomplished, can pass through the commodity circulation loading board bears the tool with a plurality of commodity circulation and places and circulate in transporting the work or material rest, can realize the batch operation of product, further improvement production efficiency.
Furthermore, the bearing main body is of a rectangular plate-shaped structure, and the identification positioning devices are arranged at the edge positions of two opposite sides of the bearing main body.
Specifically, the bearing main body is set to be a rectangular structure, the identification and positioning devices are respectively arranged on two opposite sides of the bearing main body, and the equipment determines the position of the bearing main body by identifying the identification and positioning devices, so as to determine the position of each semiconductor bearing groove, thereby achieving the purpose of determining the position of a semiconductor product.
Further, the number of the identification and positioning devices on one side is larger than that on the other side. Specifically, the number of the identification and positioning devices on two sides is set to be different, so that the placement direction of the bearing body is determined.
Preferably, the fixing device is disposed at a position on the carrying body different from the edge positions of two opposite sides of the identification and positioning device, and in particular, the fixing device can be prevented from interfering with the detection of the identification and positioning device by the device.
Furthermore, the first positioning holes are blind holes, the fixing device is arranged at the bottom of the blind holes, and the thickness of the fixing device is smaller than the depth of the blind holes.
Preferably, fixing device is high temperature resistant magnet, the commodity circulation loading board is made for use magnetic material, will through high temperature magnet bear the main part and adsorb on the commodity circulation loading board, the adsorbed mode of setting up of magnet also is convenient with bear the main part with the separation of commodity circulation loading board, high temperature magnet also can satisfy reflow soldering's operating temperature, guarantees bear the work reliability of tool.
Furthermore, the bottoms of the semiconductor bearing grooves are provided with at least one water flowing hole, and the logistics bearing plate is provided with through holes corresponding to the water flowing holes one to one.
Specifically, the water flow holes and the through holes corresponding to the water flow holes one by one are arranged to enable cleaning liquid to flow out when the solder is cleaned at the later stage.
Furthermore, the bearing groove is rectangular, and avoidance parts are arranged at four corners of the rectangular semiconductor bearing groove.
Specifically, the shape of the bearing groove is designed according to the shape of the semiconductor product, when the shape of the semiconductor product is rectangular, the semiconductor bearing groove should also be rectangular, and the avoidance parts are arranged at the four corners of the bearing groove, so that the damage caused by handling concentration at the four corners of the semiconductor product is avoided, and the quality of the semiconductor product is effectively protected.
Preferably, the upper surface of the bearing main body is further provided with at least one direction recognition device for manually recognizing the direction of the bearing main body.
Advantageous effects
The utility model provides a pair of semiconductor product bear tool's simple structure has satisfied equipment and has improved production efficiency to the automatic batch production and the commodity circulation of single semiconductor product, on the other hand, the utility model provides a pair of semiconductor product bear tool just can be full of the automated production of organizing single semiconductor product under the prerequisite of not reforming transform equipment, has practiced thrift the equipment transformation cost, has improved equipment utilization ratio.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural view illustrating a main body of the present invention fixed to a logistics carrying board;
fig. 2 is a schematic structural diagram of a bearing main body according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a logistics carrying floor according to an embodiment of the present invention;
fig. 4 is a cross-sectional view at a-a in fig. 2.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 and 2, the utility model provides a semiconductor product bearing jig, which comprises a bearing main body 10, wherein a plurality of semiconductor bearing grooves 11 are regularly arranged on the bearing main body 10; for example, the arrangement is in a matrix arrangement, an equal interval arrangement, and the like; the bearing fixture is also provided with a plurality of first positioning holes 14 which are arranged on the upper surface of the bearing main body 10, when the bearing fixture is placed on equipment, the bearing fixture is inserted into the first positioning holes 14 through positioning pins on the equipment so as to achieve the purpose of positioning the bearing main body, in addition, the appearance of the bearing main body 10 can be matched with a platform on which the bearing fixture is placed on the equipment, and the positioning effect on the bearing fixture is further achieved; for example, the platform on the equipment is provided with a channel, and the size of the bearing body is matched with that of the channel; the semiconductor bearing device is characterized by further comprising a plurality of identification and positioning devices 12, wherein the identification and positioning devices 12 are arranged on the bearing main body 10 and are different from the semiconductor bearing grooves 11, specifically, after the bearing jig is placed on the equipment, the positions of the identification and positioning devices 12 are detected through a detection device on the equipment, information such as the position, the placing direction and the like of the bearing main body 10 is further determined, the positions of the semiconductor bearing grooves 11 are further determined, the positions of semiconductor products are further determined, the equipment can automatically complete processes such as printing and mounting, the purpose of automatic operation of the equipment is achieved, the identification and positioning devices 12 can be positioning pins with different colors from the bearing main body, and the equipment can achieve the purpose of positioning by detecting the positions of the positioning pins through a color sensor.
