CN211794410U - Semiconductor refrigeration atomized liquid cooling suit - Google Patents
Semiconductor refrigeration atomized liquid cooling suit Download PDFInfo
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- CN211794410U CN211794410U CN201922400012.4U CN201922400012U CN211794410U CN 211794410 U CN211794410 U CN 211794410U CN 201922400012 U CN201922400012 U CN 201922400012U CN 211794410 U CN211794410 U CN 211794410U
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- liquid
- cooling
- water
- refrigeration
- refrigerating
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- 238000001816 cooling Methods 0.000 title claims abstract description 95
- 239000007788 liquid Substances 0.000 title claims abstract description 76
- 238000005057 refrigeration Methods 0.000 title claims abstract description 47
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 105
- 238000000889 atomisation Methods 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000006199 nebulizer Substances 0.000 abstract description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 206010019345 Heat stroke Diseases 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model discloses a semiconductor refrigeration atomizing liquid cooling clothes relates to the rapid cooling field, including liquid cooling clothes body, ultrasonic nebulizer, silicone tube, liquid refrigerating plant, switching device, outer box, controller. The utility model overcomes the not enough of portable cooling provides a cold clothes of semiconductor refrigeration atomizing liquid, the utility model discloses have the effect that a key starts the cooling, no matter be outdoor or indoor can rapid cooling to the personnel of high temperature work. The small weight and the small size are convenient for the workers to carry and use, and the portability is improved.
Description
Technical Field
The utility model relates to a rapid cooling field, especially a semiconductor refrigeration atomized liquid cooling clothes.
Background
At present, workers in many industries need to work at high temperature, particularly in hot summer, heatstroke is easy to occur, and serious heat radiation diseases can be caused. In the face of the situation, at present, people generally adopt an immovable method such as ice cubes, fans and the like to cool so as to increase the physiological comfort of human bodies. But in the open air, the staff's of liberation both hands that these modes of cooling can not be fine work is not convenient for, and the mode of most cooling is not very good at open air cooling effect moreover, so need a specific instrument that conveniently carries to solve, and the utility model discloses a this problem of improvement that semiconductor refrigeration atomized liquid cold clothes then can be very big.
Chinese patent CN207428469U discloses a semiconductor refrigeration garment, which comprises a garment body, and a plurality of heat exchange units, a first backpack and a second backpack arranged on the garment body, wherein the semiconductor refrigeration garment only realizes internal cooling. The utility model discloses compare in the semiconductor refrigeration clothes of disclosing, the utility model discloses an inside and outside dual cooling brings better experience for the wearing person.
SUMMERY OF THE UTILITY MODEL
For the work of staff under the convenient high temperature condition, improve the effect of outdoor cooling and need establish an infrastructure, the utility model provides a semiconductor refrigeration atomized liquid cooling clothes, concrete technical scheme is as follows:
a semiconductor refrigeration atomized liquid cooling suit comprises a liquid cooling suit body, an ultrasonic atomizer, a silicone tube, a liquid refrigeration device, a switch device, an outer box body and a controller;
the ultrasonic atomizer is arranged at the collar of the liquid cooling suit body, the ultrasonic atomizer and the liquid refrigerating device are respectively connected with a switch device, the liquid refrigerating device is arranged in the outer box body, and the switch device is arranged on the outer surface of the outer box body; the silicone tube is arranged inside the liquid cooling suit body, and the ultrasonic atomizer is connected with one end of the silicone tube; the other end of the silicone tube is connected with a liquid refrigerating device; the controller is electrically connected with the liquid refrigeration device.
Further, the ultrasonic atomizer comprises a water storage bag, a sponge rod and an ultrasonic atomization sheet, the water storage bag, the sponge rod and the ultrasonic atomization sheet are all arranged at the collar of the liquid cooling suit body, a water inlet of the water storage bag is connected with the liquid refrigerating device, one end of the sponge rod is connected with the water storage bag, and the other end of the sponge rod is connected with the working face of the ultrasonic atomization sheet.
Furthermore, the ultrasonic atomization sheet adopts a ceramic atomization sheet with a ceramic high-frequency resonance function.
Further, the liquid refrigerating device comprises a water cooling head, a refrigerating sheet, a cooling fan, a water pump, an electric valve and a battery;
the battery is electrically connected with the input end of the controller; the refrigerating sheet, the cooling fan, the water storage tank, the water pump and the electric valve are respectively and electrically connected with the output end of the controller; the refrigeration sheet is arranged in the water cooling head, and the input end of the water cooling head is connected with one end of the silicone tube; the output end of the water cooling head is connected with a water storage tank, and the water storage tank is connected with a water pump; the water pump is connected with the other end of the silicone tube; the water pump is electrically connected with the electric valve;
the battery is used for supplying power to the controller, and the refrigerating sheet is used for refrigerating liquid in the water cooling head to obtain refrigerating liquid; the cooling fan is used for cooling the heat generated by the refrigerating sheet; the water pump is used for pumping water in the silicone tube into the water cooling head, refrigerating fluid obtained after refrigeration is pumped into the water storage tank through the water pump, and the water storage tank is used for storing the liquid; the electric valve is used for controlling the flow rate of the refrigerant liquid flowing out of the ultrasonic atomizer.
