CN211828698U - Sponge cleaning pretreatment device - Google Patents
Sponge cleaning pretreatment device Download PDFInfo
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- CN211828698U CN211828698U CN202020621113.4U CN202020621113U CN211828698U CN 211828698 U CN211828698 U CN 211828698U CN 202020621113 U CN202020621113 U CN 202020621113U CN 211828698 U CN211828698 U CN 211828698U
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- wafer
- sponge
- sponge brush
- cleaning
- brush
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Abstract
A sponge cleaning pretreatment device comprises a wafer clamping mechanism, a wafer driving mechanism, a sponge cleaning mechanism, a spraying mechanism, a pressurizing adjusting mechanism and a control mechanism. Therefore, by simulating the environmental parameters of the production environment of the client machine, such as the wafer rotating speed, the cleaning liquid flow, the rotating speed and the rotating direction of the sponge brush, the distance between the sponge brush and the wafer, the down force between the sponge brush and the wafer and the like, the using condition of the client is simulated, the client can utilize the device to activate the sponge product before using the sponge brush, the sponge brush condition is improved, the client can be provided to reduce the time for using the self machine to perform pre-break-in under the condition of not occupying the time of the client machine for Preventive Maintenance (PM), thereby shortening the loop time of the machine, not only greatly reducing the machine used and produced by the client, but also improving the yield and reducing the product defects.
Description
Technical Field
The utility model relates to a board equipment of simulation customer board production environment especially indicates to provide the activation of sponge product, promotes sponge brush situation, contains the frictional force that improves between its cleanliness factor (purge particulate) and sponge brush and the wafer, and reducible customer uses self very expensive equipment to carry out a mode of warm-up.
Background
Commissioning of consumables (Break-In) is a key step In the Preventive Maintenance (PM) work, allowing seasonal adjustments and cleaning of new consumables. However, with the development of advanced technology nodes, particularly after 14 nm processing, the run-in time of consumables is becoming longer and longer to meet stringent process requirements. For example, a customer (e.g., a station for accumulating power) needs to use its station to perform pre-treatment (pre-break-in) of brush activation regardless of the use of any brush, and it takes a day to perform the pre-treatment, i.e., the customer needs to use its own station to perform pre-treatment of brush activation before performing PM, and the previous day is required for the pre-treatment of cleaning brush activation, which not only reduces the normal working time (Uptime) of the customer, but also affects the throughput and increases the equipment station and labor cost.
Therefore, it is generally not suitable for the user to effectively reduce the impact of the run-in of the consumables on the normal working time of the chemical-mechanical polishing (CMP) tool in practical use.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to overcome the above problems encountered in the prior art, and provide a sponge cleaning pretreatment device, a machine equipment for simulating the production environment of the client machine, which can simulate the usage situation of the client, and make the client use the device to provide the activation of sponge products before using, and improve the situation of the sponge brush, including improving its cleanliness (purge particulate) and the friction between the sponge brush and the wafer, and the function is similar to the device warming-up, so as to reduce the mode of using the expensive device to warm-up by the client; in other words, the creation can provide the customer with the time for reducing the usage of the own machine to perform the trial run without occupying the time of the customer machine to perform the PM (virtual machine center), so that the customer can shorten the PM time, thereby shortening the machine return time, not only greatly reducing the usage of the produced machine by the customer, but also improving the yield and reducing the product defects (defects).
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a processing apparatus before sponge cleaning, is to sponge brush application activation processing in order to shorten the warm-up time of follow-up board, provides this sponge brush activation through this activation processing in order to promote the cleanliness factor, and the frictional force between this sponge brush and a wafer, the device includes: a wafer clamping mechanism for fixing the wafer; the wafer driving mechanism is connected with the wafer clamping mechanism and is used for bearing and rotating the wafer clamping mechanism; the sponge cleaning mechanism is arranged above the surface of the wafer and comprises the sponge brush and a driving motor connected with the sponge brush to drive the sponge brush to rotate, and when the wafer clamping mechanism is driven by the wafer driving mechanism to rotate, the sponge brush is rotated by the driving motor to generate relative motion between the sponge brush and the wafer so as to clean the wafer; a spraying mechanism arranged on the surface of the wafer and used for supplying cleaning liquid to the surface of the wafer so as to assist the sponge brush in cleaning the wafer; the pressure adjusting mechanism is connected with the sponge cleaning mechanism and can contact the sponge brush with the surface of the wafer in a pressure state; and a control mechanism respectively connected to the wafer clamping mechanism, the wafer driving mechanism, the sponge cleaning mechanism, the spraying mechanism and the pressurizing adjustment mechanism for adjusting a plurality of environmental parameters to obtain an activated sponge brush, wherein each environmental parameter comprises setting the rotation speed of the wafer driving mechanism and controlling the rotation speed to be 30-150 rpm, setting the cleaning liquid of the spraying mechanism to be sprayed on the wafer at a flow rate of 0.5-3.5 LPM, setting the rotation direction and the rotation speed of the sponge cleaning mechanism and controlling the rotation speed to be 100-500 rpm, setting the distance between the sponge cleaning mechanism and the wafer clamping mechanism and controlling the distance (Gap) between the sponge brush and the wafer to be-0.4-2.0 millimeters (mm), and setting the pressurizing state of the pressurizing adjustment mechanism and controlling the down pressure between the sponge brush and the wafer to be 1-10 newtons (newtons).
