CN211828829U

CN211828829U - Processing device for LED packaging

Info

Publication number: CN211828829U
Application number: CN202020608456.7U
Authority: CN
Inventors: 曹占伦
Original assignee: Guangzhou Jinglun Automation Equipment Co ltd
Current assignee: Guangzhou Jinglun Automation Equipment Co ltd
Priority date: 2020-04-21
Filing date: 2020-04-21
Publication date: 2020-10-30
Anticipated expiration: 2030-04-21

Abstract

The utility model provides a processingequipment for LED encapsulation, including frame, bonding wire mechanism and point gum machine construct, on the frame was all located with the point gum machine to the bonding wire mechanism, the bonding wire mechanism was used for welding LED and forms the solder joint, and the point gum machine constructs and is used for carrying out the point to the solder joint and glue. The processing device has low cost, short time of exposing the circuit in the air, high LED packaging quality and high product qualification rate. The LED packaging process comprises the step of dispensing LEDs subjected to wire bonding on the same equipment.

Description

Processing device for LED packaging

Technical Field

The utility model relates to a LED processing technology field particularly, relates to a processingequipment for LED encapsulation.

Background

In the LED packaging process, a dispensing process (including dispensing silver paste, dispensing phosphor powder, dispensing primer, etc.) is required after the wire bonding process. Because the wire bonding process requires minimal vibration interference, and the dispensing process has great vibration, a special positioning mechanism needs to be configured. The wire bonding machine performing the wire bonding process and the dispenser performing the dispensing process are usually separately disposed and operated independently.

It has been found that the existing processing systems for LED packages have the following disadvantages:

firstly, the existing workpiece is subjected to 'first welding 010+ arc-drawing + second welding 020' (the welding wire process can be simplified into a first welding point bonding process, namely the first welding 010, a welding wire forming process, namely the arc-drawing, and a second welding point 020 bonding process, namely the second welding, wherein a connecting wire formed by the 'first welding, the arc-drawing and the second welding' is a 'wire arc 130', and the wire arc is shown in an attached figure 7 in detail) and is easily oxidized and polluted after being exposed in the air for a long time, so that the qualification rate of products is reduced;

secondly, a dispensing machine which operates independently performs dispensing on two welding positions to increase the bonding force between a welding spot and a support, the dispensing machine cannot accurately measure the position (XYZ direction) of each dispensing surface of the LED support in real time, and long-term use can cause overlarge dispensing position deviation of a dispensing head and need periodic deviation correction, otherwise, the bonding force between the welding spot and the support can be reduced, and the risk that the dispensing head is in a wrong touch state and even damages a line arc is increased;

thirdly, the traditional dispenser adopts a multi-head multi-cup dispensing head mode, the positions of a plurality of lamp cups to be dispensed at that time cannot be measured in real time, and the positions can only be used as dispensing positions according to the average position of each preset lamp cup, so that dispensing consistency can be influenced due to actual position errors, and meanwhile, the multi-head multi-cup dispensing mode enables the moving mass to be heavy and can generate great vibration impact.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a processingequipment for LED encapsulation, its time that can the contraction line arc protection in the air improves the qualification rate of product.

The embodiment of the utility model is realized like this:

an embodiment of the utility model provides a processingequipment for LED encapsulation, include:

the LED spot gluing device comprises a rack, a wire welding mechanism and a spot gluing mechanism, wherein the wire welding mechanism and the spot gluing mechanism are both arranged on the rack, the wire welding mechanism is used for welding LEDs and forming welding spots, and the spot gluing mechanism is used for carrying out spot gluing on the welding spots;

or the processing device comprises: the LED lamp holder comprises a rack, a welding line mechanism and a glue spraying mechanism, wherein the welding line mechanism and the glue spraying mechanism are arranged on the rack, the welding line mechanism is used for welding LEDs and forming welding spots, and the glue spraying mechanism is used for spraying glue to the welding spots.

In an alternative embodiment, the wire bonding mechanism comprises a porcelain nozzle and a first driving assembly, wherein the first driving assembly is connected with the rack, and the first driving assembly is used for driving the porcelain nozzle to move so that the porcelain nozzle contacts the LED and welds the LED.

In an alternative embodiment, the first driving assembly comprises a first three-dimensional moving platform, the porcelain nozzle is connected with the first three-dimensional moving platform, and the first three-dimensional moving platform is connected with the machine frame.

