CN211788939U - Device for chip installation - Google Patents
Device for chip installation Download PDFInfo
- Publication number
- CN211788939U CN211788939U CN202020871107.4U CN202020871107U CN211788939U CN 211788939 U CN211788939 U CN 211788939U CN 202020871107 U CN202020871107 U CN 202020871107U CN 211788939 U CN211788939 U CN 211788939U
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- Prior art keywords
- chip
- rubber pad
- connecting rod
- rectangular
- type base
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Abstract
The utility model relates to a device for chip mounting, including L type base, L type base is provided with two sets ofly altogether, the equal fixedly connected with spring pivot in L type base one end lateral wall surface, just the lateral wall surface that L type base one end is close to each other all passes through spring pivot swing joint has the depression bar, fixedly connected with T type connecting rod between the depression bar, T type connecting rod bottom is provided with the rectangle roof, rectangle roof bottom swing joint has rectangular rubber pad, rectangular rubber pad inner chamber bottom swing joint has the chip. Downward pressure is applied to the chip through the rectangular top plate, so that all parts of the chip are stressed uniformly, the chip can be fixed, the chip is connected with the chip groove more tightly, the stability of chip installation is ensured, and the working efficiency is improved.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment technique and specifically relates to a device for chip mounting is related to.
Background
Chips, also known as microcircuits, microchips, and integrated circuits, are silicon chips containing integrated circuits that are small and often part of a computer or other electronic device. The chip groove is arranged in the electronic equipment, the chip is inserted and fixed in the chip groove, and the welding spots on the chip are contacted with the conducting strip at the bottom of the chip groove after pressure is applied, so that the chip can be installed.
In the prior art, as disclosed in chinese patent publication No. CN206271673U, a chip mounting device and a chip mounting apparatus having the chip mounting device are disclosed, wherein the chip mounting device is used for mounting a chip on a chip base of a circuit board, and includes a slide rail, a fixing plate positioned on the slide rail and vertically moving relative to the slide rail, a first detecting device, a second detecting device, and a material sucking device. The first detection device is used for determining the chip placement position; the second detection device is used for determining the placement depth of the chip; the suction device is used for sucking the chip and placing the chip on the chip base; the second detection device comprises a support and a distance measurement sensor, one end of the support is positioned on the sliding rail, and the other end of the support extends towards the side direction of the material suction device; the distance measuring sensor is fixed at the other end of the bracket.
The above prior art solutions have the following drawbacks: although foretell utility model avoids the damage of the chip bottom solder ball that the too big amount of movement of fixed plate caused, improved the quality of maintenance welding. But the structure is complicated and in case of mounting some single chips, manual mounting is usually required. Because the chip volume is less, hardly with its accurate chip inslot of installing in electronic equipment to when the chip insert establish fix to the chip groove after to exert pressure, hardly guarantee that the atress of each part of chip is even, this phenomenon that can avoid takes place the chip perk, make the solder joint on the chip and the conducting strip of chip tank bottom portion can not all stable contact, cause the unable condition of using of electronic equipment, to a great extent has reduced the efficiency when installing the chip.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, one of the purposes of the utility model is to provide a device for chip mounting, have the effect that the atress is even when guaranteeing the chip mounting, improves installation chip efficiency.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:
the utility model provides a device for chip mounting, includes L type base, L type base is provided with two sets ofly altogether, the equal fixedly connected with spring pivot in L type base one end lateral wall surface, just the lateral wall surface that L type base one end is close to each other all passes through spring pivot swing joint has the depression bar, fixedly connected with T type connecting rod between the depression bar, T type connecting rod bottom is provided with the rectangle roof, rectangle roof bottom swing joint has the rectangle rubber pad, rectangle rubber pad inner chamber bottom swing joint has the chip.
Through the technical scheme, before the chip is arranged in the chip groove on the electronic equipment, the chip is fixed on the bottom surface of the rectangular rubber pad, and then the rectangular rubber pad is arranged on the rectangular top plate. Meanwhile, the device is horizontally fixed on the chip groove, the T-shaped connecting rod drives the rectangular top plate to move downwards by rotating the pressing rod, and when the rectangular rubber pad is pressurized by the rectangular top plate, the chip card can be arranged in the chip groove through the rectangular rubber pad, so that the chip can be protected. After the installation is finished, the external force applied to the pressure lever is released, the restoring force of the spring rotating shaft drives the rectangular top plate to move upwards, and then the device is taken down from the electronic equipment. Downward pressure is applied to the chip through the rectangular top plate, so that all parts of the chip are stressed uniformly, the chip can be fixed, the chip is connected with the chip groove more tightly, the stability of chip installation is ensured, and the working efficiency is improved.
