CN211858647U - Display assembly and display device with same - Google Patents

Abstract

The utility model provides a display module and have its display device. Wherein, the display module includes: the display bracket comprises a base body and a plurality of metal sheets arranged on the base body, wherein the plurality of metal sheets comprise a first cathode common metal sheet; the display chip is installed on the display support, the display chips comprise a first display chip and a second display chip, each display chip comprises a first chip unit, a second chip unit and a third chip unit, the first display chip is connected with the first negative pole sharing metal sheet through a first connecting portion and is conducted with the first negative pole sharing metal sheet through a first connecting portion, and the second display chip is connected with the first negative pole sharing metal sheet through a second connecting portion and is conducted with the first negative pole sharing metal sheet through a second connecting portion. The technical scheme of the application effectively solves the problem that in the related technology, the number of bonding pads required for welding four groups of RGB-LED chips is large, and processing is complex.

Description

Display assembly and display device with same

Technical Field

The utility model relates to a show the field, particularly, relate to a display module and have its display device.

Background

At present, the technology of the LED display screen is more and more mature. And because LED display screen simple to operate, repeatedly usable and advantage such as display effect are good, liked by the consumer, and then be applied to various occasions gradually, for example indoor outer show etc..

In the related art, an LED chip is soldered on a PCB board to form an LED display screen. Taking RGB-LED chips as an example, a group of RGB-LED chips includes: 1 red chip, 1 green chip, and 1 blue chip. In the group of RGB-LED chips, the positive electrode of a red chip, the positive electrode of a green chip and the positive electrode of a blue chip are connected to a pin together; the cathode of the red chip, the cathode of the green chip and the cathode of the blue chip are respectively connected to one pin. A group of RGB-LED chips constitutes one lamp point, and thus, one lamp point includes four pins. When a lamp is soldered to a PCB, four pads are required on the PCB to correspond to the lamp. When N groups of RGB-LED chips are soldered to the PCB, 4N pads (N is an integer) are required on the PCB.

According to the analysis, when the display chip in the prior art is welded on the PCB, there are many welding points, which results in complex processing.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a display module and have its display device to solve the required pad of the four group RGB-LED chips of welding among the correlation technique more, lead to processing complicated problem.

In order to achieve the above object, according to a first aspect of the present invention, there is provided a display assembly including: the display bracket comprises a base body and a plurality of metal sheets arranged on the base body, wherein the plurality of metal sheets comprise a first cathode common metal sheet; a plurality of display chips are installed on the display bracket, a plurality of display chips include first display chip and second display chip, every display chip all includes first chip unit, second chip unit and third chip unit, first chip unit and the first negative pole of second display chip of first display chip share the sheetmetal and be connected, wherein, first display chip passes through first connecting portion and is connected with first negative pole sharing sheetmetal, first chip unit and the first negative pole sharing sheetmetal of first display chip pass through first connecting portion and switch on, first chip unit and the first negative pole sharing sheetmetal of second display chip pass through the second connecting portion and are connected, the first chip unit and the first negative pole sharing sheetmetal of second display chip pass through the second connecting portion and switch on.

Furthermore, the plurality of metal sheets further comprise a second cathode common metal sheet, and the second chip unit of the first display chip and the second chip unit of the second display chip are connected with the second cathode common metal sheet.

Furthermore, the negative electrode of each second chip unit of the first display chip and the negative electrode of the second chip unit of the second display chip are connected with the second negative electrode common metal sheet through the first pin.

Furthermore, the plurality of metal sheets further comprise a plurality of negative independent metal sheets, each display chip further comprises a third chip unit, and the plurality of third chip units are correspondingly connected with the plurality of negative independent metal sheets.

Furthermore, the negative electrode of the third chip unit of the first display chip and the negative electrode of the third chip unit of the second display chip are both connected with the negative independent metal sheet through the second pin.

Further, the plurality of display chips further comprise a third display chip and a fourth display chip, the plurality of metal sheets further comprise two anode-shared metal sheets, the first display chip, the second display chip, the third display chip and the fourth display chip are arranged in an array mode, the array mode comprises a first direction and a second direction which are perpendicular to each other, the first display chip and the third display chip are arranged in the first direction, the first display chip and the second display chip are arranged in the second direction, all anodes of the display chips of the first display chip and the third display chip are connected with one of the two anode-shared metal sheets, and all anodes of the display chips of the second display chip and the fourth display chip are connected with the other of the two anode-shared metal sheets.

