CN211792695U - Electromagnetic shielding film, circuit board and electronic equipment - Google Patents
Electromagnetic shielding film, circuit board and electronic equipment Download PDFInfo
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- CN211792695U CN211792695U CN201922351975.XU CN201922351975U CN211792695U CN 211792695 U CN211792695 U CN 211792695U CN 201922351975 U CN201922351975 U CN 201922351975U CN 211792695 U CN211792695 U CN 211792695U
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Abstract
The utility model discloses an electromagnetic shielding film, a circuit board and electronic equipment, wherein the electromagnetic shielding film comprises a film layer and a shielding layer; the adhesive film layer is formed on one side of the shielding layer; the shielding layer is used for shielding electromagnetic waves; the adhesive film layer is used for being bonded with a circuit board to be shielded; the shielding layer is provided with a through hole penetrating through the shielding layer. Through set up the through-hole on the shielding layer, increased the pliability of shielding layer, avoided electromagnetic shielding film and the circuit board pressfitting of treating the shielding or in follow-up use, the condition that fracture, fracture appear in the shielding layer, improved the shielding effect of electromagnetic shielding film.
Description
Technical Field
The utility model relates to an electromagnetic shield technical field especially relates to an electromagnetic shielding membrane, circuit board and electronic equipment.
Background
With the integration of the functions of communication equipment such as mobile phones, the internal components thereof are rapidly high-frequency and high-speed. For example: besides the original audio transmission function, the camera function has become a necessary function, and WLAN (Wireless Local area network), GPS (Global Positioning System) and internet function have become popular, and the integration of the sensing component in the future makes the trend of rapid high-frequency and high-speed of the component inevitable. Problems of electromagnetic interference inside and outside the device, signal attenuation during transmission, insertion loss, and jitter caused by high-frequency and high-speed driving are becoming serious.
In the prior art, a circuit board is usually covered with an electromagnetic shielding film to shield external electromagnetic interference, and the electromagnetic shielding film is bonded with the circuit board in a pressing manner. During the pressing or using process, the electromagnetic shielding film is often broken or disconnected due to insufficient flexibility of the electromagnetic shielding film, which affects the shielding effect of the electromagnetic shielding film.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an electromagnetic shielding film, circuit board and electronic equipment can avoid electromagnetic shielding film and treat in shielded circuit board pressfitting or follow-up use, and fracture, the ruptured condition appear in the shielding layer, have improved electromagnetic shielding film's shielding effect.
In a first aspect, an embodiment of the present invention provides an electromagnetic shielding film, including: a shielding layer and an adhesive film layer;
the adhesive film layer is formed on one side of the shielding layer;
the shielding layer is used for shielding electromagnetic waves;
the shielding layer is provided with a through hole penetrating through the shielding layer, and the residual rate of the shielding layer after the through hole is formed is 15-98%.
Optionally, the thickness of the shielding layer ranges from 0.05 μm to 8 μm.
Optionally, the thickness of the shielding layer ranges from 0.1 μm to 4 μm.
Optionally, the residual rate of the shielding layer is 30% to 95%.
Optionally, the residual rate of the shielding layer is 40% to 90%.
Optionally, the residual rate of the shielding layer is 50% to 80%.
Optionally, the residual rate of the shielding layer is 60%.
Optionally, the electromagnetic shielding film further includes an insulating protection layer formed on one side of the shielding layer far from the adhesive film layer.
Optionally, the adhesive film layer is a conductive adhesive.
Optionally, a plurality of conductive protrusions are arranged on the surface of the shielding layer close to the adhesive film layer.
Optionally, the material of the shielding layer includes any one or a combination of more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold.
In a second aspect, an embodiment of the present invention provides a circuit board, including: a circuit board main body and an electromagnetic shielding film;
the circuit board main body comprises a substrate, a circuit layer formed on the substrate and an insulating covering layer covering the circuit layer, wherein the circuit layer comprises a grounding circuit;
the insulating covering layer is provided with a connecting hole;
the electromagnetic shielding film comprises a shielding layer and a film adhesive layer;
the adhesive film layer is formed on one side of the shielding layer;
the shielding layer is provided with a through hole penetrating through the shielding layer, and the residual rate of the shielding layer after the through hole is formed is 15-98%;
the insulating covering layer is bonded with the adhesive film layer, and the adhesive film layer penetrates through the connecting hole to be in contact with the grounding circuit;
the surface of the shielding layer close to the adhesive film layer is provided with a plurality of conductive bulges, and the shielding layer punctures the adhesive film layer through the conductive bulges and is electrically connected with the grounding circuit; or
Conductive particles are arranged inside the adhesive film layer, and the shielding layer is electrically connected with the grounding circuit through the conductive particles.
