CN210112064U

CN210112064U - Smart phone motherboard and smart mobile phone

Info

Publication number: CN210112064U
Application number: CN201921412817.4U
Authority: CN
Inventors: 舒勇; 粟少波
Original assignee: Shenzhen Hongxiangyuan Technology Co Ltd
Current assignee: Shenzhen Hongxiangyuan Technology Co Ltd
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-02-21
Anticipated expiration: 2029-08-28

Abstract

The utility model discloses a smart mobile phone motherboard, this mainboard include the base plate, but set up the first district of keeping away of camera behind the holding on the base plate and can the holding before camera, earphone, be close response IC and the second of signal lamp and keep away the district, the second keeps away the position in the upper portion of base plate is located between the both sides angle of base plate, first keep away the position in a corner department on base plate upper portion, the edge of the lower part of base plate is equipped with board to board connector and side pressure battery connector, side pressure battery connector establishes on the board to the board connector and with board to board connector electricity is connected. The utility model discloses still disclose a smart mobile phone, including casing and the smart mobile phone mainboard that discloses above. The utility model discloses a compatible enough of smart mobile phone motherboard structure overall arrangement, applicable in numerous mobile phone outward appearance.

Description

Smart phone motherboard and smart mobile phone

Technical Field

The utility model relates to a cell-phone part technical field, in particular to smart mobile phone mainboard and smart mobile phone.

Background

The importance of a smart phone as a communication device closely related to the daily life of people is self-evident. With the rapid development of mobile communication technology and the improvement of living standard of people, the functions of the smart phone are more and more abundant, and the design of the appearance is more and more concise and fashionable.

In order to realize a plurality of functions required by the smart phone, more components and connectors must be integrated on a mainboard of the smart phone, the design of the mainboard becomes correspondingly complex, and especially peripheral devices such as a receiver, a loudspeaker, a camera and the like occupy larger space, so that the hardware performance and the appearance of the smart phone are very difficult to be considered when the mainboard is designed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a smart mobile phone motherboard aims at solving the problem that there is compatible not enough in the aspect of the structure overall arrangement of current smart mobile phone motherboard.

In order to realize the above-mentioned purpose, the utility model provides a smart mobile phone motherboard, this smart mobile phone motherboard include the base plate, but set up the first second that keeps away the position district and can hold preceding camera, earphone, be close response IC and signal lamp of camera behind the holding on the base plate and keep away the position district, the second keeps away the position in the upper portion of base plate is located between the both sides angle of base plate, first keep away the position in a corner on base plate upper portion, the edge of the lower part of base plate is equipped with board to board connector and side pressure battery connector, side pressure battery connector establishes on the board to board connector and with the board is connected the board to the board electricity.

Preferably, the mounting device further comprises a first mounting position, a second mounting position, a third mounting position, a fourth mounting position and a fifth mounting position which are arranged on the front surface of the substrate; wherein:

the first installation position is located on the lower side of the second avoidance area and is arranged adjacent to the second avoidance area, the second installation position and the third installation position are sequentially located on one side, away from the first avoidance area, of the first installation position, the fourth installation position is located on the lower sides of the second installation position and the third installation position, and the fifth installation position is located on the lower sides of the first installation position and the first avoidance area;

the wireless microphone is characterized in that a GPS chip, a BT chip and a WiFi chip are arranged on the first installation position, an audio power amplifier chip is arranged on the second installation position, an EMMC chip is arranged on the third installation position, a radio frequency transmitting and receiving chip is arranged on the fourth installation position, and a central processing unit chip and a memory chip are arranged on the fifth installation position.