Further, the first connecting portion and the second connecting portion are welding points.

Furthermore, the first chip unit of each display chip is connected with the anode common metal sheet through a third pin, the second chip unit of each display chip is connected with the anode common metal sheet through a fourth pin, and the anode of the third chip unit of each display chip is connected with the anode common metal sheet through a fifth pin.

Furthermore, the base body comprises a first side wall and a second side wall, the first side wall and the second side wall are correspondingly arranged, the metal sheets extend out of the base body and are arranged on the first side wall and the second side wall in a bending mode, and a plurality of pins are formed by the parts, located on the first side wall and the second side wall, of the metal sheets; a plurality of mounting holes are formed in the base body, each display chip is mounted inside each mounting hole, and the metal sheet is located in each mounting hole.

Further, the base body has a front surface accommodating the plurality of display chips and a back surface opposite to the front surface, and end portions of the plurality of metal sheets extend onto the back surface.

According to a second aspect of the present invention, there is provided a display device, comprising a plurality of display modules, wherein the display modules are the above display modules.

According to a third aspect of the present invention, there is provided a manufacturing method of a display module, the manufacturing method is used for manufacturing the display module, and the manufacturing method includes the following steps: step S10: manufacturing a display bracket, which comprises manufacturing a base body blank, placing a metal sheet in the base body blank, filling plastic, injecting the metal sheet into the base body blank in an injection molding manner, forming a pin by the extension section of the metal sheet, and finally pressing the pin on the base body blank; step S20: installing a first display chip and a second display chip in the mounting hole, connecting the first display chip and the first cathode shared metal sheet through a first connecting part, and connecting the second display chip and the first cathode shared metal sheet through a second connecting part; step S30: filling epoxy resin glue or silica gel glue in the mounting hole provided with the display chip; step S40: carrying out vacuum pumping treatment on the epoxy resin glue or the silica gel glue; step S50: and (5) putting the mixture into an oven for glue solidification.

Use the technical scheme of the utility model, display module is including showing support and a plurality of display chip of installing on showing the support. The display stand includes a base and a plurality of metal sheets. A plurality of metal sheets are arranged on the base body. The plurality of metal pieces includes a first negative electrode common metal piece. The display chip comprises a first display chip and a second display chip. The first display chip and the second display chip comprise a first chip unit, a second chip unit and a third chip unit. The first chip units of the first display chip and the second display chip are connected with the first cathode common metal sheet. The first chip unit of the first display chip is conducted with the first cathode common metal sheet through the first connecting portion, and the first chip unit of the second display chip is conducted with the first cathode common metal sheet through the second connecting portion. The first connecting portion simultaneously realizes connection of the first display chip and the display support and conduction of the negative electrode of the first chip unit and the first negative electrode sharing metal sheet. The second connecting part simultaneously realizes the connection of the second display chip and the display bracket and the conduction of the cathode of the first chip unit and the first cathode common metal sheet. The first negative electrode sharing metal sheet effectively combines the negative electrodes of the display chips before the negative electrodes are led out of the matrix of the display support, so that the number of the metal sheets can be reduced, the number of welding points is further reduced, and the processing complexity is reduced. Therefore, the technical scheme of the application effectively solves the problem that in the related art, the number of bonding pads required for welding four groups of RGB-LED chips is large, and processing is complex.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 shows a schematic perspective view of an embodiment of a display assembly according to the present invention;

FIG. 2 shows a partial enlarged view at A of FIG. 1;

fig. 3 is a schematic view showing a position of arrangement of a metal sheet of the display module of fig. 1;

FIG. 4 illustrates a perspective view of a display stand of the display assembly of FIG. 1;

FIG. 5 shows a schematic top view of the display stand of FIG. 4;

FIG. 6 shows a schematic bottom view of the display stand of FIG. 4;

FIG. 7 shows an assembled schematic view of the display assembly of FIG. 1; and

FIG. 8 shows a schematic flow diagram of an embodiment of a method of manufacturing the display assembly of FIG. 1.