In an optional embodiment, the dispensing mechanism includes a dispensing head and a second driving assembly, the second driving assembly is connected to the frame, the dispensing head is connected to the second driving assembly, and the second driving assembly is used for driving the dispensing head to move, so that the dispensing head is close to the welding point.

In an optional embodiment, the dispensing head comprises an outer tube, a fixing piece and a needle tube, wherein the fixing piece is inserted in the outer tube, the needle tube is inserted in the fixing piece, and one end of the needle tube, which is far away from the outer tube, extends out of the fixing piece; the fixing piece is provided with a ventilation cavity channel, and one end of the ventilation cavity channel is provided with an air inlet; the outer wall of the fixing piece and the inner wall of the outer pipe form an air storage cavity, the fixing piece is provided with a communication hole, and the ventilation cavity channel is communicated with the air storage cavity; a first air outlet is formed in one side, far away from the air inlet, of the air storage cavity; the needle tube is communicated with the communicating hole through the ventilation cavity channel, and one end of the needle tube, which is far away from the communicating hole, is provided with a second air outlet.

In an optional embodiment, the second driving assembly includes a second three-dimensional moving platform, the second three-dimensional moving platform is connected to the frame, the dispensing head is connected to the second three-dimensional moving platform, and the second three-dimensional moving platform is used for driving the dispensing head to move.

In an optional embodiment, the second three-dimensional moving platform comprises a first linear telescopic structure, a second linear telescopic structure and a four-bar linkage structure, the second linear telescopic structure is connected with the first linear telescopic structure, the four-bar linkage structure is connected with the second linear telescopic structure, and the dispensing head is connected with the four-bar linkage structure; the four-bar linkage structure is used for driving the dispensing head to move in a third direction, and the third direction and a plane determined by the first direction and the second direction form an included angle.

In an optional implementation manner, the glue dispensing mechanism further comprises a glue storage part, the glue storage part is connected with the second driving assembly, and the glue dispensing head is used for collecting glue solution from the glue storage part.

In an optional embodiment, the glue dispensing mechanism further comprises a floating part and a driving part, the driving part is connected with the second driving assembly, and the driving part is connected with the glue storage part and used for driving the glue storage part to rotate; the floating piece is connected with the second driving assembly and used for stirring glue solution in the glue storage piece when the glue storage piece rotates.

Optionally, the tool device further comprises a control system, and the control system is used for being in communication connection with the wire bonding mechanism and the dispensing mechanism so as to control the wire bonding mechanism to weld the LEDs and the dispensing mechanism to dispense the solder joints.

The embodiment of the utility model provides a beneficial effect is:

in summary, the present embodiment provides a processing apparatus for LED packaging, including a frame and a wire bonding mechanism and a dispensing mechanism both disposed on the frame, the wire bonding mechanism and the dispensing mechanism are integrated into a device, after the wire bonding mechanism performs wire bonding operation on LEDs, the dispensing mechanism can be directly used to dispense LEDs that have completed wire bonding operation, the step of dispensing operation after completing the wire bonding operation by transferring the LEDs onto a dispensing machine that is disposed independently of the wire bonding machine is omitted, the cost of LED transferring is reduced, and the condition that bonding wires on the LEDs are damaged in the LED transferring step is also avoided, so that the subsequent dispensing process is not affected, and the product yield is improved. Meanwhile, the wire welding mechanism and the dispensing mechanism are integrated, after the LED finishes the wire welding operation, the LED can perform the dispensing operation through the dispensing mechanism in time, the time of exposing an LED arc in the air is short, the arc is not easy to be oxidized and polluted, and the qualification rate of products can be improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a processing apparatus for LED packaging according to an embodiment of the present invention;

FIG. 2 is a partially enlarged schematic view of FIG. 1;

fig. 3 is a schematic structural diagram of a partial structure of a dispensing mechanism according to an embodiment of the present invention;

fig. 4 is a schematic structural view of the glue storage member and the floating member according to the embodiment of the present invention;

fig. 5 is a schematic structural view of a dispensing head according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional structure view of the dispensing head according to the embodiment of the present invention;

fig. 7 is a schematic view of the composition of the bonding wires of the LED.

