CN211791055U

CN211791055U - Motor cooling structure

Info

Publication number: CN211791055U
Application number: CN201921348681.5U
Authority: CN
Inventors: 韦雅曼
Original assignee: Nanning College for Vocational Technology
Current assignee: Nanning College for Vocational Technology
Priority date: 2019-08-19
Filing date: 2019-08-19
Publication date: 2020-10-27
Anticipated expiration: 2029-08-19

Abstract

The utility model discloses a motor cooling structure, which comprises a shell and a heat absorption pipe arranged at the inner side of the shell, wherein a heat dissipation cavity is arranged at the middle position of the top of the shell; a water tank is arranged in the middle of the inside of the heat dissipation cavity, semiconductor refrigerators are arranged on two sides of the inside of the heat dissipation cavity, and a heat dissipation fan is arranged at the top of each semiconductor refrigerator; one side at casing top is equipped with first water pump, and the opposite side at casing top is equipped with the second water pump, first water pump and second water pump all through the pipeline with the water tank intercommunication. The utility model discloses can be convenient for install and dismantle and make it cool down large-scale motor on current motor, reduce motor element's damage.

Description

Motor cooling structure

Technical Field

The embodiment of the utility model relates to a motor element particularly, relates to a motor cooling structure.

Background

The motor is commonly called as a motor and refers to an electromagnetic device for realizing electric energy conversion or transmission according to the law of electromagnetic induction. Its main function is to generate driving torque as power source of electric appliance or various machines.

The medium-large motor can produce more heat in work, high temperature can produce the damage in different degrees to structures such as its inside brush, and its maintenance is more time-consuming and laboursome with the change, and it is higher to change motor cost. In the prior art, the cooling mode of the medium-large motor is mainly air cooling, including fan blowing and air conditioning blowing, which is low in cost, but low in cooling amplitude and low in speed, and once the motor is overheated and burned out, the motor may generate high maintenance cost. Therefore, it is necessary to provide a cooling structure for a motor with a significant effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to the above-mentioned defect among the prior art, provide a motor cooling structure that cooling effect is obvious.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme: a motor cooling structure comprises a shell and a heat absorption pipe arranged on the inner side of the shell, wherein a heat dissipation cavity is arranged in the middle of the top of the shell; a water tank is arranged in the middle of the inside of the heat dissipation cavity, semiconductor refrigerators are arranged on two sides of the inside of the heat dissipation cavity, and a heat dissipation fan is arranged at the top of each semiconductor refrigerator; one side at casing top is equipped with first water pump, the opposite side at casing top is equipped with the second water pump, first water pump with the second water pump all through the pipeline with the water tank intercommunication.

Furthermore, the utility model discloses still provide following subsidiary technical scheme:

preferably, the other end of the first water pump is provided with a first pipeline which is communicated with one end of the heat absorption pipe, the other end of the second water pump is provided with a second pipeline which is communicated with one end of the heat absorption pipe, the heat absorption pipe is of an arch-shaped structure, and the heat absorption pipe is attached to the inner side of the shell.

Preferably, the heat absorption end of the semiconductor refrigerator is positioned on the inner side of the heat dissipation cavity, the heat dissipation end of the semiconductor refrigerator is positioned outside the heat dissipation cavity, the top of the heat dissipation fan is provided with a protective cover, and the outer side of the water tank is provided with a heat conduction layer.

Preferably, the shell is of a U-shaped structure, a fixing plate is welded at the bottom of the inner side of the shell, and buffer springs are arranged on the fixing plate at equal intervals.

Preferably, one end of the buffer spring, which is far away from the fixed plate, is provided with a clamping plate and a side hinged plate, and the outer side of the clamping plate is hinged with one side of the side hinged plate, which is close to the clamping plate.

Preferably, a motor is arranged between the clamping plates, and the top of the inner side of the shell is in contact with the top of the motor.

Preferably, the bottom of the motor is provided with a supporting seat, and the shell is an aluminum alloy shell.

Compared with the prior art, the utility model has the advantages that: through the outside with the grip block centre gripping at the motor, the grip block is attached in the outside of motor with the articulated slab, make its firm centre gripping in the outside of motor under buffer spring's reaction force, thereby dispel the heat to heat dissipation intracavity portion through starting cooling blower and semiconductor cooler, thereby realize the refrigeration to the water tank, make it and first water pump, the second water pump, water tank and heat absorption pipe constitute the hydrologic cycle and realize the circulation refrigeration, thereby can convenient to detach and install and make it cool down large-scale motor on current motor, the damage of motor element has been reduced, the service life of motor is prolonged, thereby reduce the use cost of motor.

Drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the drawings that are needed in the description of the embodiments or related technologies will be briefly introduced below, and it is obvious that the drawings in the following description only relate to some embodiments of the present invention and are not limiting to the present invention.

Fig. 1 is a schematic structural diagram of a motor cooling structure.

Fig. 2 is an enlarged schematic view of a circle a in fig. 1.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the following detailed description of the present invention, taken in conjunction with the accompanying drawings and the detailed description, is given in a non-limiting manner.

As shown in fig. 1-2, the motor cooling structure of this embodiment, including casing 6 and install at the inboard heat absorption pipe 5 of casing 6, heat dissipation chamber 2 is installed to the intermediate position department at casing 6 top, water tank 9 is installed to the intermediate position department of heat dissipation chamber 2 inside, semiconductor cooler 8 is all installed to the inside both sides in heat dissipation chamber 2, radiator fan 1 is installed at semiconductor cooler 8's top, one side at casing 6 top is equipped with first water pump 3, the opposite side at casing 6 top is equipped with second water pump 10, first water pump 3 and second water pump 10 all communicate with water tank 9 through the pipeline.

In this embodiment, as shown in fig. 1, the other end of the first water pump 3 is provided with a first pipeline 4, the first pipeline 4 is communicated with one end of the heat absorbing pipe 5, the other end of the second water pump 10 is provided with a second pipeline 11, the second pipeline 11 is communicated with one end of the heat absorbing pipe 5, the heat absorbing pipe 5 is of an arch-shaped structure, and the heat absorbing pipe 5 is attached to the inner side of the housing 6.

In this embodiment, the first water pump 3 and the second water pump 10 are started to drive the water in the water tank 9 to move to the inside of the heat absorption pipe 5, and water circulation is formed with the first water pump 3, the second water pump 10, the water tank 9 and the heat absorption pipe 5.

In the embodiment, as shown in fig. 1, the heat absorption end of the semiconductor refrigerator 8 is located inside the heat dissipation chamber 2, the heat dissipation end of the semiconductor refrigerator 8 is located outside the heat dissipation chamber 2, the top of the heat dissipation fan 1 is provided with a protective cover, and the outside of the water tank 9 is provided with the heat conduction layer 7.

In this embodiment, the inside of the heat dissipation cavity 2 is dissipated by starting the heat dissipation fan 1 and the semiconductor refrigerator 8, so that the water tank 9 is cooled, and the water tank 9, the first water pump 3, the second water pump 10, the water tank 9 and the heat absorption pipe 5 form a water circulation to realize circulation cooling.

In the embodiment, as shown in fig. 1, the housing 6 is of a U-shaped structure, a fixing plate 15 is welded at the bottom of the inner side of the housing 6, buffer springs 16 are arranged at equal intervals on the fixing plate 15, a clamping plate 14 and a side hinge plate 13 are mounted at one end of the buffer springs 16 far away from the fixing plate 15, and the outer side of the clamping plate 14 is hinged with one side of the side hinge plate 13 close to the clamping plate 14.

In the present embodiment, by clamping the clamping plate 14 outside the motor 12, the clamping plate 14 and the hinge plate 13 are attached to the outside of the motor 12, and are clamped firmly outside the motor 12 by the reaction force of the buffer spring 16.

In this embodiment, as shown in fig. 1, a motor 12 is disposed between the clamping plates 14, the top of the inner side of the housing 6 contacts with the top of the motor 12, a support seat is disposed at the bottom of the motor 12, and the housing 6 is an aluminum alloy housing.

In this embodiment, the case 6 is an aluminum alloy case, thereby achieving a better heat conduction effect.

The utility model discloses an operating procedure does:

s1, clamping the clamping plate 14 on the outer side of the motor 12, wherein the clamping plate 14 and the hinge plate 13 are attached to the outer side of the motor 12, and the clamping plate is firmly clamped on the outer side of the motor 12 under the reaction force of the buffer spring 16;

s2, the interior of the heat dissipation cavity 2 is dissipated heat by starting the heat dissipation fan 1 and the semiconductor refrigerator 8, so that the water tank 9 is refrigerated, and the water tank 9, the first water pump 3, the second water pump 10, the water tank 9 and the heat absorption pipe 5 form water circulation to realize circulating refrigeration.

It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. The utility model provides a motor cooling structure which characterized in that: the heat-absorbing tube comprises a shell (6) and a heat-absorbing tube (5) arranged on the inner side of the shell (6), wherein a heat-radiating cavity (2) is arranged in the middle of the top of the shell (6);

a water tank (9) is arranged in the middle of the inside of the heat dissipation cavity (2), semiconductor refrigerators (8) are arranged on two sides of the inside of the heat dissipation cavity (2), and a heat dissipation fan (1) is arranged at the top of each semiconductor refrigerator (8);

one side at casing (6) top is equipped with first water pump (3), the opposite side at casing (6) top is equipped with second water pump (10), first water pump (3) with second water pump (10) all through the pipeline with water tank (9) intercommunication.

2. The motor cooling structure according to claim 1, wherein: the other end of the first water pump (3) is provided with a first pipeline (4), the first pipeline (4) is communicated with one end of the heat absorption pipe (5), the other end of the second water pump (10) is provided with a second pipeline (11), the second pipeline (11) is communicated with one end of the heat absorption pipe (5), the heat absorption pipe (5) is of an arch-shaped structure, and the heat absorption pipe (5) is attached to the inner side of the shell (6).

3. The motor cooling structure according to claim 1, wherein: the heat absorption end of the semiconductor refrigerator (8) is located on the inner side of the heat dissipation cavity (2), the heat dissipation end of the semiconductor refrigerator (8) is located on the outer portion of the heat dissipation cavity (2), the top of the heat dissipation fan (1) is provided with a protective cover, and the outer side of the water tank (9) is provided with a heat conduction layer (7).

4. The motor cooling structure according to claim 1, wherein: the shell (6) is of a U-shaped structure, a fixing plate (15) is welded at the bottom of the inner side of the shell (6), and buffer springs (16) are arranged on the fixing plate (15) at equal intervals.

5. The motor cooling structure according to claim 4, wherein: one end of the buffer spring (16) far away from the fixed plate (15) is provided with a clamping plate (14) and a side hinged plate (13), and the outer side of the clamping plate (14) is hinged with one side of the side hinged plate (13) close to the clamping plate (14).

6. The motor cooling structure according to claim 5, wherein: a motor (12) is arranged between the clamping plates (14), and the top of the inner side of the shell (6) is in contact with the top of the motor (12).

7. The motor cooling structure according to claim 1, wherein: the bottom of the motor (12) is provided with a supporting seat, and the shell (6) is an aluminum alloy shell.