Wherein the figures include the following reference numerals:

100. a first display chip; 200. a second display chip; 300. a third display chip; 400. a fourth display chip; 10. a display stand; 11. a substrate; 111. a first side wall; 112. a second side wall; 113. mounting holes; 12. a metal sheet; 121. a first negative electrode common metal sheet; 122. the second negative electrode shares the metal sheet; 123. a negative independent metal sheet; 124. a positive electrode common metal sheet; u1, a first chip unit; u2, a second chip unit; u3, third chip unit.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

As shown in fig. 1 to 3, in the present embodiment, the display assembly includes: a display support 10 and a plurality of display chips. The display stand 10 includes a base 11 and a plurality of metal sheets 12 disposed on the base 11, the plurality of metal sheets 12 including a first cathode common metal sheet 121; the plurality of display chips are mounted on the display bracket 10, the plurality of display chips include a first display chip 100 and a second display chip 200, each display chip includes a first chip unit U1, a second chip unit U2, and a third chip unit U3, the first chip unit U1 of the first display chip 100 and the first chip unit U1 of the second display chip 200 are connected to the first negative common metal sheet 121, the first display chip 100 is connected to the first negative electrode common metal plate 121 through a first connection portion, the first chip unit U1 of the first display chip 100 is connected to the first negative electrode common metal plate 121 through the first connection portion, the first chip unit U1 of the second display chip 200 is connected to the first negative electrode common metal plate 121 through a second connection portion, and the first chip unit U1 of the second display chip 200 is connected to the first negative electrode common metal plate 121 through the second connection portion.

In the present embodiment, the base is used to accommodate the first display chip 100, the second display chip 200, the third display chip 300 and the fourth display chip 400, and the display chips are all LED chips. The number of the first negative electrode common metal pieces 121 is two.

By applying the technical scheme of the embodiment, the display assembly comprises a display bracket 10 and a plurality of display chips installed on the display bracket. The display stand 10 includes a base 11 and a plurality of metal sheets 12. The plurality of metal sheets 12 are provided on the base 11. The plurality of metal sheets 12 includes a first negative electrode common metal sheet 121. The display chip includes a first display chip 100 and a second display chip 200. The first and second display chips 100 and 200 include a first chip unit U1, a second chip unit U2, and a third chip unit U3. The first chip unit U1 of the first display chip 100 and the second display chip 200 are both connected to the first negative common metal sheet 121. The first chip unit U1 of the first display chip 100 is electrically connected to the first negative common metal plate 121 through a first connection portion, and the first chip unit U2 of the second display chip 200 is electrically connected to the first negative common metal plate 121 through a second connection portion. The first connection portion simultaneously achieves connection between the first display chip 100 and the display bracket and conduction between the negative electrode of the first chip unit U1 and the first negative electrode common metal sheet 121. The second connection portion simultaneously achieves connection between the second display chip 200 and the display bracket and conduction between the negative electrode of the first chip unit U1 and the first negative electrode common metal sheet 121. The first negative electrode common metal sheet 121 effectively combines the display chip and the negative electrode before being led out of the substrate 11 of the display bracket 10, so that the number of metal sheets 20 can be reduced, the number of welding points can be reduced, and the processing complexity can be reduced. Therefore, the technical scheme of the embodiment effectively solves the problem that the display chip in the related art requires more bonding pads during connection, which results in complex processing.

The thickness of the metal sheet 20 is between 0.1 mm and 0.5 mm, and the metal sheet 20 is plated with gold or silver to improve the conductivity of the metal sheet.

As shown in fig. 1 to 3, in the present embodiment, the plurality of metal sheets 12 further include a second cathode common metal sheet 122, and the second chip unit U2 of the first display chip 100 and the second chip unit U2 of the second display chip 200 are connected to the second cathode common metal sheet 122. The number of the metal sheets 20 is further reduced by the arrangement of the second cathode common metal sheet 122, so that the number of welding points is reduced, and the processing complexity is reduced. Meanwhile, the second cathode common metal sheet 122 can make the arrangement of the metal sheets more flexible and have a larger arrangement space. In the present embodiment, the number of the second cathode common metal sheets 122 is two, the cathodes of the two second chip units U2 of the two adjacent display chips (i.e., the first display chip 100 and the second display chip 200) are connected to one of the two second cathode common metal sheets 122, and the cathodes of the two second chip units U2 of the other two adjacent display chips (i.e., the third display chip 300 and the fourth display chip 400) are connected to the other one of the two second cathode common metal sheets 122.

As shown in fig. 1 to 3, the cathodes of the second chip unit U2 of the first display chip 100 and the second chip unit U2 of the second display chip 200 are connected to the second cathode common metal sheet 122 through the first pins. The first pin is simple in structure and convenient to connect. As shown in fig. 2, the first pin a is a conductive wire.