Icon:

010-welding; 020-second welding; 030-wire arc; 001-LED support; 100-a wire bonding mechanism; 110-porcelain mouth; 300-a glue dispensing mechanism; 310-dispensing head; 311-an outer tube; 312-a fixture; 3121-airway passages; 3122-air intake; 3123-intercommunicating pores; 313-needle tube; 314-a gas storage chamber; 315-first outlet port; 316-second outlet; 317-conical surface; 330-a second drive assembly; 331-a first linear telescopic structure; 333-a second linear telescopic structure; 335-four bar linkage configuration; 3351-electric motor; 3352-driving wheel; 3353-driven wheel; 3354-transmission belt; 3355-first transfer lever; 3356-second transmission rod; 3357-third drive link; 350-a transmission arm; 370-glue storage; 371-ring channel; 380-a troweling member; 390 — drive.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, in the following embodiments, unless otherwise specified, the first direction refers to a direction indicated by an ab arrow or a ba arrow, the second direction refers to a direction indicated by a cd arrow or a dc arrow, and the third direction refers to a direction indicated by an ef arrow or a fe arrow, where the first direction, the second direction, and the third direction are perpendicular to each other, and obviously, in other embodiments, the three directions may not be perpendicular to each other.

Referring to fig. 7, in the process of wire bonding for LED, for ease of understanding, the wire bonding process can be simplified as follows: the bonding process of the first welding spot is called as welding 010 for short, and the bonding process is characterized in that the LED chip is welded with the wire; a weld line forming process, referred to as arc drawing for short; and the bonding process of the second welding spot is called as second welding 020 for short, and the process is that the silk thread is welded with the LED bracket. The connecting wire formed by the first welding, the arc drawing and the second welding is wire arc 030, and after the welding wire process is finished, in order to increase the strength of the second welding, a glue dispensing process is needed to be carried out at the position of the second welding point. At present, wire bonder and point gum machine are independent setting and in order to avoid the mutual influence, and wire bonder and point gum machine locate different rooms basically, accomplish the back when LED bonding wire technology, need transport LED to the room that point gum machine is located to increased the cost of transportation, and in the transportation, LED is easily impaired, influences LED encapsulation quality. In addition, during transportation, the wire loop 030 is exposed to the external environment for a long time, and the wire loop is easily oxidized and contaminated, thereby reducing the product yield.

Referring to fig. 1, in view of the above, the present embodiment provides a processing apparatus for LED packaging, which is capable of performing a wire bonding process and a dispensing process during the LED packaging process. The processing device integrates the bonding wire and the spot gluing, shortens the period of the LED packaging process, improves the processing efficiency, and has low processing cost and high product qualification rate.

Referring to fig. 1, in the present embodiment, a processing apparatus for LED packaging includes a frame (not shown), a wire bonding mechanism 100 and a dispensing mechanism 300, wherein the wire bonding mechanism 100 and the dispensing mechanism 300 are both disposed on the frame, the wire bonding mechanism 100 is used for bonding LEDs and forming solder joints, and the dispensing mechanism 300 is used for dispensing solder joints.

The processingequipment that this embodiment provided, wire bonding mechanism 100 and dispensing mechanism 300 are all installed in the frame, thereby make two mechanism integrations be a device, in LED packaging process, wire bonding mechanism 100 carries out the bonding wire operation back to LED, can directly utilize dispensing mechanism 300 to carry out the dispensing operation with the LED of accomplishing the bonding wire operation, the step of carrying out the dispensing operation on transferring LED to the dispenser that sets up with wire bonding machine independence again after having left out LED bonding wire operation and accomplishing, the cost that the LED shifted the link and produced has been reduced, also avoid taking place to damage the condition of the bonding wire on the LED in the LED shifts the link, thereby can not influence follow-up dispensing process, thereby improve the product percent of pass. Meanwhile, the wire bonding mechanism 100 and the dispensing mechanism 300 are integrated, after the LED finishes the wire bonding operation, the LED can perform the dispensing operation through the dispensing mechanism 300 in time, the time of exposing the wire arc on the LED in the air is short, the wire arc is not easy to be oxidized and polluted, and the qualification rate of products can be improved.

In this embodiment, the frame may be a frame structure or a plate structure, and a plurality of holes for passing bolts are formed in the frame, so that the wire bonding mechanism 100 and the dispensing mechanism 300 are fixed to the frame by using the bolts.

Obviously, in other embodiments, wire bonding mechanism 100 and dispensing mechanism 300 may be connected to the frame by welding or the like.

Referring to fig. 1 and fig. 2, in the present embodiment, optionally, the wire bonding mechanism 100 includes a ceramic nozzle 110 and a first driving assembly (not shown), the first driving assembly is connected to the frame, the ceramic nozzle 110 is connected to the first driving assembly, and the first driving assembly is configured to drive the ceramic nozzle 110 to move relative to the LED to be bonded, so as to achieve bonding between the LED bonding area and the wire.

Optionally, the first driving assembly comprises a first sliding table, a second sliding table and a lifting table, the first sliding table is in sliding fit with the frame along a first direction, the second sliding table is in sliding fit with the first sliding table along a second direction, the lifting table is in sliding fit with the second sliding table along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

Furthermore, the first sliding table, the second sliding table and the lifting table can be driven by an air cylinder, a hydraulic cylinder or a lead screw transmission structure. For example, in the present embodiment, a screw drive structure is exemplified as a drive source. The rack is provided with a lead screw transmission structure, and the lead screw transmission structure is connected with the first sliding table and used for driving the first sliding table to slide relative to the rack along a first direction. The first sliding table is provided with a screw rod transmission structure, and the screw rod transmission structure is connected with the second sliding table and used for driving the second sliding table to move in a second direction relative to the first sliding table; be equipped with screw drive structure on the second slip table, screw drive structure is connected with the elevating platform for drive elevating platform moves in the third direction, and porcelain mouth 110 is connected with the elevating platform, finally realizes under the drive of first drive assembly that porcelain mouth 110 is at the ascending motion of three-dimensional side, and the motion range of porcelain mouth 110 is wide, is convenient for carry out the bonding wire operation to LED.

It should be noted that, the screw transmission structure includes a motor, a screw body and a slider, the slider is screwed with the screw body, and the motor drives the screw body to rotate, so that the slider reciprocates in the extending direction of the screw body. The motor can be a servo motor, and the control is more accurate.

It should be noted that the first driving assembly may be a robot arm, the robot arm is connected to the frame, and the porcelain nozzle 110 is connected to the robot arm.

Referring to fig. 1-3, in the present embodiment, optionally, the dispensing mechanism 300 includes a dispensing head 310 and a second driving assembly 330, the second driving assembly 330 is connected to the frame, the dispensing head 310 is connected to the second driving assembly 330, the second driving assembly 330 is used for driving the dispensing head 310 to move, so that the dispensing head 310 is close to the welding point, and the dispensing head 310 sends out the glue solution to perform a dispensing operation on the welding point.

Referring to fig. 5 and fig. 6, optionally, the dispensing head 310 includes an outer tube 311, a fixing member 312 and a needle tube 313, the fixing member 312 is inserted into the outer tube 311, the needle tube 313 is inserted into the fixing member 312, and one end of the needle tube 313 far from the outer tube 311 extends out of the fixing member 312; the fixing member 312 has a ventilation channel 3121, and one end of the ventilation channel 3121 is provided with an air inlet 3122; the outer wall of the fixing piece 312 and the inner wall of the outer tube 311 form an air storage cavity 314, the fixing piece 312 is provided with a communication hole 3123, and a communication cavity channel is communicated with the air storage cavity 314; a first air outlet 315 is arranged at one side of the air storage cavity 314 far away from the air inlet 3122, the first air outlet 315 is arranged around the circumference of the needle tube 313, the air outlet direction of the first air outlet 315 points to the end part of the needle tube 313 far away from the outer tube 311, and optionally, the circumferential wall surrounding the first air outlet 315 is a conical surface 317, so that the air exhausted from the first air outlet 315 is blown to the far end of the needle tube 313; furthermore, the inner peripheral wall of the fixing member 312, which is matched with the first air outlet 315, is a conical surface 317, which plays a role of dual guiding, so that the air discharged from the first air outlet 315 smoothly reaches the outer wall of the distal end of the needle tube 313; the needle tube 313 communicates with the communication hole 3123 through the airway passage 3121, and one end of the needle tube 313 remote from the communication hole 3123 is provided as the second air outlet 316. The glue dispensing head structure adopting the internal and external blowing type can ensure that the glue dispensing head 310 moves to the glue dispensing position very close to the LED support when dispensing, and the glue dispensing head 310 does not need to contact the glue dispensing surface, and the glue dispensing is realized through internal and external blowing, so that the glue dispensing head 310 is prevented from impacting the support to generate vibration, and the glue dispensing quality is improved. Meanwhile, micro control can be realized. In the actual operation process, the dispensing head 310 is moved to enable the needle tube 313 to move to a glue taking position and to be inserted into viscous glue, a small amount of glue is adhered to the inner cavity of the needle tube 313 and the outer wall and the end face of the needle tube 313, then the dispensing head 310 is moved to a position corresponding to a position, to be dispensed, of the LED support, a fan is used for blowing air into the ventilation cavity 3121, the air flows in the needle tube 313, and the glue in the needle tube 313 is blown to a welding line position; meanwhile, the gas enters the gas storage cavity 314 from the communication hole 3123 and is exhausted from the second gas outlet 316, and the gas is directly blown to the outer tube wall of the needle tube 313, so that the glue solution on the outer tube wall falls off and reaches the welding line position. That is, the dispensing head 310 utilizes the first air outlet 315 and the second air outlet 316 to blow the glue solution adhered on the needle tube 313 and inside to the bonding wire position, so as to achieve dispensing, and since the amount of the glue solution blown to the bonding wire position can be controlled by the amount of the glue solution adhered on the needle tube 313, the situation that the glue solution is little or much is not easy to occur, so that the dispensing quality is ensured, and the waste of the glue solution is avoided. And the glue is dispensed in an internal and external blowing mode, so that glue solution is not easy to remain on the needle tube 313, the glue solution inside and outside the needle tube 313 can reach the position of the bonding wire, and the glue dispensing quality is ensured.