In a third aspect, an embodiment of the present invention provides an electronic device, including a circuit board as provided in the second aspect of the present invention.
The embodiment of the utility model provides an electromagnetic shielding film, including shielding layer and rete, the rete is formed in one side of shielding layer, and the shielding layer is used for shielding the electromagnetic wave, and the rete is used for bonding with the circuit board of treating the shielding, sets up the through-hole that runs through the shielding layer on the shielding layer. Through having seted up the through-hole on the shielding layer, increased the pliability of shielding layer, avoided electromagnetic shielding film and treat shielded circuit board pressfitting or follow-up use in-process, the condition that fracture, fracture appear in the shielding layer, improved electromagnetic shielding film's shielding effect.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a schematic structural diagram of an electromagnetic shielding film according to an embodiment of the present invention;
FIG. 2 is a top view of the shield layer of FIG. 1;
fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another electromagnetic shielding film according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another circuit board according to an embodiment of the present invention.
Reference numerals:
100. an electromagnetic shielding film; 110. a shielding layer; 120. a glue film layer; 130. an insulating protective layer; 111. a through hole; 112. a raised structure; 113. a conductive bump; 200. a circuit board main body; 210. a substrate; 221. a signal line; 222. a ground line; 230. an insulating cover layer; 231. and connecting the holes.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
The embodiment of the utility model provides an electromagnetic shielding film, figure 1 is the utility model provides a structural schematic of electromagnetic shielding film, as shown in figure 1, this electromagnetic shielding film 100 includes shielding layer 110 and glue film layer 120, and glue film layer 120 forms one side at shielding layer 110.
The shielding layer 110 is used to shield external incident electromagnetic waves and prevent the external electromagnetic waves from interfering with electrical signals transmitted on the circuit board.
The adhesive film layer 120 is used for bonding with a circuit board to be shielded.
Fig. 2 is a top view of the shielding layer in fig. 1, and as shown in fig. 2, at least two through holes 111 penetrating through the shielding layer 110 are formed on the shielding layer 110, and the through holes 111 can be uniformly distributed on the shielding layer 110. After the through hole 111 is formed, the residual rate of the shielding layer 110 is 15% -98%. The residual ratio is the mass ratio of the remaining part to the original shielding layer 110 after the through hole 111 is formed on the shielding layer 110. Through set up through-hole 111 on shielding layer 110 to the residual rate of control shielding layer 110 guarantees that shielding layer 110 improves shielding layer 110's pliability under the prerequisite that satisfies the shielding requirement, avoids shielding layer 110 and the pressfitting of the circuit board of treating the shielding or the problem that the shielding performance of electromagnetic shielding film descends that the condition such as fracture appears in the follow-up use in-process.
Illustratively, the shielding layer 110 may be a metal foil. The shielding of the electromagnetic wave by the shielding layer 110 is mainly based on the reflection of the electromagnetic wave and the absorption of the electromagnetic wave. Specifically, when an electromagnetic wave reaches the surface of the shielding layer 110, due to the impedance discontinuity on the surface of the shielding layer 110, an incident wave is reflected, and a portion of the reflected electromagnetic wave is shielded. The energy that enters the shielding layer 110 without being reflected off the surface is attenuated, i.e. so-called absorbed, by the metal during the forward propagation within the shielding layer 110. When the remaining energy that has not been attenuated within shield 110 reaches another surface of shield 110, it encounters another interface with a discontinuity in impedance, which is reflected again and returns back into shield 110. Such reflection may occur multiple times on both surfaces of the shielding layer 110.
The embodiment of the utility model provides an electromagnetic shielding film, including rete and shielding layer, the rete forms in one side of shielding layer, and the shielding layer is used for shielding the electromagnetic wave, and the rete is used for bonding with the circuit board of treating the shielding, sets up the through-hole that runs through the shielding layer on the shielding layer. Through set up the through-hole on the shielding layer, increased the pliability of shielding layer, avoided electromagnetic shielding film and the circuit board pressfitting of treating the shielding or in follow-up use, the condition that fracture, fracture appear in the shielding layer, improved the shielding effect of electromagnetic shielding film.