The present invention may be further configured in a preferred embodiment as: the surface of one side of the pressure rod is fixed with a hook, the surface of the other end of the L-shaped base is provided with three groups of limiting holes, and the limiting holes are matched with the hooks.
Through the technical scheme, the hook can be hooked in the limiting hole after the pressing rod is pressed down, so that the fixing of the pressing rod is realized. And the limiting holes are provided with three groups, so that a user can select the limiting holes conveniently according to actual pressure requirements, and the use is more flexible and convenient.
The present invention may be further configured in a preferred embodiment as: the rectangular rubber pad is characterized in that a convex through hole is formed in the inner cavity of the rectangular rubber pad, the top of the convex through hole is matched with the rectangular top plate in a sliding mode, and the bottom of the convex through hole is elastically abutted to the rectangular chip.
Through above-mentioned technical scheme, fix the chip in rectangle rubber pad type of calligraphy through-hole bottom, thereby rectangle rubber pad takes place deformation and fixes the chip in the bottom stably. The rectangle roof is at convex style of calligraphy through-hole top and rather than the cooperation of sliding, and the rectangle roof lapse of being convenient for exerts pressure to the chip, and the chip of being convenient for on the one hand separates with the rectangle rubber pad, and on the other hand makes the chip atress even to installing at the chip inslot of more rapid and stable, improved efficiency.
The present invention may be further configured in a preferred embodiment as: the bottom end of the T-shaped connecting rod is connected with a sliding plate in a sliding mode, one end of the T-shaped connecting rod penetrates through the sliding plate and is fixedly connected with the rectangular top plate, one end, far away from the T-shaped connecting rod, of the sliding plate is fixedly connected with a plurality of clamping blocks, and clamping grooves for the clamping blocks to be fixedly embedded are formed in the upper surface of the wall of the rectangular rubber cavity.
Through the technical scheme, when the chip is installed in the chip groove, the device is fixed above the chip groove, and the chip is installed on the rectangular rubber pad. The pressing rod drives the T-shaped connecting rod and the rectangular top plate to move downwards after pressing, and when the rectangular top plate applies pressure to the chip, the sliding plate slides on the T-shaped connecting rod, so that the chip is separated from the rectangular rubber pad, and the chip is convenient to install in the chip groove.
The present invention may be further configured in a preferred embodiment as: a plurality of limiting grooves are formed in the lower surface of the wall of the rectangular rubber cushion cavity.
Through the technical scheme, the limiting rods are arranged around the chip grooves of some electronic equipment and are inserted into the limiting grooves, so that the rectangular rubber pads are prevented from moving in the horizontal direction, and meanwhile, the positioning effect is achieved.
The present invention may be further configured in a preferred embodiment as: and mounting holes are respectively formed in the surfaces of two ends of the bottom of the L-shaped base along the length direction of the L-shaped base.
Through the technical scheme, the installation holes are arranged so that the L-shaped base can be stably fixed on the electronic equipment when the chip is installed, and therefore the device can accurately install the chip in the chip groove.
The present invention may be further configured in a preferred embodiment as: and one surface of the rectangular top plate, which is far away from the T-shaped connecting rod, is fixedly connected with an elastic layer.
Through above-mentioned technical scheme, when the installation chip, the one side that T type connecting rod was kept away from to the rectangle roof can push down the chip, and the elastic layer has guaranteed to a certain extent that the chip can not crushed, has improved the practicality of device.
To sum up, the utility model discloses a following at least one useful technological effect:
1. when the chip is arranged in front of a chip groove on the electronic equipment, the chip is fixed on the bottom surface of the rectangular rubber pad, and then the rectangular rubber pad is arranged on the rectangular top plate. Meanwhile, the device is horizontally fixed on the chip groove, the T-shaped connecting rod drives the rectangular top plate to move downwards by rotating the pressing rod, and when the rectangular rubber pad is pressurized by the rectangular top plate, the chip card can be arranged in the chip groove through the rectangular rubber pad, so that the chip can be protected. After the installation is finished, the external force applied to the pressure lever is released, the restoring force of the spring rotating shaft drives the rectangular top plate to move upwards, and then the device is taken down from the electronic equipment. Downward pressure is applied to the chip through the rectangular top plate, so that all parts of the chip are stressed uniformly, the chip can be fixed, the chip is connected with the chip groove more tightly, the stability of chip installation is ensured, and the working efficiency is improved.
2. After the pressure lever is pressed down, the hook can be hooked in the limiting hole, so that the fixation of the pressure lever is realized. And the limiting holes are provided with three groups, so that a user can select the limiting holes conveniently according to actual pressure requirements, and the use is more flexible and convenient.
