CN211887710U - Positioning device for semiconductor packaging adhesive dispensing - Google Patents
Positioning device for semiconductor packaging adhesive dispensing Download PDFInfo
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- CN211887710U CN211887710U CN202020487848.2U CN202020487848U CN211887710U CN 211887710 U CN211887710 U CN 211887710U CN 202020487848 U CN202020487848 U CN 202020487848U CN 211887710 U CN211887710 U CN 211887710U
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- fixedly mounted
- telescopic cylinder
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- limiting plate
- dispensing
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Abstract
The utility model discloses a positioner that is used for semiconductor package point to glue, including the device main part. The glue dispensing head can move in multiple directions up, down, left, right, front and back through the cooperation of the multiple groups of telescopic cylinders, the speed reducer is driven by the motor to rotate, and the speed reducer drives the rotating shaft to rotate, so that the glue dispensing head can perform circular motion, the glue dispensing head can complete branch line glue dispensing work and circumferential glue dispensing work at the same time, and the practicability of the device is enhanced; the first limiting plate and the second limiting plate can fix the semiconductor materials, the semiconductor materials are prevented from moving in the dispensing process, the dispensing effect is guaranteed, and the position of the second limiting plate can be adjusted through the telescopic action of the telescopic cylinder, so that the limiting mechanism can fix the semiconductor materials with different sizes; the distance between the dispensing head and the semiconductor material can be controlled through the distance inductor, so that the dispensing effect is ensured.
Description
Technical Field
The utility model belongs to the technical field of semiconductor package adhesive deposite device, particularly, relate to a positioner that is used for semiconductor package point to glue.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors, which are important from the standpoint of technological or economic development, are widely used in radio, television and thermometry, for example, diodes are devices made of semiconductors, which are materials with controlled electrical conductivity ranging from insulators to conductors.
The prior Chinese patent with the publication number of 201920430043.1 discloses a positioning device for semiconductor package glue dispensing, which comprises a base, an intermediate plate and a support plate, wherein a first fixing frame is arranged at the top of the base, a first motor is arranged at one end of the first fixing frame, the output end of the first motor drives a first screw rod to rotate, a nut seat at the bottom of a connecting block is in threaded connection with the first screw rod, so that a second fixing frame longitudinally moves along the direction of a sliding plate, the output end of the second motor drives a second screw rod to rotate, when the second screw rod rotates, a nut seat at one side of a limiting sliding groove is in threaded connection with the second screw rod, so that a third fixing frame transversely moves along the sliding plate, the output end of a third motor drives a third screw rod to rotate, and the support plate vertically moves along a vertical plate due to the threaded connection between the third screw rod and a nut on a fixing plate, so that a glue dispensing head can, the position of the semiconductor is not required to be moved by workers, and the working efficiency is improved.
The above prior art solutions also have the following drawbacks:
1. semiconductor material directly places on the base, does not carry out the position to the semiconductor and prescribes a limit to, and when the in-process of gluing, when the semiconductor material appears moving, the position of gluing just is inaccurate to can't guarantee the efficiency nature of the work of gluing.
2. Although the technical scheme can realize multidirectional glue dispensing operation of the glue dispensing head in the vertical, horizontal, front and back directions, the circumferential glue dispensing operation cannot be completed.
3. Above-mentioned scheme is when making the dispensing head downstream, can't guarantee the distance between dispensing head and the semiconductor material, if the dispensing head downstream's distance is too big, can lead to dispensing head and semiconductor material direct contact for semiconductor material will dispense the head shutoff, if the downstream's distance undersize, make the dispensing head and semiconductor material between the distance too big, can't guarantee the effect of gluing.
Therefore in order to solve the above problems, the utility model provides a positioner that is used for semiconductor package point to glue.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a positioner for semiconductor package point is glued to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a positioning device for semiconductor packaging adhesive dispensing comprises a device main body, wherein a bottom plate is fixedly mounted at the bottom end of the device main body, a guide rail is fixedly mounted at one side of the bottom plate, a second telescopic cylinder is fixedly mounted at the top end of the guide rail, a third telescopic cylinder is fixedly mounted at one side of the top end of the second telescopic cylinder, a motor box is fixedly mounted at the bottom side of one end of the third telescopic cylinder, a motor is fixedly mounted in the motor box, a speed reducer is fixedly mounted at the bottom end of the motor, a rotating shaft is fixedly mounted at the bottom end of the speed reducer, a rotating plate is fixedly mounted at the bottom end of the rotating shaft, a distance sensor is fixedly mounted at the bottom end of the rotating plate, a limiting mechanism is fixedly mounted at the top end of the bottom plate, a first limiting plate is arranged at one side of the limiting mechanism, and, and a second limiting plate is arranged on one side of the first limiting plate.