It should be noted that the dispensing mechanism 300 in this embodiment is used for dispensing the led bracket that has completed the wire bonding process, the dispensing mechanism 300 may also adopt a glue spraying mechanism, and the dispensing process performed by the dispensing mechanism 300 may also adopt a glue spraying mechanism, which is referred to as a glue spraying process. Similarly, the dispensing head 310 may also be a glue spraying head.

In addition, in the dispensing process described in this embodiment, the dispensing head 310 may directly contact with the led support, or may keep a certain distance therebetween; simultaneously, the gluey process of spouting that this embodiment provided, it can direct contact to spout gluey head and led support, and the two also can have a certain interval.

Optionally, the second driving assembly 330 includes a second three-dimensional moving platform, the second three-dimensional moving platform includes a first linear telescopic structure 331, a second linear telescopic structure 333 and a four-bar linkage structure 335, the second linear telescopic structure 333 is connected to the first linear telescopic structure 331, the four-bar linkage structure 335 is connected to the second linear telescopic structure 333, and the dispensing head 310 is connected to the four-bar linkage structure 335; the first linear telescopic structure 331 extends and retracts along a first direction, the second linear telescopic structure 333 extends and retracts along a second direction perpendicular to the first direction, and the four-bar linkage structure 335 is used for driving the dispensing head 310 to move in a third direction, wherein the third direction is perpendicular to a plane determined by the first direction and the second direction. Obviously, in other embodiments, the third direction may be inclined not perpendicularly to the plane defined by the first direction and the second direction.

Referring to fig. 3, optionally, the four-bar linkage 335 includes a motor 3351, a driving wheel 3352, a driven wheel 3353, a transmission belt 3354, a first transmission rod 3355, a second transmission rod 3356 and a third transmission rod 3357, the motor 3351 is connected to the second linear telescopic structure 333, the driving wheel 3352 and the driven wheel 3353 are rotatably engaged with the second linear telescopic structure 333, the transmission belt 3354 is tensioned outside the driving wheel 3352 and the driven wheel 3353, the first transmission rod 3355 is simultaneously rotatably engaged with the axle of the driving wheel 3352 and the third transmission rod 3357, and the second transmission rod 3356 is simultaneously rotatably engaged with the axle of the driven wheel 3353 and the third transmission rod 3357. The driving wheel 3352 is driven by the motor 3351 to rotate, so as to drive the driven wheel 3353, the first transmission rod 3355, the second transmission rod 3356 and the point transmission rod to move.

It should be noted that the driving wheel 3352 and the driven wheel 3353 may be a sprocket or a gear, and correspondingly, the transmission belt 3354 may be a chain or a toothed bar.

Optionally, the dispensing mechanism 300 further includes a transmission arm 350, the transmission arm 350 is connected to the third transmission rod 3357, and the dispensing head 310 is connected to the transmission arm 350. The glue outlet of the glue dispensing head 310 is arranged downwards. When the four-bar linkage 335 drives the dispensing head 310 to rise or fall, the dispensing head 310 is always kept in a vertical state, the glue solution in the dispensing head 310 cannot flow backwards, the uniformity of glue discharging is ensured, and the dispensing quality is improved. And through the setting of four connecting rod structures 335, the horizontal space of rational utilization avoids the condition that the spare part of processingequipment concentrates and produces the interference.