3. When a chip is installed in the chip groove, the device is fixed above the chip groove, and the chip is installed on the rectangular rubber pad. The pressing rod drives the T-shaped connecting rod and the rectangular top plate to move downwards after pressing, and when the rectangular top plate applies pressure to the chip, the sliding plate slides on the T-shaped connecting rod, so that the chip is separated from the rectangular rubber pad, and the chip is convenient to install in the chip groove.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic sectional view of the present invention.
Fig. 3 is a top view of the present invention showing the rectangular rubber pad and the sliding plate.
Reference numerals: 1. an L-shaped base; 11. a limiting hole; 12. mounting holes; 2. a spring shaft; 21. a pressure lever; 22. hooking; 3. a T-shaped connecting rod; 31. a sliding plate; 311. a clamping block; 4. a rectangular top plate; 41. an elastic layer; 5. a rectangular rubber pad; 51. a convex through hole; 52. a clamping groove; 53. a limiting groove; 6. a chip;
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, for the utility model discloses a device for chip mounting, including L type base 1, L type base 1 is provided with two sets ofly altogether, the equal fixedly connected with spring pivot 2 in 1 one end lateral wall surface of L type base, and the lateral wall surface that 1 one end of L type base is close to each other all has depression bar 21 through 2 swing joint of spring pivot, fixedly connected with T type connecting rod 3 between the depression bar 21, 3 bottoms of T type connecting rod are provided with rectangle roof 4, 4 bottom swing joint of rectangle roof have rectangular rubber pad 5, 5 inner chamber bottom swing joint of rectangular rubber pad have chip 6.
Wherein, the surface of one side of depression bar 21 all is fixed with couple 22, and L type base 1 other end surface has seted up spacing hole 11, and spacing hole 11 is provided with three groups altogether, and spacing hole 11 and couple 22 mutually support. After the press rod 21 is pressed down, the hook 22 can be hooked in the limiting hole 11, so that the press rod 21 is fixed. And the limiting holes 11 are provided with three groups, so that a user can conveniently select the limiting holes 11 according to actual pressure requirements, and the use is more flexible and convenient. The bottom of the L-shaped base 1 is provided with mounting holes 12 along the surface of the two ends of the length direction. The mounting holes 12 are provided to stably fix the L-shaped base 1 to the electronic device when the chip 6 is mounted, so that the device can accurately mount the chip 6 in the chip 6 slot.
Referring to fig. 2 and 3, a convex through hole 51 is formed in the inner cavity of the rectangular rubber pad 5, the top of the convex through hole 51 is in sliding fit with the rectangular top plate 4, and the bottom of the convex through hole 51 is elastically abutted to the rectangular chip 6. The chip 6 is fixed at the bottom of the convex through hole 51 of the rectangular rubber pad 5, and the rectangular rubber pad 5 deforms so as to stably fix the chip 6 at the bottom. Rectangle roof 4 is at convex style of calligraphy through-hole 51 top and rather than the cooperation of sliding, and the rectangle roof 4 downstream of being convenient for exerts pressure to chip 6, and the chip 6 of being convenient for separates with rectangle rubber pad 5 on the one hand, and on the other hand makes chip 6 atress even to install at chip 6 inslot fast and stable more, improved efficiency.
Referring to fig. 2, the bottom end of the T-shaped connecting rod 3 is slidably connected with a sliding plate 31, one end of the T-shaped connecting rod 3 passes through the sliding plate 31 and is fixedly connected with the rectangular top plate 4, one end of the sliding plate 31 far away from the T-shaped connecting rod 3 is fixedly connected with a plurality of clamping blocks 311, and the upper surface of the cavity wall of the rectangular rubber pad 5 is provided with a clamping groove 52 for the clamping blocks 311 to be embedded and fixed. In the present embodiment, the engaging groove 52 is in the shape of a tongue-and-groove, and the engaging block 311 is configured as a tenon. When the chip 6 is mounted in the chip 6 groove, the device is fixed above the chip 6 groove, and the chip 6 is mounted on the rectangular rubber pad 5. The pressing rod 21 drives the T-shaped connecting rod 3 and the rectangular top plate 4 to move downwards after being pressed downwards, and when the rectangular top plate 4 applies pressure to the chip 6, the sliding plate 31 slides on the T-shaped connecting rod 3, so that the chip 6 is separated from the rectangular rubber pad 5, and the chip 6 is conveniently installed in the chip 6 groove.
