CN211743120U - Position fixing device is used in semiconductor chip production and processing - Google Patents

Position fixing device is used in semiconductor chip production and processing Download PDF

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Publication number
CN211743120U
CN211743120U CN202020660751.7U CN202020660751U CN211743120U CN 211743120 U CN211743120 U CN 211743120U CN 202020660751 U CN202020660751 U CN 202020660751U CN 211743120 U CN211743120 U CN 211743120U
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semiconductor chip
fixedly connected
threaded
rod
processing
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Chinese (zh)
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不公告发明人
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Gaojin Guangdong Chip Technology Co ltd
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Gaojin Guangdong Chip Technology Co ltd
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Abstract

The utility model belongs to the technical field of the semiconductor chip production technique and specifically relates to a semiconductor chip is position fixing device for production and processing, the on-line screen storage device comprises a base, other fixedly connected with pillar is equallyd divide to base upper surface both sides, other fixedly connected with fixed establishment is equallyd divide to two pillar upper ends, threaded connection has the threaded rod with running through among the threaded sleeve, threaded rod one end extends to one side and the fixedly connected with connector of threaded sleeve, two bull sticks of fixedly connected with on the lateral wall of connector symmetry each other, it has two third connecting rods to articulate mutually on the lateral wall of threaded sleeve symmetrically, two third connecting rod one ends are equallyd divide and are do not articulated have the head rod, two second connecting rod one ends are equallyd divide and are articulated do not articulated have the connecting seat. The position fixing device for producing and processing the semiconductor chip can be used for fixing the semiconductor chip quickly and conveniently, and is simple to operate and convenient to use.

