CN211956500U - Fingerprint sensor component, electronic equipment and mobile phone - Google Patents
Fingerprint sensor component, electronic equipment and mobile phone Download PDFInfo
- Publication number
- CN211956500U CN211956500U CN202020715830.3U CN202020715830U CN211956500U CN 211956500 U CN211956500 U CN 211956500U CN 202020715830 U CN202020715830 U CN 202020715830U CN 211956500 U CN211956500 U CN 211956500U
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- China
- Prior art keywords
- fingerprint sensor
- die
- sensor component
- top surface
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
Abstract
The utility model relates to a fingerprint sensor part, electronic equipment and mobile phone. A fingerprint sensor component, comprising: a substrate including a substrate top surface having a top surface conductor pattern, a substrate bottom surface having a bottom surface conductor pattern, and a via hole electrically connecting the top surface conductor pattern and the bottom surface conductor pattern; a fingerprint sensor die having die attach pads, a die top surface having a sensing surface, a die bottom surface, and side surfaces connecting the die top surface and the die bottom surface, wherein the die bottom surface of the fingerprint sensor die is bonded to the substrate top surface of the substrate, and the die attach pads are electrically connected to the top surface conductor patterns of the substrate; and a molding material covering the sensing surface and the side surfaces of the fingerprint sensor die and a portion of the base top surface of the base not covered by the fingerprint sensor die, the molding material exhibiting a convex shape on the sensing surface of the fingerprint sensor die.
Description
Technical Field
The utility model relates to a fingerprint sensor part.
Background
Biometric systems are widely used as a means for increasing the convenience and security of personal electronic devices such as mobile phones and the like. In particular, fingerprint sensing systems are now included in a large portion of all newly released personal communication devices, such as mobile phones.
To improve the user experience, many electronic devices include a device housing having at least one protrusion. It is desirable to provide improvements in the integration of fingerprint sensor components in such electronic devices.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is an object of the present invention to provide improvements in the integration of fingerprint sensor components in an electronic device comprising a device housing having at least one protrusion.
Thus, according to the present invention, there is provided a fingerprint sensor component comprising: a substrate including a substrate top surface having a top surface conductor pattern, a substrate bottom surface having a bottom surface conductor pattern, and a via electrically connecting the top surface conductor pattern and the bottom surface conductor pattern; a fingerprint sensor die (die) having die connection pads, a die top surface having a sensing surface, a die bottom surface, and side surfaces connecting the die top surface and the die bottom surface, wherein the die bottom surface of the fingerprint sensor die is bonded to the substrate top surface of the substrate, and the die connection pads are electrically connected to the top surface conductor patterns of the substrate; and a molding material covering the sensing surface and the side surfaces of the fingerprint sensor die and a portion of the base top surface of the base not covered by the fingerprint sensor die, the molding material exhibiting a convex shape on the sensing surface of the fingerprint sensor die.
Drawings
These and other aspects of the present invention will now be described in more detail, with reference to the appended drawings showing exemplary embodiments of the invention, wherein:
fig. 1 is a diagram of an exemplary electronic device in the form of a mobile phone including a fingerprint sensor component according to an embodiment of the invention;
FIG. 2 is an enlarged view of a portion of the electronic device of FIG. 1;
fig. 3A to 3B are perspective views of a fingerprint sensor part included in the mobile phone of fig. 1 and 2;
FIG. 4 is a partially open perspective schematic view of a fingerprint sensor assembly included in the mobile phone of FIGS. 1 and 2; and
figure 5 is a schematic cross-sectional view of the fingerprint sensor component of figure 4.
Detailed Description
In this detailed description, various embodiments of a fingerprint sensor component according to the invention are described mainly with reference to a fingerprint sensor component comprising a semiconductor-based capacitive fingerprint sensor Integrated Circuit (IC). It should be noted that fingerprint sensor components comprising other types or configurations of fingerprint sensors also fall within the scope defined by the claims. For example, a fingerprint sensor comprised in the fingerprint sensor component may sense the fingerprint of a finger placed on the sensor using one or several other measurement principles, such as ultrasonic measurement, thermal measurement or optical measurement.
