CN211857414U

CN211857414U - Server node air duct structure and server

Info

Publication number: CN211857414U
Application number: CN202020863702.3U
Authority: CN
Inventors: 吴恭英
Original assignee: Zhejiang Uniview Technologies Co Ltd
Current assignee: Zhejiang Uniview Technologies Co Ltd
Priority date: 2020-05-21
Filing date: 2020-05-21
Publication date: 2020-11-03
Anticipated expiration: 2030-05-21

Abstract

The utility model discloses a server node air channel structure and server, which belongs to the technical field of servers, wherein the server node air channel structure comprises a windshield, a first CPU and a second CPU are sequentially arranged in an air channel in the windshield along a first direction, the first CPU and the second CPU are respectively provided with a memory bar at two sides of a respective second direction, the first direction is perpendicular to the second direction, and the first direction is the flowing direction of wind; the first heat dissipation mechanism comprises a heat dissipation base plate and a heat dissipation structure, the heat dissipation base plate comprises a body connected to the second CPU and an extension plate extending from the body to the downstream of the memory bank on at least one side of the second CPU, and the heat dissipation structure is arranged on one side of the extension plate, facing the windshield, and forms an accommodating space with the windshield. Compared with the prior art, the heat dissipation structure has the advantages that the wind resistance can be reduced while the heat dissipation effect of the second CPU is guaranteed, the space of a wind shield behind the second CPU is not occupied, VGA and a solid state disk are convenient to install, and the first CPU and the second CPU are convenient to maintain.

Description

Server node air duct structure and server

Technical Field

The utility model relates to a server technical field especially relates to a server node wind channel structure and server.

Background

With the increasing progress of social science and technology, people's daily life is more and more unable to leave the network, and the requirement on the network quality is higher and higher, so that the server is required to be continuously upgraded to improve the data processing capacity of the server. The current 1U server is usually provided with the CPU1 and the CPU2 in front and back of the windshield along the wind direction, and the heat dissipation effect of the CPU2 is poor due to the blocking of the CPU1 against the wind.

To improve the heat dissipation effect to the CPU2, two methods are generally adopted: one is that the CPU1 adopts low-density heat dissipation fins, and the two high-density fins are connected by a heat pipe behind the CPU2, but the high-density fins and the heat pipe increase resistance to wind and reduce air volume, and then the high-density fins occupy more space of a wind shield, so that accessories such as a solid state disk and a VGA cannot be inserted; the other is that the heat sink of the CPU1 adopts large-spacing fins, the heat sink of the CPU2 adopts small-spacing fins, and the two heat sinks are connected by using heat pipes to equalize the heat dissipation temperatures of the CPU1 and the CPU2, but in this way, when the CPU1 and the CPU2 are maintained, the two heat sinks need to be removed, which increases the difficulty.

Therefore, a server node duct structure is needed to improve heat dissipation to the CPU2, reduce wind resistance, and facilitate maintenance of the CPU1 and the CPU 2.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a server node wind channel structure and server to improve the heat dissipation to CPU2, reduce the windage and be convenient for CPU1 and CPU 2's maintenance.

As the conception, the utility model adopts the technical proposal that:

a server node duct structure, comprising:

the wind shield comprises a wind shield, wherein a first CPU and a second CPU are sequentially arranged in an air channel in the wind shield along a first direction, the first CPU and the second CPU are respectively provided with an internal memory bar at two sides of a second direction, the first direction is perpendicular to the second direction, and the first direction is the flowing direction of wind;

the first heat dissipation mechanism comprises a heat dissipation base plate and a heat dissipation structure, the heat dissipation base plate comprises a body connected to the second CPU and an extension plate extending from the body to at least one side of the second CPU and located at the downstream of the memory bank, and the heat dissipation structure is arranged on one side, facing the windshield, of the extension plate and forms an accommodating space between the extension plate and the windshield.

Further, the heat dissipation structure comprises a heat dissipation plate and a plurality of fins arranged on the heat dissipation plate, and the heat dissipation plate is connected to the extension plate.

Further, the body comprises a top plate and a side plate which are connected, the top plate abuts against the top surface of the second CPU, the side plate abuts against the side surface of the second CPU, and the extension plate is connected to the top plate.

Further, the heat-dissipating substrate includes one of the extension plates; and a VGA is further arranged in the air duct, and is positioned at the downstream of the second CPU and in the accommodating space in the first direction.