Preferably, the antenna comprises a first antenna side pressing elastic sheet, a USB seat, an earphone seat, a second antenna side pressing elastic sheet and a rear main camera connector, wherein the first antenna side pressing elastic sheet, the USB seat, the earphone seat, the second antenna side pressing elastic sheet and the rear main camera connector are arranged on the front surface of the substrate; wherein:

the first antenna side pressure shell fragment is located keep away between the position district and the second and be located the edge of the upper end of base plate, USB seat, earphone seat and second antenna side pressure shell fragment arrange in proper order and are located the second keeps away the position district and keeps away from one side in the first position district of keeping away.

Preferably, the mounting device further comprises a sixth mounting position and a seventh mounting position which are arranged on the reverse side of the substrate; wherein:

the sixth installation position is positioned at the lower side of the second avoidance area and at one side of the first avoidance area, the seventh installation position is positioned at one side of the sixth installation position, which is deviated from the first avoidance area, and the sixth installation position is provided with a partial accommodation area for avoiding the seventh installation position;

and a power management chip is arranged on the sixth mounting position, and a radio frequency power amplifier chip is arranged on the seventh mounting position.

Preferably, the mobile phone further comprises a first antenna positive pressure spring, a rear auxiliary camera connector, a proximity induction IC connector, a signal lamp connector, a front camera connector, a receiver crimping spring and a second antenna positive pressure spring, wherein the first antenna positive pressure spring, the rear auxiliary camera connector, the proximity induction IC connector, the signal lamp connector, the front camera connector, the receiver crimping spring and the second antenna positive pressure spring are arranged on the reverse side of the substrate; wherein:

first antenna malleation shell fragment and vice camera connector in back are located between the first position district of keeping away and the second is kept away between the position district, first antenna malleation shell fragment is located the edge of the upper end of base plate and with vice camera connector in back adjacent setting from top to bottom, it arranges in proper order and is located to be close response IC connector, signal lamp connector, preceding camera connector, earphone crimping shell fragment the second is kept away between position district and the sixth installation position, and second antenna malleation shell fragment is located the upper end of base plate with a relative edge in first position district of keeping away.

Preferably, the device further comprises a Micro SIM and T Flash two-in-one card socket and a NANO SIM card socket which are arranged on the reverse side of the substrate; wherein:

the Micro SIM and T Flash two-in-one card socket is positioned on one side, close to the first avoidance area, of the sixth installation position, the sixth installation position is provided with a partial containing area used for avoiding the Micro SIM and T Flash two-in-one card socket, and the NANO SIM card socket is positioned on one side, far away from the first avoidance area, of the sixth installation position and is positioned on the upper side of the seventh installation position.

Preferably, the portable terminal further comprises a volume key/power-on key/AI voice key connector, a two-antenna printed circuit board connector, a touch screen connector, a fingerprint identification connector and a radio frequency connector which are arranged on the reverse side of the substrate; wherein:

the volume key/start key/AI voice key connector, the two antenna printed circuit board connectors, the touch screen connector and the fingerprint identification connector are sequentially arranged at the edge of the lower part of the substrate, the board-to-board connector and the side pressure battery connector are positioned between one of the two antenna printed circuit board connectors and the touch screen connector, one of the volume key/start key/AI voice key connector and the two antenna printed circuit board connectors is positioned on the lower side of the Micro SIM and T Flash two-in-one card seat, the other antenna printed circuit board connector is positioned on the lower side of the sixth mounting position, the touch screen connector and the fingerprint identification connector are positioned on the lower side of the seventh mounting position, and the radio frequency connector is positioned on one side of the seventh mounting position, which is far away from the sixth mounting position.

Preferably, the device further comprises a patch type rear flash lamp and a flip type flash lamp which are arranged on the reverse side of the substrate; wherein:

the patch type rear flash lamp and the elastic sheet type flash lamp are positioned between the first avoiding area and the two-in-one card seat of the Micro SIM and the TFlash.

Preferably, the antenna further comprises an antenna printed circuit board which is integrally formed with the substrate and is located in the first avoiding area.

The utility model discloses still provide a smart mobile phone, this smart mobile phone includes casing and the smart mobile phone mainboard that the above-mentioned proposed.

