CN211880434U

CN211880434U - Integrated intelligent computer mainboard

Info

Publication number: CN211880434U
Application number: CN202020729669.5U
Authority: CN
Inventors: 王斌
Original assignee: Beijing Dayou Zhizao Science & Technology Co ltd
Current assignee: Shenzhen Yonglaida Electronic Technology Co ltd
Priority date: 2020-05-06
Filing date: 2020-05-06
Publication date: 2020-11-06
Anticipated expiration: 2030-05-06

Abstract

The utility model discloses an integrated form intelligence machine mainboard, integrated form intelligence machine mainboard includes, rectangular shape mainboard PCB piles up for piling up the original point with the lower left corner of intelligent machine front view, rectangular shape mainboard PCB's upper right portion is equipped with a sunk part, rectangular shape mainboard PCB's right lower part has a salient position, wherein, the sunk part with the size phase-match at salient position, the sunk part with salient position in the vertical direction with the distance of rectangular shape mainboard PCB's horizontal intermediate line equals.

Description

Integrated intelligent computer mainboard

Technical Field

The utility model relates to a smart mobile phone field, in particular to integrated form smart machine mainboard.

Background

At present, the main board design of the smart phone generally adopts three modes of whole board stacking, broken board + small board stacking and bar stacking. Fig. 1 shows a main board stacking diagram of three main designs at present. The broken board and the small board are stacked, two boards are connected through a flexible circuit board and a radio frequency cable, a battery is arranged between the two main boards, the main boards are compact in design, the battery capacity can exceed 2500mAH, the thickness of the whole machine can be within 10mm, and the main mode is currently designed for most of main boards of smart phones; the whole board is stacked, namely, the battery is positioned on the PCB, so that the PCB has the advantages of simple structure, high assembly efficiency and high cost due to the thick thickness of the whole machine and high cost of the PCB, and the whole board is applied to early smart phones and is rarely adopted by smart phones at present; the design mode is piled up to the slat is that the mainboard is located the cell-phone and piles up one side, and the battery is located the opposite side, and each circuit board passes through the interconnection of precision connector, and this kind of traditional slat advantage designs according to product special demand, and the structure is exquisite, and the shortcoming is that the PCB utilization ratio is not high, and the cost is than higher, mainly is applied to high-end smart mobile phone at present, for example HUAWEI Mate30 and Apple iPhone's mainboard etc.. The common constraint of the three design modes is that for different appearance designs of the smart phone, a mobile phone mainboard needs to be redesigned to be matched with the design modes, the universality of the mainboard is not enough, the mainboard too depends on the appearance of the smart phone, and even for a middle-end smart phone with low appearance requirement, a large amount of repeated hardware design work is needed.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides an integrated form smart machine mainboard can improve the design and the production efficiency of middle and low end smart mobile phone.

The utility model provides an integrated form intelligence machine mainboard, integrated form intelligence machine mainboard includes, rectangular shape mainboard PCB piles up as the initial point with the lower left corner of intelligent machine front view, rectangular shape mainboard PCB's upper right portion is equipped with a sunk part, rectangular shape mainboard PCB's right lower part has a salient position, wherein, the sunk part with the size phase-match at salient position, the sunk part with salient position in the vertical direction with the distance of rectangular shape mainboard PCB's horizontal intermediate line equals.

The utility model discloses a carry out the standardized design of integrated form with middle and low end smart mobile phone mainboard, can greatly overcome the non-commonality restraint of present mainstream smart mobile phone mainboard stacking mode, when satisfying the different smart mobile phone outward appearance requirement of overwhelming majority, support public mainboard universal characteristic, the hardware that greatly reduces repeatability piles up design development, improves the design and the paster efficiency of middle and low end smart mobile phone mainboard, when reducing design and manufacturing cost, has improved the production yield.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 is a schematic diagram of three main board stacking schemes in the prior art;

fig. 2 is a schematic diagram of an integrated smart motherboard according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a jointed board of an integrated intelligent motherboard in a production process according to an embodiment of the present invention.