Furthermore, the refrigeration piece is formed by connecting different semiconductor materials in series to form a semiconductor couple, and two ends of the semiconductor couple respectively absorb heat and emit heat.
Further, switching device includes switch, water-cooling switch, the cold switch of fog, switch is connected with the battery, the water-cooling switch is connected with the water-cooling head, the cold switch of fog is connected with the ultrasonic atomization ware.
Further, the controller adopts a 51-chip microcomputer.
The utility model has the advantages that:
the utility model overcomes the not enough of portable cooling provides a cold clothes of semiconductor refrigeration atomizing liquid, the utility model discloses have the effect that a key starts the cooling, no matter be outdoor or indoor can rapid cooling to the personnel of high temperature work. The small weight and the small size are convenient for the workers to carry and use, and the portability is improved. Through the inside refrigeration cycle of silicone tube and the outside refrigeration of ultrasonic nebulizer, make liquid cooling suit can cool off the health and protect the staff to avoid heat stress, surplus metabolism heat is taken away in the passageway that the coolant flow through being close to the health, to the head region, we adopt cooling atomization cooling in the collar position, give the better experience of head region with the water molecule heat dissipation, and outdoor dust pollution problem has been solved effectively, prevent outside environment heat to pass the health of wearing liquid cooling suit staff simultaneously, make the heat stress and the fatigue of the staff of wearing liquid cooling suit can reduce widely, and even in extremely harsh thermal environment, also can avoid the danger of slight heatstroke.
Drawings
Fig. 1 is a view of the body of the refrigeration suit of the present invention.
Fig. 2 is an internal structure view of the refrigerating garment of the present invention.
Fig. 3 is a structural diagram of the control box of the present invention.
Fig. 4 is a diagram of the switch position of the present invention.
Fig. 5 is a plan view of the control box of the present invention.
Fig. 6 is a schematic view of the structure of the present invention.
Fig. 7 is a circuit structure diagram of the present invention.
The reference numerals shown in the drawings denote: 1: a refrigeration garment body; 2: an ultrasonic atomizer; 3: a silicone tube; 4: a liquid refrigeration device; 5: a switching device; 6: an outer case; 21: a water storage bag; 22: a sponge stick; 23 ultrasonic atomization sheet; 41: a water cooling head; 42: a refrigeration plate; 43: a heat radiation fan; 44: a water storage tank; 45: a water pump; 46: an electrically operated valve; 47: a battery; 51: a power switch; 52: a water-cooling switch; 53: fog cooling switch.
Detailed Description
For a better understanding of the present invention, the following further description is made in conjunction with the accompanying drawings and the specific embodiments:
example 1:
as shown in fig. 1 and 2, a semiconductor refrigeration atomized liquid cooling suit comprises a liquid cooling suit body 1, an ultrasonic atomizer 2, a silicone tube 3, a liquid refrigeration device 4, a switch device 5, an outer box 6 and a controller;
the ultrasonic atomizer 2 is arranged at the collar of the liquid cooling suit body 1, the ultrasonic atomizer 2 and the liquid refrigerating device 4 are respectively connected with the switch device 5, the liquid refrigerating device 4 is arranged in the outer box body, and the switch device 5 is arranged on the outer surface of the outer box body 6; the silicone tubes 3 are arranged in order inside the liquid cooling suit body 1, and the ultrasonic atomizer 2 is connected with one end of the silicone tubes 3; the other end of the silicone tube 3 is connected with a liquid refrigerating device 4; the controller is electrically connected to the liquid cooling device 4.
The ultrasonic atomizer 2 is used for atomizing liquid, and the generated water mist lowers the temperature around the head of a wearer; the silicone tube 3 is used for transmitting cooling liquid, and the flowing cooling liquid enables the body of a wearer to be cooled; the liquid refrigerating device 4 is used for refrigerating liquid and transmitting the cooling liquid obtained by refrigeration to the ultrasonic atomizer 2 and the silicone tube 3.