Further, a solid state disk is arranged in the air duct, the solid state disk and the VGA are arranged side by side, and in the first direction, one part of the solid state disk is right opposite to the second CPU.

Further, server node wind channel structure still includes second heat dissipation mechanism, second heat dissipation mechanism connect in first CPU, second heat dissipation mechanism sets up along the ventilation groove that first direction extends.

Further, a fan is further arranged in the air duct, the fan is mounted on the windshield, and in the first direction, the fan is located on the upstream of the first CPU.

Furthermore, the windshield cover comprises a bottom plate and two baffles, the two baffles are respectively connected to the two sides of the bottom plate in the second direction, the first CPU and the second CPU are both mounted on the bottom plate, and the air duct is formed between the two baffles and the bottom plate.

Furthermore, the extension plate is provided with a fixing lug, and the fixing lug is connected to the windshield.

In order to achieve the above object, the present invention further provides a server, including the server node air duct structure in any one of the above schemes.

The utility model has the advantages that:

the utility model provides a server node wind channel structure and server, server node wind channel structure is through setting up heat dissipation base plate and heat radiation structure, can increase second CPU's heat radiating area, and heat radiation structure is located the rear of DRAM through the extension board, can utilize the wind through the DRAM to come to dispel the heat to second CPU, and form the accommodation space between heat radiation structure and the windshield, compare in prior art, can be when guaranteeing the radiating effect to second CPU, reduce the windage, and do not occupy the space of the windshield at second CPU rear, be convenient for VGA, the installation of solid state hard disk, and be convenient for the maintenance to first CPU and second CPU.

Drawings

Fig. 1 is a schematic structural diagram of an air duct structure of a server node provided by the present invention;

fig. 2 is a schematic structural diagram of the first heat dissipation mechanism provided by the present invention.

In the figure:

101. an air duct; 11. a base plate; 12. a baffle plate; 2. a first heat dissipation mechanism; 21. a heat-dissipating substrate; 211. a body; 2111. a top plate; 2112. a side plate; 212. an extension plate; 2121. fixing the ear; 22. a heat dissipation structure; 221. a heat dissipation plate; 222. a fin; 3. a second heat dissipation mechanism; 31. a ventilation slot; 4. a fan;

10. a second CPU; 20. a memory bank; 30. VGA; 40. provided is a solid state disk.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1 and fig. 2, the present embodiment provides a server node air duct structure, which includes a wind shield and a first heat dissipation mechanism 2. The air duct 101 in the windshield is sequentially provided with a first CPU and a second CPU10 along a first direction, the first CPU and the second CPU10 are respectively provided with an internal memory bank 20 on two sides of a second direction, the first direction is perpendicular to the second direction, the first direction is a wind flowing direction, specifically, the first direction is an ab direction in fig. 1, and the second direction is a cd direction in fig. 2. The first heat dissipation mechanism 2 includes a heat dissipation substrate 21 and a heat dissipation structure 22, the heat dissipation substrate 21 includes a body 211 connected to the second CPU10, and an extension plate 212 extending from the body 211 to at least one side of the second CPU10 along a downstream of the first direction of the memory stick 20, and the heat dissipation structure 22 is disposed on one side of the extension plate 212 facing the windshield 101, and forms an accommodating space with the windshield 101.

It can be understood that, by providing the heat dissipation substrate 21 and the heat dissipation structure 22, the heat dissipation area of the second CPU10 can be increased, and the heat dissipation structure 22 is located behind the memory bank 20 through the extension board 212, and can dissipate heat to the second CPU10 by using wind passing through the memory bank 20, compared with the prior art, the heat dissipation effect to the second CPU10 can be ensured, and the space of the windshield behind the second CPU10 is not occupied, so that wind resistance can be reduced, and the installation of the VGA (Video Graphics Array) 30 and the solid hard disk 40 is facilitated, and in addition, the first CPU and the second CPU10 are separately dissipated, so that the maintenance of the first CPU and the second CPU10 is facilitated.

It should be noted that the memory bank 20 does not have a large heat dissipation requirement, and therefore the temperature of the wind passing through the memory bank 20 is lower than the temperature of the wind passing through the first CPU and the second CPU10, so that the extension board 212 and the heat dissipation structure 22 can be utilized, and the heat dissipation effect on the second CPU10 can be enhanced.