Fig. 1 schematically shows an electronic device, here in the form of a mobile phone 1, comprising a device housing 3 and a fingerprint sensor part 5. As can be seen from fig. 1, the device housing 3 comprises a projection 7 with an opening 9. The fingerprint sensor part 5 is arranged in the opening 9 and also assumes a convex shape. The convex shape of the fingerprint sensor part 5 may (at least at the opening 9) substantially follow the convex space of the convex portion 7 of the device housing 3. This is better seen in the enlarged partial view of fig. 2.
Fig. 3A to 3B are perspective views of the fingerprint sensor section 5 included in the mobile phone 1 of fig. 1 and 2.
Fig. 3A is a perspective view showing the component top surface 11 and the side surface 13 of the fingerprint sensor component 5. As can be seen from fig. 3A, the fingerprint sensor part 5 is elongated, having a length l and a width w. For easy integration into various electronic devices, such as the mobile phone 1 in fig. 1 and 2, the ratio between the length l and the width w may be at least 4. Advantageously, the ratio between the length l and the width w may be in the range of 4 to 9. According to one example configuration, the length l may be in the range of 12mm to 16mm and the width w may be in the range of 1.8mm to 3 mm.
Fig. 3B is a perspective view showing the component bottom surface 15 and the side surface 13 of the fingerprint sensor component 5. As can be seen from fig. 3B, the fingerprint sensor part 5 has a part conductor pattern 17 on the part bottom surface 15. In the embodiment of fig. 3B, the component conductor pattern 17 defines a grid array (land grid array) having a plurality of component connection pads 19 (in fig. 3B, only one of these component connection pads is indicated by a reference numeral to avoid cluttering the drawing).
Fig. 4 is a partially open perspective schematic view of the fingerprint sensor section 5 included in the mobile phone 1 of fig. 1 and shown in fig. 3A and 3B.
Referring to fig. 4, the fingerprint sensor part 5 includes a substrate 21, a fingerprint sensor die 23, and a molding material 25. Substrate 21 has a top substrate surface 27 and a bottom substrate surface 29. The substrate top surface 27 has a top surface conductor pattern including bond pads 31 visible in fig. 4, and (although not visible in fig. 4) the substrate bottom surface 29 has a bottom surface conductor pattern that may constitute the component conductor pattern 17 described above with reference to fig. 3B. The fingerprint sensor die 23 has a die top surface 33, a die bottom surface 35, and a side surface 37 connecting the die top surface 33 and the die bottom surface 35. The die top surface 33 includes a sensing surface 39, where the sensing surface 39 is indicated as including an array of sensing structures 41. The die bottom surface 35 of the fingerprint sensor die 23 is bonded to the substrate top surface 27 of the substrate 21. As schematically indicated in fig. 4, the fingerprint sensor die 23 further comprises die attach pads 43 electrically connected to the bond pads 31 on the substrate top surface 27 of the substrate 21. The electrical connection may be made using bond wires 45 as shown in fig. 4 or by any other suitable connector known to those skilled in the art. The molding material 25 covers the sensing surface 39 and the side surfaces 37 of the fingerprint sensor die 23, as well as portions of the base top surface 27 of the base 21 not covered by the fingerprint sensor die 23. As schematically indicated in fig. 4, the molding material 25 exhibits a convex shape on the sensing surface 39 of the fingerprint sensor die 23. As schematically indicated in fig. 4, the fingerprint sensor part 5 may optionally additionally comprise a colored coating 47 on top of the moulding material 25.
Fig. 5 is a schematic cross-sectional view of a portion of the fingerprint sensor section 5 in fig. 4, taken along the line a-a' in fig. 4. In addition to what has been described above with reference to fig. 4, fig. 5 schematically shows a via 49 that electrically connects the top surface conductor pattern of the substrate 21 with the bottom surface conductor pattern 17 of the substrate 21.