The utility model discloses technical scheme's beneficial effect lies in: in this smart mobile phone motherboard, set up the first district of keeping away on the base plate, the second keeps away the district, side pressure battery connector and board are to the board connector, camera after keeping away the district holding through the first, the second keeps away the preceding camera of district holding, the earphone, be close response IC and signal lamp, side pressure battery connector and board are to the board connector matching connection detachable battery and built-in integrative battery respectively, smart mobile phone motherboard overall structure layout compatibility is sufficient, can reach the purpose that is suitable for multiple cell-phone outward appearance, realize that a board is multi-purpose.

Drawings

Fig. 1 is a schematic front structural view of a smart phone motherboard according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a reverse structure of a motherboard of a smart phone according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a motherboard of a smart phone according to another embodiment of the present invention.

Detailed Description

In the following, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model provides a smart mobile phone motherboard, as shown in fig. 1, this smart mobile phone motherboard includes base plate 100, but set up the first of camera behind the holding on the base plate 100 and keep away the position district 1 and can hold preceding camera, the earphone, the second that is close response IC and signal lamp keeps away the position district 2, the second keeps away the position district 2 and is located base plate 100's upper portion and is located between base plate 100's both sides angle, first keep away a position district 1 and is located a boundary angle department on base plate 100 upper portion, the edge of base plate 100's lower part is equipped with board to board connector and side pressure battery connector 3, side pressure battery connector 3 establishes on board to board connector and is connected with board to board connector electricity.

The embodiment of the utility model provides a built-in mainboard of smart mobile phone mainboard as smart mobile phone for support smart mobile phone's corresponding function. As shown in fig. 1, the motherboard of the smart phone includes a substrate 100, where the substrate 100 is a circuit board, and the circuit design and arrangement on the circuit board are determined according to actual situations. The substrate 100 is provided with a first avoidance area 1 and a second avoidance area 2, and the first avoidance area 1 and the second avoidance area 2 are both notches formed by sinking from the circumferential side edge of the substrate 100 toward the inside of the substrate 100. The first avoidance area 1 is located at a corner of the upper portion of the substrate 100 and can accommodate a rear camera located at a corner of the upper end of the mobile phone. The second avoidance area 2 is located on the upper portion of the substrate 100 and between two corners of the substrate 100, and can accommodate a front camera, a receiver, an approach sensing IC and a signal lamp located at the upper end of the mobile phone. The shape and size of the first avoidance area 1 and the second avoidance area 2 are set according to actual conditions. As a better design, the second avoidance area 2 is arranged in the middle of the upper portion of the substrate 100, forms a U-shaped structure, and can be suitable for screen types such as 18:9 proportional screens, bang screens, water drop screens, blind hole screens, and the like, so that the smart phone motherboard can be compatible with various screen designs. Furthermore, a board-to-board connector and a side-pressure battery connector 3 are arranged on the base board 100, the board-to-board connector and the side-pressure battery connector 3 are located at the edge of the lower portion of the base board 100 and are located in the middle of the lower portion of the base board 100, the board-to-board connector is used for connecting the built-in integrated battery, and the side-pressure battery connector 3 is used for connecting the detachable battery. As a preferred design, the lateral-pressure battery connectors 3 are disposed on the board-to-board connectors to be electrically connected with the board-to-board connectors, and are fixed on the substrate 100 by the retaining structure, so as to reduce the occupied arrangement position of the substrate 100. The clamping structure may include two vertical plates fixed to the substrate 100, and clamping grooves formed thereon, and elastic clamping portions disposed on two corresponding sides of the lateral-pressure battery connector 3, wherein the elastic clamping portions on two sides of the lateral-pressure battery connector 3 are correspondingly clamped into the clamping grooves of the two vertical plates to fix the lateral-pressure battery connector 3 to the substrate 100. When the side pressure battery connector 3 is not required to be connected with a detachable battery, the side pressure battery connector can be detached, and the side pressure battery connector is convenient and practical. Therefore, the smart phone mainboard can be matched with the different mobile phone battery designs of the two battery types at the same time, is almost suitable for all mainstream smart phones in the current market, and for smart phones of different mobile phone battery design types, manufacturers can directly adopt the smart phone mainboard, so that the time for correspondingly adjusting the mainboard structure of each type of mobile phone can be saved, the research and development period is shortened, the financial and labor investment of research and development is reduced, and the product competitiveness is ensured.