In the above embodiments of the present invention, the rotation direction of the sponge cleaning mechanism controlled by the control mechanism may be Clockwise (CW) or counterclockwise (CCW).
Drawings
Fig. 1 is a schematic diagram of the structural block of the present invention.
Reference numbers refer to:
sponge cleaning pretreatment device 100
Wafer 1
Sponge brush 31
A control mechanism 60.
Detailed Description
Fig. 1 is a schematic diagram of a structural block of the present invention. As shown in the figure: the utility model relates to a processing apparatus 100 before sponge cleaning, it is the warm-up time of applying an activation treatment in order to shorten follow-up board to the sponge brush, provide this sponge brush activation through this activation treatment in order to promote the frictional force between cleanliness factor (purge particulate) and this sponge brush and the wafer. The sponge cleaning pretreatment apparatus 100 comprises a wafer holding mechanism 10, a wafer driving mechanism 20, a sponge cleaning mechanism 30, a spraying mechanism 40, a pressurizing adjustment mechanism 50 and a control mechanism 60.
The wafer clamping mechanism 10 is used to fix the wafer 1.
The wafer driving mechanism 20 is connected to the wafer holding mechanism 10 for carrying and rotating the wafer holding mechanism 10.
The sponge cleaning mechanism 30 is disposed above the surface of the wafer 1, and includes a sponge brush 31 and a driving motor 32, when the wafer holding mechanism 10 is driven by the wafer driving mechanism 20 to rotate, the driving motor 32 rotates the sponge brush 31 to generate a relative motion between the sponge brush 31 and the wafer 1, so as to have a friction effect, thereby cleaning the wafer 1.
The spraying mechanism 40 is disposed on the surface of the wafer 1 for supplying a cleaning solution to the surface of the wafer 1 to assist the sponge brush 31 in cleaning the wafer 1.
The pressure adjustment mechanism 50 is connected to the sponge cleaning mechanism 30, and can make the sponge brush 31 contact the surface of the wafer 1 in a pressurized state.
The control mechanism 60 is connected to the wafer holding mechanism 10, the wafer driving mechanism 20, the sponge cleaning mechanism 30, the spraying mechanism 40 and the pressure adjusting mechanism 50 respectively, for adjusting several environmental parameters to obtain the activated sponge brush 31. Thus, the device disclosed above constitutes a new sponge cleaning pretreatment device 100.
In this embodiment, the utility model discloses a design a board, simulation customer's board production environment selectively adjusts environmental parameter in order to gain the sponge brush 31 of activation in the interactive in-process of sponge brush 31 and wafer 1. The obtained sponge brush 31 is then used for subsequent Preventive Maintenance (PM) of the machine.
More specifically, the actions of adjusting the environmental parameters of the present embodiment may include adjusting the rotation speed of the wafer driving mechanism 20, adjusting the flow rate of the cleaning solution of the spraying mechanism 40, adjusting the rotation direction and the rotation speed of the sponge cleaning mechanism 30, adjusting the distance between the sponge cleaning mechanism 30 and the wafer holding mechanism 10, and adjusting the pressurization state of the pressurization adjusting mechanism 50. For example, in the embodiment, the actions of the various mechanisms can be adjusted by the control mechanism 60 according to the process requirements, including setting the rotation speed of the wafer driving mechanism 20 and controlling the rotation speed to be 30-150 rpm, setting the cleaning liquid of the spraying mechanism 40 to be sprayed on the wafer 1 at a flow rate of 0.5-3.5 LPM, setting the rotation direction of the sponge cleaning mechanism 30 to be Clockwise (CW) or counterclockwise (CCW), setting the rotation speed of the sponge cleaning mechanism 30 and controlling the rotation speed to be 100-500 rpm, setting the distance between the sponge cleaning mechanism 30 and the wafer holding mechanism 10 and controlling the Gap (Gap) between the sponge brush 31 and the wafer 1 to be-0.4-2.0 mm (mm), and setting the pressurizing state of the pressurizing adjustment mechanism 50 and controlling various parameters such as the down force (down force) between the sponge brush 31 and the wafer 1 to be 1-10 newtons. Wherein, the Gap is the contact distance between the sponge brush and the wafer, usually a negative value (since a positive value indicates no contact), and is the basis for the american manufacturer to control the contact between the sponge and the wafer, and the down force is the force generated by the Gap, and is the basis for the japanese manufacturer to control the contact between the sponge and the wafer; accordingly, the present inventor includes the above two ways in the present device.
Therefore, this creation designs a board equipment, it is simulation customer service conditions, mainly let the customer utilize this device to provide the activation of sponge product earlier before using, promote the sponge brush situation, contain the frictional force that improves between its cleanliness factor and sponge brush and the wafer, the similar equipment heat up of function, reducible customer uses the very expensive equipment of self to carry out a mode of heat up, the customer can shorten its PM time, can shorten board loop time, and then improve output and reduce product defect (defect).
In conclusion, the sponge cleaning pretreatment device of the present creation can effectively improve various defects of the prior art, utilize simulation client machine production environment, activate sponge products, promote sponge brush condition, can provide clients to reduce the time of using their machine to do pre-trial operation (pre break-in) under the condition of not occupying client machine time to perform Preventive Maintenance (PM), not only can greatly reduce the machines used and produced by clients, but also can improve yield, further make the creation more advanced, more practical, more in line with the needs of users, ensure to meet the requirements of novel patent application, and legally propose patent application.
However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereto. Therefore, all the equivalent changes and modifications made in accordance with the claims of the present invention and the contents of the new specification should still fall within the scope covered by the present invention.
Claims (2)
1. A sponge cleaning pretreatment device is characterized by comprising:
the wafer clamping mechanism is used for fixing the wafer;
the wafer driving mechanism is connected with the wafer clamping mechanism and is used for bearing and rotating the wafer clamping mechanism;
the sponge cleaning mechanism is arranged above the surface of the wafer and comprises a sponge brush and a driving motor connected with the sponge brush to drive the sponge brush to rotate, and when the wafer clamping mechanism is driven by the wafer driving mechanism to rotate, the sponge brush is rotated by the driving motor to generate relative motion between the sponge brush and the wafer so as to clean the wafer;
a spraying mechanism arranged on the surface of the wafer and used for supplying cleaning liquid to the surface of the wafer so as to assist the sponge brush in cleaning the wafer;
the pressure adjusting mechanism is connected with the sponge cleaning mechanism and can contact the sponge brush with the surface of the wafer in a pressure state; and
a control mechanism connected to the wafer clamping mechanism, the wafer driving mechanism, the sponge cleaning mechanism, the spraying mechanism and the pressure adjusting mechanism respectively for adjusting a plurality of environmental parameters to obtain an activated sponge brush, wherein each environmental parameter comprises setting the rotation speed of the wafer driving mechanism and controlling the rotation speed to be 30-150 rpm, setting the cleaning liquid of the spraying mechanism to be sprayed on the wafer at a flow rate of 0.5-3.5 LPM, setting the rotation direction and the rotation speed of the sponge cleaning mechanism and controlling the rotation speed to be 100-500 rpm, setting the distance between the sponge cleaning mechanism and the wafer clamping mechanism and controlling the distance between the sponge brush and the wafer to be-0.4- -2.0 mm, and setting the pressure state of the pressure adjusting mechanism and controlling the down pressure between the sponge brush and the wafer to be 1-10 Newton.
2. The sponge cleaning pretreatment apparatus of claim 1, wherein the control mechanism controls the rotation direction of the sponge cleaning mechanism to be clockwise or counterclockwise.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020621113.4U CN211828698U (en) | 2020-04-23 | 2020-04-23 | Sponge cleaning pretreatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020621113.4U CN211828698U (en) | 2020-04-23 | 2020-04-23 | Sponge cleaning pretreatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211828698U true CN211828698U (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020621113.4U Expired - Fee Related CN211828698U (en) | 2020-04-23 | 2020-04-23 | Sponge cleaning pretreatment device |
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| Country | Link |
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| CN (1) | CN211828698U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117644074A (en) * | 2024-01-30 | 2024-03-05 | 深圳市龙图光罩股份有限公司 | Mask cleaning method, device, terminal equipment and storage medium |
-
2020
- 2020-04-23 CN CN202020621113.4U patent/CN211828698U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117644074A (en) * | 2024-01-30 | 2024-03-05 | 深圳市龙图光罩股份有限公司 | Mask cleaning method, device, terminal equipment and storage medium |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 Termination date: 20210423 |