It should be noted that, in the embodiment of the present invention, the cross-sectional shape of the through hole 111 is not limited, and may be a regular shape such as a circle, a square, or an irregular polygon; be on a parallel with electromagnetic shielding film's arbitrary cross-section, the area of the cross section of cutting same through-hole 111 can be the same, also can be inequality, perpendicular to electromagnetic shielding film's direction promptly, and same through-hole 111's aperture can be unchangeable, also can change, the embodiment of the utility model provides a do not limit here. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole may be a regular shape such as a circle, a square, etc., and the aperture of the same through hole 111 is unchanged in a direction perpendicular to the electromagnetic shielding film. Furthermore, in the embodiment of the utility model provides an in, the aperture size of each through-hole 111 is not done the injecing, and simultaneously, the aperture of each through-hole 111 can be the same, also can be inequality, the embodiment of the utility model provides a do not do the injecing here.
Illustratively, the thickness of the shielding layer 110 is 0.05um-8um, and further, the shielding layer 110 can be thinner and more flexible. In a specific embodiment, the shielding layer 110 is 0.1um to 4 um.
Furthermore, the residual rate of the shielding layer is 30-95%.
Furthermore, the residual rate of the shielding layer is 40-90%.
Furthermore, the residual rate of the shielding layer is 50-80%.
Further, the residual rate of the shielding layer was 60%.
It should be noted that the residual rate of the shielding layer 110 is in inverse proportion to the flexibility of the shielding layer 110, that is, the smaller the residual rate of the shielding layer 110 is, the greater the flexibility of the shielding layer 110 is, and the smaller the probability of the shielding layer 110 breaking or cracking during the process of laminating the electromagnetic shielding film 100 and the circuit board to be shielded. However, the residual rate of the shielding layer 110 is in direct proportion to the electromagnetic shielding effect of the shielding layer 110, i.e. the larger the residual rate of the shielding layer 110 is, the better the electromagnetic shielding effect is. Therefore, in order to achieve both flexibility and electromagnetic shielding performance of the shielding layer 110, the residual ratio of the shielding layer is required to be 50% to 80%. In one embodiment, the residual rate of the shielding layer is 60%, and the electromagnetic shielding effect is optimized on the premise of satisfying the flexibility.
On the basis of the above embodiment, as shown in fig. 1, the electromagnetic shielding film of this embodiment further includes an insulating protection layer 130, and the insulating protection layer 130 is formed on the shielding layer 110 on the side away from the adhesive film layer 120. The insulating protection layer 130 has insulating and protecting functions, so as to prevent the shielding layer 110 of the electromagnetic shielding film 100 from contacting with other external electronic components and causing short circuit, and also protect the shielding layer 110 from being damaged during use.
For example, the insulating protection layer 130 may be any one of a PPS (Polyphenylene sulfide) film layer, a PEN (Polyethylene naphthalate) film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing epoxy resin ink, a film layer formed after curing polyurethane ink, a film layer formed after curing modified acrylic resin, or a film layer formed after curing polyimide resin.
Exemplarily, as shown in fig. 1, a plurality of protruding structures 112 are further formed on one side of the shielding layer 110 away from the adhesive film layer 120, and the shielding layer 110 and the protruding structures 112 are integrally made of the same material, so that the bonding force between the two is improved, the protruding structures 112 are not easy to fall off, and the service life and the stability of the electromagnetic shielding film are ensured.
In the embodiment of the present invention, the shape of the protruding structure 112 may have diversity according to actual needs, and may be a regular or irregular solid geometry, and the embodiment of the present invention is not limited herein. In some examples, the shape of the raised structures 112 is one or more of pointed, inverted conical, granular, dendritic, columnar, and massive. For example, in the example of fig. 1, the raised structures 112 are irregularly curved in shape.
The protrusion structure 112 extends into the insulating protection layer 130, so that the connection reliability between the shielding layer 110 and the insulating protection layer 130 is improved, and the situation that the insulating protection layer 130 and the shielding layer 110 are peeled off and fall off is prevented. The height of the protruding structure 112 is smaller than the thickness of the insulating protection layer 130, and the protruding structure 112 is ensured to extend into the insulating protection layer 130 but not extend out of the insulating protection layer 130 by the design, so as to prevent the insulating protection layer 130 from failing. It should be noted that the heights of the plurality of protruding structures 112 may be different, and in this case, the height of the protruding structure 112 refers to the highest height of all the protruding structures 112.
Fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present invention, as shown in fig. 3, the circuit board includes the electromagnetic shielding film 100 shown in fig. 1 and a circuit board to be shielded (i.e., a circuit board main body 200). The circuit board body 200 includes a substrate 210, a wiring layer, and an insulating cover layer 230. Wherein a wiring layer is formed on one side of the substrate 210, and the wiring layer includes a signal wiring 221 and a ground wiring 222. An insulating capping layer 230 is formed on the substrate 210 and covers the wiring layer. The insulating cover 230 has a connection hole 231, and the connection hole 231 may be formed at a position corresponding to the ground line 222 on the insulating cover 230.
The electromagnetic shielding film 100 and the circuit board main body 200 are pressed together by thermal pressing, so that the adhesive film layer 120 is attached to the insulating cover layer 230, and the adhesive film layer 120 passes through the connection hole 231 and contacts the ground line 222 under the action of pressure.
In the working process of the electromagnetic shielding film, when the electromagnetic wave is reflected or absorbed by the shielding layer 110, induced charges are generated inside the shielding layer 110, and a magnetic field is generated by the induced charges correspondingly, so that an interference effect is generated on an electrical signal transmitted on the signal line 221. If the induced charges are not discharged in time, the interference with the electrical signal transmitted on the signal line 221 is greater as the induced charges are accumulated. Therefore, a conductive medium is usually disposed in the adhesive film layer in the connection hole 231, so that the shielding layer 110 and the ground line 222 are electrically connected, and in particular, the manner in which the shielding layer 110 and the ground line 222 are electrically connected will be described in detail later. By electrically connecting the shielding layer 110 and the ground line 222, the induced charges generated inside the shielding layer 110 are timely introduced into the ground line 222, so that the interference of the accumulation of the induced charges inside the shielding layer 110 on the electrical signal transmitted on the signal line 221 is avoided.
The insulating cover layer 230 is thicker than the shielding layer 110, and due to the existence of the connection hole 231 on the insulating cover layer 230, a structure similar to a step exists at the connection hole 231, and in the process of pressing the electromagnetic shielding film 100 and the circuit board main body 200, the region of the electromagnetic shielding film 100 corresponding to the connection hole 231 is recessed into the connection hole 231, if the flexibility of the shielding layer 110 is insufficient, the shielding layer 110 is easily broken and cracked at the step, which is particularly obvious at the corner of the step, and further affects the shielding effect of the electromagnetic shielding film 100. The embodiment of the utility model provides an electromagnetic shielding film 100 through seted up through-hole 111 on shielding layer 110, has increased shielding layer 110's pliability, avoids the in-process of electromagnetic shielding film 100 and circuit board main part 200 pressfitting, and fracture, the cracked condition appears in shielding layer 110, has improved electromagnetic shielding film 100's shielding effect.
Illustratively, as shown in fig. 1 and 3, the adhesive layer 120 may be a conductive adhesive. The conductive adhesive is an adhesive with certain conductivity after being cured or dried, and conductive particles are coated inside the conductive adhesive. The conductive paste may adhere the electro-magnetic shielding film 100 to the circuit board main body 200. When the electromagnetic shielding film 100 is pressed against the circuit board main body 200, the conductive paste is passed through the connection hole 231 by pressing, and the shielding layer 110 and the ground line are electrically connected by the conductive particles inside the conductive paste to conduct out the interference charges accumulated in the shielding layer 110.
Fig. 4 is a schematic structural diagram of another electromagnetic shielding film according to an embodiment of the present invention, which provides another connection form between the shielding layer and the ground line. Fig. 5 is a schematic structural diagram of another circuit board according to an embodiment of the present invention, which includes the electromagnetic shielding film shown in fig. 4.
As shown in fig. 4 and 5, the shielding layer 110 has a plurality of conductive bumps 113 on a surface thereof close to the adhesive film layer 120, and the conductive bumps 113 extend into the adhesive film layer 120.
Specifically, the adhesive layer 120 is an insulating adhesive layer covering the shielding layer 110, and can adhere the electromagnetic shielding film 100 to the circuit board (circuit board main body 200) to be shielded.
