CN211743287U - Adapter plate and battery pack - Google Patents

Abstract

The utility model provides a keysets and battery pack relates to battery technical field. Wherein, the keysets includes: a substrate and a conductive sheet; a plurality of through holes are formed in the substrate; the two or more conducting plates are arranged on the first surface of the substrate, and the two opposite ends of each conducting plate are respectively provided with a through hole; the conducting strip comprises a main body part and bending parts positioned at two ends of the main body part in the length direction, and the two bending parts are respectively inserted into the through holes at two ends of the conducting strip and connected with the substrate; the substrate is provided with insertion holes at both side positions along the width direction of the main body. Through forming the kink at the both ends of conducting strip, the kink is inserted and is established in the via hole that sets up on the base plate and fix on the base plate to need not to fix through the mode of tin cream between conducting strip and base plate, and then avoided effectively adopting the short circuit risk that laser welding welded utmost point ear's in-process was brought because the tin cream between conducting strip and the base plate melts, improved the yields.

Description

Adapter plate and battery pack

Technical Field

The utility model relates to a battery technology field especially relates to a keysets and battery pack.

Background

Along with the popularization of intelligent terminals such as electric motorcycles, the application of lithium batteries formed by connecting a plurality of battery cells in series is also more and more extensive, and in the manufacturing process of the lithium batteries, the plurality of battery cells are generally connected in series through conducting strips by utilizing an adapter plate. Specifically, the positive electrode lug and the negative electrode lug of different battery cells are welded with the same conducting strip on the adapter plate, so that the lithium battery is formed by connecting a plurality of battery cells in series.

The existing adapter plate comprises a base plate, a plurality of conducting strips which are distributed in a staggered mode are welded on the base plate through soldering paste, the anode lug and the cathode lug of two adjacent electric cores are connected in series and conducted through welding on one conducting strip, the anode lug of one electric core and the cathode lug of the other electric core are sequentially overlapped and pressed on the same conducting strip, and then the three is welded together through laser welding to achieve series connection and conduction between the two adjacent electric cores.

However, in this way, the conducting strip and the two adjacent tabs with opposite polarities of the two battery cells are welded and conducted by laser welding, which easily causes melting of solder paste for fastening the conducting strip and the substrate, and even causes short circuit.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an adapter plate and battery pack for solve the above-mentioned defect among the prior art, avoid adopting the fastening mode fixed through the tin cream among the prior art between conducting strip and base plate, and then avoided effectively adopting the short circuit risk that the in-process tin cream melting of laser welding utmost point ear brought.

An aspect of the utility model provides an adapter plate, a serial communication port, include: a substrate and a conductive sheet;

a plurality of through holes are formed in the substrate;

the two or more conducting strips are arranged on the first surface of the substrate, and the two opposite ends of each conducting strip are respectively provided with one through hole;

the conducting strip comprises a main body part and bending parts positioned at two ends of the main body part in the length direction, and the two bending parts are respectively inserted into the through holes at the two ends of the conducting strip and connected with the substrate together;

and the base plate is provided with insertion holes along the two sides of the width direction of the main body part.

Optionally, the body portion includes a land, the land occupying 20-80% of the area of the body portion;

a gap is formed between the welding area and the substrate, and no solder paste is arranged on the welding area.

Optionally, a bottom plate is connected to a second surface of the substrate opposite to the first surface, and a plurality of through grooves are formed in the bottom plate; the orthographic projections of each conducting strip and the jacks at the two sides of the conducting strip on the bottom plate are all positioned in the same through groove.

Optionally, the tail end of the bent portion protrudes from the through hole and is welded with the substrate by wave soldering, and a welding protrusion is formed at the tail end of the bent portion.

Optionally, the through groove is configured to prevent the welding protrusion formed at the end of the bending part from protruding to a surface of the bottom plate away from the substrate.

Optionally, a signal collection socket is disposed on the first surface of the substrate, the signal collection socket includes a plurality of detection pins, and each detection pin is electrically connected to one of the conductive strips.

Optionally, the first surface of the substrate is provided with a transfer conductive sheet.

Optionally, a switching conducting strip avoiding hole and a signal acquisition socket avoiding hole are formed in the bottom plate.

Optionally, the substrate is a PCB, and the bottom plate is an insulating plate;

the thickness of the substrate is 1.6-2mm, and the thickness of the bottom plate is 1.4-2 mm.

The utility model discloses another aspect provides a battery pack, include: the electric core assembly is composed of a plurality of electric cores and the adapter plate, and the pole lugs of the electric cores penetrate through the insertion holes in the base plate to be welded with the main body part of the conducting plate.