Furthermore, the inside one end fixed mounting of guide rail has first telescopic cylinder, the one end fixed mounting of first telescopic cylinder has first slider, first slider with guide rail sliding connection.
Furthermore, the bottom of the second telescopic cylinder is fixedly connected with the top end of the first sliding block, a first fixing seat is fixedly mounted at the top end of the second telescopic cylinder, and the first fixing seat is L-shaped.
Furthermore, the one end of third telescopic cylinder with one side fixed connection of first fixing base, just the other end fixed mounting of third telescopic cylinder has the second fixing base, the top of motor case with the bottom fixed connection of second fixing base.
Further, the output of pivot in the motor with the receiving terminal of pivot passes through coupling fixed connection in the speed reducer, the output of pivot in the speed reducer with coupling fixed connection is passed through on the top of pivot, bottom one side fixed mounting of commentaries on classics board has the dispensing head, the dispensing head passes through the injecting glue pipe and is connected with the injecting glue equipment of peripheral hardware.
Further, the top of bottom plate is equipped with the spout, the inside one end fixed mounting of spout has the flexible cylinder of fourth, the one end fixed mounting of the flexible cylinder of fourth has the second slider, the top of second slider with the bottom fixed connection of second limiting plate.
Further, the top fixed mounting of bottom plate has the controller, apart from the inductor pass through the signal line with the controller is connected, the controller pass through the signal line with the flexible cylinder of second is connected, just the model apart from the inductor is Q4X, the model of controller is MAM-100.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses in, can realize the diversified removal around the upper and lower left and right sides of dispensing head through multiunit telescopic cylinder's mating reaction, and through the rotation of motor drive speed reducer, the speed reducer drives the rotation of pivot to can make the dispensing head carry out the circular motion, and then make the dispensing head not only can accomplish branch line point and glue work, can also accomplish circumference point simultaneously and glue work, strengthened the practicality and the functionality of device.
2. The utility model discloses in, can fix semiconductor material through the effect of first limiting plate with the second limiting plate to prevent that the in-process semiconductor material of gluing from taking place to remove, and then guarantee the glue effect, and the second limiting plate can carry out position adjustment through telescopic cylinder's concertina action, makes this stop gear can both fix not unidimensional semiconductor material.
3. The distance between the dispensing head and the semiconductor material can be controlled through the distance inductor, so that the dispensing effect is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a side view of the present invention;
fig. 3 is a bottom plate structure view of the present invention.
Reference numerals:
1. a device main body; 2. a base plate; 3. a guide rail; 301. a first telescopic cylinder; 302. a first slider; 4. a second telescopic cylinder; 401. a first fixed seat; 5. a third telescopic cylinder; 501. a second fixed seat; 6. a motor case; 601. a motor; 602. a speed reducer; 603. a rotating shaft; 7. rotating the plate; 701. dispensing a glue head; 702. a distance sensor; 8. a limiting mechanism; 801. a first limit plate; 802. a second limiting plate; 803. a chute; 804. a fourth telescopic cylinder; 805. a second slider; 9. and a controller.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
referring to fig. 1-3, a positioning device for semiconductor package dispensing according to an embodiment of the present invention includes a device main body 1, a bottom plate 2 is fixedly mounted at a bottom end of the device main body 1, a guide rail 3 is fixedly mounted at one side of the bottom plate 2, a second telescopic cylinder 4 is fixedly mounted at a top end of the guide rail 3, a third telescopic cylinder 5 is fixedly mounted at one side of a top end of the second telescopic cylinder 4, a motor case 6 is fixedly mounted at a bottom side of one end of the third telescopic cylinder 5, a motor 601 is fixedly mounted in the motor case 6, a speed reducer 602 is fixedly mounted at a bottom end of the motor 601, a rotating shaft 603 is fixedly mounted at a bottom end of the speed reducer 602, a rotating plate 7 is fixedly mounted at a bottom end of the rotating plate 603, a distance sensor 702 is fixedly mounted at a bottom end of the rotating plate 7, and a limiting mechanism 8 is fixedly mounted, one side of the limiting mechanism 8 is provided with a first limiting plate 801, the bottom end of the first limiting plate 801 is fixedly connected with the top end of the bottom plate 2, and one side of the first limiting plate 801 is provided with a second limiting plate 802.