The utility model discloses an ultrasonic atomizer 2 includes water storage bag 21, sponge stick 22, ultrasonic atomization piece 23, water storage bag 21, sponge stick 22, ultrasonic atomization piece 23 all sets up the collar department at liquid cooling clothes body 1, sponge stick 22 is provided with 3, ultrasonic atomization piece 23 is provided with 3, water storage bag 21's water inlet is connected with liquid refrigerating plant 4, 3 sponge stick's one end links to each other with water storage bag 21, 3 sponge stick's the other end and 3 ultrasonic atomization piece's working face one-to-one meet.
The utility model discloses an ultrasonic atomization piece 23 adopts the pottery ultrasonic atomization piece that has ceramic high frequency resonance function, the pottery ultrasonic atomization piece that has ceramic high frequency resonance function breaks up the liquid hydrone structure and produces the elegant water smoke of nature, do not need the heating or add any chemical reagent, 90% energy has been saved, in atomizing process a large amount of anions of release, with showy smog in the air, produce electrostatic reaction such as dust, make its deposit, can also effectively get rid of formaldehyde simultaneously, carbon monoxide, harmful substance such as bacterium, make the air obtain purifying.
As shown in fig. 5, the liquid refrigerating apparatus 4 of the present invention includes a water cooling head 41, a refrigerating plate 42, a heat dissipation fan 43, a water pump 45, an electric valve 46, and a battery 47;
the battery 47 is electrically connected with the input end of the controller; the refrigerating sheet 42, the cooling fan 43, the water storage tank 44, the water pump 45 and the electric valve 46 are respectively electrically connected with the output end of the controller; the refrigeration sheet 42 is arranged in the water cooling head 41, and the input end of the water cooling head 41 is connected with one end of the silicone tube 3; the output end of the water cooling head 41 is connected with a water storage tank 44, and the water storage tank 44 is connected with a water pump 45; the water pump 45 is connected with the other end of the silicone tube 3; the water pump 45 is electrically connected with the electric valve 46;
the battery 7 is used for supplying power to the controller, and the refrigerating sheet 42 is used for refrigerating liquid in the water cooling head 41 to obtain refrigerating liquid; the cooling fan 43 is used for cooling heat generated by the refrigerating sheet 42, the water pump 45 is used for pumping water in the silicone tube 3 into the water cooling head 41, refrigerating fluid obtained after refrigeration is pumped into the water storage tank 44 through the water pump 45, and the water storage tank 44 is used for storing liquid; the electric valve 46 is used to control the flow rate of the refrigerant fluid out to the ultrasonic atomizer 2.
The utility model discloses a refrigeration piece 42 establishes ties for different semiconductor materials and forms the semiconductor galvanic couple, and the both ends of semiconductor galvanic couple absorb the heat respectively and emit the heat.
As shown in fig. 4, the switch device 5 of the present invention includes a power switch 51, a water-cooling switch 52, and a fog-cooling switch 53, wherein the power switch 51 is connected to the battery 47, and the water-cooling switch 52 is electrically connected to the refrigeration sheet 42 for controlling whether the refrigeration sheet 42 performs refrigeration; the fog cooling switch 53 is connected with the ultrasonic atomizer 2, and the fog cooling switch 53 is used for controlling the start and stop of the electric valve 46.
The utility model discloses a controller adopts 51 singlechips.
The working principle of the utility model is as follows:
the utility model discloses electron device in the embodiment utilizes semiconductor refrigerating plant, when the galvanic couple that the direct current was established ties through two kinds of different semiconductor materials and is formed, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can realize the refrigerated purpose of convection current through liquid.
When the device is used, the power switch 51 is turned on to supply power to the device through the battery, the water cooling switch 52 is turned on, the water cooling head 41 is attached with the refrigerating sheet 42, the refrigerating sheet 42 refrigerates the liquid of the water cooling head 41, the liquid in the refrigeration flows into the water storage tank 44, the water pump 45 extracts the water in the water storage tank 44, the water in the water storage tank 44 enters the silicone tube 3 and then enters the water cooling head 41 through the water circulation of the silicone tube 3, and the refrigerating liquid flows in a circulating manner to achieve the effect of water cooling.
The fog cooling switch 53 is opened, the single chip microcomputer controls the electric valve 46 to be in a normally open state from a normally closed state, the water pump 45 sends water into the water storage bag 21, and the water flow speed in the electric valve 46 is controlled, so that the water consumed by the ultrasonic atomization sheet 23 is approximately equal to the water flowing into the water storage bag 21. 3 sponge sticks in the water storage bag 21 absorb water and convey the water to the working surface of the ultrasonic atomization sheet, the 3 ultrasonic atomization sheets begin to atomize the refrigerated liquid, and the water mist begins to cool the periphery, so that the circulating cooling is realized.
