CN211929887U

CN211929887U - Butterfly-shaped packaging laser assembly with low-temperature glass welding part

Info

Publication number: CN211929887U
Application number: CN202020617607.5U
Authority: CN
Inventors: 郭丽彬; 张永刚
Original assignee: Gretel Tianjin Optoelectronics Technology Co ltd
Current assignee: Gretel Tianjin Optoelectronics Technology Co ltd
Priority date: 2020-04-22
Filing date: 2020-04-22
Publication date: 2020-11-13
Anticipated expiration: 2030-04-22

Abstract

The utility model discloses a butterfly encapsulation laser subassembly that possesses low temperature glass welding spare, including the base plate, install the butterfly laser instrument main part on the base plate and install the stitch on butterfly laser instrument main part both sides surface, the pilot plate is installed to the base plate top rotatable formula of butterfly laser instrument main part one side, the side movable plate is installed to the base plate top rotatable formula of butterfly laser instrument main part opposite side, movable mounting has the expansion plate on the side movable plate, and the internally mounted of expansion plate has the arm-tie, the one end of arm-tie extends to the expansion plate outside, and the one end of arm-tie passes through stop gear and the spacing connection of pilot plate. The utility model discloses a be provided with a series of structures for this butterfly encapsulation laser assembly who possesses low temperature glass welding spare in actual assembling process, when can realize filling up the foot support, play the shock attenuation effect, and form around formula protecting effect, can follow in-process such as follow-up maintenance, protecting component does benefit to the dismantlement, satisfies the in-service use demand.

Description

Butterfly-shaped packaging laser assembly with low-temperature glass welding part

Technical Field

The utility model relates to a butterfly laser technical field specifically is a butterfly encapsulation laser subassembly that possesses low temperature glass welding spare.

Background

The laser is generally a device capable of emitting laser, and since the first microwave quantum amplifier was manufactured in 1954, the laser has been widely used in many fields with the continuous development of the laser, the types of the formed lasers are many, the lasers can be divided into a gas laser, a solid laser, a semiconductor laser and a dye laser according to the working medium, and the butterfly laser is one of the semiconductor lasers, and is generally welded with an optical fiber by a low-temperature glass welding piece.

The butterfly laser is different from a general semiconductor laser in structure, and is called a butterfly laser because a plurality of pins are installed on the butterfly laser, and the actual butterfly laser needs to fix and use the pins in the packaging process, but the pins are generally thin and easy to damage, and have the problems of inconvenient installation and the like.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a butterfly encapsulation laser subassembly that possesses low temperature glass welding to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a butterfly encapsulation laser subassembly that possesses low temperature glass welding spare, includes the base plate, installs the butterfly laser main part on the base plate and installs the stitch on butterfly laser main part both sides surface, the pilot plate is installed to the base plate top rotatable formula of butterfly laser main part one side, the side movable plate is installed to the base plate top rotatable formula of butterfly laser main part opposite side, movable mounting has the expansion plate on the side movable plate, and the internally mounted of expansion plate has the arm-tie, the one end of arm-tie extends to the expansion plate outside, and the one end of arm-tie passes through stop gear and is connected with the pilot plate is spacing.

Preferably, a return spring is installed on the pulling plate and extends to the inner wall of the telescopic plate.

Preferably, the surfaces of the side moving plate and the assembling plate are provided with movable grooves, and the pins extend outwards through the movable grooves.

Preferably, stop gear includes draw-in groove and snap ring, and the draw-in groove sets up on the top of assembly plate, and the card post is installed on the top of draw-in groove, and the snap ring is installed on the one end surface of arm-tie, and the snap ring cup joints on the card post.

Preferably, the clamping frame is installed in the clamping groove through a rotating shaft, and the lamination is installed at one end of the clamping frame.

Preferably, the bottom end of the butterfly laser main body is provided with a pad foot, and a shock pad is arranged at a gap between the pad foot and the substrate.

Preferably, the limiting blocks are mounted on the surface of the substrate on the inner side of the side moving plate and the surface of the substrate on the inner side of the assembling plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this butterfly encapsulation laser subassembly that possesses low temperature glass welding spare, through the assembly plate, and use with the side movable plate combines, the two can carry out rotary motion around the base plate, and at the actual assembly in-process, carry out spacing and protection to the laser instrument main part, do benefit to the completion that the effect was overhauld in the actual dismantlement, and through the expansion plate, use with the arm-tie combination, but the two relative motion, when being convenient for open and close this subassembly top, realize the connection effect of assembly plate and side movable plate.