As shown in fig. 1 to fig. 3, in the present embodiment, the plurality of metal sheets 12 further include a plurality of negative independent metal sheets 123, each display chip further includes a third chip unit U3, and the plurality of third chip units U3 are correspondingly connected to the plurality of negative independent metal sheets 123. In the present embodiment, the number of the negative electrode individual metal pieces 24 is four, and four negative electrode individual metal pieces 123 are located at the end of the base 11. The cathodes of the third chip units U3 of the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 are respectively connected to the adjacent cathode independent metal sheets 123. The proximity means that the four negative independent metal sheets 123 are close to the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400.

In the embodiment not shown in the figure, as a possible solution, a third negative electrode common metal sheet may be further provided, and the third negative electrode common metal sheet replaces the negative electrode independent metal sheet, so as to further integrate the negative electrodes of the display chip, thereby further reducing the number of metal sheets. The arrangement mode of the metal sheets is more flexible, and the structure is simpler.

As shown in fig. 1 to 3, in the present embodiment, the negative electrode of the third chip unit U3 of the first display chip 100 and the negative electrode of the third chip unit U3 of the second display chip 200 are both connected to the negative independent metal sheet 123 through the second pin. As shown in fig. 2, the second pin b is a wire, so that the connection is more flexible. The position of the metal sheet is conveniently and reasonably arranged.

As shown in fig. 1 to 3, in this embodiment, the plurality of display chips further includes a third display chip 300 and a fourth display chip 400, the plurality of metal sheets 12 further includes two anode-shared metal sheets 124, the first display chip, the second display chip, the third display chip and the fourth display chip are arranged in an array, the array arrangement includes a first direction and a second direction perpendicular to each other, the first display chip 100 and the third display chip 300 are arranged in the first direction, the first display chip 100 and the second display chip 200 are arranged in the second direction, all anodes of the display chips of the first display chip 100 and the third display chip 300 are connected to one of the two anode-shared metal sheets 124, and all anodes of the display chips of the second display chip 200 and the fourth display chip 400 are connected to the other of the two anode-shared metal sheets 124. The above connection manner can effectively reduce the number of metal sheets, and the first display chip 100 and the third display chip 300, and the second display chip 200 and the fourth display chip 400 are adjacent display chips, and the two anode common metal sheets 124 are respectively located between the first display chip 100 and the third display chip 300, and between the second display chip 200 and the fourth display chip 400, so as to facilitate connection.

Of course, as a person skilled in the art can know, the arrangement of the present embodiment belongs to the preferred embodiment, and the positive electrode common metal sheet and the first negative electrode common metal sheet may be arranged in the same direction in actual design. Meanwhile, only one positive electrode common metal sheet may be provided, and at this time, the positive electrodes of the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 are all connected to the positive electrode common metal sheet as shown in fig. 1 to 3, in this embodiment, the first negative electrode common metal sheet 121 and the second negative electrode common metal sheet 122 are both two, the negative electrode of the first chip unit U1 of the third display chip 300 and the negative electrode of the first chip unit U1 of the fourth display chip 400 in the second direction are connected to one of the two first negative electrode common metal sheets 121, and the second chip unit U2 of the third display chip 300 and the second chip unit U2 of the fourth display chip 400 in the second direction are connected to one of the two second negative electrode common metal sheets 122. The third display chip 300 and the fourth display chip 400 are adjacent display chips, and are connected to the first cathode common metal sheet 121 and the second cathode common metal sheet 122 through the adjacent display chips, so that the structure is more compact and reasonable. Meanwhile, the two first negative electrode common metal pieces 121 and the two second negative electrode common metal pieces 122 are of a symmetrical structure.

As shown in fig. 1 to 3, in the present embodiment, the first connection portion and the second connection portion are both solder points. The structure of the welding spot is simple. All the chip units on the first display chip 100 and the third display chip 300 are located above the first negative common metal sheet. The connection of welding spots is more convenient.

