CN211745104U - A cooling device for charging pile power supply - Google Patents

Abstract

The utility model discloses a heat dissipation device for a charging pile power supply. The charging pile includes a protective casing, and a heat dissipation device is arranged on the charging pile. The radiator, the heat absorber comprises a heat absorbing shell and a semiconductor refrigerating sheet, the heat absorbing shell includes a heat absorbing cavity provided inside and a heat absorbing opening provided on the side, and the semiconductor refrigerating sheet is spaced at the heat absorbing opening; The device includes a heat dissipation shell, a heat dissipation cavity is arranged in the heat dissipation shell, and one or more ventilation holes are arranged on the heat dissipation shell; At the bottom, the heat-absorbing section of the heat pipe is located in the heat-absorbing cavity, and the heat-releasing section of the heat pipe is located in the heat-dissipating cavity. The heat dissipation device can quickly and effectively transfer the heat generated in the power supply to the outside of the charging pile, and the heat dissipation device has a good dustproof effect.

Description

A cooling device for charging pile power supply

technical field

The utility model relates to the technical field of heat dissipation of charging piles, in particular to a heat dissipation device for a power supply of a charging pile.

Background technique

With the development of the economy, the problems of energy and environmental protection have become increasingly prominent, and new energy technology has developed rapidly. As a kind of new energy technology products, electric vehicles have gradually entered the city. The energy of electric vehicles comes from electric energy. In the charging system, the charging pile is the execution equipment to complete the fast and safe charging of electric vehicles, and its demand and requirements have also continued to increase. When the charging pile power supply is working, the heating components such as MOS tubes and inductors in it will heat up. Therefore, in order to improve the charging efficiency and safety, it is necessary to add a heat dissipation structure or device to the charging pile power supply.

Existing heat dissipation technologies include passive heat dissipation of heat sinks, fan air cooling heat dissipation, liquid cooling heat dissipation, heat pipe heat dissipation, semiconductor cooling fin heat dissipation, etc. Among them, the principle of heat pipe heat dissipation technology is to make full use of the principle of heat conduction and the rapid heat transfer of phase change media. In nature, the heat of the heating object is quickly transferred to the outside of the heat source through the heat pipe, and its thermal conductivity exceeds that of any known metal; in addition, the semiconductor refrigeration sheet is equivalent to a heat pump, and its heat dissipation technology principle is to use semiconductor materials. Peltier effect, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, and the purpose of cooling can be achieved. It is a refrigeration technology that produces negative thermal resistance, which is characterized by no moving parts and high reliability.

Utility model content

Aiming at the problems in the prior art, the utility model provides a heat dissipation device for a charging pile power supply.

In order to achieve the above object, the utility model realizes through the following technical solutions:

A heat dissipation device for a power supply of a charging pile, the charging pile includes a protective casing, the power source is fixed on the inner side wall of the protective casing, a heat dissipation device is arranged on the charging pile, and the heat dissipation device comprises a Heat absorbers on both sides of the power supply and a radiator at the bottom of the protective casing, the heat absorbers include a heat absorber casing and a semiconductor refrigeration sheet, and the heat absorber casing includes a heat absorber cavity provided inside and a side part The heat-absorbing opening is provided, and the semiconductor refrigeration sheet is spaced at the heat-absorbing opening, and the outer end of the heat-absorbing opening is connected to the side of the power supply. a heat-absorbing cavity; the radiator includes a heat-dissipating casing, the heat-dissipating casing is provided with a heat-dissipating cavity, and one or more ventilation holes are arranged on the heat-dissipating casing; the heat-dissipating device further includes one or more The heat pipe is vertically penetrated and arranged at the bottom of the protective casing, the heat absorption section of the heat pipe is located in the heat absorption cavity, and the heat release section of the heat pipe is located in the heat dissipation cavity.

Further, the plurality of heat pipes are bundled together to form a heat pipe assembly, and the top and bottom ends of each heat pipe are flush.

Further, a heat-conducting component is sleeved on the top heat-absorbing end and the bottom heat-dissipating end of the above-mentioned heat pipe assembly, and the heat-conducting component includes a sleeve ring and a plurality of heat-conducting sheets connected to the outside of the sleeve ring.

