CN211838962U

CN211838962U - Four-selection separation equipment for electronic wafer products

Info

Publication number: CN211838962U
Application number: CN201922162350.9U
Authority: CN
Inventors: 孙永光
Original assignee: Hunan Wangji Electronic Technology Co ltd
Current assignee: Hunan Wangji Electronic Technology Co ltd
Priority date: 2019-12-05
Filing date: 2019-12-05
Publication date: 2020-11-03
Anticipated expiration: 2029-12-05

Abstract

The invention discloses four-separation equipment for electronic wafer products, which comprises a box body, wherein a primary screening device is arranged at the top of the box body, and a secondary screening device is arranged below the primary screening device; one end of the primary screening device is provided with a first blanking channel; one end of the secondary screening device is provided with a second blanking channel, and a magnetic separation device is arranged below the bottom of the second blanking channel; the invention can efficiently and reliably separate the mixture after the nickel-containing electronic wafer is electroplated, the whole device is compact and continuous, and the operation is very convenient and easy.

Description

Four-selection separation equipment for electronic wafer products

Technical Field

The invention belongs to the technical field of electronic wafer processing and manufacturing, and particularly relates to a four-selection separation device for an electronic wafer product.

Background

The process of making resistors requires electroplating of conductive materials onto a substrate, and electroplating is an important process. The steel ball plays a role in electric conduction in the electroplating process, so that the steel ball is one of indispensable materials in the resistance electroplating process. In the electroplating step, the steel balls and the product are mixed together and placed in a plating barrel, so that the effect of uniform electroplating is achieved, and then the steel balls and the product are separated after the electroplating is finished.

The mixture of the steel balls and the products has a plurality of products, which mainly comprises four products, namely: 1. the double-connected product which is not completely separated between every two products due to incomplete processing in the previous segmentation link; 2. defective products with broken corners or insufficient nickel are not processed in the previous processing links; 3. processing qualified good products; 4. mixing steel balls in the electroplating link; in the prior art, the separation of the four products needs to be carried out by a plurality of separation devices, the separation efficiency is low, the occupied area of the separation devices is too large, the separation links are complicated, and the processing cost is increased.

Disclosure of Invention

The invention aims to solve the problems and provides a four-selection separation device for electronic wafer products, which can efficiently and reliably separate a mixture after nickel-containing electronic wafer electroplating, is compact and continuous in the whole device and is very convenient and easy to operate.

In order to realize the purpose, the invention adopts the technical scheme that: a four-selection separation device for electronic wafer products comprises a box body, wherein a primary screening device is arranged at the top of the box body, and a secondary screening device is arranged below the primary screening device; one end of the primary screening device is provided with a first blanking channel, and the bottom of the first blanking channel is provided with a duplicate product collecting box; one end of the secondary screening device is provided with a second blanking channel, and a magnetic separation device is arranged below the bottom of the second blanking channel; the bottom of the magnetic separation device is provided with a good product collecting box and a defective product collecting box respectively; the box is provided with a third blanking channel below the secondary screening device, one side of the bottom of the third blanking channel is provided with a bottom groove, and a steel ball collecting box is arranged in the bottom groove.

Furthermore, the primary screening device comprises a coarse-pore sieve plate which is arranged at the top of the box body and used for separating the double-connected electronic wafers; the coarse-pore sieve plate inclines towards one end of the blanking channel I.

Further, the secondary screening device comprises a fine-hole screen plate which is arranged under the coarse-hole screen plate and used for separating steel balls; and the fine hole sieve plate inclines towards one end of the blanking channel II.

Further, the magnetic separation device comprises a conveying roller and a conveying belt arranged on the conveying roller, and a magnet is arranged at one end in the conveying belt; the defective product collecting box is arranged at one end, close to the magnet, below the conveyor belt, and the non-defective product collecting box is arranged at one end, far away from the magnet, below the conveyor belt; the direction of rotation of the conveyor belt is such that objects falling on the conveyor belt first pass one side of the magnet.

Furthermore, one end of the blanking channel, which is close to the bottom groove, is inclined in three directions.

Furthermore, flanges for preventing the wafers from falling off are arranged on one side of the box body and on the outer sides of the transmission belt and the blanking channel.