It should be noted that the second driving assembly 330 may be a robot arm, the robot arm is connected to the frame, and the dispensing head 310 is connected to the robot arm.

In this embodiment, it should be noted that the dispensing head 310 of the dispensing mechanism 300 and the ceramic nozzle 110 of the wire bonding mechanism 100 may also share a three-dimensional motion platform.

Referring to fig. 3 and 4, in the present embodiment, optionally, the glue dispensing mechanism 300 further includes a glue storage member 370, a leveling member 380, and a driving member 390.

Optionally, the glue reservoir 370 has an annular groove 371 for receiving glue. The glue storage member 370 is rotatably engaged with the second linear telescopic structure 333, and the rotation axes of the two extend along the third direction, and meanwhile, the axis of the annular groove 371 coincides with the rotation axis. The glue reservoir 370 is aligned with the dispensing head 310 in both the first and second directions. In other words, when the first and second linear

telescopic structures

331 and 333 move, the glue storage member 370 and the glue dispensing head 310 both move synchronously.

The driving element 390 is connected to the second linear extending structure 333, and the driving element 390 is used for driving the glue storage element 370 to rotate relative to the second linear extending structure 333.

Wherein, floating piece 380 is connected with second straight line extending structure 333, and the part of floating piece 380 stretches into ring channel 371, when storing up gluey piece 370 and rotate under the effect of driving piece 390, stores up gluey piece 370 and rotates for floating piece 380, and floating piece 380 realizes the stirring operation to the glue solution that is located ring channel 371, and the glue solution is difficult for condensing, and when dispensing head 310 gathered the glue solution from storing up gluey piece 370, the glue solution misce bene can improve some quality of gluing. Meanwhile, in the rotation process of the glue storage part 370, after the glue solution in the glue storage part 370 is stirred by the leveling part 380, the liquid level of the glue solution is more flat, consistent and stable, so that the depth of the glue dipping head 310 in the glue solution is consistent when the glue is taken every time, the consistency of the glue taking is ensured, and the glue dispensing quality is further improved.

The mechanism of the dispenser mechanism 300 is not limited to the above-described structure, and the structure of the existing dispenser may be directly adopted.

In this embodiment, optionally, the processing apparatus further includes a conveying mechanism, the conveying mechanism is connected to the frame, the conveying mechanism is in sliding fit with the frame in the second direction, and the conveying mechanism is configured to bear the LED support 001 and drive the LED support 001 to move in the second direction.

It should be noted that the dispensing heads 310 and the ceramic nozzles 110 are arranged at intervals in the second direction, and when the LED support 001 is transported by the transport mechanism, the LED support reaches the ceramic nozzles 110 and completes the wire bonding operation, and then is transported to the dispensing heads 310 to complete the dispensing operation. The LED bonding wire and the dispensing process are carried out on the same processing device, and in the processing process, the LED moves through the conveying mechanism, the LED does not need to be repositioned, in other words, the LED shares a positioning coordinate system in the bonding wire and the dispensing process, the welding point position of the LED is convenient to confirm and can be directly fed back to the dispensing process, so that the accuracy of the dispensing position is ensured, and the dispensing quality is improved.

In this embodiment, the bonding wires and the dispensing can be controlled in a unified manner through the control system, so as to realize automatic packaging. For example, the control system sends an instruction to drive a porcelain nozzle of the welding line mechanism to move to a position to be welded to weld the wire on the LED bracket, and then the porcelain nozzle returns to prepare for welding the wire next time; then, the conveying mechanism conveys the LED bracket and moves the position where the wire bonding is completed to the dispensing mechanism, the control system obtains the position information of the wire bonding of the LED bracket and can control the second driving assembly 330 to move by using the position information, at this time, the dispensing head 310 is driven by the second driving assembly 330 to move to the position of the glue storage member 370 for glue taking, and then the dispensing head 310 is driven to perform the dispensing operation, after the dispensing is completed, the dispensing head 310 returns to the position, which is convenient for the next glue taking and dispensing operation.

The processing device provided by the embodiment is used for LED packaging, the LED welding wires and the glue dispensing are realized through the same device, the cost for transferring the LEDs is reduced, the time of exposing the wire arcs of the LEDs in the air is shortened, and the qualification rate of products is improved.