Fig. 5 also indicates an advantageous configuration of the convex shape of the molding material 25. As indicated in fig. 5, the top surface of the fingerprint sensor part 5 presents a convex shape with a radius of curvature R. The radius of curvature R of the fingerprint sensor part 5 may be adjusted to substantially follow the radius of curvature of the convex part 7 of the device housing 3 of the electronic device 1 and may advantageously be in the range of 4mm to 20 mm.
In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
Claims (11)
1. A fingerprint sensor component, comprising:
a substrate including a substrate top surface having a top surface conductor pattern, a substrate bottom surface having a bottom surface conductor pattern, and a via electrically connecting the top surface conductor pattern and the bottom surface conductor pattern;
a fingerprint sensor die having die connection pads, a die top surface having a sensing surface, a die bottom surface, and side surfaces connecting the die top surface and the die bottom surface, wherein the die bottom surface of the fingerprint sensor die is bonded to the substrate top surface of the substrate, and the die connection pads are electrically connected to the top surface conductor patterns of the substrate; and
a molding material covering the sensing surface and the side surfaces of the fingerprint sensor die and portions of the base top surface of the base not covered by the fingerprint sensor die, the molding material exhibiting a convex shape on the sensing surface of the fingerprint sensor die.
2. The fingerprint sensor component of claim 1, wherein the convex shape of the fingerprint sensor component exhibits a radius of curvature in the range of 4mm to 20 mm.
3. The fingerprint sensor component of claim 1 or 2, wherein the fingerprint sensor component is elongated, having a length and a width.
4. The fingerprint sensor component of claim 3, wherein a ratio between the length and the width is at least 4.
5. The fingerprint sensor component of claim 4, wherein a ratio between the length and the width is in a range of 4 to 9.
6. The fingerprint sensor component of claim 1 or 2, further comprising a colored coating on top of the molding material.
7. The fingerprint sensor component of claim 1 or 2, wherein the fingerprint sensor die comprises an array of conductive sensing structures for sensing capacitive coupling with a finger touching the fingerprint sensor component.
8. The fingerprint sensor component of claim 7, further comprising a dielectric layer having a uniform thickness, the dielectric layer being disposed between the array of conductive sensing structures and the molding material.
9. The fingerprint sensor component of claim 1 or 2, wherein the bottom surface conductor pattern defines a grid array.
10. An electronic device, comprising:
an apparatus housing including a boss having an opening; and
the fingerprint sensor component of claim 1 or 2, arranged in an opening of the convex portion of the device housing.
11. A mobile phone, comprising:
an apparatus housing including a boss having an opening; and
the fingerprint sensor component of claim 1 or 2, arranged in an opening of the convex portion of the device housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715830.3U CN211956500U (en) | 2020-04-30 | 2020-04-30 | Fingerprint sensor component, electronic equipment and mobile phone |
| KR2020210000922U KR20210002478U (en) | 2020-04-30 | 2021-03-25 | Fingerprint sensor component, electronic device and mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715830.3U CN211956500U (en) | 2020-04-30 | 2020-04-30 | Fingerprint sensor component, electronic equipment and mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211956500U true CN211956500U (en) | 2020-11-17 |
Family
ID=73163638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020715830.3U Active CN211956500U (en) | 2020-04-30 | 2020-04-30 | Fingerprint sensor component, electronic equipment and mobile phone |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20210002478U (en) |
| CN (1) | CN211956500U (en) |
-
2020
- 2020-04-30 CN CN202020715830.3U patent/CN211956500U/en active Active
-
2021
- 2021-03-25 KR KR2020210000922U patent/KR20210002478U/en active Search and Examination
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210002478U (en) | 2021-11-09 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211210 Address after: Gothenburg Patentee after: Fingerprint kaana Kadun Intellectual Property Co.,Ltd. Address before: Gothenburg Patentee before: FINGERPRINT CARDS AB |