Furthermore, a scraper for scraping the wafer bonded on the conveyor belt is fixedly arranged on the outer side of one end, away from the magnet, of the conveyor belt.

Furthermore, the steel ball collecting box, the doubly-linked product collecting box, the defective product collecting box and the non-defective product collecting box are provided with handles convenient to push and pull on the outer sides.

Furthermore, a vibrator is arranged on one side of the box body.

The invention has the beneficial effects that:

1. the invention can carry out high-efficiency separation on the mixture after the nickel-containing electronic wafer is electroplated, and four types of products are synchronously separated out in the latter half section through three links respectively; separating and collecting the doubly-linked product or multiply-linked product with the largest volume by using a coarse-meshed sieve plate; separating the steel balls with the minimum volume by using a fine-hole sieve plate, and simultaneously carrying out magnetic separation on the nickel-containing electronic wafer to select qualified products and completely collect the qualified products; the whole process is compact and continuous, and the operation is convenient and easy.

2. The invention can evenly spread and speed up the materials being separated by the vibrator or the inclined blanking channel; and the collecting boxes corresponding to the blanking channels are used for collecting the materials completely, so that the waste of the processed materials is avoided, and the production cost and the labor intensity are reduced.

3. The flanges can be used for placing the wafers on the outer sides of the transmission belt and the blanking channel to fall off; the scraper can scrape off the wafer adhered on the conveyor belt.

Drawings

Fig. 1 is a schematic perspective view of the device of the present invention.

FIG. 2 is a schematic top view of the apparatus of the present invention.

Fig. 3 is a schematic cross-sectional view taken along line a-a in fig. 2.

In the figure: 1. a box body; 2. a primary screening device; 3. a secondary screening device; 4. a magnetic separation device; 5. a vibrator; 6. a steel ball collecting box; 7. a duplicate collection box; 8. a defective product collection box; 9. a good product collecting box; 101. a bottom groove; 102. a blanking channel III; 103. a baffle plate; 104. a squeegee; 201. a coarse-pore sieve plate; 202. a first blanking channel; 301. a fine-pore sieve plate; 302. a second blanking channel; 401. a transmission belt; 402. a conveying roller; 403. a magnet.

Detailed Description

The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.

As shown in fig. 1 to 3, the specific structure of the present invention is: a four-selection separation device for electronic wafer products comprises a box body 1, wherein a primary screening device 2 is arranged at the top of the box body 1, and a secondary screening device 3 is arranged below the primary screening device 2; a first blanking channel 202 is arranged at one end of the primary screening device 2, and a duplicate product collecting box 7 is arranged at the bottom of the first blanking channel 202; a second blanking channel 302 is arranged at one end of the secondary screening device 3, and a magnetic separation device 4 is arranged below the bottom of the second blanking channel 302; the bottom of the magnetic separation device 4 is respectively provided with a good product collection box 9 and a defective product collection box 8; the box body 1 is provided with a third blanking channel 102 below the secondary screening device 3, one side of the bottom of the third blanking channel 102 of the box body 1 is provided with a bottom groove 101, and the bottom groove 101 is internally provided with a steel ball collecting box 6.

In order to further improve the separation efficiency, the primary screening device 2 comprises a coarse-pore screen plate 201 which is arranged at the top of the box body 1 and is used for separating double-connected electronic wafers; the coarse screen plate 201 inclines towards one end of the blanking channel I202.

In order to further improve the separation efficiency, the secondary screening device 3 comprises a fine-pore screening plate 301 which is arranged right below the coarse-pore screening plate 201 and is used for separating steel balls; the fine-hole sieve plate 301 inclines towards one end of the second blanking channel 302.

In order to carry out efficient separation on the wafers with insufficient nickel content, the magnetic separation device 4 comprises a conveying roller 402 and a conveying belt 401 arranged on the conveying roller 402, wherein a magnet 403 is arranged at one end in the conveying belt 401; the defective product collection box 8 is disposed at an end below the conveyor belt 401 close to the magnet 403, and the non-defective product collection box 9 is disposed at an end below the conveyor belt 401 far from the magnet 403.

In order to further improve the separation efficiency, the blanking channel III 102 is inclined towards one end close to the bottom groove 101.

In order to reduce the product loss in the separation process, a rib 103 for preventing the wafer from falling is arranged on one side of the box body 1 outside the transmission belt 401 and the second blanking channel 302.

