CN211738506U

CN211738506U - Heat dissipation support of electronic equipment

Info

Publication number: CN211738506U
Application number: CN201921658066.4U
Authority: CN
Inventors: 何世友; 钟琼伟
Original assignee: Shenzhen Times Innovation Technology Co Ltd
Current assignee: Shenzhen Times Innovation Technology Co Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-10-23
Anticipated expiration: 2029-09-30

Abstract

The utility model provides a heat dissipation support of electronic equipment, including support shell, circuit board and interface module, the support shell includes the first support section and the second support section of interconnect, the first support section is used for supporting electronic equipment, the second support section is used for supporting in the mesa, first support section and second support section have the inner chamber respectively, the slope of first support section for the second support section makes the two form V font structure up, circuit board and interface module set up the inner chamber in the second support section, interface module electric connection circuit board; be provided with air inlet structure and air-out structure on the casing of first support section respectively, the fan setting in the inner chamber of first support section, and be located between air inlet structure and the air-out structure, the surface that first support section is used for supporting electronic equipment is the leading flank, and the air-out structure sets up in the leading flank. From this, the user more conveniently adjusts the electronic equipment angle, and application scope is extensive, and heat dispersion is better, can set up more interfaces, and the heat dissipation support is more miniaturized.

Description

Heat dissipation support of electronic equipment

Technical Field

The utility model relates to an electronic equipment accessory field particularly, relates to electronic equipment's heat dissipation support.

Background

In order to help heat dissipation of electronic devices such as notebook computers, a heat dissipation support with a fan appears on the market. The conventional heat dissipation support only has a heat dissipation function and is single in function.

With the development of the technology, a heat dissipation bracket with an interface appears in the prior art for providing functions such as charging and the like. However, the prior art has defects, and on one hand, the heat dissipation support in the market generally has large volume, heavy weight and small number of interfaces. On the other hand, the functions of the interface, the circuit board and the like in the market generate heat, so that the temperature of wind blowing to the electronic equipment by the fan is high, and the heat dissipation performance is poor.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides an electronic equipment's heat dissipation support, concrete technical scheme is as follows:

a heat dissipation support of electronic equipment comprises a support shell, a circuit board and an interface assembly, wherein the support shell comprises a first support section and a second support section which are connected with each other, the first support section is used for supporting the electronic equipment, the second support section is used for supporting a table board, the first support section and the second support section are respectively provided with an inner cavity, the first support section is inclined upwards relative to the second support section so that the first support section and the second support section form a V-shaped structure, the circuit board and the interface assembly are arranged in the inner cavity of the second support section, and the interface assembly is electrically connected with the circuit board;

be provided with air inlet structure and air-out structure on the casing of first support section respectively, the fan sets up the inner chamber of first support section, and be located the air inlet structure with between the air-out structure, the surface that first support section is used for supporting electronic equipment is the leading flank, the air-out structure sets up the leading flank.

In a specific embodiment, at the joint between the first support section and the second support section, the inner cavity of the first support section and the inner cavity of the second support section are communicated, so that the inner cavities between the first support section and the second support section jointly form a V-shaped cavity.

In a particular embodiment, the first support section and the second support section are of integrally formed construction.

In a specific embodiment, a side of the first support section facing the second support section is a rear side, and the air inlet structure is disposed at the rear side of the first support section.

In a specific embodiment, the air outlet structure includes a plurality of air outlet grid holes formed on the front side surface, the air inlet structure includes an air inlet plate movably disposed at the rear side of the first support section, and the air inlet plate is provided with a plurality of air inlet grid holes.

In a specific embodiment, a sliding groove is formed in the rear side of the first support section, and the air inlet plate is slidably arranged in the sliding groove, so that the air inlet plate can be pulled out from the rear side of the first support section.

In a specific embodiment, the air inlet plate is flush with the rear shell of the first support section, and a groove is formed in the outer edge of the rear shell of the first support section and used for a user to insert a finger into the groove to clamp the air inlet plate.