Further, the heat dissipation structure 22 includes a heat dissipation plate 221 and a plurality of fins 222 provided on the heat dissipation plate 221, and the heat dissipation plate 221 is connected to the extension plate 212. By providing the plurality of fins 222, the contact area between the heat dissipation structure 22 and the wind can be increased, and the heat dissipation effect on the second CPU10 can be further improved. Specifically, in the present embodiment, the fins 222 have a columnar structure, and the plurality of fins 222 are divided into a plurality of rows arranged side by side along the first direction, so that the flow pattern of the wind when passing through the fins 222 is complicated, and the wind can better exchange heat with the fins 222 to take away the heat transferred from the fins 222 by the second CPU 10.

In order to further enhance the heat dissipation effect of the second CPU10, the body 211 of the heat dissipation substrate 21 includes a top plate 2111 and a side plate 2112 connected to each other, wherein the top plate 2111 abuts against the top surface of the second CPU10, and the side plate 2112 abuts against the side surface of the second CPU10, so as to increase the heat exchange area with the second CPU10, and thus the heat generated by the second CPU10 can be quickly transferred to the heat dissipation structure 22. The extension plate 212 is connected to the top plate 2111.

In order to reduce the number of parts and the assembly time, the top plate 2111, the side plate 2112, and the extension plate 212 constituting the heat dissipation substrate 21 are integrally formed. Of course, in other embodiments, the top plate 2111, the side plate 2112 and the extension plate 212 may be provided separately.

In the present embodiment, the extension plate 212 is provided with a fixing ear 2121, and the fixing ear 2121 is connected to the windshield. The extension plate 212 is fixed to the windshield by the fixing ears 2121, and other fixing structures are omitted, so that the other fixing structures are prevented from blocking the wind.

As shown in fig. 1, in order to avoid that the first CPU blocks too much wind to affect the heat dissipation of the second CPU10, in this embodiment, the server node air duct structure further includes a second heat dissipation mechanism 3, the second heat dissipation mechanism 3 is connected to the first CPU, the second heat dissipation mechanism 3 is provided with a ventilation slot 31 extending along the first direction, so that a part of the wind can flow to the second CPU10 through the ventilation slot 31, which is beneficial to improving the heat dissipation of the second CPU 10. It should be noted that, because the wind enters from the side close to the first CPU, the temperature of the wind flowing through the first CPU is relatively low, and the wind can cool and dissipate the heat of the first CPU, so that a part of the wind flowing to the second CPU10 through the ventilation slot 31 does not affect the heat dissipation of the first CPU, or the generated effect is negligible.

As shown in fig. 1 and 2, in the present embodiment, the heat dissipating substrate 21 includes only one extension plate 212, and the extension plate 212 is located behind the memory bank 20 on the side of the second CPU 10. The air duct 101 is further provided with a VGA30, in the first direction, the VGA30 is located downstream of the second CPU10, and the VGA30 is located in the accommodating space. It can be understood that the VGA30 is located behind one of the memory banks 20, and since the heat dissipation structure 22 is disposed on the extension plate 212, the heat dissipation structure 22 and the windshield form the above-mentioned accommodating space therebetween, thereby facilitating the installation of the VGA30 behind the second CPU 10.

Further, a solid state disk 40 is disposed in the air duct 101, the fixed hard disk 40 is disposed side by side with the VGA30, and a part of the solid state disk 40 is aligned with the second CPU10 in the first direction. It can be appreciated that since the solid state disk 40 and the VGA30 are arranged side by side and a portion of the solid state disk 40 is directly opposite the second CPU10, another portion of the solid state disk 40 is behind the memory bank 20 on the other side of the second CPU 10. It should be noted that the specification of the solid state disk 40 requires that the temperature of the wind passing through the solid state disk 40 is less than 70 ℃, a part of the wind entering the area where the solid state disk 40 is located passes through the memory bank 20 at the upstream of the solid state disk 40, and the other part passes through the second CPU10, because the heat dissipation of the first CPU10 is more, the temperature of a part of the wind passing through the second CPU10 exceeds 70 ℃, and through the arrangement of the heat dissipation structure 22, the heat of the second CPU10 can be transferred to the heat dissipation structure 22 to be dissipated, so that the temperature of the wind entering the area where the solid state disk 40 is located through the second CPU10 can be reduced. Of course, in other embodiments, the solid state disk 40 may also be replaced by a PCIE card, and the temperature of the wind entering the area where the PCIE card is located through the second CPU10 is reduced through the arrangement of the heat dissipation structure 22.