The conductive bump 113 may be a bump structure formed on the shielding layer 110 and extends into the adhesive film layer 120. The protruding structure can be integrally formed with the shielding layer 110, so that the bonding force between the protruding structure and the shielding layer can be improved, the conductive protrusion 113 is not easy to fall off, and the service life and the stability of the electromagnetic shielding film are ensured.
The height of the conductive bump 113 is less than or equal to the thickness of the adhesive film layer 120. Through the design, it is ensured that the conductive protrusions 113 extend into the interior of the adhesive film layer 120, but do not extend out of the adhesive film layer 120.
When the electromagnetic shielding film 100 is pressed against the circuit board main body 200, the plurality of conductive bumps 113 are pressed to pierce the adhesive film layer 120 and electrically connect with the ground line 222, so as to conduct out the interference charges accumulated in the shielding layer 110.
It should be noted that the shapes of the conductive bumps 113 in fig. 4 and 5 are merely exemplary, and due to differences in process means and parameters, the shapes of the conductive bumps 113 are regular or irregular solid geometries, for example, the shapes of the conductive bumps 113 may be one or more of sharp corners, inverted cones, particles, dendrites, columns, and blocks. The shapes of the conductive protrusions 113 may be the same or different, and the sizes of the conductive protrusions 113 may also be the same or different, that is, the shapes of the conductive protrusions 113 may be one or more of a sharp corner, an inverted cone, a particle, a dendrite, a column, and a block, and the sizes of the conductive protrusions 113 of the same shape may not be completely the same. In addition, the plurality of conductive protrusions 113 may be continuously or discontinuously distributed on the shielding layer 110, for example, when the plurality of conductive protrusions 113 are in the shape of a sharp corner and are continuously distributed, a regular and periodic three-dimensional insection pattern or an irregular and disordered three-dimensional insection pattern may be formed. It should be noted that the heights of the conductive bumps 113 may be different, and in this case, the height of the conductive bump 113 refers to the highest height of all the conductive bumps 113.
Based on the above embodiment, the material of the shielding layer 110 may be any one or a combination of more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. In one embodiment, shield layer 110 is a copper foil.
The embodiment of the present invention also provides a circuit board, referring to fig. 3 and 5, the circuit board includes a circuit board main body 200 and an electromagnetic shielding film 100.
The circuit board body 200 includes a substrate 210, a wiring layer, and an insulating cover layer 230. Wherein a wiring layer is formed on one side of the substrate 210, and the wiring layer includes a signal wiring 221 and a ground wiring 222. An insulating capping layer 230 is formed on the substrate 210 and covers the wiring layer.
The insulating cover 230 has a connection hole 231, and the connection hole 231 may be formed at a position corresponding to the ground line 222 on the insulating cover 230. Illustratively, the thickness of the insulating cap layer 230 is 30 μm to 80 μm, and in a specific embodiment, the thickness of the insulating cap layer 230 is 50 μm.
The electro-magnetic shielding film 100 includes a shielding layer 110 and an adhesive film layer 120, and the adhesive film layer 120 is formed on one side of the shielding layer 110.
The shielding layer 110 is used to shield external incident electromagnetic waves and prevent the external electromagnetic waves from interfering with electrical signals transmitted on the circuit board.
The adhesive film layer 120 is used for connecting with the circuit board main body 200.
At least two through holes 111 penetrating through the shielding layer 110 are formed in the shielding layer 110, and the through holes 111 can be uniformly distributed on the shielding layer. After the through hole 111 is formed, the residual rate of the shielding layer 110 is 15% -98%. Through set up through-hole 111 on shielding layer 110, increased shielding layer 110's pliability, avoided electromagnetic shielding film 100 and circuit board main part 200 pressfitting in-process, the condition that shielding layer 110 appears splitting, fracture has improved electromagnetic shielding film 100's shielding effect.
The electromagnetic shielding film 100 and the circuit board main body 200 are pressed together by thermal pressing, so that the adhesive film layer 120 is attached to the insulating cover layer 230, and the adhesive film layer 120 passes through the connection hole 231 and contacts the ground line 222 under the action of pressure.