The utility model provides an adaptor plate and battery pack, wherein, the adaptor plate includes: a substrate and a conductive sheet; a plurality of through holes are formed in the substrate; the two or more conducting plates are arranged on the first surface of the substrate, and the two opposite ends of each conducting plate are respectively provided with a through hole; the conducting strip comprises a main body part and bending parts positioned at two ends of the main body part in the length direction, and the two bending parts are respectively inserted into the through holes at two ends of the conducting strip and connected with the substrate; jacks are arranged on the substrate along the two sides of the width direction of the main body part, and the jacks are used for inserting the battery cell tabs on the two sides of the width direction of the main body part. Through forming the kink at the both ends of conducting strip, the kink is inserted and is established in the via hole that sets up on the base plate and fix on the base plate to need not to fix through the mode of tin cream between conducting strip and base plate, and then avoided effectively adopting the short circuit risk that laser welding welded utmost point ear's in-process was brought because the tin cream between conducting strip and the base plate melts, improved the yields.

Drawings

The above-mentioned advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an interposer provided in an embodiment one;

FIG. 2 is a schematic view of a substrate according to an embodiment;

fig. 3 is a schematic structural diagram of a conductive sheet according to an embodiment;

fig. 4 is a schematic structural diagram of an exploded state of an interposer according to an embodiment;

fig. 5 is a front view of a battery cell provided in the first embodiment;

fig. 6 is a side view of a battery cell provided in the first embodiment;

FIG. 7 is a schematic view of a core tab distribution on an interposer provided in accordance with one embodiment;

FIG. 8 is a schematic structural diagram of a base plate according to an embodiment;

fig. 9 is an exploded view of an interposer according to the second embodiment;

fig. 10 is a schematic structural diagram of a base plate according to a second embodiment;

fig. 11 is a front view of an interposer according to the second embodiment;

fig. 12 is a right side view of an interposer according to the second embodiment;

fig. 13 is a rear view of an interposer according to a second embodiment.

Reference numerals:

10: an adapter plate; 100: a substrate; 200: a conductive sheet;

101: a via hole; 201: a main body portion; 202: a bending section;

102: a jack; 300: an electric core; 301: a cell main body;

302: a battery core tab; 400: a base plate; 500: a signal acquisition socket;

401: perforating; 402: an avoidance part; 403: a signal acquisition socket avoidance hole;

404: switching the conducting plate avoiding hole; 600: switching the conducting strips; 2011: a welding area.

With the foregoing drawings in mind, certain embodiments of the disclosure have been shown and described in more detail below. These drawings and written description are not intended to limit the scope of the disclosed concepts in any way, but rather to illustrate the concepts of the disclosure to those skilled in the art by reference to specific embodiments.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The following describes the technical solution of the present invention and how to solve the above technical problems with specific embodiments. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present invention will be described below with reference to the accompanying drawings.

It should be noted that the terms "first", "second", "front", "back", "upper", "lower", "bottom", "top", "front", "rear", "left", "right", etc. in the description and claims of the present invention and the accompanying drawings indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the related art, the fixing of the conductive sheet and the substrate is always realized by arranging solder paste between the conductive sheet and the substrate, but since the conductive sheet and the pole piece of the battery cell are connected by laser welding, the solder paste is easily melted by the temperature of the laser welding and then flows to the outer side of the conductive sheet, even causes short circuit. The scheme integrally adopts the mode that the bent parts are arranged at the two ends of the conducting strip, the through holes corresponding to the bent parts are arranged on the substrate, and the bent parts are inserted into the through holes during assembly and then are welded and fixed with the substrate through the bent parts. Like this, also need not to set up the tin cream between conducting strip and base plate and fix the conducting strip on the base plate yet, just also avoided the tin cream between conducting strip and the base plate to melt the problem of outflow, just also avoided the short circuit risk of battery certainly, improved the yields.

Example one

Fig. 1 is a schematic structural diagram of an interposer provided in this embodiment. Fig. 2 is a schematic structural diagram of a substrate provided in this embodiment. Fig. 3 is a schematic structural diagram of a conductive sheet provided in this embodiment. Fig. 4 is a schematic structural diagram of an exploded state of an interposer according to this embodiment. Fig. 5 is a front view of a battery cell provided in this embodiment. Fig. 6 is a side view of a battery cell provided in this embodiment. Fig. 7 is a schematic diagram illustrating a distribution of core tabs on an interposer according to this embodiment. Fig. 8 is a schematic structural diagram of a base plate according to this embodiment.

Referring to fig. 1 to 8, an interposer 10 provided in the present embodiment includes: a substrate 100 and a conductive sheet 200; a plurality of via holes 101 are formed in the substrate 100; two or more conductive sheets 200 are disposed on the first surface of the substrate 100, and the two opposite ends of each conductive sheet 200 are respectively provided with one via hole 101; the conductive sheet 200 includes a main body 201 and two bent portions 202 located at two ends of the main body 201 in the length direction, and the two bent portions 202 are respectively inserted into the through holes 101 at two ends of the conductive sheet 200 and connected to the substrate 100.