This smart mobile phone mainboard is through first camera after keeping away 1 holding in position district, and camera, earphone, proximity response IC and signal lamp before the 2 holding in position district are kept away to the second, and side pressure battery connector 3 and board are to board connector match connection detachable battery and built-in integrative battery respectively, and smart mobile phone mainboard overall structure layout compatibility is sufficient, can reach the purpose that is suitable for multiple cell-phone outward appearance, realizes that a board is multi-purpose.

In addition, it should be noted that the connector mentioned in this embodiment and the following embodiments is used to electrically connect the peripheral device and the smart phone motherboard, so as to implement corresponding functions.

As shown in fig. 1, in an embodiment of the present invention, the first mounting position 4, the second mounting position 5, the third mounting position 6, the fourth mounting position 7, and the fifth mounting position 8 are further included on the front surface of the substrate 100, and a plurality of mounting positions are provided for mounting and setting various functional components. It is understood that the substrate 100 has front and back surfaces, and the surface of the substrate 100 disposed toward the screen of the mobile phone is the front surface, as shown in fig. 1; the side of the substrate 100 that faces away from the screen of the phone when mounted on the phone is the reverse side, as shown in fig. 2. The front and back sides of the substrate 100 in this and corresponding embodiments are defined only for convenience of description of the mounting positions of the components on the substrate 100, and are not absolutely limited. Wherein, first installation position 4 is located the second and keeps away the downside of position district 2 and keeps away position district 2 adjacent setting with the second, and second installation position 5 is located the left side of first installation position 4, and third installation position 6 is located the left side of second installation position 5, and fourth installation position 7 is located the downside of second installation position 5 and third installation position 6, and fifth installation position 8 is located first installation position 4 and the first downside of keeping away position district 1 and is located the right side of fourth installation position 7. The first installation position 4 is provided with a GPS chip, a BT chip and a WiFi chip, and preferably a three-in-one chip. An audio power amplifier chip is arranged on the second mounting position 5, an EMMC chip is arranged on the third mounting position 6, a radio frequency transmitting and receiving chip is arranged on the fourth mounting position 7, and a central processing unit chip and a memory chip are arranged on the fifth mounting position 8. The chip is mounted in a surface mount manner, is matched with the substrate 100 and other electronic components to realize functions, and is reasonably distributed in the whole framework; and the chip model is selected according to the actual situation, and will not be described in detail here.

As shown in fig. 1, the front surface of the substrate 100 is further provided with a first antenna side elastic pressing sheet 9, a USB socket 10, an earphone socket 11, a second antenna side elastic pressing sheet 12 and a rear main camera connector 13; the first antenna side pressing elastic sheet 9 is located between the first avoidance area 1 and the second avoidance area 2 and located at the edge of the upper end of the substrate 100, and the USB seat 10, the earphone seat 11 and the second antenna side pressing elastic sheet 12 are located on the left side of the second avoidance area 2 and are sequentially and adjacently arranged from right to left. The first antenna side pressure elastic sheet 9 is a GPS/WIFI antenna side pressure elastic sheet, the second antenna side pressure elastic sheet 12 is a 4G diversity antenna side pressure elastic sheet, the side pressure antenna elastic sheet is only specific to a mobile phone with a metal frame antenna, and the side pressure elastic sheet is directly conducted with the mobile phone metal frame antenna to realize antenna work. In addition, the earphone seat 11 is used for plugging an earphone, and the USB seat 10 is used for plugging an external USB connector to realize data communication.