As shown in fig. 1 to 3, in the present embodiment, the first chip unit U1 of each display chip is connected to the positive common metal plate 124 through a third pin, the second chip unit U2 of each display chip is connected to the positive common metal plate 124 through a fourth pin, and the positive electrode of the third chip unit U3 of each display chip is connected to the positive common metal plate 124 through a fifth pin. As shown in fig. 2, the third pin c, the fourth pin d and the fifth pin e are wires, so that the wire connection is more flexible and convenient

As shown in fig. 4 to 6, in the present embodiment, the base 11 includes a first sidewall 111 and a second sidewall 112, the first sidewall 111 and the second sidewall 112 are disposed correspondingly, the plurality of metal sheets 12 extend from the base 11 and are disposed on the first sidewall 111 and the second sidewall 112 in a bent manner, a plurality of pins are formed on portions of the plurality of metal sheets 12 on the first sidewall 111 and on the second sidewall 112, a plurality of mounting holes 113 are disposed on the base 11, each display chip is mounted inside each mounting hole 113, and the metal sheets 12 are disposed in the mounting holes 113. In the present embodiment, the pins are ten in total, and are pins 1-10, and the pins are located on the first side wall 111 and the second side wall 112 of the base 11 and are uniformly arranged. The pins are arranged to facilitate connection of the base 11 to the PCB board and to facilitate mounting. Pin 1, pin 5, pin 6 and pin 10 are part of four negative independent metal sheets 123, pin 2 and pin 4 are part of two second negative common metal sheets 122, pin 3 and pin 8 are part of two positive common metal sheets 124, and pin 7 and pin 9 are part of two first negative common metal sheets 121.

In the present embodiment, the first chip unit U1 of the first display chip 100 and the first chip unit U1 of the second display chip 200 are connected to the first negative common metal plate 121 corresponding to pin 7, and the second chip unit U2 of the first display chip 100 and the second chip unit U2 of the second display chip 200 are connected to the second negative common metal plate 122 corresponding to pin 2. The third chip unit U3 of the first display chip 100 is connected to the negative independent metal piece 123 corresponding to pin 6, and the third chip unit U3 of the second display chip 200 is connected to the negative independent metal piece 123 corresponding to pin 1. All the anodes of the first display chip 100 and the third display chip 300 are connected to the anode common metal sheet 124 corresponding to pin 8. All the anodes of the second display chip 200 and the fourth display chip 400 are connected to the anode common metal sheet 124 corresponding to pin 3. The first chip unit U1 of the third display chip 300 and the first chip unit U1 of the fourth display chip 400 are connected to the first negative common metal piece 121 corresponding to pin 9, and the second chip unit U2 of the third display chip 300 and the second chip unit U2 of the fourth display chip 400 are connected to the second negative common metal piece 122 corresponding to pin 4. The third chip unit U3 of the third display chip 300 is connected to the negative independent metal piece 123 corresponding to the pin 10, and the third chip unit U3 of the fourth display chip 400 is connected to the negative independent metal piece 123 corresponding to the pin 5. In the present embodiment, the plurality of metal pieces are axisymmetric in a direction with respect to a central axis parallel to the second direction. As shown in fig. 4 and 6, in the present embodiment, the base body 11 has a front surface that accommodates a plurality of display chips and a back surface opposite to the front surface, and end portions of the plurality of metal sheets 12 extend onto the back surface. The position of being connected with the PCB is more flexible through the structure, and the installation is easier.

In addition, a cross-shaped groove is further formed in the substrate 11, and the first display chip 100, the second display chip 200, the third display chip 300 and the fourth display chip 400 are spaced by the cross-shaped groove, so that light is prevented from being influenced by each other. Meanwhile, the cross-shaped groove can play a role in draining and reducing weight. And the heat dissipation area between the display chips is effectively increased.

The present application further provides a display device, as shown in fig. 7, an embodiment of the display device according to the present application includes a display assembly, and the display assembly is the above-mentioned display assembly. The display assembly has simple structure and easy processing, so the display device with the display assembly also has the advantages.

The present application further provides a manufacturing method of a display module, as shown in fig. 8, for manufacturing the display module according to an embodiment of the manufacturing method of the present application, the manufacturing method includes the following steps:

step S10: manufacturing the display bracket 10, which comprises manufacturing a base body blank, placing the metal sheet 12 in the base body blank, filling plastic, injecting the metal sheet 12 into the base body blank in an injection molding manner, forming a pin by the extension section of the metal sheet 12, and finally pressing the pin on the base body blank;

step S20: mounting the first display chip 100 and the second display chip 200 in the mounting hole 113, and connecting the first display chip 100 and the first cathode common metal sheet 121 through a first connection portion, and connecting the second display chip 200 and the first cathode common metal sheet 121 through a second connection portion;

step S30: filling epoxy resin glue or silica gel glue in the mounting hole 113 provided with the display chip;

step S40: carrying out vacuum pumping treatment on the epoxy resin glue or the silica gel glue;

step S50: and (5) putting the mixture into an oven for glue solidification.