In the present embodiment, the plurality of conductive sheets 200 disposed on the substrate 100 are illustrated as being disposed alternately on the first surface of the substrate 100 as shown in fig. 1. Of course, it should be noted that the plurality of conductive sheets 200 may also adopt any other suitable arrangement manner to meet the requirement of the series circuit of the plurality of battery cells, and the plurality of conductive sheets are not limited to the staggered arrangement manner shown in fig. 1.

Exemplarily, as shown in fig. 3, the conductive sheet 200 includes a main body portion 201 and a bent portion 202. In this embodiment, the main body portion 201 is an elongated conductive strip, and two ends along the length direction of the elongated conductive strip are respectively connected with a bending portion 202, for example, the bending portion 202 and the main body portion 201 may be an integrated structure. For example, in the present embodiment, the two end portions of the strip-shaped conductive sheet are bent to the same side by a certain angle, so as to form two bent portions at the two ends of the strip-shaped conductive sheet, the forming method is simple, and the production cost is reduced.

In an example of the present invention, please continue to refer to fig. 3, the main body 201 is provided with a connecting hole, and the connecting hole is used for connecting with a clamp. Therefore, the clamp is connected with the conducting strip through the connecting hole to clamp the conducting strip for rack plating, and further nickel is plated on the surface of the conducting strip to prevent the conducting strip from being oxidized. Moreover, compared with the clamping of the conducting strip by the clamping manipulator in the related art, the conducting strip can be prevented from being damaged due to overlarge clamping force of the clamping manipulator.

The shape of the connecting hole is not limited to the regular shape such as circle, square, triangle, etc., but can be irregular as long as the connecting hole is matched with the clamp.

It can be understood that when one connecting hole is arranged, the clamp is arranged in the connecting hole in a penetrating manner to realize the taking of the conducting strip; when the number of the connecting holes is two, one part of the clamp is arranged in one connecting hole in a penetrating mode, the other part of the clamp is arranged in the other connecting hole in a penetrating mode, and therefore the clamp and the conducting strip are connected more reliably. Of course, the utility model discloses in, the connecting hole can also be more than two to further improve its and the reliability of being connected of anchor clamps.

Specifically, in this embodiment, the end of the bending portion may extend out of the via 101 on the substrate and be soldered to the substrate 100 by wave soldering, that is, the end of the bending portion penetrates through the substrate and is soldered to the back of the substrate by wave soldering. Of course, other suitable soldering methods may also be adopted by those skilled in the art, and the embodiment does not limit the specific soldering method for connecting the end of the bending portion and the substrate, and the following connection method for the end of the bending portion and the substrate is described by taking the soldering method of wave soldering as an example.

Specifically, as shown in fig. 2, a plurality of via holes 101 are provided at positions on the substrate 100 for mounting the conductive sheets 200, and the plurality of via holes 101 are used for inserting the plurality of conductive sheets 200; for example, fig. 1 shows a schematic diagram of a plurality of conductive sheets on the left and right sides interleaved on the substrate 100 along the longitudinal center line.

Referring to fig. 2, two opposite ends of each conductive sheet on the substrate 100 along the length direction are respectively provided with a via hole 101, the bent portions 202 at two ends of the conductive sheet 200 are inserted into the two via holes 101 at the corresponding position of each conductive sheet on the substrate 100 from the front surface of the substrate 100, and the ends of the bent portions 202 extend out from the via holes at the back surface of the substrate 100, so that one conductive sheet 200 is inserted into the substrate 100. Similarly, after the other conductive sheets 200 are all inserted into the via holes 101 at the corresponding positions on the substrate 100, the tail ends of the bent portions of the conductive sheets are reliably fixed on the substrate by wave soldering from the back of the substrate 100. It should be noted that the shape of the via hole 101 is not specifically limited in this embodiment, and the shape of the via hole 101 may be adapted to the shape of the bent portion 202 on the conductive sheet 200, and meanwhile, it is not limited to perform wave soldering after all the conductive sheets are inserted into the via holes.

In some possible implementations, as shown in fig. 4, the bent portion 202 is perpendicular to the main body portion 201, and when the bent portions 202 at two ends of the conductive sheet 200 are perpendicularly plugged onto the substrate 100, the main body portion 201 of the conductive sheet is disposed parallel to the substrate, so that the conductive sheet 200 is reliably plugged onto the substrate 100.

Of course, in other embodiments, the bent portion 202 may be disposed at an obtuse angle or an acute angle with the main body portion 201, and those skilled in the art can set the bent portion according to actual requirements.

The adaptor plate provided by this embodiment forms the bent portion 202 at both ends of the conductive sheet 200, and the bent portion 202 is inserted into the via hole 101 formed on the substrate 100, and then the conductive sheet is fixed on the substrate by the wave-soldering welding method, and then the adaptor plate is used to connect a plurality of battery cells in series through a plurality of conductive sheets formed on the substrate. Specifically, the positive electrode lug and the negative electrode lug of different battery cells are welded with the same conducting strip on the adapter plate, so that the battery is formed by connecting a plurality of battery cells in series.