In order to further improve the separation efficiency, a scraper 104 for scraping off the wafers bonded on the conveyor belt 401 is fixedly arranged on the outer side of one end of the conveyor belt 401 away from the magnet 403.

Preferably, handles convenient to push and pull are arranged on the outer sides of the steel ball collecting box 6, the doubly-linked product collecting box 7, the inferior product collecting box 8 and the good product collecting box 9.

In order to further improve the separation efficiency, a vibrator 5 is arranged on one side of the box body 1

When the device works, an operator pours a product mixture to be separated onto a primary screening device in the box body, separates double-connected products or multi-connected products with the largest volume through the coarse-pore sieve plate, and slides the double-connected products or the multi-connected products into the first blanking channel to be collected; the rest mixture drops on the pore sieve plate and separates out the steel ball of minimum volume, and the steel ball falls into the steel ball through blanking passageway three and collects the box, carries out the magnetic separation to remaining nickeliferous electronic chip simultaneously, and the electronic chip that nickeliferous is not enough can not be adsorbed on the conveyer belt by the magnet, is consequently fallen down naturally to the substandard product by conveyer belt to one end and collects the box in, loses the adsorption affinity after the qualified product of nickeliferous wafer passes through magnet one end and falls down naturally to the yields and collects the box in finally.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.

Claims

1. The four-selection separation equipment for the electronic wafer products comprises a box body (1) and is characterized in that a primary screening device (2) is arranged at the top of the box body (1), and a secondary screening device (3) is arranged below the primary screening device (2); a first blanking channel (202) is arranged at one end of the primary screening device (2), and a doubly-linked product collecting box (7) is arranged at the bottom of the first blanking channel (202); a second blanking channel (302) is arranged at one end of the secondary screening device (3), and a magnetic separation device (4) is arranged below the bottom of the second blanking channel (302); a good product collecting box (9) and a defective product collecting box (8) are respectively arranged at the bottom of the magnetic separation device (4); the box body (1) is provided with a third blanking channel (102) below the secondary screening device (3), one side of the bottom of the third blanking channel (102) of the box body (1) is provided with a bottom groove (101), and the bottom groove (101) is internally provided with a steel ball collecting box (6).

2. The four-stage separation equipment for electronic wafer products as claimed in claim 1, wherein the primary screening device (2) comprises a coarse screen plate (201) arranged at the top of the box body (1) for separating double-product electronic wafers; the coarse screen plate (201) inclines towards one end of the blanking channel I (202).

3. The four-stage separation equipment for electronic wafer products as claimed in claim 1, wherein the secondary screening device (3) comprises a fine-mesh screen plate (301) disposed just below the coarse-mesh screen plate (201) for separating steel balls; and the fine hole sieve plate (301) inclines towards one end of the blanking channel II (302).

4. The quartic separation equipment of electronic wafer products according to claim 1, characterized in that the magnetic separation device (4) comprises a conveying roller (402) and a conveyor belt (401) arranged on the conveying roller (402), and a magnet (403) is arranged at one end in the conveyor belt (401); the defective product collecting box (8) is arranged at one end, close to the magnet (403), below the conveyor belt (401), and the non-defective product collecting box (9) is arranged at one end, far away from the magnet (403), below the conveyor belt (401).

5. The selective separation apparatus of electronic wafer products according to claim 1, wherein said third blanking channel (102) is inclined toward an end near the bottom slot (101).

6. The four-selection separation equipment for electronic wafer products as claimed in claim 1, wherein a retaining edge (103) for preventing the wafer from falling off is arranged on one side of the box body (1) and outside the conveyor belt (401) and the second blanking channel (302).

7. The four-separation equipment for electronic wafer products as claimed in claim 4, characterized in that a scraper (104) for scraping off wafers bonded on the conveyor belt (401) is fixedly arranged outside one end of the conveyor belt (401) far away from the magnet (403).

8. The four-selection separation equipment for electronic wafer products as claimed in claim 1, wherein handles for pushing and pulling are arranged on the outer sides of the steel ball collecting box (6), the doubly-linked product collecting box (7), the defective product collecting box (8) and the non-defective product collecting box (9).

9. The apparatus according to claim 1, characterized in that a vibrator (5) is provided on one side of the housing (1).