Through the steps, the display assembly is manufactured. The metal sheet is injected into the base body blank by using the mold, so that the structure of the display bracket is more stable and reliable, and meanwhile, the extension section of the metal sheet 12 forms a pin, so that the structure is simpler. And the display chip can be effectively fixed by using the epoxy resin glue or the silica gel glue, and the light of the display chip is not easy to disperse. The light condensation effect is good.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

1. A display assembly, the display assembly comprising:

a display stand (10), the display stand (10) comprising a base (11) and a plurality of metal sheets (12) disposed on the base (11), the plurality of metal sheets (12) comprising a first negative electrode common metal sheet (121);

a plurality of display chips mounted on the display stand (10), the plurality of display chips including a first display chip (100) and a second display chip (200), each of the display chips including a first chip unit (U1), a second chip unit (U2), and a third chip unit (U3), the first chip unit (U1) of the first display chip (100) and the first chip unit (U1) of the second display chip (200) being connected to the first negative common metal sheet (121),

the first display chip (100) is connected with the first negative electrode shared metal sheet (121) through a first connecting portion, the first chip unit (U1) of the first display chip (100) is conducted with the first negative electrode shared metal sheet (121) through the first connecting portion, the second display chip (200) is connected with the first negative electrode shared metal sheet (121) through a second connecting portion, and the first chip unit (U1) of the second display chip (200) is conducted with the first negative electrode shared metal sheet (121) through the second connecting portion.

2. The display module according to claim 1, wherein the plurality of metal sheets (12) further comprises a second negative common metal sheet (122), and the second chip unit (U2) of the first display chip (100) and the second chip unit (U2) of the second display chip (200) are connected to the second negative common metal sheet (122).

3. The display module according to claim 2, wherein the negative electrode of the second chip unit (U2) of the first display chip (100) and the negative electrode of the second chip unit (U2) of the second display chip (200) are connected to the second negative common metal sheet (122) through a first pin.

4. The display module according to claim 1, wherein the plurality of metal sheets (12) further comprises a plurality of negative independent metal sheets (123), each of the display chips further comprises a third chip unit (U3), and the plurality of third chip units (U3) are correspondingly connected to the plurality of negative independent metal sheets (123).

5. The display module according to claim 4, wherein the negative electrode of the third chip unit (U3) of the first display chip (100) and the negative electrode of the third chip unit (U3) of the second display chip (200) are connected to the negative independent metal sheet (123) through a second pin.

6. The display module according to claim 3, wherein the plurality of display chips further comprises a third display chip (300) and a fourth display chip (400), the plurality of metal sheets (12) further comprises two anode-common metal sheets (124), the first display chip (100), the second display chip (200), the third display chip (300) and the fourth display chip (400) are arranged in an array, the array comprises a first direction and a second direction perpendicular to each other, the first display chip (100) and the third display chip (300) are arranged along the first direction, the first display chip (100) and the second display chip (200) are arranged along the second direction, all anodes of the first display chip (100) and the third display chip (300) are connected to one of the two anode-common metal sheets (124), all anodes of the second display chip (200) and the fourth display chip (400) are connected to the other of the two anode-common metal sheets (124).

7. The display assembly of claim 1, wherein the first connection portion and the second connection portion are both solder points.

8. The display module according to claim 6, wherein each of the first chip units (U1) is connected to the positive common metal plate (124) through a third pin, each of the second chip units (U2) is connected to the positive common metal plate (124) through a fourth pin, and the positive electrode of each of the third chip units (U3) is connected to the positive common metal plate (124) through a fifth pin.

9. The display module according to claim 1, wherein the base (11) comprises a first sidewall (111) and a second sidewall (112), the first sidewall (111) and the second sidewall (112) are correspondingly disposed, the plurality of metal sheets (12) extend from the base (11) and are disposed on the first sidewall (111) and the second sidewall (112) in a bent manner, and a plurality of pins are formed on the portions of the plurality of metal sheets (12) on the first sidewall (111) and the second sidewall (112); the display panel is characterized in that the base body (11) is provided with a plurality of mounting holes (113), each display chip is mounted in each mounting hole (113), and the metal sheet (12) is located in each mounting hole (113).

10. The display module according to claim 1, wherein the base body (11) has a front surface accommodating the plurality of display chips and a rear surface opposite to the front surface, and ends of the plurality of metal sheets (12) extend onto the rear surface.

11. A display device comprising a plurality of display elements, wherein the display elements are as claimed in any one of claims 1 to 10.

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