Description

Position fixing device is used in semiconductor chip production and processing
Technical Field
The utility model relates to a semiconductor chip produces technical field, especially relates to a semiconductor chip is position fixing device for production and processing.
Background
In the course of the production and processing of semiconductor chips, it is often necessary to use a position fixing device for fixing the semiconductor chip to be processed under a processing apparatus. Most of the existing position fixing devices need to fix the semiconductor chip on a placing frame through a traditional complex bolt fastening structure, but the fixing mode is very complicated and troublesome to operate, is very inconvenient to use, and also needs to disassemble each bolt fastener when the semiconductor chip needs to be taken out, and the disassembling process is also inconvenient, so that the production and processing processes of the semiconductor chip are greatly troublesome.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the current position fixing device that exists among the prior art and being not convenient for fix and dismantle, can bring very big trouble shortcoming for semiconductor chip's production and processing process, and the position fixing device is used in the semiconductor chip production and processing who provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
designing a position fixing device for producing and processing a semiconductor chip, comprising a base, wherein two sides of the upper surface of the base are respectively and fixedly connected with a supporting column, the upper ends of the two supporting columns are respectively and fixedly connected with a fixing mechanism, the two fixing mechanisms are oppositely arranged, the middle position of the upper surface of the base is fixedly connected with a placing frame, the semiconductor chip is placed on the placing frame and is fixedly arranged between the two fixing mechanisms, the fixing mechanism comprises a threaded sleeve, the threaded sleeve is fixedly connected with the upper end of the supporting column, a threaded rod is in threaded connection with the threaded sleeve in a penetrating way, one end of the threaded rod extends to one side of the threaded sleeve and is fixedly connected with a connector, two rotating rods are fixedly connected with the side wall of the connector in a mutually symmetrical way, and two third connecting rods are hinged with the outer side wall of the threaded sleeve in a mutually symmetrical way, two it has the head rod respectively to articulate is equallyd divide to third connecting rod one end, and two for relative setting between the head rod, two other fixedly connected with second connecting rod is equallyd divide to head rod one end, two it has the connecting seat respectively to articulate is equallyd divide to second connecting rod one end, two other fixedly connected with splint are equallyd divide to the relative one end of connecting seat, two be provided with the connecting block between the head rod, just the both ends of connecting block are equallyd divide and are articulated respectively two on the head rod, the middle part position of connecting block is run through ground fixedly connected with screwed pipe, just the other end of threaded rod is run through ground threaded connection among the.
Preferably, the two rotating rods are respectively fixedly sleeved with an anti-skidding sleeve, and the anti-skidding sleeves are rubber anti-skidding sleeves.
Preferably, two the relative one side of splint is equallyd divide and is glued the protective layer respectively, just the protective layer is the rubber pad.
Preferably, the middle position of the upper surface of the placing frame is provided with a through hole in a penetrating manner, and the through hole is positioned under the semiconductor chip.
Preferably, the bottom position of pillar lateral wall is a plurality of strengthening rib of circumference fixedly connected with uniformly, and a plurality of the strengthening rib is equallyd divide and is do not fixedly connected in on the base.
The utility model provides a pair of position fixing device is used in semiconductor chip production and processing, beneficial effect lies in: the position fixing device for producing and processing the semiconductor chip is designed with the fixing mechanism, through the arrangement of the fixing mechanism, when the semiconductor chip needs to be fixed, the connecting block can move along the horizontal direction by holding the rotating rod to rotate the threaded rod, and the moving connecting block can drive the two first connecting rods and the two second connecting rods to rotate inwards, so that the two clamping plates can clamp and fix the semiconductor chip; similarly, when the semiconductor chip needs to be loosened, the two clamping plates can be directly loosened only by reversely rotating the threaded rod, and then the semiconductor chip can be loosened. Therefore, through the design, the semiconductor chip can be quickly and conveniently clamped and fixed and loosened, the operation process is very simple, the use is very convenient, the clamping and fixing structure is stable and reliable, and the production and processing process of the semiconductor chip can be greatly facilitated.
Drawings
Fig. 1 is a schematic structural view of the position fixing device for semiconductor chip production and processing according to the present invention.
Fig. 2 is a structural plan view of the fixing mechanism in fig. 1.
Fig. 3 is a partial structural sectional view of fig. 2.
In the figure: the device comprises a base 1, a reinforcing rib 2, a fixing mechanism 3, a connecting head 301, a threaded sleeve 302, a connecting block 303, a first connecting rod 304, a second connecting rod 305, a connecting seat 306, a protective layer 307, a clamping plate 308, a threaded pipe 309, a third connecting rod 310, a threaded rod 311, a rotating rod 312, an anti-skidding sleeve 313, a semiconductor chip 4, a through hole 5, a placing frame 6 and a support 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, a position fixing device is used in semiconductor chip production and processing, including base 1, other fixedly connected with pillar 7 is equallyd divide to base 1 upper surface both sides, and the bottom position of pillar 7 lateral wall is circumference fixedly connected with a plurality of strengthening rib 2 uniformly, and a plurality of strengthening rib 2 is equallyd divide other fixed connection on base 1, through strengthening rib 2 add the setting to can strengthen the steadiness of connection structure between pillar 7 and the base 1 effectively, and then can strengthen the device overall structure's stability and fastness effectively.
Divide equally two 7 upper ends of pillar and do not fixedly connected with fixed establishment 3, and be relative setting between two fixed establishment 3, the middle part fixedly connected with rack 6 of base 1 upper surface, semiconductor chip 4 has been placed on rack 6, and semiconductor chip 4 is fixed to be set up between two fixed establishment 3, in the in-process of carrying out production and processing to semiconductor chip 4, place semiconductor chip 4 that will carry out processing earlier on rack 6, then the tight fixing of semiconductor chip 4 clamp is fixed with two fixed establishment 3 rethread.
The fixing mechanism 3 comprises a threaded sleeve 302, the threaded sleeve 302 is fixedly connected to the upper end of the pillar 7, a threaded rod 311 is in threaded connection with the threaded sleeve 302 in a penetrating manner, one end of the threaded rod 311 extends to one side of the threaded sleeve 302 and is fixedly connected with a connector 301, two rotating rods 312 are fixedly connected to the side wall of the connector 301 in a mutually symmetrical manner, two third connecting rods 310 are hinged to the outer side wall of the threaded sleeve 302 in a mutually symmetrical manner, one ends of the two third connecting rods 310 are respectively hinged to a first connecting rod 304 and are oppositely arranged between the two first connecting rods 304, one ends of the two first connecting rods 304 are respectively fixedly connected with a second connecting rod 305, one ends of the two second connecting rods 305 are respectively hinged to a connecting seat 306, the opposite ends of the two connecting seats 306 are respectively fixedly connected with a clamping plate 308, a connecting block 303 is arranged between the two first connecting rods 304, and two ends of, through the arrangement of the fixing mechanism 3, when the semiconductor chip 4 needs to be fixed, the rotating rod 312 is held to rotate the threaded rod 311, so that the connecting block 303 can move in the horizontal direction, the moving connecting block 303 can drive the two first connecting rods 304 and the two second connecting rods 305 to rotate inwards, and the two clamping plates 308 can clamp and fix the semiconductor chip 4; similarly, when it is necessary to release the semiconductor chip 4, the semiconductor chip 4 can be released by directly releasing the two clamp plates 308 by rotating the threaded rod 311 in the reverse direction. Therefore, through the design, the semiconductor chip 4 can be quickly and conveniently clamped and fixed and loosened, the operation process is very simple, the use is very convenient, the clamping and fixing structure is stable and reliable, and the production and processing process of the semiconductor chip 4 can be greatly facilitated.
Example 2
Referring to fig. 1-3, as another preferred embodiment of the present invention, the difference from embodiment 1 lies in that, two rotating rods 312 are equally divided into two fixed sleeves respectively equipped with an anti-slip sleeve 313, and the anti-slip sleeve 313 is a rubber anti-slip sleeve, and the anti-slip sleeve 313 made of rubber is added to the arrangement, so as to effectively play the anti-slip role, and further effectively avoid the situation of slipping in the operation and use process.
Example 3
Referring to fig. 1 to 3, as another preferred embodiment of the present invention, the difference from embodiment 1 is that two opposite clamping plates 308 are equally bonded with a protection layer 307, and the protection layer 307 is a rubber pad, and the protection layer 307 using the rubber pad is added, so as to effectively play the role of buffering and protecting the semiconductor chip 4, and effectively avoid the damage to the semiconductor chip 4 due to the excessive force of the two clamping plates 308.
Example 4
Referring to fig. 1, as another preferred embodiment of the present invention, the difference from embodiment 1 is that through opening 5 is opened through the middle position of the upper surface of placing frame 6, and through opening 5 is located under semiconductor chip 4, through the setting of through opening 5, the ventilation of placing semiconductor chip 4 at placing frame 6 can be increased, and the heat dissipation is facilitated.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (5)