Wherein the substrate is a PCB board. Illustratively, as shown in fig. 2, the substrate 100 may be a rectangular PCB, but the shape of the PCB is not limited to a rectangle.

The substrate 100 includes a first surface and a second surface (the first surface is a front surface of the substrate, and the second surface is a back surface of the substrate) arranged opposite to the first surface, as shown in fig. 3, a plurality of insertion holes 102 for the core tabs to pass through are arranged on the substrate 100 along two sides of the main body in the width direction, and each of the plurality of insertion holes 102 is a through hole, specifically, the core tabs are inserted from the back surface of the substrate 100 and are passed out from the front surface of the substrate 100, so as to implement the insertion of the core tabs on the substrate 100.

As shown in fig. 5 and fig. 6, the battery cell 300 provided in this embodiment includes a cell main body 301 and a cell tab 302, where the cell tab 302 of one battery cell 300 includes a positive electrode tab and a negative electrode tab. In this embodiment, please refer to fig. 5 and fig. 6, the positive electrode tab and the negative electrode tab of the battery cell 300 may have the same shape and structure, and are symmetrically disposed on the top of the battery cell main body 301 with respect to the center of the battery cell main body 301, and it should be noted that this embodiment merely shows an exemplary structure of the battery cell 300, and the layout of the positive electrode tab and the negative electrode tab may also be different.

Fig. 2 is a front view of the substrate 100, and as shown in fig. 2, the plurality of insertion holes 102 provided on the substrate 100 are all elongated through holes, and the plurality of elongated through holes are arranged on the substrate 100 in an array. For example, fig. 2 illustrates that seven rows of long strip-shaped through holes are distributed along the short side of the rectangular substrate, and two rows of long strip-shaped through holes are distributed along the long side of the rectangular substrate.

Referring to fig. 1, fig. 2, fig. 5 and fig. 6, for example, the entire battery cell 300 may be a plate-shaped structure, when the battery cell 300 is inserted into the substrate 100, the battery cell 300 is first placed on the back surface of the substrate 100, then two battery cell tabs 302 on the battery cell 300 are respectively inserted into two elongated through holes arranged in parallel in the transverse direction on the substrate 100, and the two battery cell tabs 302 extend from the front surface of the substrate 100, so that one battery cell 300 is inserted into the substrate 100. The insertion mode of other electric cores is similar to that described above, and is not described again.

Specifically, the plurality of battery cells 300 inserted on the substrate 100 are connected in series and conducted through the plurality of conductive sheets disposed on the substrate 100. For example, in the present embodiment, as shown in fig. 1, a plurality of conductive sheets 200 are staggered on the front surface of the substrate 100, each conductive sheet is used as a conductive element on the adapter plate for electrically connecting two adjacent battery cells, and a plurality of conductive sheets 200 staggered on the substrate 100 are used for electrically connecting a plurality of battery cells in series.

For example, fig. 1 shows that the left and right conductive sheets are staggered along the longitudinal center line of the substrate, the two sides of each conductive sheet in the width direction are provided with the insertion holes 102, the insertion holes 102 are used for inserting the tabs of the plurality of cells from the back of the substrate, the specific insertion manner of the cells is to insert two cell tabs with opposite polarities in two adjacent cells into the two sides of the same conductive sheet, the positive tab of one cell and the negative tab of another cell are sequentially stacked on the same conductive sheet, and then the three are welded together by laser welding to realize series connection and conduction between two adjacent cells, thereby realizing series connection and conduction of the plurality of cells.

According to the circuit series principle, it is exemplified here that the state of the series connection of the plurality of cells is: the negative pole utmost point ear of first electric core and the positive pole utmost point ear of second electric core switch on, and the negative pole utmost point ear of second electric core and the positive pole utmost point ear of third electric core switch on, analogizes in proper order, and the total number of supposing electric core is N, so the negative pole utmost point ear of N-1 electric core switches on with the positive pole utmost point ear of N electric core, and after N electric core series connection, the positive pole utmost point ear of first electric core and the negative pole utmost point ear of N electric core regard as positive terminal, negative pole end after N electric core series connection respectively. It should be noted that the total number of the battery cells may be two or more, the total number of the battery cells is not specifically limited in this embodiment, and a person skilled in the art may set the total number according to actual needs.

Exemplarily, the position of the cell tab inserted on the transfer plate is illustrated according to the circuit series connection principle: for example, fig. 7 illustrates that three rows of insertion holes 102 are distributed along the short side of the rectangular substrate, and two columns of insertion holes 102 are distributed along the long side of the rectangular substrate, and two insertion holes 102 arranged in each row on the substrate 100 are used for inserting two cell tabs of one cell. For example, in some embodiments, as shown in fig. 7, it is assumed that the insertion holes on the top-down substrate 100 are a first line of insertion holes, a second line of insertion holes, and a third line of insertion holes, and are respectively used for inserting the first battery cell, the second battery cell, and the third battery cell, and the positions of two tabs of each battery cell are distributed as follows, a left side insertion hole of the first line of insertion holes is used for inserting a positive tab of the first battery cell (indicated by + in fig. 7), and a right side insertion hole of the first line of insertion holes is used for inserting a negative tab of the first battery cell (indicated by-in fig. 7); the left side jack of the second row of jacks is used for inserting a negative pole lug of a second battery cell, and the right side jack of the second row of jacks is used for inserting a positive pole lug of the second battery cell; and the left side jack of the third row jack is used for inserting a positive pole lug of a third battery cell, and the right side jack of the third row jack is used for inserting a negative pole jack of the third battery cell. Thus, three cells are inserted on the substrate.

