CN211788974U

CN211788974U - Chip structure, mobile phone and electronic product

Info

Publication number: CN211788974U
Application number: CN202020633049.1U
Authority: CN
Inventors: 王林
Original assignee: Kunshan Q Technology Co Ltd
Current assignee: Kunshanqiu Titanium Biometric Technology Co ltd
Priority date: 2020-04-23
Filing date: 2020-04-23
Publication date: 2020-10-27
Anticipated expiration: 2030-04-23

Abstract

The utility model provides a chip structure, including chip and base plate, the lower surface of chip with bond through the glue between the upper surface of base plate, the lower surface of chip is in corresponding the position forms the breach all around of base plate, makes the lower surface of chip with in corresponding between the upper surface of base plate the position all around of base plate forms the outer jiao kou that advances that expands, glue and pass through outer jiao kou that advances that expands gets into the lower surface of chip with in the clearance between the upper surface of base plate.

Description

Chip structure, mobile phone and electronic product

Technical Field

The utility model relates to an electronic equipment field especially relates to a chip architecture and cell-phone and electronic product.

Background

With the rapid development of the mobile internet era, the integration level of electronic products such as mobile phones is higher, the requirement on the integration level of components is higher, and the requirements on the precision and reliability of the components are higher.

As shown in fig. 1, in the conventional capacitive fingerprint chip, an FPC substrate 12 is disposed at the bottom, a chip (Die)11 is disposed on the FPC substrate 12, the entire chip 11 is soldered (soldered 14) to the FPC substrate 12 by SMT (Surface mount Technology), and the chip 11 and the FPC substrate 12 are electrically connected by Bonding wires; the whole FPC substrate 12 and the chip 11 are plastically packaged by EMC (Epoxy Molding Compound), the chip 11 and the FPC substrate 12 are connected by glue 13, the periphery of the chip 11 is sealed by using glue 13, and then the glue 13 is baked by a pressure oven to fill the inside of the chip 11, so that the chip 11 is sealed, and the bonding force between the chip 11 and the FPC substrate 12 is increased.

However, in this method, since the gap filled with the glue 13 is relatively small, the amount of the glue 13 entering between the chip 11 and the FPC substrate 12 is relatively small, and thus the bonding force and the sealing property between the chip 11 and the FPC substrate 12 are affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a chip architecture aims at solving the not enough of above-mentioned background art existence, increases the entering volume of gluing to improve cohesion and leakproofness.

Further, the gap is of a triangular structure.

Further, the notch is of a rectangular structure.

Further, the substrate is an FPC (flexible printed circuit) board.

Further, the lower surface of the chip and the upper surface of the substrate are connected by solder.

The utility model also provides a mobile phone, including above the chip architecture.

The utility model also provides an electronic product, including above the chip structure

The utility model discloses a chip structure, the lower surface of chip is equipped with the breach to increase gluey entering glue space and advance gluey volume, thereby improve cohesion and the leakproofness between chip and the base plate.

Drawings

FIG. 1 is a schematic diagram of a prior art fingerprint chip;

fig. 2 is a schematic structural diagram of a chip structure according to a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of a chip structure according to a second embodiment of the present invention;

fig. 4 is a schematic structural diagram of a chip structure according to a third embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

The terms "first," "second," "third," "fourth," "fifth," and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

First embodiment

As shown in fig. 2, the utility model discloses the chip architecture that the first embodiment provided, including chip 1 and base plate 2, through gluing 3 bonding between the lower surface of chip 1 and the upper surface of base plate 2, the lower surface of chip 1 forms breach 6 in the position all around that corresponds base plate 2, and what make between the lower surface of chip 1 and the upper surface of base plate 2 forms the outer jiao kou 5 that expands in the position all around that corresponds base plate 2, glues 3 and gets into in the clearance between the lower surface of chip 1 and the upper surface of base plate 2 through the jiao kou 5 that expands outward.

Specifically, the glue 3 may be underfil glue or other common glue, which has functions of adhesion and sealing and has certain heat resistance. underfil glue filling is a popular underfill method, which mainly uses a non-contact spray dispensing technology for dispensing, and meanwhile, the non-contact spray dispensing technology is an optimal method for performing underfill on a circuit board for Chip Scale Package (CSP), Ball Grid Array (BGA) and Package On Package (POP), and a spray system can automatically manage a key process flow of underfill.

Further, the gap 6 has a triangular structure.