Furthermore, an elastic layer 41 is fixedly connected to one surface of the rectangular top plate 4 away from the T-shaped connecting rod 3. The elastic layer 41 is preferably made of elastic rubber material in the embodiment, when the chip 6 is mounted, the chip 6 is pressed down by one surface of the rectangular top plate 4 away from the T-shaped connecting rod 3, the chip 6 is guaranteed not to be crushed by the elastic layer 41 to a certain extent, and the practicability of the device is improved.
Referring to fig. 2, a plurality of limiting grooves 53 are formed on the lower surface of the cavity wall of the rectangular rubber pad 5. Limiting rods are arranged around the grooves of the electronic device chips 6 and are inserted into the limiting grooves 53, so that the rectangular rubber pads 5 are prevented from moving in the horizontal direction, and meanwhile, the positioning effect is achieved.
The implementation principle of the embodiment is as follows: before the chip 6 is mounted in the chip 6 slot on the electronic device, the chip 6 is fixed on the bottom surface of the rectangular rubber pad 5, and then the rectangular rubber pad 5 is mounted on the rectangular top plate 4. Meanwhile, the device is horizontally fixed on a chip 6 groove, the T-shaped connecting rod 3 drives the rectangular top plate 4 to move downwards by rotating the pressing rod 21, and when the rectangular top plate 4 pressurizes the rectangular rubber pad 5, the chip 6 can be clamped in the chip 6 groove through the rectangular rubber pad 5, so that the chip 6 can be protected.
After the installation is completed, the external force applied to the pressing rod 21 is released, the restoring force of the spring rotating shaft 2 drives the rectangular top plate 4 to move upwards, and then the device is removed from the electronic equipment. Downward pressure is applied to the chip 6 through the rectangular top plate 4, so that all parts of the chip 6 are stressed uniformly, the chip 6 can be fixed, the chip 6 is connected with the chip groove more tightly, the stability of chip 6 installation is ensured, and the working efficiency is improved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (7)
1. An apparatus for chip mounting, characterized by: including L type base (1), L type base (1) is provided with two sets ofly altogether, the equal fixedly connected with spring pivot (2) of L type base (1) one end lateral wall surface, just the lateral wall surface that L type base (1) one end is close to each other all passes through spring pivot (2) swing joint has depression bar (21), fixedly connected with T type connecting rod (3) between depression bar (21), T type connecting rod (3) bottom is provided with rectangle roof (4), rectangle roof (4) bottom swing joint has rectangular rubber pad (5), rectangular rubber pad (5) inner chamber bottom swing joint has chip (6).
2. An apparatus for chip mounting according to claim 1, wherein: the utility model discloses a pressure bar, including depression bar (21), spacing hole (11) are provided with three groups altogether, depression bar (21) one side surface all is fixed with couple (22), L type base (1) other end surface, just spacing hole (11) with couple (22) are mutually supported.
3. An apparatus for chip mounting according to claim 1, wherein: a convex through hole (51) is formed in the inner cavity of the rectangular rubber pad (5), the top of the convex through hole (51) is matched with the rectangular top plate (4) in a sliding mode, and the bottom of the convex through hole (51) is elastically abutted to the chip (6).
4. An apparatus for chip mounting according to claim 3, wherein: the bottom sliding connection of T type connecting rod (3) has sliding plate (31), the one end of T type connecting rod (3) is passed sliding plate (31) with rectangle roof (4) fixed connection, sliding plate (31) are kept away from the one end fixed connection of T type connecting rod (3) has a plurality of joint pieces (311), the confession has been seted up to rectangle rubber pad (5) chamber wall upper surface joint piece (311) inlay establishes fixed joint groove (52).
5. An apparatus for chip mounting according to claim 4, wherein: the lower surface of the cavity wall of the rectangular rubber pad (5) is provided with a plurality of limiting grooves (53).
6. An apparatus for chip mounting according to claim 5, wherein: the bottom of the L-shaped base (1) is provided with mounting holes (12) along the surfaces of two ends of the length direction of the L-shaped base respectively.
7. An apparatus for chip mounting according to claim 6, wherein: and one surface of the rectangular top plate (4) far away from the T-shaped connecting rod (3) is fixedly connected with an elastic layer (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020871107.4U CN211788939U (en) | 2020-05-21 | 2020-05-21 | Device for chip installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020871107.4U CN211788939U (en) | 2020-05-21 | 2020-05-21 | Device for chip installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211788939U true CN211788939U (en) | 2020-10-27 |
Family
ID=72955266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020871107.4U Expired - Fee Related CN211788939U (en) | 2020-05-21 | 2020-05-21 | Device for chip installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211788939U (en) |
-
2020
- 2020-05-21 CN CN202020871107.4U patent/CN211788939U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201027 Termination date: 20210521 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |