CN211910602U

CN211910602U - Air conditioning clothes with semiconductor refrigerating system

Info

Publication number: CN211910602U
Application number: CN201922262916.5U
Authority: CN
Inventors: 陈永根
Original assignee: Zhejiang Qiyi Special Clothing Co ltd
Current assignee: Zhejiang Qiyi Special Clothing Co ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2020-11-13
Anticipated expiration: 2029-12-16

Abstract

The utility model discloses an air-conditioning coat with a semiconductor refrigerating system, which comprises a coat body and a semiconductor refrigerating unit; the semiconductor refrigeration unit is fixedly arranged on the garment body and comprises a semiconductor refrigeration device, a cold guide module, a cold air fan, a heat conduction module, a heat dissipation fan and a flow guide fan cover; the cold guide module is attached to the first surface of the semiconductor refrigeration device, the cold air fan is fixedly arranged on the cold guide module and generates first directional air flow, and the first directional air flow enters the garment body from the exterior of the garment body through the surface of the cold guide module; the heat conduction module is attached to the second surface of the semiconductor refrigeration device, and the heat dissipation fan is fixedly arranged on the heat conduction module and generates second directional airflow; the first air guide fan cover of the air guide fan cover guides the first directional air flow, the second air guide fan cover covers the outer portion of the heat dissipation fan, the inlet of the second air guide fan cover extends towards the outer portion of the garment body, and the second directional air flow flows out of the garment body after passing through the surfaces of the second air guide fan cover and the heat conduction module.

Description

Air conditioning clothes with semiconductor refrigerating system

Technical Field

The utility model belongs to the technical field of the air conditioner clothing, specifically speaking relate to an air conditioner clothing with semiconductor refrigerating system.

Background

For outdoor and field workers such as policemen, soldiers, geological prospecting personnel and the like, and workers in special environments such as steel-making personnel, foundry personnel, tank armored soldiers and the like, the working environment is relatively severe, and the conventional air conditioner can hardly meet the body requirements of the workers, so that the air-conditioning suit for adjusting the temperature of the microenvironment of the human body is produced.

The air conditioning clothes on the market at present mainly have three forms of eddy current cooling type, insert bag type and direct air cooling type; the three forms of air-conditioning clothes have certain defects, such as large noise, violent airflow, limited moving range and potential safety hazard of the eddy current cooling type air-conditioning clothes, heavy pocket type air-conditioning clothes, inconvenient carrying and poor comfort, and the direct air-cooling type air-conditioning clothes only accelerate heat dissipation, have no refrigerating and heating functions and are poor in comfort.

Disclosure of Invention

The utility model aims at providing an air conditioner clothing with semiconductor refrigerating system, it is aiming at overcoming the problem that exists among the background art.

In order to solve the technical problem, the purpose of the utility model is to realize like this:

an air-conditioning garment with a semiconductor refrigeration system comprises a garment body and a semiconductor refrigeration unit; the semiconductor refrigeration unit is fixedly arranged on the garment body and comprises a semiconductor refrigeration device, a cold guide module, a cold air fan, a heat conduction module, a heat dissipation fan and a flow guide fan cover; the cold guide module is attached to the first surface of the semiconductor refrigeration device, the cold air fan is fixedly arranged on the cold guide module and generates first directional air flow, and the first directional air flow enters the garment body from the exterior of the garment body through the surface of the cold guide module; the heat conduction module is attached to the second surface of the semiconductor refrigeration device, and the heat radiation fan is fixedly arranged on the heat conduction module and generates second directional airflow; the air guide fan cover comprises a first air guide fan cover and a second air guide fan cover, the first air guide fan cover guides the first directional air flow, the second air guide fan cover covers the outside of the heat dissipation fan, an inlet of the second air guide fan cover extends towards the outside of the garment body, and the second directional air flow flows out of the garment body after passing through the surfaces of the second air guide fan cover and the heat conduction module.

On the basis of the above scheme and as a preferable scheme of the scheme: also includes a power supply, a controller and a control button.