Through the scheme of the utility model, a first telescopic cylinder 301 is fixedly installed at one end inside the guide rail 3, a first slider 302 is fixedly installed at one end of the first telescopic cylinder 301, and the first slider 302 is connected with the guide rail 3 in a sliding manner; the bottom end of the second telescopic cylinder 4 is fixedly connected with the top end of the first sliding block 302, a first fixed seat 401 is fixedly mounted at the top end of the second telescopic cylinder 4, and the first fixed seat 401 is L-shaped; one end of the third telescopic cylinder 5 is fixedly connected with one side of the first fixing seat 401, the other end of the third telescopic cylinder 5 is fixedly provided with a second fixing seat 501, and the top end of the motor box 6 is fixedly connected with the bottom end of the second fixing seat 501; the output end of the rotating shaft in the motor 601 is fixedly connected with the receiving end of the rotating shaft in the speed reducer 602 through a shaft connector, the output end of the rotating shaft in the speed reducer 602 is fixedly connected with the top end of the rotating shaft 603 through a shaft connector, one side of the bottom end of the rotating plate 7 is fixedly provided with a dispensing head 701, and the dispensing head 701 is connected with an external glue injection device through a glue injection pipe; a sliding groove 803 is formed in the top end of the bottom plate 2, a fourth telescopic cylinder 804 is fixedly mounted at one end inside the sliding groove 803, a second sliding block 805 is fixedly mounted at one end of the fourth telescopic cylinder 804, and the top end of the second sliding block 805 is fixedly connected with the bottom end of the second limiting plate 802; the top fixed mounting of bottom plate 2 has controller 9, distance inductor 702 pass through the signal line with controller 9 connects, controller 9 pass through the signal line with the flexible cylinder 4 of second is connected, just the model of distance inductor 702 is Q4X, the model of controller 9 is MAM-100.
When the semiconductor material dispensing device is used specifically, firstly, the semiconductor material is mounted on the bottom plate 2 and is fixed by the limiting mechanism 8, specifically, the distance between the first limiting plate 801 and the second limiting plate 802 is adjusted according to the size of the semiconductor material, then the distance is adjusted to be slightly larger than the semiconductor material, the semiconductor material is placed between the first limiting plate 801 and the second limiting plate 802, then the chute 803 is pushed towards the direction of the first limiting plate 801 by the action of the fourth telescopic cylinder 804, so that the second limiting plate 802 moves towards the direction of the first limiting plate 801, when two sides of the semiconductor material are contacted with the first limiting plate 801 and the second limiting plate 802, the operation of the fourth telescopic cylinder 804 is stopped, then the dispensing head 701 is moved to the upper side of the dispensing position of the semiconductor material by the telescopic action of the first telescopic cylinder 301 and the third telescopic cylinder 5, then the dispensing head 701 moves towards the semiconductor material dispensing position under the telescopic action of the second telescopic cylinder 4, the distance sensor 702 can detect the vertical distance between the dispensing head 701 and the semiconductor material in the process, when the detected distance meets the dispensing work, the result is transmitted to the controller 9, the controller 9 immediately closes the second telescopic cylinder 4, so that the height of the dispensing head 701 is fixed, when the circumferential dispensing work needs to be carried out, the motor 601 is started, the motor 601 drives the speed reducer 602 to rotate, the speed reducer 602 drives the rotating shaft 603 to rotate, and the dispensing head 701 can rotate circumferentially, so that the circumferential dispensing work is realized.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The positioning device for semiconductor packaging adhesive dispensing is characterized by comprising a device main body (1), a bottom plate (2) is fixedly mounted at the bottom end of the device main body (1), a guide rail (3) is fixedly mounted at one side of the bottom plate (2), a second telescopic cylinder (4) is fixedly mounted at the top end of the guide rail (3), a third telescopic cylinder (5) is fixedly mounted at one side of the top end of the second telescopic cylinder (4), a motor box (6) is fixedly mounted at the bottom side of one end of the third telescopic cylinder (5), a motor (601) is fixedly mounted in the motor box (6), a speed reducer (602) is fixedly mounted at the bottom end of the motor (601), a rotating shaft (603) is fixedly mounted at the bottom end of the rotating shaft (603), a rotating plate (7) is fixedly mounted at the bottom end of the rotating plate (7), a distance sensor (702) is fixedly mounted at the bottom end of the rotating plate (, the top fixed surface of bottom plate (2) installs stop gear (8), one side of stop gear (8) is equipped with first limiting plate (801), the bottom of first limiting plate (801) with the top fixed connection of bottom plate (2), one side of first limiting plate (801) is equipped with second limiting plate (802).