At this time, a conducting strip 200 is installed between the negative electrode tab of the first cell and the positive electrode tab of the second cell, the negative electrode tab of the first cell and the positive electrode tab of the second cell are both folded and laminated on the main body part of the conducting strip positioned between the two, as shown in fig. 1 and fig. 3, the main body portion includes a welding area 2011, the welding area 2011 on the main body portion is located in the middle of the main body portion, specifically, the negative electrode tab of the first electrical core and the positive electrode tab of the second electrical core are both turned over and folded to press on the welding area 2011 of the main body portion of the conducting strip located in the middle of the two, that is, the position where the negative electrode tab of the first electrical core and the positive electrode tab of the second electrical core are folded to press on the main body portion on the conducting strip after being turned over is the tab welding area, and then laser welding is adopted to weld the three together to realize that the negative electrode tab of the first electrical core and the positive electrode tab of the second electrical core are. It should be noted that, the welding area on the main body portion is not provided with solder paste, and when the structure in which the two tabs are laminated by laser welding is used for welding, the temperature of the welding area on the main body portion 2011 is increased to be molten, so that the negative electrode tab of the first electrical core and the positive electrode tab of the second electrical core are welded, fixed and conducted. Similarly, the conduction modes of the other two adjacent electric cores on the substrate are similar to those of the above, and are not described again.

Certainly, in some other possible implementation manners, the weld zone of main part with can have the clearance between the base plate, that is to say, when carrying out laser welding to the structure that two utmost point ears fold and press behind utmost point ear weld zone on the main part, thereby the temperature of weld zone on the main part rises to melting and fixedly switches on the negative pole utmost point ear of first electric core and the positive pole utmost point ear of second electric core, through the weld zone of main part with can have the clearance setting between the base plate, avoided the unnecessary conducting liquid of weld zone melting on the main part to flow to the risk that leads to other copper skin circuits on the base plate to switch on the base plate to the short circuit risk of battery has been avoided, the yields has been improved.

Optionally, the gap between the land of the body portion and the substrate has a value of 5-50 mm. For example, in some embodiments, the gap between the bond pad and the substrate may have a value of 5 mm; as another example, in other embodiments, the gap between the bond pad and the substrate may have a value of 20 mm; for example, in some further embodiments, the gap between the pad and the substrate may be any one of 5, 8, 10, 12, 16, 18, 25, 30, 35, 40, 45, and 50mm, and the gap between the pad and the substrate is not specifically limited in this embodiment.

It should be noted that the area of the welding zone on the main body part is 20% -80%, that is, when the size of the tab of the battery cell is larger, the area of the welding zone on the main body part can be increased, so that the welding zone can have enough conductive liquid under the action of high temperature, and the two tabs to be welded can be fully conducted; similarly, if the size of the tab of the battery cell is small, the occupied area of the welding area on the main body part can be reduced, and excessive conductive liquid is prevented from flowing out due to the melting of the welding area when laser welding is used. For example, in some embodiments, the weld area may occupy 20% of the body portion area; in other embodiments, the weld region may occupy 80% of the area of the body portion; for example, in some other embodiments, the welding area may occupy any proportion value of 20% to 80% of the area of the main body portion, for example, the proportion value may be: 25%, 30%, 35%, 40%, 42%, 52%, 60%, 65%, 70%, 75%, and can be set by a person skilled in the art according to a specific use case.

Furthermore, a bottom plate is fastened to the back of the substrate 100, and the bottom plate is an insulating plate, so that the overall strength of the adapter plate is enhanced. As shown in fig. 8, a plurality of through slots are disposed on the bottom plate 400, the through slots may be all rectangular through holes, and orthographic projections of each conductive sheet disposed on the substrate and the jacks on the two sides of the conductive sheet on the bottom plate are all located in the same through slot.

With reference to fig. 8, the through slot includes a through hole 401 and an avoiding portion 402, where the through hole 401 is used for a core tab to pass through, it should be understood that the through hole 401 corresponds to the position of the insertion hole 102 formed on the substrate 100 one by one, that is, after the base plate is fastened to the substrate, the through hole 401 coincides with the position of the insertion hole 102 on the substrate, and together form a through hole for inserting a core tab, so that the core tab is inserted into the adapter plate formed by combining the substrate and the base plate.

For example, the adapter plate is formed after the bottom plate is tightly connected to the back surface of the substrate, when the battery cell is inserted into the adapter plate, the battery cell is firstly placed on the back surface of the bottom plate, two battery cell tabs on the battery cell sequentially penetrate through the through hole 401 on the bottom plate and the insertion hole 102 on the substrate, and the tail ends of the battery cell tabs extend out of the front surface of the substrate, so that the battery cell is inserted into the adapter plate. The manner of inserting other electric cores into the adapter plate is similar to that described above, and is not described again.

In some possible implementation modes, the shape of the bottom plate is consistent with the outer contour shape of the substrate, and the bottom plate can be an epoxy plate commonly used in the field, so that the method is economical and practical and reduces the cost.

Furthermore, in this embodiment, the bottom plate can be fixed to the back surface of the substrate by means of adhesion, and the fixing method is simple and easy to operate. It should be noted that, in the present embodiment, the fixing manner between the bottom plate and the substrate is not specifically limited, and those skilled in the art may adopt any fastening manner that can be implemented and meets the specification, and the present embodiment is not described one by one.

In the embodiment, the bent portions 202 at two ends of the conductive sheet are inserted into the via hole 101 from the front surface of the substrate, the ends of the bent portions 202 extend from the back surface of the substrate, wave soldering is used to fixedly connect the ends of the bent portions 202 to the substrate at the back surface of the substrate, soldering bumps are formed at multiple positions on the back surface of the substrate after wave soldering, and the through grooves are configured to prevent the soldering bumps formed at the ends of the bent portions 202 from extending to the surface of the bottom plate away from the substrate.

Specifically, as shown in fig. 8, the avoiding portion 402 on the through groove disposed on the bottom plate is used to avoid the welding protrusion formed on the back surface of the substrate, that is, the welding protrusion formed on the back surface of the substrate by wave soldering is accommodated in the avoiding portion 402 in the middle of the through groove on the bottom plate, so that the welding protrusion formed on the back surface of the substrate by wave soldering does not protrude out of the surface of the bottom plate away from the substrate, that is, the welding protrusion formed on the back surface of the substrate by wave soldering does not protrude out of the bottom surface of the bottom plate. Therefore, the planarization of the back surface of the adapter plate is realized, the structure of the adapter plate is standardized, and the adapter plate is convenient to use and package. It should be noted that the accommodating depth of the through groove on the bottom plate is at least greater than the height of the soldering bump formed on the back surface of the substrate.

Furthermore, the thickness of the substrate is 1.6-2mm, and the thickness of the bottom plate is 1.4-2 mm. For example, in the present embodiment, an adapter plate is adopted, which is formed by adhering a substrate with a thickness of 1.6mm and a bottom plate with a thickness of 1.4 mm; for another example, in other embodiments, an adapter plate is fixed by a substrate with a thickness of 2mm and a bottom plate with a thickness of 2 mm; for example, in some further embodiments, the thickness of the substrate may also be any one of thickness values of 1.68, 1.7, 1.8, 1.9, and 1.95mm, and the thickness of the bottom plate may be any one of thickness values of 1.5, 1.6, 1.65, 1.7, 1.8, and 1.9mm, and the thickness of the substrate and the thickness of the bottom plate are not specifically limited in this embodiment.

The interposer 10 according to the present embodiment includes: a substrate 100 and a conductive sheet 200; a plurality of via holes 101 are formed on the substrate 100; two or more conductive sheets 200 are disposed on the first surface of the substrate 100, and each of the conductive sheets 200 has a via hole 101 at each of opposite ends thereof; the conductive sheet 200 comprises a main body part 201 and bent parts 202 positioned at two ends of the main body part 201 in the length direction, and the two bent parts 202 are respectively inserted into the through holes 101 at the two ends of the conductive sheet 200 and connected with the substrate 100; the substrate 100 is provided with insertion holes 102 at positions along both sides of the width direction of the body 201, and the insertion holes 102 are used for inserting battery cell tabs at both sides of the width direction of the body 201. That is to say, through forming kink 202 at the both ends of conducting strip, kink 202 is inserted and is established in the via hole 101 that sets up on the base plate, and the welding mode of rethread wave-soldering is with the terminal welding of kink at the back of base plate to need not to fix through the mode of tin cream between conducting strip 200 and base plate 100, and then avoided effectively adopting the short circuit risk that laser welding utmost point ear's in-process was brought because the tin cream between conducting strip and the base plate melts, improved the yields.

Example two

Fig. 9 is an exploded view of an interposer according to the present embodiment. Fig. 10 is a schematic structural diagram of a base plate according to this embodiment. Fig. 11 is a front view of an interposer according to this embodiment. Fig. 12 is a right side view of an interposer according to the present embodiment. Fig. 13 is a rear view of an interposer according to this embodiment. Referring to fig. 9 to fig. 13, in combination with the above embodiments, an improved interposer is provided in the present embodiment.