On the basis of the above scheme and as a preferable scheme of the scheme: the cold guide module and the heat conduction module are provided with a plurality of air flow channels, and the trend of the air flow channels is from the inside of the garment body to the outside of the garment body; the cold air fan is positioned on one side of the air flow channel of the cold guide module, which faces the outside of the garment body; the heat dissipation fan is located on one side, facing the inside of the garment body, of the air flow channel of the heat conduction module.

On the basis of the above scheme and as a preferable scheme of the scheme: the first air guide sleeve is fixedly arranged on the outer side of the air flow channel of the cold guide module.

On the basis of the above scheme and as a preferable scheme of the scheme: the second air guide sleeve further comprises a guide plate fixedly arranged on the outer side of the air flow channel of the heat conduction module.

On the basis of the above scheme and as a preferable scheme of the scheme: the cold conducting module and the heat conducting module are radiating fins.

On the basis of the above scheme and as a preferable scheme of the scheme: the radiating fin is made of aluminum or copper.

Compared with the prior art, the utility model outstanding and profitable technological effect is: 1. the semiconductor refrigerating device is adopted, and air blown into the clothing body can be cooled, so that the clothing body can be cooled well, and the comfort level of wearing the air conditioning clothing in hot weather is improved.

2. The refrigerating effect is better when the temperature difference between the first end and the second end (the cold end and the hot end) of the semiconductor refrigerating device is larger, and the efficiency is higher; this application carries out new design through the structure to semiconductor refrigeration unit, has improved the heat dispersion of semiconductor refrigeration device second end (hot junction), just so can make the first end refrigeration efficiency and the effect of semiconductor refrigeration device promote greatly.

Drawings

FIG. 1 is a perspective view of the overall structure of a semiconductor refrigeration unit;

FIG. 2 is another perspective view of the overall structure of the semiconductor refrigeration unit;

FIG. 3 is a perspective view of the internal structure of the semiconductor refrigeration unit;

FIG. 4 is another perspective view of the internal structure of the semiconductor refrigeration unit;

FIG. 5 is a top view of the internal structure of the semiconductor refrigeration unit;

fig. 6 is a schematic view of a semiconductor refrigeration unit mounting structure.

Detailed Description

In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person skilled in the art without making any inventive step, based on the given embodiments, fall within the scope of protection of the present application.

In the description of the present application, it is to be understood that the terms "upper", "lower", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

In the description of the present application, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.

An air-conditioning garment with a semiconductor refrigeration system comprises a garment body 8 and a semiconductor refrigeration unit; the semiconductor refrigeration unit is fixedly arranged on the clothing body 8 and comprises a semiconductor refrigeration device 1, a cold guide module 2, a cold air fan 3, a heat conduction module 4, a heat dissipation fan 5, a first air guide hood 6 and a second air guide hood 7; the cold guide module 2 is attached to a first surface 11 of the semiconductor refrigeration device, the cold air fan 3 is fixedly arranged on the cold guide module 2 and generates a first directional air flow, the first directional air flow enters the garment body 8 from the outside of the garment body 8 through the surface of the cold guide module 2, and the first directional air flow is cooled when flowing through the surface of the cold guide module 2 and then continuously enters the garment body 8 to cool the interior of the garment body, so that a user feels comfortable; the heat conduction module 4 is attached to the second surface 12 of the semiconductor refrigeration device, and the heat radiation fan 5 is fixedly arranged on the heat conduction module 4 and generates a second directional airflow; first air guide fan housing 6 is right first directional air current guides, second air guide fan housing 7 cover establish with radiator fan 5's outside, and its import extends to the clothing body is outside, the directional air current of second flows out outside clothing body 8 to the surface of import 71, export 72 and the heat conduction module 4 of second air guide fan housing to absorb the heat of heat conduction module 4 and finally bat out outside clothing body 8 when the air is through heat conduction module 4 surface, realize the heat dissipation cooling to the heat conduction module.

In order to realize the control of the semiconductor refrigeration unit, the semiconductor refrigeration unit further comprises a power supply, a controller and a control button, the function selection is realized by pressing the control button, the power supply provides power for the controller, the controller drives the semiconductor refrigeration device 1, the cold air fan 3 and the heat dissipation fan 5 to operate in a coordinated manner, and the semiconductor refrigeration device 1 is connected with the controller through a lead 13. In view of facilitating flexible movement even after wearing the air-conditioning suit, it would be preferable to release the deadly power source as a rechargeable battery, preferably a lithium battery.