The present invention is not limited to the above-described embodiments, but only to the preferred embodiments of the present invention, and the present invention is not limited thereto, and any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (7)
1. The semiconductor refrigeration atomized liquid cooling suit is characterized by comprising a liquid cooling suit body (1), an ultrasonic atomizer (2), a silicone tube (3), a liquid refrigeration device (4), a switch device (5), an outer box body (6) and a controller;
the ultrasonic atomizer (2) is arranged at the collar of the liquid cooling garment body (1), the ultrasonic atomizer (2) and the liquid refrigerating device (4) are respectively connected with a switch device (5), the liquid refrigerating device (4) is arranged in the outer box body, and the switch device (5) is arranged on the outer surface of the outer box body (6); the silicone tube (3) is arranged inside the liquid cooling suit body (1), and the ultrasonic atomizer (2) is connected with one end of the silicone tube (3); the other end of the silicone tube (3) is connected with the liquid refrigerating device (4); the controller is electrically connected with the liquid refrigerating device (4).
2. The semiconductor refrigeration atomized liquid cooling suit according to claim 1, wherein the ultrasonic atomizer (2) comprises a water storage bag (21), a sponge rod (22) and an ultrasonic atomization sheet (23), the water storage bag (21), the sponge rod (22) and the ultrasonic atomization sheet (23) are all arranged on a collar of the liquid cooling suit body (1), a water inlet of the water storage bag (21) is connected with the liquid refrigeration device (4), one end of the sponge rod (22) is connected with the water storage bag (21), and the other end of the sponge rod (22) is connected with a working surface of the ultrasonic atomization sheet (23).
3. A semiconductor refrigeration atomized liquid cooling suit according to claim 2, wherein the ultrasonic atomization sheet (23) is a ceramic atomization sheet with ceramic high-frequency resonance function.
4. A semiconductor refrigeration atomized liquid cold garment as claimed in claim 1, wherein the liquid refrigeration device (4) comprises a water cooling head (41), a refrigeration sheet (42), a cooling fan (43), a water pump (45), an electric valve (46) and a battery (47);
the battery (47) is electrically connected with the input end of the controller; the refrigerating sheet (42), the cooling fan (43), the water storage tank (44), the water pump (45) and the electric valve (46) are respectively and electrically connected with the output end of the controller; the refrigeration sheet (42) is arranged in the water cooling head (41), and the input end of the water cooling head (41) is connected with one end of the silicone tube (3); the output end of the water cooling head (41) is connected with a water storage tank (44), and the water storage tank (44) is connected with a water pump (45); the water pump (45) is connected with the other end of the silicone tube (3); the water pump (45) is electrically connected with an electric valve (46);
the battery (47) is used for supplying power to the controller, and the refrigerating sheet (42) is used for refrigerating liquid in the water cooling head (41) to obtain refrigerating liquid; the heat dissipation fan (43) is used for dissipating heat generated by the refrigerating sheet (42); the water pump (45) is used for pumping water in the silicone tube (3) into the water cooling head (41), refrigerating fluid obtained after refrigeration is pumped into the water storage tank (44) through the water pump (45), and the water storage tank (44) is used for storing liquid; the electric valve (46) is used for controlling the flow rate of the refrigerant liquid flowing out of the ultrasonic atomizer (2).
5. The semiconductor refrigeration atomized liquid cooling garment as claimed in claim 4, wherein the refrigeration sheet (42) is a semiconductor couple formed by connecting different semiconductor materials in series, and two ends of the semiconductor couple respectively absorb heat and emit heat.
6. A semiconductor refrigeration atomized liquid cold clothing as claimed in claim 1, wherein the switch device (5) comprises a power switch (51), a water cooling switch (52) and a fog cooling switch (53), the power switch (51) is connected with the battery (47), the water cooling switch (52) is connected with the water cooling head (41), and the fog cooling switch (53) is connected with the ultrasonic atomizer (2).
7. The semiconductor refrigeration atomized liquid cooling suit of claim 1, wherein the controller adopts a 51-chip microcomputer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922400012.4U CN211794410U (en) | 2019-12-27 | 2019-12-27 | Semiconductor refrigeration atomized liquid cooling suit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922400012.4U CN211794410U (en) | 2019-12-27 | 2019-12-27 | Semiconductor refrigeration atomized liquid cooling suit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211794410U true CN211794410U (en) | 2020-10-30 |
Family
ID=73037318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922400012.4U Expired - Fee Related CN211794410U (en) | 2019-12-27 | 2019-12-27 | Semiconductor refrigeration atomized liquid cooling suit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211794410U (en) |
-
2019
- 2019-12-27 CN CN201922400012.4U patent/CN211794410U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 |
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| CF01 | Termination of patent right due to non-payment of annual fee |