1. The utility model provides a semiconductor chip is position fixing device for production and processing, includes base (1), its characterized in that, base (1) upper surface both sides are equallyd divide respectively fixedly connected with pillar (7), two do not fixedly connected with fixed establishment (3) are equallyd divide to pillar (7) upper end, and two be relative setting between fixed establishment (3), the middle part position fixedly connected with rack (6) of base (1) upper surface, semiconductor chip (4) have been placed on rack (6), just semiconductor chip (4) are fixed to be set up two between fixed establishment (3), fixed establishment (3) include threaded sleeve (302), threaded sleeve (302) fixed connection be in the upper end of pillar (7), run through ground threaded connection has threaded rod (311) in threaded sleeve (302), threaded rod (311) one end extends to one side and fixedly connected with connector of threaded sleeve (302) (301) Two rotating rods (312) are symmetrically and fixedly connected to the side wall of the connector (301), two third connecting rods (310) are symmetrically and hinged to the outer side wall of the threaded sleeve (302), one end of each third connecting rod (310) is hinged to a first connecting rod (304), the two first connecting rods (304) are oppositely arranged, one end of each first connecting rod (304) is hinged to a second connecting rod (305), one end of each second connecting rod (305) is hinged to a connecting seat (306), the opposite end of each connecting seat (306) is fixedly connected with a clamping plate (308), a connecting block (303) is arranged between the two first connecting rods (304), and the two ends of the connecting block (303) are hinged to the two first connecting rods (304), the middle position of the connecting block (303) is fixedly connected with a threaded pipe (309) in a penetrating mode, and the other end of the threaded rod (311) is connected in the threaded pipe (309) in a penetrating mode in a threaded mode.
2. The apparatus as claimed in claim 1, wherein the two rotation rods (312) are respectively provided with an anti-slip sleeve (313), and the anti-slip sleeves (313) are rubber anti-slip sleeves.
3. The apparatus as claimed in claim 1, wherein the opposing surfaces of the two clamping plates (308) are respectively adhered with a protective layer (307), and the protective layer (307) is a rubber pad.
4. The position fixing device for producing and processing the semiconductor chip as claimed in claim 1, wherein a through opening (5) is formed through the middle position of the upper surface of the placing frame (6), and the through opening (5) is located right below the semiconductor chip (4).
5. The position fixing device for semiconductor chip production and processing as claimed in claim 1, wherein a plurality of ribs (2) are fixedly connected to the bottom of the outer sidewall of the pillar (7) uniformly in the circumferential direction, and a plurality of ribs (2) are fixedly connected to the base (1) respectively.
CN202020660751.7U 2020-04-27 2020-04-27 Position fixing device is used in semiconductor chip production and processing Active CN211743120U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020660751.7U CN211743120U (en) 2020-04-27 2020-04-27 Position fixing device is used in semiconductor chip production and processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020660751.7U CN211743120U (en) 2020-04-27 2020-04-27 Position fixing device is used in semiconductor chip production and processing

Publications (1)

Publication Number Publication Date
CN211743120U true CN211743120U (en) 2020-10-23

Family

ID=72852542

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020660751.7U Active CN211743120U (en) 2020-04-27 2020-04-27 Position fixing device is used in semiconductor chip production and processing

Country Status (1)

Country Link
CN (1) CN211743120U (en)

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