To facilitate the placement of various functional components on the reverse side of the substrate 100, a sixth mounting location 14 and a seventh mounting location 15 are provided on the reverse side of the substrate 100 as shown in fig. 2. Wherein, the sixth mounting position 14 is located at the lower side of the second aversion region 2 and at one side of the first aversion region 1, and the sixth mounting position 14 occupies the middle position of the reverse side of the substrate 100. The seventh mounting position 15 is located on the right side of the sixth mounting position 14, and the sixth mounting position 14 has a partial accommodation area for avoiding the seventh mounting position 15, and a partial position of the seventh mounting position 15 is located in the partial accommodation area. A power management chip is arranged on the sixth mounting position 14, and a radio frequency power amplifier chip is arranged on the seventh mounting position 15. The chip is mounted in a patch manner, and the model of the chip is selected according to actual conditions, which is not described in detail herein. In addition, the first mounting position 4, the second mounting position 5, the third mounting position 6, the fourth mounting position 7, the fifth mounting position 8, the sixth mounting position 14 and the seventh mounting position 15 arranged above can be respectively covered with shielding cases for preventing the influence of external electromagnetic radiation on the radio frequency circuit, preventing the interference of the radio frequency from influencing the normal operation of devices in the baseband circuit, and simultaneously playing a role of protecting electronic components covered by the shielding cases. Preferably, the shield case is mounted in a patch manner.

As shown in fig. 2, the reverse side of the substrate 100 is further provided with a first antenna positive pressure spring 16, a rear sub-camera connector 17, a proximity sensing IC connector 18, a signal lamp connector 19, a front camera connector 20, a receiver press-contact spring 21 and a second antenna positive pressure spring 22. Wherein, first antenna positive pressure shell fragment 16 and the vice camera connector 17 in back are located first keeping away between district 1 and the second keeping away and distinguish 2, and first antenna positive pressure shell fragment 16 is located the edge of the upper end of base plate 100 and sets up adjacent from top to bottom with the vice camera connector 17 in back, and proximity induction IC connector 18, signal lamp connector 19, preceding camera connector 20, earphone crimping shell fragment 21 are located the second and keep away between district 2 and the sixth installation position 14, and adjacent arranging in proper order from a left side to the right side. The second antenna positive pressure spring 22 is located at a corner of the upper end of the substrate 100 opposite to the first avoiding location area 1, that is, the second antenna positive pressure spring 22 is located at the upper right corner of the substrate 100, and is reasonably arranged according to the positions of the second avoiding location area 2 and the first avoiding location area 1, so that the shortest FPC routing is realized, and the cost is saved. The first antenna positive pressure spring 16 is a GPS/WIFI antenna positive pressure spring, and the second antenna positive pressure spring 22 is a 4G diversity positive pressure spring.

As shown in fig. 2, the reverse side of the substrate 100 is further provided with a Micro SIM and T Flash two-in-one card socket 23 and a NANOSIM card socket 24. The Micro SIM and T Flash two-in-one card socket 23 is located on one side, close to the first avoiding area 1, of the sixth mounting position 14, the sixth mounting position 14 is provided with a partial accommodating area for avoiding the Micro SIM and T Flash two-in-one card socket 23, and the NANO SIM card socket 24 is located on one side, far away from the first avoiding area 1, of the sixth mounting position 14 and located on the upper side of the seventh mounting position 15. The Micro SIM and T Flash two-in-one card socket 23 can be inserted with an SIM card and a T Flash card, and the NANO SIM card socket 24 can be inserted with an NANO standard SIM card, and the two are combined to realize the double-card function of the mobile phone.