Further preferably, the cold conduction module 2 and the heat conduction module 4 are provided with a plurality of air flow channels 21/41, and the direction of the air flow channel 21/41 is from the inside of the garment body to the outside of the garment body; the cold air fan 3 is positioned on one side of the air flow channel 21 of the cold guide module, which faces the outside of the garment body; the heat dissipation fan 5 is located on one side, facing the inside of the garment body, of the heat conduction module air flow channel 41, so that the gas flowing structure of the semiconductor refrigeration unit is more reasonable, the heat end of the semiconductor refrigeration device can obtain better heat dissipation, the refrigeration efficiency of the cold end is higher, and the refrigeration effect of the air-conditioning suit is better.

In this embodiment, preferably, the first air guide sleeve 6 is fixedly disposed at the outer side of the air flow channel 21 of the cold guide module, so that the first directional air flow can more sufficiently enter the garment body along the air flow channel 21 of the cold guide module from the exterior of the garment body, and the cooled first directional air flow is prevented from being emitted to the exterior, thereby maximizing the utilization rate of cold energy and improving the refrigeration effect. In addition, the second air guide sleeve 7 further comprises a guide plate 73 fixedly arranged on the outer side of the air flow channel 41 of the heat conduction module; preferably, the cold conducting module and the heat conducting module are heat sinks made of aluminum or copper.

The above-mentioned embodiment is only the preferred embodiment of the present invention, and does not limit the protection scope of the present invention according to this, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. An air conditioning clothing with semiconductor refrigerating system, its characterized in that: comprises a garment body and a semiconductor refrigeration unit; the semiconductor refrigeration unit is fixedly arranged on the garment body and comprises a semiconductor refrigeration device, a cold guide module, a cold air fan, a heat conduction module, a heat dissipation fan and a flow guide fan cover; the cold guide module is attached to the first surface of the semiconductor refrigeration device, the cold air fan is fixedly arranged on the cold guide module and generates first directional air flow, and the first directional air flow enters the garment body from the exterior of the garment body through the surface of the cold guide module; the heat conduction module is attached to the second surface of the semiconductor refrigeration device, and the heat radiation fan is fixedly arranged on the heat conduction module and generates second directional airflow; the air guide fan cover comprises a first air guide fan cover and a second air guide fan cover, the first air guide fan cover guides the first directional air flow, the second air guide fan cover covers the outside of the heat dissipation fan, an inlet of the second air guide fan cover extends towards the outside of the garment body, and the second directional air flow flows out of the garment body after passing through the surfaces of the second air guide fan cover and the heat conduction module.

2. An air conditioning garment with a semiconductor refrigeration system as recited in claim 1, wherein: also includes a power supply, a controller and a control button.

3. An air conditioning garment with a semiconductor refrigeration system as recited in claim 1, wherein: the cold guide module and the heat conduction module are provided with a plurality of air flow channels, and the trend of the air flow channels is from the inside of the garment body to the outside of the garment body; the cold air fan is positioned on one side of the air flow channel of the cold guide module, which faces the outside of the garment body; the heat dissipation fan is located on one side, facing the inside of the garment body, of the air flow channel of the heat conduction module.

4. An air conditioning garment with a semiconductor refrigeration system as recited in claim 1, wherein: the first air guide fan cover is fixedly arranged on the outer side of the air flow passage of the cold guide module.

5. An air conditioning garment with a semiconductor refrigeration system as recited in claim 1, wherein: the second air guide hood further comprises a guide plate fixedly arranged on the outer side of the air flow channel of the heat conduction module.

6. An air conditioning garment with a semiconductor refrigeration system as recited in claim 5, wherein: the cold conducting module and the heat conducting module are radiating fins.

7. An air conditioning garment having a semiconductor refrigeration system as claimed in claim 6, wherein: the radiating fin is made of aluminum or copper.