Preferably, the above-mentioned thermally conductive sheet is any one of a silica gel sheet, a graphite sheet, a metal aluminum sheet or an aluminum alloy sheet.

As an improvement in the structure of the present invention, an exhaust fan is also provided on the radiator, and a ventilation pipe is provided between the two heat dissipation shells at the bottom of the protective shell, and the two ends of the ventilation pipe are respectively connected to the heat dissipation of the corresponding side. The cavities are communicated, and the exhaust fan is arranged on the side of the ventilation pipe.

The utility model has the following beneficial effects:

The heat dissipation device for the power supply of the charging pile of the utility model has a simple structure and a reasonable design. Specifically, the heat dissipation technology of a semiconductor refrigerating sheet and a heat pipe heat dissipation technology are combined in the structure, so that the heat generated in the power supply can be quickly and effectively transferred to the charging station. Outside the pile, and the heat dissipation device has a good dustproof effect, it will not cause dust in the air to enter the inside of the charging pile through the heat dissipation hole, thereby affecting the normal operation of the electrical components, greatly reducing the heating problem inside the charging pile, and improving the efficiency of the charging pile. It improves the charging efficiency and safety of the charging pile during use.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification, and are used to explain the present invention together with the embodiments of the present invention, and do not constitute a limitation to the present invention. In the attached image:

FIG. 1 is a schematic three-dimensional structure diagram of a charging pile in this embodiment;

FIG. 2 is a schematic three-dimensional structural diagram of the interior of the charging pile housing of FIG. 1;

FIG. 3 is a schematic structural diagram of the heat dissipation device of the present embodiment;

Fig. 4 is a three-dimensional schematic diagram of the heat pipe in Fig. 3;

Marked as: 1, protective shell; 2, support column; 3, power supply; 4, heat sink; 401, heat absorption shell; 402, semiconductor refrigeration chip; 403, heat absorption cavity; 404, heat absorption opening ;5, radiator; 501, heat dissipation shell; 502, heat dissipation cavity; 503, ventilation hole; 6, heat pipe; 7, heat conduction part; 701, socket ring; 702, heat conduction sheet; 8, exhaust fan; 9, ventilation pipe .

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions in the embodiments of the present utility model will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present utility model.

In the description of the present utility model, it should be noted that, unless otherwise specified, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", " The orientation or positional relationship indicated by "inside", "outside", "front end", "rear end", "top", "bottom", etc. are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model. and simplified description, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," etc. are used for descriptive purposes only and should not be construed to indicate or imply relative importance. It should also be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection ; It can be a mechanical connection or a circuit connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific conditions.

A cooling device for a charging pile power supply, as shown in Figure 1-Figure 2, has the following general structure:

The charging pile in this embodiment includes an external protective casing 1 and a support column 2 provided at the bottom of the protective casing 1. The power source 3 is fixedly installed on the inner side wall of the protective casing 1. In order to ensure that the power source 3 can work in time To dissipate heat quickly, a heat dissipation device is provided on the above-mentioned charging pile, and the heat dissipation device includes a heat sink 4 arranged on both sides of the power supply 3 and a radiator 5 located at the bottom of the protective casing 1;

Referring to FIG. 3 , the heat absorber 4 includes a heat-absorbing casing 401 and a semiconductor refrigeration sheet 402 . The heat-absorbing casing 401 includes a heat-absorbing cavity 403 provided inside and a heat-absorbing opening 404 provided on the side. The cooling sheet 402 is separated from the heat-absorbing opening 404, and the outer end of the heat-absorbing opening 404 is connected to the side of the power supply 3 (or correspondingly connected to the heat dissipation hole provided on the side of the power supply 3), and the heat-absorbing end surface of the semiconductor cooling sheet 402 Attached to the power source 3, the heat releasing end face of the semiconductor refrigeration sheet 402 faces the heat absorbing cavity 403;

The radiator 5 includes a heat dissipation casing 501, a heat dissipation cavity 502 is arranged in the heat dissipation casing 501, and one or more ventilation holes 503 are arranged on the heat dissipation casing 501;

The heat dissipation device further includes one or more heat pipes 6 provided, and the heat pipes 6 are vertically penetrated and arranged at the bottom of the protective casing 1. The exothermic section is partially in the heat dissipation cavity 502;