As shown in fig. 3, the adhesive layer 120 may be a conductive adhesive, and conductive particles are coated inside the conductive adhesive. The conductive paste may adhere the electro-magnetic shielding film 100 to the circuit board main body 200. When the electromagnetic shielding film 100 is pressed against the circuit board main body 200, the conductive paste is passed through the connection hole 231 by pressing, and the shielding layer 110 and the ground line are electrically connected by the conductive particles inside the conductive paste to conduct out the interference charges accumulated in the shielding layer 110.
As shown in fig. 5, the adhesive film layer 121 is an insulating adhesive layer covering the shielding layer 110, and it can adhere the electromagnetic shielding film 100 to the circuit board (circuit board main body 200) to be shielded. The surface of the shielding layer 110 close to the adhesive film layer 120 is provided with a plurality of conductive protrusions 113, and the conductive protrusions 113 extend into the adhesive film layer 120. When the electromagnetic shielding film 100 is pressed against the circuit board main body 200, the plurality of conductive bumps 113 are pressed to pierce the adhesive film layer 120 and electrically connect with the ground line 222, so as to conduct out the interference charges accumulated in the shielding layer 110.
The embodiment of the utility model provides a circuit board, including electromagnetic shielding membrane and circuit board main part, electromagnetic shielding membrane includes rete and shielding layer, and the rete forms in one side of shielding layer, and the shielding layer is used for shielding the electromagnetic wave, and the rete is used for bonding with the circuit board of treating the shielding, sets up the through-hole that runs through the shielding layer on the shielding layer. The shielding layer and the grounding circuit of the circuit board to be shielded are electrically connected through the conductive particles or the conductive bumps on the shielding layer, and the induction charges accumulated in the shielding layer are led into the grounding circuit, so that the interference of the accumulation of the induction charges in the shielding layer on the electric signals transmitted on the signal circuit is avoided. Through having seted up the through-hole on the shielding layer, increased the pliability of shielding layer, avoided electromagnetic shielding film and treat shielded circuit board pressfitting or subsequent use in-process, the condition that fracture, fracture appear in the shielding layer, improved electromagnetic shielding film's shielding effect.
Illustratively, the thickness of the shielding layer 110 is 0.05-8um, and further, the shielding layer 110 can be thinner and more flexible. In a specific embodiment, the shielding layer 110 is 0.1-4 um.
Furthermore, the residual rate of the shielding layer is 30-95%.
Furthermore, the residual rate of the shielding layer is 40-90%.
Furthermore, the residual rate of the shielding layer is 50-80%.
Further, the residual rate of the shielding layer was 60%.
In order to achieve both flexibility and electromagnetic shielding performance of the shielding layer 110, the residual rate of the shielding layer is required to be 50% to 80%. In one embodiment, the residual rate of the shielding layer is 60%, and the electromagnetic shielding effect is optimized on the premise of satisfying the flexibility.
Illustratively, as shown in fig. 3 and 5, the electromagnetic shielding film further includes an insulating protection layer 130, and the insulating protection layer 130 is formed on the shielding layer 110 on a side away from the adhesive film layer 120. The insulating protection layer 130 has insulating and protecting functions, so as to prevent the shielding layer 110 of the electromagnetic shielding film 100 from contacting with other external electronic components and causing short circuit, and also protect the shielding layer 110 from being damaged during use.
One side of keeping away from glue film layer 120 on shielding layer 110 still is formed with a plurality of protruding structures 112, and shielding layer 110 and protruding structure 112 adopt the same material an organic whole to make, can improve cohesion between them for protruding structure 112 is difficult for droing, guarantees this electromagnetic shielding film's life and stability.
In order to verify the effect of the embodiment of the present invention, the resistance of the shielding layer 110 is detected under the setting condition, and under the setting condition, when the resistance of the detected shielding layer 110 is smaller than the preset value, it is described that the electromagnetic shielding film 100 and the circuit board main body 200 are pressed together, and the shielding layer 110 is not broken or cracked.
Specifically, the shielding layer 110 is a copper foil, the residual ratio of the shielding layer 110 is 60%, the thickness of the shielding layer 110 is 2 μm, and the thickness of the insulating cover layer 230 is 50 μm. The resistance of the shield layer 110 was measured under the following set conditions: the laminating temperature of the electro-magnetic shielding film 100 and the circuit board main body 200 is 180 ℃, the laminating time is 300 seconds, the pressure is 100kg/cm2, the curing temperature of the adhesive film layer 120 is 160 ℃, and the curing application time is 1.5 hours. The detection result shows that the resistance of the shielding layer 110 is smaller than the preset resistance value (1 Ω), that is, the shielding layer 110 is not broken or cracked when the electromagnetic shielding film 100 and the circuit board main body 200 are pressed together.
The embodiment of the utility model provides an electromagnetic shielding film uses on the circuit board, through the pliability that increases the shielding layer and solved the department of windowing on the circuit board and appear breaking easily, explode the board scheduling problem, uses simultaneously when the board is combined to the rigid-flex, because the increase of shielding layer pliability, also can solve the junction of rigid-flex and appear breaking easily, explode the problem of board.
The embodiment of the utility model provides an electronic equipment is still provided, and this electronic equipment includes the utility model discloses the circuit board that above-mentioned embodiment provided, it is specific, the structure of circuit board has had detailed record in the preceding embodiment, the utility model discloses no longer describe herein.
In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used in a descriptive sense and with reference to the illustrated orientation or positional relationship for purposes of descriptive convenience and simplicity of operation, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (13)
1. An electromagnetic shielding film, comprising: a shielding layer and an adhesive film layer;
the adhesive film layer is formed on one side of the shielding layer;
the shielding layer is used for shielding electromagnetic waves;
the shielding layer is provided with a through hole penetrating through the shielding layer, and the residual rate of the shielding layer after the through hole is formed is 15-98%.
2. The electro-magnetic shielding film of claim 1, wherein the shielding layer has a thickness in the range of 0.05 μ ι η to 8 μ ι η.
3. The electro-magnetic shielding film of claim 1, wherein the shielding layer has a thickness in the range of 0.1 μ ι η to 4 μ ι η.
4. The electro-magnetic shielding film of claim 1, wherein the shielding layer has a residual ratio of 30% to 95%.
5. The electro-magnetic shielding film of claim 4, wherein the shielding layer has a residual ratio of 40% to 90%.
6. The electro-magnetic shielding film of claim 5, wherein the shielding layer has a residual ratio of 50% to 80%.
7. The electro-magnetic shielding film of claim 6, wherein the shielding layer has a residual ratio of 60%.
8. The electromagnetic shielding film according to claim 1, further comprising an insulating protective layer formed on a side of the shielding layer away from the adhesive film layer.
9. The electromagnetic shielding film of claim 1, wherein the adhesive film layer is a conductive adhesive.
10. The electromagnetic shielding film of claim 1, wherein the surface of the shielding layer adjacent to the adhesive film layer is provided with a plurality of conductive protrusions.
11. The EMI shielding film of claim 1, wherein said shielding layer is made of Al, Ti, Zn, Fe, Ni, Cr, Co, Cu, Ag or Au.
12. A circuit board, comprising: a circuit board main body and an electromagnetic shielding film;
the circuit board main body comprises a substrate, a circuit layer formed on the substrate and an insulating covering layer covering the circuit layer, wherein the circuit layer comprises a grounding circuit;
the insulating covering layer is provided with a connecting hole;
the electromagnetic shielding film comprises a shielding layer and a film adhesive layer;
the adhesive film layer is formed on one side of the shielding layer;
the shielding layer is provided with a through hole penetrating through the shielding layer, and the residual rate of the shielding layer after the through hole is formed is 15-98%;
the insulating covering layer is bonded with the adhesive film layer, and the adhesive film layer extends into the connecting hole to be contacted with the grounding circuit;
the surface of the shielding layer close to the adhesive film layer is provided with a plurality of conductive bulges, and the shielding layer punctures the adhesive film layer through the conductive bulges and is electrically connected with the grounding circuit; or
Conductive particles are arranged inside the adhesive film layer, and the shielding layer is electrically connected with the grounding circuit through the conductive particles.
13. An electronic device comprising the circuit board of claim 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922351975.XU CN211792695U (en) | 2019-12-24 | 2019-12-24 | Electromagnetic shielding film, circuit board and electronic equipment |
Applications Claiming Priority (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438455A (en) * | 2021-12-23 | 2022-05-06 | 信维通信（江苏）有限公司 | Shielding film for wireless charging and preparation method and manufacturing equipment thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438455A (en) * | 2021-12-23 | 2022-05-06 | 信维通信（江苏）有限公司 | Shielding film for wireless charging and preparation method and manufacturing equipment thereof |
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