2. This butterfly package laser subassembly that possesses low temperature glass welding spare, through reset spring, can produce elasticity that resets, make expansion plate and arm-tie taut each other and be connected, need provide the pulling force for being connected of actual assembly plate and side movable plate, through the card post, and combine to use with the snap ring, the two chucking each other, realize the spacing installation effect of the relative draw-in groove of arm-tie from this, through the screens frame, and combine to use with the lamination, can wrap up and shelter from the whole draw-in groove, and carry out certain spacing to snap ring top-down.

3. This butterfly encapsulation laser subassembly that possesses low temperature glass welding spare through filling up the foot to use with the shock pad combination, can arrange whole butterfly laser instrument main part in under the state of support, and can realize the shock attenuation protective effect under the condition that suffers outside moment, through the stopper, can contact and the top tightly with assembly plate and side movable plate, reach the effect of spacing support, when promoting the plate body vertically, reach certain spacing effect.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a schematic view of the internal structure of the retractable plate shown in FIG. 2;

fig. 4 is a schematic diagram of the internal structure of the present invention.

In the figure: 1. a substrate; 2. assembling a plate; 3. laminating; 4. a clamping frame; 5. a card slot; 6. a movable groove; 7. a side moving plate; 8. a retractable plate; 9. pulling a plate; 10. clamping the column; 11. a stitch; 12. a return spring; 13. a snap ring; 14. a butterfly laser body; 15. a foot pad; 16. a shock pad; 17. and a limiting block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 to 4, the butterfly package laser assembly with the low temperature glass welding piece of the embodiment includes a base plate 1, a butterfly laser main body 14 mounted on the base plate 1, and pins 11 mounted on both side surfaces of the butterfly laser main body 14, the base plate 1 is integrally mounted inside a laser device housing to support the butterfly laser main body 14, the rear portion of the butterfly laser main body 14 is connected with a tail fiber, connected with the outside and influenced by the structure of the butterfly laser main body 14, the number of the pins 11 is large, an assembling plate 2 is rotatably mounted on the top end of the base plate 1 on one side of the butterfly laser main body 14 through a hinge, the assembling plate 2 can rotate around the hinge, a side moving plate 7 is rotatably mounted on the top end of the base plate 1 on the other side of the butterfly laser main body 14 through a hinge, the side moving plate 7 and the assembling plate 2 are oppositely disposed and can be disposed on both sides of the butterfly laser main, have expansion plate 8 through hinge movable mounting on the side

movable plate

7, 8 inside cavitys that are provided with of expansion plate, and the internally mounted of expansion plate 8 has arm-tie 9, arm-tie 9 atress relative expansion plate 8 moves, the one end of arm-tie 9 is to 8 outside extensions of expansion plate, but the two relative motion, and the one end of arm-tie 9 is passed through stop gear and 2 spacing connections of assembly panel, make and be connected relatively between assembly panel 2 and the side movable plate 7, form a four sides around formula structure from this, protect internal butterfly laser instrument main part 14.

Specifically, install reset spring 12 on arm-tie 9, and reset spring 12 extends to 8 inner walls of expansion plate, can produce the elasticity that resets for expansion plate 8 and arm-tie 9 are taut each other and are connected, need provide the pulling force for being connected of actual assembly plate 2 and side movable plate 7.

Further, the surfaces of the side moving plate 7 and the assembling plate 2 are provided with movable grooves 6, the pins 11 extend outwards through the movable grooves 6, the movable grooves 6 extend upwards to the top end surfaces of the side moving plate 7 and the assembling plate 2, and the pins 11 can move relatively along the movable grooves 6 in the process of actually mounting and dismounting the side moving plate 7 or the assembling plate 2.

Further, stop gear includes draw-in groove 5 and snap ring 13, and draw-in groove 5 sets up on the top of assembly plate 2, is curved cell body for horizontal both ends in the middle of one, and card post 10 is installed on the top of draw-in groove 5, and snap ring 13 is installed on the one end surface of arm-tie 9, and snap ring 13 cup joints on calorie post 10 for card post 10 can carry out spacing installation to snap ring 13, makes arm-tie 9 spacing relatively install on draw-in groove 5 and even assembly plate 2 from this.

Further, screens frame 4 is installed through the pivot in the inside of draw-in groove 5, and screens frame 4 is a metal support body, can wrap up and spacing whole draw-in groove 5, and the bottom can contact with card post 10 top, and lamination 3 is installed to the one end of screens frame 4, and lamination 3 upwards extends to on the assembly plate 2 to can realize being connected of lamination 3 and assembly plate 2 with the help of the screw, from this carry out fixed mounting to screens frame 4.

Furthermore, a pad foot 15 is installed at the bottom end of the butterfly laser main body 14, the pad foot 15 can transmit supporting force to support the whole butterfly laser main body 14, a shock absorption pad 16 is installed at a gap between the pad foot 15 and the substrate 1, the shock absorption pad 16 is formed by a plastic gasket with good flexibility, can be stressed to prevent water deformation and achieve a shock absorption effect, and in practical use, the whole butterfly laser main body 14 only suffers from the supporting and transmitting vibration force of the pad foot 15, and the vibration force is mostly counteracted by the shock absorption pad 16, so that the protection operation of the butterfly laser main body 14 is met.