As shown in fig. 1, 3 and 4, the semiconductor carrying fixture further includes a material flow carrying plate 20 disposed below the carrying main body 10, a plurality of fixing devices 15 are disposed on the carrying main body 10, and the carrying main body 10 is fixed to the material flow carrying plate 20 by the fixing devices 15;
the material loading plate 20 is provided with a plurality of second positioning holes 22, and the second positioning holes 22 correspond to the plurality of identification positioning devices 12 one to one.
Specifically, as shown in fig. 4, the plurality of identification and positioning devices 12 extend out of the lower surface of the carrying main body 10, the identification and positioning devices 12 are disposed in the plurality of second positioning holes 22, the identification and positioning devices 12 corresponding to each other one by one are disposed in the second positioning holes 22, so as to ensure the corresponding position relationship between the carrying main body 10 and the logistics carrying board, the carrying main body 10 is disposed on the logistics carrying board 20 via the fixing device 15, on one hand, the appearance of the logistics carrying board 20 can correspond to the platform on which the carrying jig is disposed on the equipment, so as to achieve the purpose of positioning the carrying jig, on the other hand, after the semiconductor product disposed on the carrying jig is processed in one process, a plurality of logistics carrying jigs can be placed in the transferring rack via the logistics carrying board 20 for circulation, the batch operation of products can be realized, and the production efficiency is further improved.
As shown in fig. 1 and 2, as a preferred embodiment, the carrying body 10 is configured as a rectangular plate, and the identification and positioning devices 12 are disposed at two opposite side edges of the carrying body 10.
Specifically, the bearing main body 10 is set to be a rectangular structure, the identification and positioning devices 12 are respectively arranged on two opposite sides of the bearing main body 10, and the equipment determines the position of the bearing main body 10 by identifying the identification and positioning devices 12, and further determines the position of each semiconductor bearing groove 11, so as to achieve the purpose of determining the position of the semiconductor product.
As shown in fig. 1 and 2, the number of the identification and positioning devices 12 on one side is greater than the number of the identification and positioning devices 12 on the other side.
Specifically, the number of the identification and positioning devices 12 on the two sides is set to be different, and the placement direction of the bearing main body 10 is determined by the difference of the number after the detection of the detection device of the device, and on the other hand, the number of the identification and positioning devices 12 on the two sides is set to be different, so that when the bearing main body 10 is arranged on the logistics bearing plate, the relative position of the bearing main body 10 and the logistics bearing plate can be prevented from being reversed, and the fool-proof effect is achieved.
As a preferable real-time manner, the fixing device 15 is disposed on the carrying body 10 at a position different from two opposite side edges of the identification and positioning device 12, and in particular, this manner can prevent the fixing device 15 from interfering with the position of the identification and positioning device 12 detected by the equipment.
As shown in fig. 1, 2, and 4, the first positioning holes 13 are blind holes, the fixing device 15 is disposed at the bottom of the blind holes, and the thickness of the fixing device 15 is smaller than the depth of the blind holes.
Preferably, the fixing device 15 is a high temperature resistant magnet, and the logistics carrying board 20 is made of a magnetic conductive material, such as steel, magnetic conductive stainless steel, etc.; will through high temperature magnet bear main part 10 and adsorb on commodity circulation loading board 20, the mode of setting up that magnet adsorbs also is convenient with bear main part 10 with commodity circulation loading board 20 separation, high temperature magnet also can satisfy reflow soldering's operating temperature, guarantees bear the operational reliability of tool.
As shown in fig. 1 to 3, drain holes 110 are formed at the bottoms of the plurality of semiconductor bearing grooves 11, and through holes 21 corresponding to the drain holes 110 are formed in the material flow bearing plate 20.
Specifically, the water flow holes 110 and the through holes 21 corresponding to the water flow holes 110 one by one are provided to allow a cleaning liquid to flow out when the solder is cleaned in a later stage.
As shown in fig. 2, the semiconductor carrying groove 11 is rectangular, and four corners of the rectangular semiconductor carrying groove are provided with relief portions 111.
Specifically, the shape of the semiconductor carrying groove 11 is designed according to the shape of the semiconductor product, when the shape of the semiconductor product is rectangular, the semiconductor carrying groove 11 should also be rectangular, and the avoiding portions 111 are arranged at the four corners of the semiconductor carrying groove 11, so that the damage of the semiconductor product due to the concentrated stress at the four corners is avoided, and the quality of the semiconductor product is effectively protected.
Preferably, the upper surface of the bearing main body 10 is further provided with at least one direction recognition device for manually recognizing the direction of the bearing main body 10.