For example, in this embodiment, as shown in fig. 9, 11 and 12, a signal collection socket 500 is further disposed on the front surface of the interposer, and the signal collection socket 500 includes a positive pin and a negative pin, the positive pin is electrically connected to the positive end of the plurality of cells connected in series, and the negative pin is electrically connected to the negative end of the plurality of cells connected in series, so that the signal collection socket is connected in parallel to the two ends of the plurality of cells connected in series. When the plurality of cells connected in series are powered on, the positive pin and the negative pin of the signal acquisition socket 500 are used for acquiring the total voltage of the plurality of cells connected in series. Illustratively, the signal acquisition socket can also be in communication connection with a power management system, and the total voltage of a plurality of series-connected cells is displayed and monitored in real time through the power management system, if the total voltage acquired on the power management system is within the theoretical normal voltage range of the plurality of series-connected cells, the plurality of series-connected cells are judged to be in a normal charging or discharging state, otherwise, the plurality of cells are judged to be abnormal in working state, and the cells need to be maintained.

For example, in the present embodiment, as shown in fig. 11, the signal collecting socket 500 may adopt a pin header signal collecting socket commonly used by those skilled in the art, wherein the pin header signal collecting socket is fixed on the substrate 100 by a fixing method commonly used by those skilled in the art. For example, in this embodiment, the bottom surface of the pin header signal collection socket is provided with a convex pillar, the substrate is provided with a mounting hole for mounting the convex pillar, the convex pillar is inserted into the mounting hole from the front surface of the substrate, and the end of the convex pillar extends out from the back surface of the substrate, and the end of the convex pillar at the bottom of the signal collection socket is welded with the substrate by wave soldering on the back surface of the substrate, so as to reliably fix the pin header signal collection socket on the substrate, although the fixing manner of the signal collection socket and the substrate is not limited thereto.

Illustratively, one of the pins of the pin header signal acquisition socket can be used as a positive pin, the other pin header of the pin header signal acquisition socket can be used as a negative pin, and the conductive copper sheet is arranged on the substrate to electrically connect the pin header of the positive pin of the pin header signal acquisition socket with the positive terminals of the plurality of series-connected cells and electrically connect the pin header of the negative pin with the negative terminals of the plurality of series-connected cells, so that the pin header signal acquisition socket is electrically connected with the positive terminals and the negative terminals of the plurality of series-connected cells.

Further, as shown in fig. 11, a relay conductive sheet 600 is connected to the front surface of the substrate. For example, the relay conductive sheet 600 may be a rectangular conductive sheet. Specifically, in this embodiment, the adapting conductive sheet is fixed on the substrate in the same fixing manner as the conductive sheet, which is not described herein, and of course, the adapting conductive sheet may also be fixed on the substrate in any other suitable fixing manner, which is not illustrated herein.

For example, referring to fig. 11, two ends of the signal collecting socket 500 are respectively provided with one adapting conductive sheet 600, the positive pin and the negative pin of the pin header signal collecting socket can be electrically connected to the two adapting conductive sheets 600 at the two ends of the pin header signal collecting socket through the copper sheet laid on the substrate, and simultaneously, the two adapting conductive sheets 600 can be electrically connected to the positive terminals and the negative terminals of the plurality of cells in series through the electric wires, so that the positive pin and the negative pin of the signal collecting socket are respectively conducted to the positive terminals and the negative terminals of the plurality of cells in series through one adapting conductive sheet.

Further, the signal collecting socket 500 may further include a plurality of detecting pins, and each detecting pin is electrically connected to one of the conductive strips 200. For example, in this implementation, adopt row needle signal acquisition socket as signal acquisition socket, a plurality of row needles of row needle signal acquisition socket can regard as a plurality of detection pins, and simultaneously, a plurality of row needles correspond respectively through the copper sheet conductive circuit that sets up on the circuit and a plurality of conducting strips that set up on the base plate and switch on to equally divide every conducting strip on the base plate and do not switch on with a plurality of row needles of row needle signal acquisition socket, also be connected with signal acquisition socket electricity at the both ends of a single electric core. When a plurality of series connection electric cores are electrified, the signal acquisition socket can acquire the voltage of a single electric core through a pin header indicating a plurality of detection pins, the voltage of the single electric core is displayed in real time through a power management system in communication connection with the signal acquisition socket, if the voltage value of the single electric core acquired by the power management system is in the calculated voltage theoretical value range, the single electric core is judged to be in a normal charging or discharging state, otherwise, the working state of the single electric core is judged to be abnormal, and the electric core maintenance is needed.

For example, the switching conductive sheet and the signal collecting socket on the adapter plate may be inserted into a predetermined mounting hole on the substrate from the front surface of the substrate, and then the components such as the switching conductive sheet and the signal collecting socket are fixed on the substrate by wave soldering on the back surface of the substrate, and a plurality of soldering bumps are formed on the back surface of the substrate.