Based on the foregoing, the working principle of the above-mentioned heat dissipation device is as follows: the semiconductor refrigerating sheet 402 is energized to work, and the heat generated by the power supply 3 is transferred from the heat-absorbing end surface to the heat-absorbing cavity 403, and the heat-absorbing end of the heat pipe 6 absorbs the heat in the heat-absorbing cavity 403. It is transmitted to the heat dissipation cavity 502, and finally the heat is dissipated through the ventilation holes 503, and the existing conventional method is to directly set the heat dissipation holes on the charging pile shell, but this method will cause dust in the air to enter the charging pile. inside the casing, but not the heat sink designed by the present invention.

Further, in order to more effectively improve the heat dissipation efficiency of the heat dissipation device, the above-mentioned multiple heat pipes 6 are bundled together to form a heat pipe 6 assembly, as shown in FIG. 4 , and the top and bottom ends of each heat pipe 6 are flush; The top heat-absorbing end and the bottom heat-releasing end of the heat pipe 6 are sheathed with a heat-conducting component 7. The heat-conducting component 7 includes a socket ring 701 and a plurality of heat-conducting sheets 702 connected to the outside of the socket-ring 701, wherein the heat-conducting sheet 702 is the most It is better to use silica gel sheet, graphite sheet, metal aluminum sheet or aluminum alloy sheet; further, an exhaust fan 8 is also provided on the above-mentioned radiator 5. Specifically, as shown in the figure, there are two heat dissipation shells at the bottom of the protective shell 1. A ventilation pipe 9 is arranged between 501, and the two ends of the ventilation pipe 9 are respectively communicated with the heat dissipation cavity 502 on the corresponding side. heat.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still understand the foregoing. The technical solutions described in the various embodiments are modified, or some technical features thereof are equivalently replaced. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims (5)

1. A heat dissipation device for a charging pile power supply, the charging pile comprises a protective casing, the power supply is fixed on the inner side wall of the protective casing, and a heat dissipation device is provided on the charging pile, characterized in that the The heat sink includes a heat sink arranged on both sides of the power supply and a radiator located at the bottom of the protective casing. The heat sink includes a heat sink and a semiconductor refrigerating sheet. The heat-absorbing cavity and the heat-absorbing opening provided on the side, the semiconductor refrigeration sheet is spaced at the heat-absorbing opening, the outer end of the heat-absorbing opening is connected to the side of the power supply, the heat-absorbing end face of the semiconductor cooling sheet is attached to the power supply, and the semiconductor refrigeration sheet The heat-dissipating end face of the sheet faces the heat-absorbing cavity; the radiator includes a heat-dissipating shell, a heat-dissipating cavity is arranged in the heat-dissipating shell, and one or more ventilation holes are arranged on the heat-dissipating shell; the heat-dissipating device further includes a device In some one or more heat pipes, the heat pipes are vertically penetrated and arranged at the bottom of the protective casing, the heat absorption section of the heat pipe is located in the heat absorption cavity, and the heat release section of the heat pipe is located in the heat dissipation cavity. 2 . The heat dissipation device for a charging pile power supply according to claim 1 , wherein the plurality of heat pipes are bundled together to form a heat pipe assembly, and the top and bottom ends of each heat pipe are flush. 3 . 3 . The heat dissipation device for a charging pile power supply according to claim 2 , wherein a heat-conducting component is sleeved on the top heat-absorbing end and the bottom heat-dissipating end of the heat pipe assembly, and the heat-conducting component includes a sleeve ring and a connecting ring. 4 . A plurality of thermally conductive fins on the outside of the socket ring. 4 . The heat dissipation device for a charging pile power supply according to claim 3 , wherein the thermally conductive sheet is any one of a silica gel sheet, a graphite sheet, a metal aluminum sheet or an aluminum alloy sheet. 5 . 5. The heat dissipation device for a charging pile power supply according to claim 1, characterized in that, an exhaust fan is further provided on the radiator, and a ventilation pipe is provided between the two heat dissipation shells at the bottom of the protective shell, The two ends of the ventilation pipe are respectively communicated with the radiating cavity on the corresponding side, and the exhaust fan is arranged on the side of the ventilation pipe.

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