Specifically, as shown in fig. 2, the notch 6 may be a slope cut inward from the lower surface of the chip 1 at a position corresponding to the substrate 2, forming a triangular structure. Before filling with glue 3, an inclined plane is cut inwards at the position corresponding to the substrate 2 on the lower surface of the chip 1 to serve as an outward-expanded glue inlet 5, the glue 3 enters a gap between the lower surface of the chip 1 and the upper surface of the substrate 2 through the glue inlet 5, a pressure oven is used for baking after dispensing, the glue 3 is uniformly distributed and the glue inlet amount is increased, meanwhile, the glue 3 is shaped and fixed, and the glue 3 plays a role in sealing the chip 1 and increasing the bonding force between the chip 1 and the substrate 2.

Further, the utility model provides an among the chip architecture, base plate 2 is the FPC circuit board.

Further, the lower surface of the chip 1 and the upper surface of the substrate 2 are connected by solder 4.

Specifically, the entire chip 1 is first Mounted on the FPC board by SMT (Surface Mounted Technology), namely, the chip 1 is connected with the FPC circuit board through the soldering tin 14, so that the electrical performance of the chip 1 is connected with the FPC circuit board through the binding (Bonding) line, a gap exists between the lower surface of the chip 1 and the upper surface of the FPC circuit board, furthermore, the gap is filled with the glue 3 to play a role in sealing the chip 1 and increasing the binding force between the chip 1 and the FPC circuit board, when the chip 1 is bonded with the FPC circuit board, an inclined plane is cut inwards at the position, corresponding to the FPC circuit board, of the lower surface of the chip 1 to serve as an outward-expanded glue inlet 5, glue 3 enters between the chip 1 and the FPC circuit board through the outward-expanded glue inlet 5, glue is dispensed, then a pressure oven is used for baking to enable the glue 3 to be distributed uniformly and increase glue inlet amount, and meanwhile the glue 3 is molded and fixed.

Second embodiment

The utility model discloses the chip structure that the second embodiment provided, the structure with the first embodiment is roughly the same, and the difference lies in the structure difference of breach 6.

Specifically, as shown in fig. 3, the notch 6 has a rectangular structure.

Of course, the notch 6 may also have other shapes, such as other concave structures, and at the same time, may be flexibly selected according to actual requirements and the actual structure of the chip 1, that is, a structure capable of achieving outward expansion for increasing the amount of glue to be fed may be formed.

Third embodiment

The utility model discloses the chip structure that the third embodiment provided, the structure with the first embodiment is roughly the same, and the difference lies in that breach 6 is different for the position of the lower surface of chip 1.

Specifically, in the first embodiment, the size of the chip 1 is similar to that of the FPC circuit board, and the notch 6 is located on the side edge of the lower surface of the chip 1; in the third embodiment, the size of the chip 1 is larger than that of the FPC circuit board, and the notch 6 is located on the lower surface of the chip 1 at a position corresponding to the periphery of the FPC circuit board (around the pad of the chip 1). The position of the gap 6 can be determined according to the specific position of dispensing or the size relationship between the chip 1 and the FPC circuit board.

The utility model discloses the structure of chip 1 has been optimized to increase advancing gluey space of gluing 3 and advance gluey volume, increase cohesion and the leakproofness between chip 1 and the FPC circuit board.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a chip structure, includes chip (1) and base plate (2), the lower surface of chip (1) with through gluing (3) bonding between the upper surface of base plate (2), its characterized in that, the lower surface of chip (1) in corresponding base plate (2) position all around forms breach (6), makes the lower surface of chip (1) with between the upper surface of base plate (2) in corresponding base plate (2) position all around forms outer gluey mouth (5) of advancing that expands, glue (3) pass through outer gluey mouth (5) of advancing that expands get into the lower surface of chip (1) with in the clearance between the upper surface of base plate (2).

2. Chip structure according to claim 1, characterized in that the indentations (6) are triangular structures.

3. Chip structure according to claim 1, characterized in that the indentation (6) is a rectangular structure.

4. Chip structure according to claim 1, characterized in that the substrate (2) is an FPC board.

5. Chip structure according to claim 1, characterized in that the lower surface of the chip (1) and the upper surface of the substrate (2) are connected by means of a solder (4).

6. A mobile phone comprising the chip structure of any one of claims 1 to 5.

7. An electronic product, characterized in that it comprises a chip structure according to any one of claims 1 to 5.