Referring to fig. 1 again, the windshield includes a bottom plate 11 and two baffles 12, the two baffles 12 are respectively connected to two sides of the bottom plate 11 in the second direction, the first CPU10 and the second CPU10 are both mounted on the bottom plate 11, and the air duct 101 for air to flow is formed between the two baffles 12 and the bottom plate 11. It is understood that VGA30 and solid state disk 40 are also mounted on backplane 11.

Further, the server node air duct structure further includes a fan 4, the fan 4 is installed on the windshield, and in the first direction, the fan 4 is located upstream of the first CPU. The fan 4 blows air to the first CPU to dissipate heat of the first CPU, the second CPU10, the memory bank 20, the VGA30, and the solid state disk 40. Preferably, the fans 4 are arranged in plurality, and the fans 4 are arranged side by side along the second direction to increase the flow speed and flow rate of the wind and improve the heat dissipation effect on the first CPU, the second CPU10, the memory bank 20, the VGA30 and the solid state disk 40.

In summary, the server node air duct structure provided in this embodiment, through setting up the heat dissipation substrate 21 and the heat dissipation structure 22, the heat dissipation area of the second CPU10 can be increased, and the heat dissipation structure 22 is located behind the memory bank 20 through the extension plate 212, the second CPU10 can be dissipated by using the air passing through the memory bank 20, and an accommodation space is formed between the heat dissipation structure 22 and the wind shield, compared with the prior art, the heat dissipation effect of the second CPU10 can be ensured, the wind resistance is reduced, and the space of the wind shield behind the second CPU10 is not occupied, which facilitates the installation of the VGA30 and the solid state disk 40, and facilitates the maintenance of the first CPU and the second CPU 10.

The embodiment further provides a server, which comprises the server node air duct structure.

The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A server node wind tunnel structure, comprising:

the wind shield comprises a wind shield, wherein a first CPU and a second CPU (10) are sequentially arranged in a wind channel (101) in the wind shield along a first direction, the first CPU and the second CPU (10) are respectively provided with an internal memory bar (20) at two sides of a second direction, the first direction is perpendicular to the second direction, and the first direction is the flowing direction of wind;

the first heat dissipation mechanism (2) comprises a heat dissipation substrate (21) and a heat dissipation structure (22), the heat dissipation substrate (21) comprises a body (211) connected to the second CPU (10) and an extension plate (212) extending from the body (211) to at least one side of the second CPU (10) and located on the downstream of the memory bank (20), and the heat dissipation structure (22) is arranged on one side, facing the windshield, of the extension plate (212) and forms an accommodating space between the windshield and the extension plate (212).

2. The server node air duct structure according to claim 1, wherein the heat dissipation structure (22) includes a heat dissipation plate (221) and a plurality of fins (222) provided on the heat dissipation plate (221), the heat dissipation plate (221) being connected to the extension plate (212).

3. The server node duct structure according to claim 1, wherein the body (211) includes a top plate (2111) and a side plate (2112) connected, the top plate (2111) abuts against a top surface of the second CPU (10), the side plate (2112) abuts against a side surface of the second CPU (10), and the extension plate (212) is connected to the top plate (2111).

4. The server node air duct structure according to claim 1, wherein a VGA (30) is further disposed in the air duct (101), and in the first direction, the VGA (30) is located downstream of the second CPU (10) and in the accommodating space.

5. The server node air duct structure according to claim 4, wherein a solid state disk (40) is further disposed in the air duct (101), the solid state disk (40) is disposed side by side with the VGA (30), and in the first direction, a part of the solid state disk (40) is opposite to the second CPU (10).

6. The air duct structure of the server node according to claim 1, further comprising a second heat dissipation mechanism (3), wherein the second heat dissipation mechanism (3) is connected to the first CPU, and the second heat dissipation mechanism (3) is provided with a ventilation slot (31) extending along the first direction.

7. The server node air duct structure according to claim 1, wherein a fan (4) is further disposed in the air duct (101), the fan (4) is mounted to the windshield, and the fan (4) is located upstream of the first CPU in the first direction.

8. The server node air duct structure according to claim 1, wherein the windshield includes a bottom plate (11) and two baffles (12), the two baffles (12) are respectively connected to two sides of the bottom plate (11) in the second direction, the first CPU and the second CPU (10) are both mounted on the bottom plate (11), and the air duct (101) is formed between the two baffles (12) and the bottom plate (11).

9. The server node duct structure of claim 1, wherein the extension plate (212) is provided with a fixing lug (2121), and the fixing lug (2121) is connected to the windshield.

10. A server comprising a server node duct structure according to any one of claims 1-9.