The embodiment also provides an LED packaging process, the LED of the bonding wire is subjected to dispensing on the same equipment, the cost for transferring the LED is reduced, the time of exposing the wire arc 030 of the LED in the air is shortened, and the product yield is improved.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A tooling apparatus for LED packaging, comprising:

the LED packaging machine comprises a rack, a wire welding mechanism and a dispensing mechanism, wherein the wire welding mechanism and the dispensing mechanism are both arranged on the rack, the wire welding mechanism is used for welding the LED and forming a welding spot, and the dispensing mechanism is used for dispensing the welding spot;

or the processing device comprises: the LED lamp holder comprises a rack, a welding line mechanism and a glue spraying mechanism, wherein the welding line mechanism and the glue spraying mechanism are arranged on the rack, the welding line mechanism is used for welding the LEDs and forming welding spots, and the glue spraying mechanism is used for spraying glue to the welding spots.

2. The processing apparatus according to claim 1, wherein:

the wire welding mechanism comprises a porcelain nozzle and a first driving assembly, the first driving assembly is connected with the rack, and the first driving assembly is used for driving the porcelain nozzle to move so that the porcelain nozzle contacts the LED and is welded with the LED.

3. The processing apparatus according to claim 2, wherein:

the first driving assembly comprises a first three-dimensional moving platform, the porcelain nozzle is connected with the first three-dimensional moving platform, and the first three-dimensional moving platform is connected with the rack.

4. The processing apparatus according to claim 1, wherein:

the glue dispensing mechanism comprises a glue dispensing head and a second driving assembly, the second driving assembly is connected with the frame, the glue dispensing head is connected with the second driving assembly, and the second driving assembly is used for driving the glue dispensing head to move so that the glue dispensing head is close to the welding spot.

5. The processing apparatus according to claim 4, wherein:

the dispensing head comprises an outer tube, a fixing piece and a needle tube, the fixing piece is inserted in the outer tube, the needle tube is inserted in the fixing piece, and one end of the needle tube, far away from the outer tube, extends out of the fixing piece; the fixing piece is provided with a ventilation cavity channel, and one end of the ventilation cavity channel is provided with an air inlet; the outer wall of the fixing piece and the inner wall of the outer pipe form an air storage cavity, the fixing piece is provided with a communication hole, and the ventilation cavity channel is communicated with the air storage cavity; a first air outlet is formed in one side, far away from the air inlet, of the air storage cavity; the needle tube is communicated with the communicating hole through the ventilation cavity channel, and one end of the needle tube, which is far away from the communicating hole, is provided with a second air outlet.

6. The processing apparatus according to claim 4, wherein:

the second driving assembly comprises a second three-dimensional moving platform, the second three-dimensional moving platform is connected with the rack, the dispensing head is connected with the second three-dimensional moving platform, and the second three-dimensional moving platform is used for driving the dispensing head to move.

7. The processing apparatus as set forth in claim 6, wherein:

the second three-dimensional moving platform comprises a first linear telescopic structure, a second linear telescopic structure and a four-bar linkage structure, the second linear telescopic structure is connected with the first linear telescopic structure, the four-bar linkage structure is connected with the second linear telescopic structure, and the dispensing head is connected with the four-bar linkage structure; the first linear telescopic structure stretches along a first direction, the second linear telescopic structure stretches along a second direction perpendicular to the first direction, the four-bar linkage structure is used for driving the dispensing head to move in a third direction, and the third direction has an included angle with the first direction and a plane determined by the second direction.

8. The processing apparatus according to claim 4, wherein:

the glue dispensing mechanism further comprises a glue storage part, the glue storage part is connected with the second driving assembly, and the glue dispensing head is used for collecting glue solution from the glue storage part.

9. The processing apparatus as set forth in claim 8, wherein:

the glue dispensing mechanism further comprises a floating part and a driving part, the driving part is connected with the second driving assembly, and the driving part is connected with the glue storage part and used for driving the glue storage part to rotate; the floating piece is connected with the second driving assembly and used for stirring glue solution in the glue storage piece when the glue storage piece rotates.

10. The processing apparatus according to claim 1, wherein:

still include control system, control system be used for with welding wire mechanism with mechanism communication connection is glued to the point, in order to control welding wire mechanism welds LED and it is right to glue the mechanism the solder joint carries out the point and glues.