Further, in this embodiment, as shown in fig. 10 and 13, the bottom plate 400 is provided with a signal collecting socket avoiding hole 403, the signal collecting socket avoiding hole 403 is used for accommodating a welding protrusion formed on the back surface of the substrate by the signal collecting socket, and the shape of the signal collecting socket avoiding hole 403 should be adapted to the structure of the welding protrusion formed on the back surface of the substrate by the signal collecting socket.

Illustratively, as shown in fig. 10, the bottom plate 400 is further provided with transferring conductive sheet avoiding holes 404 for accommodating the soldering bumps formed on the back surface of the substrate by the transferring conductive sheets, and the number and the positions of the transferring conductive sheet avoiding holes 404 correspond to those of the transferring conductive sheets on the circuit board. The signal acquisition socket avoiding hole and the switching conducting strip avoiding hole are formed in the bottom plate, the welding protrusions formed on the back face of the substrate of each electronic element are accommodated in the avoiding holes, planarization treatment on the back face of the switching plate is achieved, the structure of the switching plate is standardized, and the switching plate is convenient to use and package.

The interposer 10 according to the present embodiment includes: the conductive sheet 200 comprises a main body part 201 and bent parts 202 located at two ends of the main body part 201, the two bent parts 202 are respectively inserted into the via holes 101 at two ends of the conductive sheet, and the tail ends of the bent parts 202 extend out of the via holes 101 and are connected with the substrate 100. That is to say, through forming the kink at the both ends of conducting strip, the kink is inserted and is established in the via hole that sets up on the base plate, and the welding mode of rethread wave-soldering is with the terminal welding of kink at the back of base plate to need not to fix through the mode of tin cream between conducting strip and base plate, and then avoided effectively because the short circuit risk that tin cream melting probably brought, improved the yields.

The embodiment also provides a battery assembly, which is an electric core assembly formed by a plurality of electric cores and the adapter plate 10, wherein the tabs of the electric cores penetrate through the jacks on the substrate to be welded with the main body part of the conducting strip. A plurality of battery cores are inserted into the adapter plate in the installation mode, and then the positive electrode lug and the negative electrode lug of different battery cores are welded with the same conducting strip on the adapter plate, so that the battery assembly is formed by connecting the plurality of battery cores in series.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its various embodiments.

Claims (10)

1. An interposer (10), comprising: a substrate (100) and a conductive sheet (200);

a plurality of through holes (101) are formed in the substrate (100);

two or more than two conducting strips (200) are arranged on the first surface of the substrate (100), and two opposite ends of each conducting strip (200) are respectively provided with one through hole (101);

the conductive sheet (200) comprises a main body part (201) and bent parts (202) positioned at two ends of the main body part (201) in the length direction, and the two bent parts (202) are respectively inserted into the through holes (101) at the two ends of the conductive sheet (200) and connected with the substrate (100);

insertion holes (102) are formed in the substrate at positions on both sides in the width direction of the main body.

2. The interposer (10) as recited in claim 1, wherein the body portion (201) includes bond pads (2011), the bond pads (2011) comprising 20% -80% of an area of the body portion (201);

a gap is formed between the bonding pad (2011) and the substrate (100), and no solder paste is arranged on the bonding pad (2011).

3. The interposer (10) as recited in claim 1, wherein a base plate (400) is attached to a second surface of the substrate (100) opposite the first surface, the base plate (400) having a plurality of through slots disposed therein; the orthographic projections of each conducting strip (200) and the jacks (102) on the two sides of the conducting strip on the bottom plate (400) are located in the same through groove.

4. The interposer (10) according to claim 3, wherein the end of the bent portion (202) protrudes from the via hole (101) and is soldered to the substrate (100) by wave soldering, and a solder bump is formed at the end of the bent portion (202).

5. The interposer (10) according to claim 4, wherein the through-slots are configured such that the soldering bumps formed at the ends of the bent portions (202) do not protrude to a side of the base plate away from the substrate.

6. The interposer (10) according to any one of claims 3-5, wherein the first surface of the substrate (100) is provided with a signal acquisition socket (500), the signal acquisition socket (500) comprising a plurality of detection pins, each of the detection pins being electrically connected to one of the conductive strips (200).

7. The interposer (10) according to claim 6, wherein the first surface of the substrate (100) is provided with a interposer conductive sheet (600).

8. The interposer (10) as claimed in claim 7, wherein the bottom plate (400) is provided with interposer conductive plate relief holes (404) and signal acquisition socket relief holes (403).

9. The interposer (10) according to claim 8, wherein the substrate (100) is a PCB board and the base plate (400) is an insulating plate;

the thickness of the substrate (100) is 1.6-2mm, and the thickness of the bottom plate (400) is 1.4-2 mm.

10. A battery assembly, comprising: the electric core assembly formed by a plurality of electric cores and the adapter plate (10) of any one of claims 1 to 9, wherein the lugs of the electric cores are welded with the main body part of the conducting strip through the insertion holes on the base plate.

Images