As shown in fig. 2, a volume key/power-on key/AI voice key connector 25, a two-antenna printed circuit board connector 26, a touch screen connector 27, a fingerprint identification connector 28 and a radio frequency connector 29 are further disposed on the reverse side of the substrate 100. The volume key/start key/AI voice key connector 25, the two antenna printed circuit board connectors 26, the touch screen connector 27 and the fingerprint identification connector 28 are sequentially arranged at the edge of the lower part of the substrate 100 from left to right, the board-to-board connector and the side pressure battery connector 3 are positioned between one of the two antenna printed circuit board connectors 26 and the touch screen connector 27, one of the volume key/start key/AI voice key connector 25 and the two antenna printed circuit board connectors 26 is positioned on the lower side of the two-in-one card seat 23 for Micro SIM and T Flash, the antenna printed circuit board connectors 26 are compatible with the function of a Micro USB connector, and the requirement of a high-end mobile phone client on the position of the Micro USB connector at the bottom of the mobile phone can be realized. Another antenna printed circuit board connector 26 is located at the lower side of the sixth mounting position 14, and this antenna printed circuit board connector 26 is not compatible with the function of the Micro USB connector, so as to ensure the pursuit of low-end mobile phone customers for cost performance. The touch screen connector 27 and the fingerprint identification connector 28 are located at the lower side of the seventh mounting position 15, and the touch screen connector 27 is used for being connected with a lead of a touch screen to realize the display and touch functions of the touch screen. The radio frequency connector 29 is located on the right side of the seventh mounting position 15 and used for being connected with an antenna printed circuit board to achieve 2G/3G/4G communication signals of the mobile phone.

As shown in fig. 2, a chip-on type rear flash lamp 30 and a flip-chip type flash lamp 31 are also provided on the reverse surface of the substrate 100. The patch type rear Flash lamp 30 and the rear Flash lamp pad 31 are located between the first avoiding area 1 and the two-in-one card holder 23 for Micro SIM and T Flash. The patch type rear flash lamp 30 is mounted on the substrate 100 by adopting a patch type method and is arranged close to the first avoidance area 1, and the patch type rear flash lamp 30 is designed by fixing and matching the main board of the smart phone, so that the overall cost of a customer is saved. And set up shell fragment formula flash light 31 near sixth installation position 14, shell fragment formula flash light 31 is the crimping setting on base plate 100, and flexible dismouting to match the display screen of different sizes, promote this smart mobile phone mainboard to the compatibility of different cell-phone outward appearances.

As shown in fig. 3, the main board of the smart phone further includes an antenna pcb 200 integrally formed with the substrate 100 and located in the first avoiding region 1. The antenna printed circuit board 200 is an important component of the smart phone, the antenna printed circuit board 200 and the substrate 100 are integrally designed, the antenna printed circuit board 200 and the substrate 100 can perform multi-circuit layer wiring design and patch production together, and finally the antenna printed circuit board 200 is cut and separated from the substrate 100 to form a first avoiding area 1 for accommodating a rear camera. Therefore, the cost for manufacturing the antenna printed circuit board 200 can be saved, and the antenna and performance of the antenna printed circuit board 500 can be better ensured, thereby meeting the low-price and high-quality requirements of the market.

As shown in fig. 1, in an embodiment based on a front-forward view of the substrate 100, the substrate 100 is located at the upper left corner of the third mounting location 6 and located at the edge of the substrate 100, the fourth mounting location 7 is located at the left side of the substrate 100, the fourth mounting location 7 is located at the edge of the substrate 100, the fifth mounting location 8 is located at the lower side of the substrate 100 and located at the edge of the substrate 100, the fifth mounting location 8 is located at the lower right corner of the substrate 100, the fifth mounting location 8 is located at the upper right corner of the substrate 100 and located at the edge of the substrate 100, and screw locking holes 32 for screws to pass through are disposed at positions between the second mounting location and the USB socket, so that the substrate 100 is better fixed in the mobile phone case by cooperating with the screws, and the first avoiding location region 1 and the second avoiding location region 2 are detailed embodiments of specific appearance portions of the substrate 100.