Specifically, the direction recognition device may be a first recognition hole 14 disposed on the carrying main body 10, or may be a second recognition hole 23 disposed on the logistics carrying board 20, and the direction of the carrying jig is recognized by manually recognizing the position of the first recognition hole 14 or/and the second recognition hole 23, or whether the relative position of the carrying main body 10 and the logistics carrying board 20 is correct can be achieved by the relative position relationship between the first recognition hole 14 and the second recognition hole 23, or in addition, the purpose of manual recognition can be achieved by disposing marks such as an arrow on the carrying main body 10.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of features described above or equivalents thereof without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A semiconductor product bearing jig is characterized by comprising:
the semiconductor device comprises a bearing main body, wherein a plurality of semiconductor bearing grooves are regularly arranged on the upper surface of the bearing main body;
the first positioning holes are arranged on the upper surface of the bearing main body and used for positioning the bearing main body by equipment;
and the plurality of identification positioning devices are arranged on the bearing main body at positions different from the semiconductor bearing grooves and are used for positioning the plurality of semiconductor bearing grooves by equipment.
2. The product carrier fixture of claim 1, further comprising a carrier plate disposed under the carrier body, wherein the carrier body has a plurality of fastening devices thereon, and the carrier body is fastened to the carrier plate by the fastening devices;
the logistics bearing plate is provided with a plurality of second positioning holes, and the second positioning holes correspond to the plurality of identification positioning devices one to one.
3. The product carrier as claimed in claim 2, wherein the carrier has a rectangular plate-like structure, and the positioning device is disposed at two opposite edges of the carrier.
4. The product carrier as claimed in claim 3, wherein the number of positioning devices on one side is greater than the number of positioning devices on the other side.
5. The product carrier as claimed in claim 3, wherein the fixing device is disposed at a position different from two opposite edges of the identification positioning device on the carrier body.
6. The product carrier as claimed in claim 4, wherein the first positioning holes are blind holes, the fixing device is disposed at the bottom of the blind holes, and the thickness of the fixing device is smaller than the depth of the blind holes.
7. The product carrier as claimed in claim 6, wherein the fixing means is a high temperature magnet.
8. The product loading jig of claim 2, wherein the bottoms of the semiconductor loading grooves are provided with drain holes, and the material loading plate is provided with through holes corresponding to the drain holes one to one.
9. The product carrier fixture of claim 2, wherein the semiconductor carrier trough is rectangular, and four corners of the rectangular semiconductor carrier trough are provided with an avoiding portion.
10. The product carrying tool of claim 3, wherein the upper surface of the carrying body is further provided with at least one direction recognition device for manually recognizing the direction of the carrying body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020425850.7U CN211957606U (en) | 2020-03-27 | 2020-03-27 | Semiconductor product bearing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020425850.7U CN211957606U (en) | 2020-03-27 | 2020-03-27 | Semiconductor product bearing jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211957606U true CN211957606U (en) | 2020-11-17 |
Family
ID=73167621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020425850.7U Active CN211957606U (en) | 2020-03-27 | 2020-03-27 | Semiconductor product bearing jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211957606U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115090491A (en) * | 2022-07-13 | 2022-09-23 | 北京无线电测量研究所 | Microminiature high-density slide mounting tool and mounting method |
-
2020
- 2020-03-27 CN CN202020425850.7U patent/CN211957606U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115090491A (en) * | 2022-07-13 | 2022-09-23 | 北京无线电测量研究所 | Microminiature high-density slide mounting tool and mounting method |
| CN115090491B (en) * | 2022-07-13 | 2024-04-26 | 北京无线电测量研究所 | Microminiature high-density slide glass pasting tool and pasting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10290526B2 (en) | Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier | |
| US4759488A (en) | Circuit board carrier | |
| KR101940564B1 (en) | An automatic carrier transfer for transferring a substrate carrier in a semiconductor manufacturing post-process and method of transferring the substrate carrier using the same | |
| US6474477B1 (en) | Carrier assembly for semiconductor IC (integrated circuit) packages | |
| CN211957606U (en) | Semiconductor product bearing jig | |
| US6474475B1 (en) | Apparatus for handling stacked integrated circuit devices | |
| JP6857241B2 (en) | Electronic component mounting machine | |
| US10507991B2 (en) | Vacuum conveyor substrate loading module | |
| US20200035529A1 (en) | Semiconductor processing boat design with pressure sensor | |
| US4490087A (en) | Elevating jig for semi-conductor wafers and similar articles | |
| US20190119051A1 (en) | Unloading System | |
| US5695331A (en) | Multiple width boat carrier for vertical ovens | |
| CN109884455B (en) | Carrier tray assembly and identification system | |
| EP3553813B1 (en) | Die component supply device | |
| CN111083882A (en) | Partial hardboard removal apparatus, systems and methods | |
| CN215438625U (en) | Chip feeding equipment | |
| CN211417986U (en) | Board collecting jig | |
| CN216348230U (en) | Measuring tool of circuit board | |
| CA1240405A (en) | Circuit board carrier | |
| CN215314002U (en) | Testing device and bearing assembly thereof | |
| CN211557638U (en) | Transportation tool of circuit board | |
| CN216634268U (en) | Object carrying platform and detection equipment | |
| KR20090097363A (en) | Automatic position detecting system of memory module tray and method of the same | |
| CN108328015B (en) | Object transferring device and method | |
| KR20240012793A (en) | Double-layered pcb table unit capable of loading and unloading |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |