CN211897146U - Novel alkali copper electroplating device - Google Patents
Novel alkali copper electroplating device Download PDFInfo
- Publication number
- CN211897146U CN211897146U CN202020335721.9U CN202020335721U CN211897146U CN 211897146 U CN211897146 U CN 211897146U CN 202020335721 U CN202020335721 U CN 202020335721U CN 211897146 U CN211897146 U CN 211897146U
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- Prior art keywords
- fixedly connected
- electroplating
- rod
- wall
- plates
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Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 19
- 239000010949 copper Substances 0.000 title claims abstract description 19
- 239000003513 alkali Substances 0.000 title claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 24
- 238000003756 stirring Methods 0.000 claims abstract description 9
- 230000008093 supporting effect Effects 0.000 claims description 24
- 244000309464 bull Species 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 210000002421 cell wall Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to an electroplate technical field, and disclose a novel alkali copper is electroplated device, including electroplating bath, two support columns of the bottom fixedly connected with symmetry of electroplating bath, electroplating bath's bottom fixedly connected with motor, the bottom and the fixedly connected with stirring leaf of electroplating bath are passed to the output of motor, the electric putter of the equal fixed connection symmetry in both sides top of electroplating bath, four electric putter's top fixedly connected with movable plate, the spout has been seted up to the bottom of movable plate, the inside horizontal fixedly connected with slide bar of spout, the pole wall of slide bar is provided with fixture, the fixture bottom is provided with the plated item, electroplating bath's right side fixedly connected with backup pad, the top of backup pad is provided with grinding machanism. The utility model discloses can carry out the two-sided polishing that advances to the plated item that needs carry out the electroplating, increase and electroplate the effect.
Description
Technical Field
The utility model relates to an electroplate technical field, especially relate to a novel alkali copper is electroplated device.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to prevent the metal from being oxidized, thereby increasing some resistance of the material and increasing the using effect.
The existing alkali copper electroplating is performed by adding alkali liquor into an electroplating pool, so that electroplating is performed, and in the alkali copper electroplating process, a plated part is not polished in advance, so that stains or rust stains carried by the plated part body affect electrolyte, and the final electroplating effect is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the electroplated part is not polished before electroplating in the prior art, thereby influencing the subsequent electroplating result, and providing a novel alkali copper electroplating device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a novel alkali copper is electroplated device, including electroplating bath, two support columns of electroplating bath's bottom fixedly connected with symmetry, electroplating bath's bottom fixedly connected with motor, the output of motor passes electroplating bath's bottom and fixedly connected with stirring leaf, two electric putter of the equal fixed connection symmetry in both sides top of electroplating bath, four electric putter's top fixedly connected with movable plate, the spout has been seted up to the bottom of movable plate, the inside horizontal fixedly connected with slide bar of spout, the pole wall of slide bar is provided with fixture, the fixture bottom is provided with plated item, electroplating bath's right side fixedly connected with backup pad, the top of backup pad is provided with grinding machanism.
Preferably, fixture includes the annular plate, the inside wall of annular plate and the pole wall sliding connection of slide bar, the bottom fixedly connected with connecting block of annular plate, the bottom fixed connection telescopic link of connecting block, the equal fixedly connected with splint in both ends of telescopic link, the below of telescopic link is provided with first spring, the both ends of first spring are respectively in the one side fixed connection that two splint are close to mutually, the lower extreme of two splint is close to one side mutually and is connected with the lateral wall contact of plated item.
Preferably, the polishing mechanism comprises two polishing sheets, the two polishing sheets are positioned at two sides of the electroplated part and are symmetrically arranged, one side close to each other is in contact connection with the side wall of the electroplated part, the top of the supporting plate is fixedly connected with two symmetrical supporting rods, the tops of the two supporting rods are fixedly connected with supporting blocks, the insides of the two supporting blocks are respectively and rotatably connected with first rotating rods through first rotating bearings, the close ends of the two first rotating rods are respectively and fixedly connected with one side far away from the two polishing sheets, the far ends of the two first rotating rods are respectively and fixedly connected with first belt pulleys, the bottom of the supporting plate is fixedly connected with two symmetrical limiting plates, the two limiting plates are rotatably connected with second rotating rods through second rotating bearings, the right ends of the second rotating rods penetrate through the limiting plates and are fixedly connected with rotating motors, the rod walls of the second rotating rods are fixedly connected with two symmetrical belt pulleys, the first belt pulley and the second belt pulley are in transmission connection through a belt.
Preferably, the top of backup pad is seted up flutedly, and the cell wall of recess transversely fixedly connected with dead lever, and the pole wall of dead lever slides and has cup jointed two cardboard of symmetry, and the pole wall of dead lever has cup jointed two second springs of symmetry, and the both sides of second spring are respectively in cardboard and the cell wall of recess one side fixed connection that is close to mutually.
Preferably, a sealing bearing is arranged at the contact position of the output end of the motor and the bottom of the electroplating pool.
Compared with the prior art, the utility model provides a novel alkali copper is electroplated device possesses following beneficial effect:
1. this novel alkaline copper electroplating device, through electroplating bath, movable plate and the electric putter that is equipped with, the plated item that will polish is through adding the pole wall of holding mechanism evenly distributed at the slide bar, moves down through electric putter drive movable plate to electroplate in getting into the electroplating bath and electroplate.
2. This novel alkaline copper electroplating device through the grinding machanism that is provided with, will carry out the plated item that electroplates and carry out two-sided polishing in advance to do not influence following electroplating.
3. This novel alkaline copper is electroplated device through the motor and the stirring leaf that are equipped with, carries out abundant stirring with the plating solution in the electroplating bath to increase and electroplate the effect.
The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, the utility model discloses convenient operation can carry out the plated item that electroplates to needs and carry out two-sided polishing in advance to do not influence subsequent electroplating and go on, increased final electroplating effect.
Drawings
FIG. 1 is a schematic structural view of a novel alkali copper electroplating device according to the present invention;
FIG. 2 is a schematic diagram of the right side structure of FIG. 1;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
fig. 4 is an enlarged view of a portion B in fig. 2.
In the figure: 1 electroplating pool, 2 support columns, 3 motors, 4 stirring blades, 5 electric push rods, 6 moving plates, 7 sliding rods, 8 electroplated parts, 9 support plates, 10 annular plates, 11 connecting blocks, 12 telescopic rods, 13 clamping plates, 14 first springs, 15 polishing plates, 16 support rods, 17 support blocks, 18 first rotating rods, 19 first belt wheels, 20 limiting plates, 21 second rotating rods, 22 rotating motors, 23 second belt wheels, 24 belts, 25 fixing rods, 26 clamping plates and 27 second springs.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-4, a novel alkali copper electroplating device comprises an electroplating pool 1, wherein the bottom of the electroplating pool 1 is fixedly connected with two symmetrical supporting columns 2, the supporting columns 2 are arranged to increase the supporting effect on the electroplating pool 1, the bottom of the electroplating pool 1 is fixedly connected with a motor 3, the output end of the motor 3 passes through the bottom of the electroplating pool 1 and is fixedly connected with a stirring blade 4, the stirring blade 4 and the motor 3 are arranged to uniformly mix electroplating solution in the electroplating pool 1, the tops of two sides of the electroplating pool 1 are fixedly connected with two symmetrical electric push rods 5, the tops of the four electric push rods 5 are fixedly connected with a movable plate 6, the bottom of the movable plate 6 is provided with a chute, the inside of the chute is transversely and fixedly connected with a slide rod 7, the rod wall of the slide rod 7 is provided with a clamping mechanism, the bottom of the clamping mechanism is provided with an electroplating piece 8, the slide rod 7 and the clamping, the right side fixedly connected with backup pad 9 of electroplating bath 1, the top of backup pad 9 is provided with grinding machanism.
Fixture includes annular slab 10, the inside wall of annular slab 10 and the pole wall sliding connection of slide bar 7, the bottom fixedly connected with connecting block 11 of annular slab 10, the bottom fixed connection telescopic link 12 of connecting block 11, the equal fixedly connected with splint 13 in both ends of telescopic link 12, the below of telescopic link 12 is provided with first spring 14, the both ends of first spring 14 are respectively in the one side fixed connection that two splint 13 are close to mutually, the one side that the lower extreme of two splint 13 is close to mutually is connected with the lateral wall contact of plated item 8, it can carry out effectual centre gripping to plated item 8 to set up first spring 14 and splint 13.
The polishing mechanism comprises two polishing sheets 15, the two polishing sheets 15 are positioned at two sides of the electroplated part 8 and are symmetrically arranged, one side close to each other is in contact connection with the side wall of the electroplated part 8, the top of the supporting plate 9 is fixedly connected with two symmetrical supporting rods 16, the tops of the two supporting rods 16 are both fixedly connected with supporting blocks 17, the interiors of the two supporting blocks 17 are both rotatably connected with first rotating rods 18 through first rotating bearings, the first rotating bearings are arranged to increase the transverse rotating stability of the first rotating rods 18, so that the electroplated part 8 can be effectively polished by the polishing sheets 15 in a rotating manner, the close ends of the two first rotating rods 18 are respectively fixedly connected with one sides far away from the two polishing sheets 15, the far ends of the two first rotating rods 18 are both fixedly connected with first belt pulleys 19, the bottom of the supporting plate 9 is fixedly connected with two symmetrical limiting plates 20, and the two limiting plates 20 are rotatably connected with second rotating rods 21 through second rotating bearings, the right end of second bull stick 21 passes limiting plate 20 and fixedly connected with and rotates motor 22, and the pole wall fixedly connected with of second bull stick 21 has two second pulleys 23 of symmetry, and first pulley 19 and second pulley 23 pass through belt 24 transmission and connect, through belt 24 transmission for first bull stick 18 and second bull stick 21 rotate simultaneously, make two abrasive disc 5 polish plated item 8 simultaneously.
The top of backup pad 9 is seted up flutedly, the horizontal fixedly connected with dead lever 25 of cell wall of recess, two cardboard 26 of symmetry have been cup jointed in the pole wall slip of dead lever 25, two second springs 27 of symmetry have been cup jointed to the pole wall of dead lever 25, one side fixed connection that the both sides of second spring 27 are close to mutually in cardboard 26 and the cell wall of recess respectively, can carry out the centre gripping through second spring 27 and cardboard 26 when polishing to the bottom of plated item 8 and stabilize, the output of motor 3 and the bottom contact position of electroplating bath 1 are provided with sealed bearing, it prevents that the plating solution from spilling to cause the influence to the motor to set up sealed bearing.
In the utility model, when electroplating is needed, the top of the electroplated part 8 is placed between two clamping plates 13, the electroplated part 8 is clamped by the elastic compression of a first spring 14, the electroplated part 8 is moved into a space between two polishing plates 15, two clamping plates 26 are used for stably clamping the bottom of the electroplated part 8 by the elastic compression of a second spring 27 at the top of a supporting plate 9, a rotating motor 22 is opened to rotate a second rotating rod 21, the second rotating rod 21 drives two second belt wheels 23 to rotate, the two second belt wheels 23 drive two first belt wheels 19 to rotate by the transmission of a belt 24, so that two first rotating rods 18 rotate simultaneously, the two polishing plates 15 rotate synchronously to polish the electroplated part 8, the two clamping plates 26 are opened after polishing, so that an annular plate 10 and a connecting block 11 in the clamping mechanism drive part 8 to slide on a sliding rod 7, and move to electroplating bath 1 top, the work of polishing is carried out repeatedly for when a plurality of plated item 8 are located electroplating bath 1 top simultaneously, open motor 3 and drive stirring leaf 4 and make the plating solution misce bene, thereby open electric putter 5 and make movable plate 6 move down, drive plated item 8 and electroplate in getting into the plating solution of electroplating bath 1.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A novel alkali copper electroplating device comprises an electroplating pool (1) and is characterized in that the bottom of the electroplating pool (1) is fixedly connected with two symmetrical supporting columns (2), the bottom of the electroplating pool (1) is fixedly connected with a motor (3), the output end of the motor (3) penetrates through the bottom of the electroplating pool (1) and is fixedly connected with a stirring blade (4), the tops of the two sides of the electroplating pool (1) are fixedly connected with two symmetrical electric push rods (5), the tops of the four electric push rods (5) are fixedly connected with a movable plate (6), the bottom of the movable plate (6) is provided with a sliding chute, the inside of the sliding chute is transversely and fixedly connected with a sliding rod (7), the rod wall of the sliding rod (7) is provided with a clamping mechanism, the bottom of the clamping mechanism is provided with an electroplated part (8), and the right side of the electroplating pool (1) is fixedly connected with a, and a polishing mechanism is arranged at the top of the supporting plate (9).
2. The novel alkali copper electroplating device according to claim 1, wherein the clamping mechanism comprises a ring-shaped plate (10), the inner side wall of the ring-shaped plate (10) is slidably connected with the rod wall of the sliding rod (7), the bottom of the ring-shaped plate (10) is fixedly connected with a connecting block (11), the bottom of the connecting block (11) is fixedly connected with a telescopic rod (12), both ends of the telescopic rod (12) are fixedly connected with clamping plates (13), a first spring (14) is arranged below the telescopic rod (12), both ends of the first spring (14) are fixedly connected with the side faces, close to the two clamping plates (13), of the two clamping plates (13), and the side faces, close to the lower ends of the two clamping plates (13), of the two clamping plates are in contact connection with the side wall of the electroplated part (8).
3. The novel alkali copper electroplating device according to claim 1, wherein the polishing mechanism comprises two polishing plates (15), the two polishing plates (15) are symmetrically arranged on two sides of the electroplated part (8), one side of the two polishing plates close to each other is in contact connection with the side wall of the electroplated part (8), the top of the supporting plate (9) is fixedly connected with two symmetrical supporting rods (16), the tops of the two supporting rods (16) are both fixedly connected with supporting blocks (17), the insides of the two supporting blocks (17) are both rotatably connected with first rotating rods (18) through first rotating bearings, one ends of the two first rotating rods (18) close to each other are respectively fixedly connected with one side of the two polishing plates (15) far away from each other, and one ends of the two first rotating rods (18) far away from each other are both fixedly connected with first belt pulleys (19), two limiting plates (20) of bottom fixedly connected with symmetry of backup pad (9), two limiting plate (20) rotate through second rolling bearing and are connected with second bull stick (21), limiting plate (20) and fixedly connected with rotation motor (22) are passed to the right-hand member of second bull stick (21), two second belt pulleys (23) of pole wall fixedly connected with symmetry of second bull stick (21), first belt pulley (19) and second belt pulley (23) are connected through belt (24) transmission.
4. The novel alkali copper electroplating device according to claim 1, wherein a groove is formed in the top of the supporting plate (9), a fixing rod (25) is transversely and fixedly connected to the groove wall of the groove, two symmetrical clamping plates (26) are slidably sleeved on the rod wall of the fixing rod (25), two symmetrical second springs (27) are sleeved on the rod wall of the fixing rod (25), and two sides of each second spring (27) are fixedly connected to the side where the clamping plate (26) is close to the groove wall of the groove.
5. The novel alkaline copper electroplating device according to claim 1, characterized in that a sealing bearing is arranged at the contact position of the output end of the motor (3) and the bottom of the electroplating pool (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020335721.9U CN211897146U (en) | 2020-03-18 | 2020-03-18 | Novel alkali copper electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020335721.9U CN211897146U (en) | 2020-03-18 | 2020-03-18 | Novel alkali copper electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211897146U true CN211897146U (en) | 2020-11-10 |
Family
ID=73323145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020335721.9U Expired - Fee Related CN211897146U (en) | 2020-03-18 | 2020-03-18 | Novel alkali copper electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211897146U (en) |
-
2020
- 2020-03-18 CN CN202020335721.9U patent/CN211897146U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201110 |
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| CF01 | Termination of patent right due to non-payment of annual fee |