The utility model discloses a further smart mobile phone that provides, this smart mobile phone include the casing and the smart mobile phone mainboard that proposes in the above embodiment, and the concrete structure of this smart mobile phone mainboard refers to above-mentioned embodiment, because this smart mobile phone mainboard has adopted all technical scheme of above-mentioned all embodiments, consequently has all technical effect that the technical scheme of above-mentioned embodiment brought at least, no longer gives unnecessary details here.

The above is only the part or the preferred embodiment of the present invention, no matter the characters or the drawings can not limit the protection scope of the present invention, all under the whole concept of the present invention, the equivalent structure transformation performed by the contents of the specification and the drawings is utilized, or the direct/indirect application in other related technical fields is included in the protection scope of the present invention.

Claims

1. The utility model provides an intelligent mobile phone mainboard, its characterized in that, includes the base plate, set up on the base plate and can hold the first district of keeping away of back camera and can hold preceding camera, earphone, the second that is close response IC and signal lamp and keep away the position district, the second keeps away the position and is located the upper portion of base plate and is located between the both sides angle of base plate, first keep away the position and is located a corner on base plate upper portion, the edge of the lower part of base plate is equipped with board to board connector and side pressure battery connector, the side pressure battery connector establish on the board to board connector and with board to board connector electricity is connected.

2. The motherboard of a smart phone of claim 1, further comprising a first mounting location, a second mounting location, a third mounting location, a fourth mounting location, and a fifth mounting location disposed on the front side of the substrate; wherein:

3. The smart phone motherboard according to claim 2, further comprising a first antenna side pressure spring, a USB socket, an earphone socket, a second antenna side pressure spring, and a rear main camera connector disposed on the front side of the substrate; wherein:

4. The motherboard of a smart phone of claim 2, further comprising a sixth mounting location and a seventh mounting location disposed on a reverse side of the substrate; wherein:

5. The smart phone motherboard according to claim 4, further comprising a first antenna positive pressure spring, a rear sub-camera connector, a proximity sensing IC connector, a signal lamp connector, a front camera connector, a receiver crimping spring and a second antenna positive pressure spring, which are arranged on the reverse side of the substrate; wherein:

6. The motherboard of a smart phone of claim 4, further comprising a Micro SIM and T Flash two-in-one card socket and a NANO SIM card socket arranged on the reverse side of the substrate; wherein:

7. The smart phone motherboard according to claim 6, further comprising a volume key/power-on key/AI voice key connector, a two-antenna printed circuit board connector, a touch screen connector, a fingerprint identification connector and a radio frequency connector disposed on the reverse side of the substrate; wherein:

the volume key/power-on key/AI voice key connector, the two antenna printed circuit board connectors, the touch screen connector and the fingerprint identification connector are sequentially arranged at the edge of the lower part of the substrate, the board-to-board connector and the side-pressure battery connector are positioned between one of the two antenna printed circuit board connectors and the touch screen connector, one of the volume key/power-on key/AI voice key connector and the two antenna printed circuit board connectors is positioned on the lower side of the Micro SIM and TFlash two-in-one card seat, the other antenna printed circuit board connector is positioned on the lower side of the sixth mounting position, the touch screen connector and the fingerprint identification connector are positioned on the lower side of the seventh mounting position, and the radio frequency connector is positioned on one side of the seventh mounting position, which is far away from the sixth mounting position.

8. The smart phone motherboard of claim 6, further comprising a post-flash and a flip-chip flash disposed on a reverse side of the substrate; wherein:

9. The motherboard of a smart phone as recited in claim 1 further comprising an antenna printed circuit board integrally formed with the substrate and located in the first keep-out zone.

10. A smartphone, comprising a housing and a smartphone motherboard of any of claims 1-9.