Furthermore, the limiting blocks 17 are arranged on the surface of the substrate 1 on the inner side of the side movable plate 7 and the surface of the substrate 1 on the inner side of the assembling plate 2, the limiting blocks 17 can play a limiting role, the assembling plate 2 and the side movable plate 7 are contacted and tightly pushed, the effect of limiting support is achieved, and vertical arrangement of plate bodies is promoted.

The using method of the embodiment comprises the following steps: in the assembly process, the whole substrate 1 is assembled on a large-scale circuit substrate together with other circuit elements and is positioned in a laser equipment shell, a butterfly laser main body 14 is arranged at the middle position of the substrate 1 by virtue of a pad foot 15 and a shock pad 16, tail fibers and other elements are arranged on the butterfly laser main body 14, the assembly plate 2 and the side movable plate 7 are driven to rotate oppositely until the inner side wall surfaces of the assembly plate 2 and the side movable plate 7 are contacted with a limiting block 17, so that the assembly plate 2 and the side movable plate 7 are both in a vertical state, the pull plate 9 is pulled by manually overcoming the action of a return spring 12, the pull plate 9 drives the expansion plate 8 to rotate around the side movable plate 7, the clamping ring 13 is clamped on the clamping column 10, the limiting and clamping effect is realized, the pull plate 9 is loosened, at the moment, under the elastic force of the return spring 12, the pull plate 9 contracts towards the inside of the expansion plate 8 and generates a pulling force to act between the assembly plate 2 and the side movable plate, make assembly plate 2 and side movable plate 7 receive inward pulling force simultaneously from this, at this moment, base plate 1, expansion plate 8, arm-tie 9, assembly plate 2 and side movable plate 7 form an annular safeguard mechanism jointly, center on and protect butterfly laser main part 14, avoid external force to cause destruction to it, go into inside clamping groove 5 with clamping frame 4 card afterwards, there is clamping frame 4 inner wall to carry out the top tightly to calorie post 10, later with lamination 3 fixed mounting on assembly plate 2, certain sealed to clamping groove 5, during operation such as follow-up maintenance, only need open assembly plate 2, make card post 10 and snap ring 13 separation, just can open whole annular safeguard mechanism, the going on of the easy access operation from this.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a butterfly-shaped encapsulation laser subassembly that possesses low temperature glass welding spare, includes base plate (1), installs butterfly laser main part (14) on base plate (1) and installs stitch (11) on butterfly laser main part (14) both sides surface, its characterized in that: mounting plate (2) are installed to base plate (1) top rotatable formula of butterfly laser instrument main part (14) one side, side movable plate (7) are installed to base plate (1) top rotatable formula of butterfly laser instrument main part (14) opposite side, movable mounting has expansion plate (8) on side movable plate (7), and the internally mounted of expansion plate (8) has arm-tie (9), the one end of arm-tie (9) is extended to expansion plate (8) outside, and the one end of arm-tie (9) is passed through stop gear and is connected with mounting plate (2) are spacing.

2. The butterfly package laser assembly with a cryogenic glass weldment of claim 1, wherein: and a return spring (12) is installed on the pulling plate (9), and the return spring (12) extends to the inner wall of the telescopic plate (8).

3. The butterfly package laser assembly with a cryogenic glass weldment of claim 1, wherein: the surfaces of the side moving plate (7) and the assembling plate (2) are provided with movable grooves (6), and pins (11) extend outwards through the movable grooves (6).

4. The butterfly package laser assembly with a cryogenic glass weldment of claim 1, wherein: stop gear includes draw-in groove (5) and snap ring (13), and draw-in groove (5) set up on the top of pilot plate (2), and card post (10) are installed on the top of draw-in groove (5), and one end surface at arm-tie (9) is installed in snap ring (13), and snap ring (13) cup joint on card post (10).

5. The butterfly package laser assembly with a cryogenic glass weldment of claim 4 wherein: the inside of draw-in groove (5) is installed card position frame (4) through the pivot, and lamination (3) are installed to the one end of card position frame (4).

6. The butterfly package laser assembly with a cryogenic glass weldment of claim 1, wherein: the bottom end of the butterfly laser main body (14) is provided with a pad foot (15), and a shock pad (16) is arranged at the gap between the pad foot (15) and the substrate (1).

7. The butterfly package laser assembly with a cryogenic glass weldment of claim 1, wherein: and limiting blocks (17) are arranged on the surface of the substrate (1) on the inner side of the side moving plate (7) and the surface of the substrate (1) on the inner side of the assembling plate (2).