Reference numerals:

10 stacking origin 11 concave part

12 protruding part 20 integrated form intelligent machine mainboard

30 integrated form intelligent machine mainboard makeup

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

The embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, as shown in fig. 2, integrated form intelligence machine mainboard includes, rectangular shape mainboard PCB piles up for piling up original point 10 with the lower left corner of intelligent machine front view, rectangular shape mainboard PCB's upper right portion is equipped with a depressed part 11, rectangular shape mainboard PCB's right lower part has a salient position 12, wherein, the size phase-match at depressed part and salient position, the depressed part equals with the distance of salient position at the horizontal intermediate line of rectangular shape mainboard PCB's vertical direction.

It can be known from fig. 3 that, the size phase-match of depressed part and salient position, depressed part and salient position equal this technical feature at the distance of the horizontal intermediate line of vertical direction and rectangular shape mainboard PCB, can be so that rectangular shape mainboard PCB forms the makeup of symmetrical formula in manufacturing process, and with another rectangular shape mainboard PCB horizontal rotation 180 degrees after, depressed part and salient position between integrated form smart mobile phone mainboard makeup 30 can closely laminate, form the matching formula makeup of full symmetry, this can make the rate of utilization of PCB substrate in process of production be higher than 95%, and the used HDI circuit board of present smart mobile phone mainboard occupies higher HDI cost ratio, this can make the utility model discloses an integrated form smart mobile phone mainboard that embodiment provided has more economic nature.

It should be noted here that, in order to make the utility model provides an integrated form smart machine mainboard schematic diagram more closely actual so that the reader understands, has the electronic components detail that probably exists on a large amount of smart mobile phone mainboards in fig. 2 and fig. 3, and this is not repeated everywhere.

Furthermore, the embodiment of the utility model provides a pair of integrated form smart machine mainboard piles up for piling up the initial point through the lower left corner at the positive view of smart machine to the design is rectangular shape mainboard, can adapt to the different outward appearance requirements of the well low-end smart mobile phone of various sizes, need not to supply the platelet.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, rectangular shape mainboard PCB's depressed part region is used for setting up diversity antenna, WIFI antenna and GPS antenna and presents a little. Through with WIFI, GPS and the regional near the sunken position in rectangular shape mainboard PCB's top with the dipole antenna feed point setting, save the support platelet.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, rectangular shape mainboard PCB's salient position region is used for laying battery connector and main collection antenna and presents a little. The lithium cell is linked through the battery connector to rectangular shape mainboard PCB's bottom salient position, supports vertical direction battery contact point and mainboard battery connector to contact, and rectangular shape mainboard PCB's side is arranged in with the lithium cell to this kind of mode, can provide physical space and the heat dissipation space as big as possible for the lithium cell.

Optionally, the embodiment of the utility model provides a pair of integrated form smart machine mainboard, rectangular shape mainboard PCB is no longer than 118mm in the ascending length of vertical direction, generally speaking, the adaptable minimum 4 inches of length size of 118mm to the biggest smart mobile phone screen of 7 inches.

Optionally, the embodiment of the utility model provides a pair of integrated form smart machine mainboard, according to the outward appearance requirement of smart machine, earphone, loudspeaker, camera, flash light, the sensor of smart mobile phone are connected to rectangular shape mainboard PCB through assorted FPC. The positions of the devices and the size of the required space can be supported by different FPCs connected to the long-strip-shaped main board PCB according to the product appearance requirements of the smart phone.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, the keying circuit of intelligence machine set up in rectangular shape mainboard PCB's left side. Generally speaking, a 3.5-inch earphone interface and a USB interface which are required to be configured by a middle-low-end smart phone are both arranged at fixed positions of a strip-shaped main board PCB, and in addition, in special cases, keys, the earphone interface and the USB interface can be adjusted through an FPC of an expansion pad.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, the earphone and the USB interface circuit of intelligence machine set up in rectangular shape mainboard PCB's bottom.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, rectangular shape mainboard PCB adopts the single face to place components and parts, wherein does not place components and parts with LCD module coincidence position region.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, the camera and the LCD screen of intelligence machine with rectangular shape mainboard PCB connects through the welding of positive pad or through the reverse side connector.

Optionally, the embodiment of the utility model provides a pair of integrated form intelligence machine mainboard, the top right side of rectangular shape mainboard PCB is arranged in to the preceding camera subassembly connector of intelligence machine, and rectangular shape mainboard PCB's top is arranged in to the rearmounted camera subassembly connector of intelligence machine, and rectangular shape mainboard PCB's bottom is arranged in to the LCD screen connector and the CTP connector of intelligence machine.

To sum up, the embodiment of the utility model provides a pair of integrated form smart machine mainboard carries out the standardized design of integrated form with middle and low end smart mobile phone mainboard, can greatly overcome the non-commonality restraint of present mainstream smart mobile phone mainboard stacking mode, when satisfying the different smart mobile phone outward appearance requirements of the overwhelming majority, support public mainboard universal characteristic, the design development is piled up to the hardware that greatly reduces repeatability, the design and the paster efficiency of middle and low end smart mobile phone mainboard are improved, when reducing design and manufacturing cost, the production yield has been improved.

Specifically, one PCB of the general strip-shaped main board is adopted to replace two PCBs of the traditional broken board, so that radio frequency cables and connecting FPCs are reduced, and the cost of main board materials is reduced by 2-3%; the universal strip-shaped main boards are stacked and distributed on the whole machine, different requirements of appearances of most different smart phones are met, common characteristics of the common main boards are supported, a design method for designing the intelligent first main boards by the smart phones according to the appearances of the whole machine is changed, and a large amount of repeated software and hardware design development is reduced; general bar shaped plate reduces the cable of traditional disconnected board and bar shaped plate more through a mainboard of high integrated level, and PCB board and FPC are more, and the complete machine auxiliary material is more, leads to the packaging technology complicacy, and production efficiency is low and the uniformity is not high. The smart phone designed based on the universal strip-shaped plate has the advantages of simple whole machine assembly process and high production efficiency.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. The utility model provides an integrated form intelligence machine mainboard, its characterized in that, integrated form intelligence machine mainboard includes, rectangular shape mainboard PCB piles up for piling up the initial point with the lower left corner of intelligent machine front view, the upper right portion of rectangular shape mainboard PCB is equipped with a depressed part, the lower right part of rectangular shape mainboard PCB has a salient position, wherein, the depressed part with the size phase-match at salient position, the depressed part with salient position in the vertical direction with the distance of the horizontal intermediate line of rectangular shape mainboard PCB equals.

2. The integrated smart machine motherboard of claim 1 wherein said recessed area is configured to provide a diversity antenna, a WIFI antenna, and a GPS antenna feed point.

3. The integrated smart machine motherboard of claim 1 wherein said ledge area is used to route battery connectors and primary set antenna feed points.

4. The integrated smart machine motherboard of claim 1 wherein the length of the elongated motherboard PCB in the vertical direction is no more than 118 mm.

5. The integrated intelligent machine mainboard of claim 1, wherein an earphone, a speaker, a camera, a flash lamp and a sensor of the intelligent machine are connected to the elongated mainboard PCB through a matched FPC according to appearance requirements of the intelligent machine.

6. The integrated intelligent machine mainboard of claim 1, wherein the key circuit of the intelligent machine is arranged on the left side of the elongated mainboard PCB.

7. The integrated intelligent machine mainboard of claim 1, wherein the earphone and the USB interface circuit of the intelligent machine are disposed at the bottom of the elongated mainboard PCB.

8. The integrated intelligent machine mainboard of claim 1, wherein the elongated mainboard PCB is configured with a single-sided component placement, and no component is disposed in a region coinciding with the LCD module.

9. The integrated intelligent machine mainboard of claim 1, wherein the cameras and LCD screens of the intelligent machine are connected with the elongated mainboard PCB by front pad soldering or by back connector.

10. The integrated smart machine motherboard according to claim 1, wherein the front camera assembly connector of the smart machine is disposed on the top right side of the elongated motherboard PCB, the rear camera assembly connector of the smart machine is disposed on the top of the elongated motherboard PCB, and the LCD screen connector and CTP connector of the smart machine are disposed on the bottom of the elongated motherboard PCB.