2. The positioning device for semiconductor package dispensing according to claim 1, wherein a first telescopic cylinder (301) is fixedly mounted at one end inside the guide rail (3), a first sliding block (302) is fixedly mounted at one end of the first telescopic cylinder (301), and the first sliding block (302) is slidably connected with the guide rail (3).
3. The positioning device for semiconductor package dispensing according to claim 2, wherein the bottom end of the second telescopic cylinder (4) is fixedly connected with the top end of the first slider (302), and a first fixing seat (401) is fixedly mounted at the top end of the second telescopic cylinder (4), and the first fixing seat (401) is L-shaped.
4. The positioning device for semiconductor package dispensing according to claim 3, wherein one end of the third telescopic cylinder (5) is fixedly connected with one side of the first fixing seat (401), a second fixing seat (501) is fixedly mounted at the other end of the third telescopic cylinder (5), and the top end of the motor box (6) is fixedly connected with the bottom end of the second fixing seat (501).
5. The positioning device for semiconductor package dispensing according to claim 1, wherein an output end of an inner rotating shaft of the motor (601) is fixedly connected with a receiving end of an inner rotating shaft of the speed reducer (602) through a shaft connector, an output end of an inner rotating shaft of the speed reducer (602) is fixedly connected with a top end of the rotating shaft (603) through a shaft connector, a dispensing head (701) is fixedly mounted on one side of a bottom end of the rotating plate (7), and the dispensing head (701) is connected with an external glue injection device through a glue injection pipe.
6. The positioning device for semiconductor package dispensing according to claim 1, wherein a sliding slot (803) is formed in the top end of the bottom plate (2), a fourth telescopic cylinder (804) is fixedly mounted at one end inside the sliding slot (803), a second sliding block (805) is fixedly mounted at one end of the fourth telescopic cylinder (804), and the top end of the second sliding block (805) is fixedly connected with the bottom end of the second limiting plate (802).
7. The positioning device for semiconductor package adhesive dispensing according to claim 1, wherein a controller (9) is fixedly mounted at the top end of the bottom plate (2), the distance sensor (702) is connected with the controller (9) through a signal line, the controller (9) is connected with the second telescopic cylinder (4) through a signal line, the model of the distance sensor (702) is Q4X, and the model of the controller (9) is MAM-100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020487848.2U CN211887710U (en) | 2020-04-07 | 2020-04-07 | Positioning device for semiconductor packaging adhesive dispensing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020487848.2U CN211887710U (en) | 2020-04-07 | 2020-04-07 | Positioning device for semiconductor packaging adhesive dispensing |
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| Publication Number | Publication Date |
|---|---|
| CN211887710U true CN211887710U (en) | 2020-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020487848.2U Active CN211887710U (en) | 2020-04-07 | 2020-04-07 | Positioning device for semiconductor packaging adhesive dispensing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113477470A (en) * | 2021-07-01 | 2021-10-08 | 深圳市泰达机器人有限公司 | Automatic dispensing assembly production line |
| CN115255425A (en) * | 2022-08-30 | 2022-11-01 | 航天特种材料及工艺技术研究所 | Sectional type remote induction power supply vibration auxiliary machining system of drilling and boring machine |
-
2020
- 2020-04-07 CN CN202020487848.2U patent/CN211887710U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113477470A (en) * | 2021-07-01 | 2021-10-08 | 深圳市泰达机器人有限公司 | Automatic dispensing assembly production line |
| CN115255425A (en) * | 2022-08-30 | 2022-11-01 | 航天特种材料及工艺技术研究所 | Sectional type remote induction power supply vibration auxiliary machining system of drilling and boring machine |
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