In a specific embodiment, the electronic device includes a notebook computer, the interface assembly includes a plurality of interfaces, each of the interfaces is distributed at intervals on the housing of the second support section, each of the interfaces includes a plurality of charging interfaces, an audio interface, a TF/SD card interface, a network interface, and a television interface, and the charging interface includes a USB interface, a Type-C interface, or a Lighting interface.

In a specific embodiment, a mesh slot and a slot cover are arranged on the shell of the second support section, a network interface is arranged in the mesh slot, and the slot cover is configured to open or close the mesh slot.

In a specific embodiment, the front side surface of the first supporting section is provided with a rubber pad for contacting the electronic equipment;

and/or a rubber pad is arranged on the bottom surface of the second support section, which is used for contacting the table top.

The utility model discloses following beneficial effect has at least:

according to the utility model provides a heat dissipation support of electronic equipment, including support shell, circuit board and interface module, the support shell includes first support section and the second support section of interconnect, first support section is used for supporting electronic equipment, the second support section is used for supporting in the mesa, first support section and second support section have the inner chamber respectively, first support section makes the two form V font structure for the slope of second support section up, circuit board and interface module set up the inner chamber at the second support section, interface module electric connection circuit board; be provided with air inlet structure and air-out structure on the casing of first support section respectively, the fan setting in the inner chamber of first support section, and be located between air inlet structure and the air-out structure, the surface that first support section is used for supporting electronic equipment is the leading flank, and the air-out structure sets up in the leading flank.

Therefore, the side surface V-shaped form is combined with ergonomics, so that the electronic equipment such as a notebook computer and the like can be placed to generate the most comfortable inclination angle, the specific height of the electronic equipment can be adjusted according to personal conditions, and the application range is wide. And, first support section and second support section have the inner chamber respectively, and one is used for giving the electronic equipment heat dissipation, and another is used for setting up interface module and then expands the function of heat dissipation support. On one hand, the circuit board and the interface assembly which generate heat are relatively separated from the fan, so that the fan can guide wind with lower temperature, and the electronic equipment is better cooled. Moreover, the first supporting section and the second supporting section are inclined upwards relative to each other to form a V-shaped structure, and when the first supporting section and the second supporting section have the same or even more functional parts, the whole space of the table board is occupied by the heat dissipation support, so that the heat dissipation support is more miniaturized.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a first perspective view of a heat dissipation bracket of an electronic device in an embodiment;

FIG. 2 is a second perspective view of a heat sink bracket of an electronic device in an embodiment;

FIG. 3 is a perspective view of the heat dissipating bracket of the electronic device in the embodiment when the air inlet plate is pulled out;

FIG. 4 is an exploded view of a heat dissipating bracket of an electronic device in an embodiment;

fig. 5 is a sectional view of a heat dissipating bracket of an electronic apparatus in an embodiment.

Description of the main element symbols:

1-a first support section; 2-a second support section; 3-air outlet structure; 4-a rubber cushion; 5-air inlet structure; 6-groove; 7-USB interface; 8-a mesh slot; 9-a slot cover; 10-an air inlet plate; 11-a circuit board; 12-Fan.

Detailed Description

Examples

As shown in fig. 1 to 5, the present embodiment provides a heat dissipation bracket for an electronic device, which includes a support housing, a circuit board 11, and an interface assembly. Among them, the electronic device is preferably a notebook computer. The support shell comprises a first support section 1 and a second support section 2 which are connected with each other, wherein the connection mode between the first support section 1 and the second support section 2 is an integral forming mode or a non-integral forming mode, and fig. 1-5 show the integral forming mode, and the complete support shell is formed after the first support section 1 and the second support section are connected with each other. First support section 1 is used for supporting electronic equipment, and second support section 2 is used for supporting in the mesa, and first support section 1 and second support section 2 have the inner chamber respectively, and first support section 1 makes the two form V font structure for the slope of second support section 2 makes up, and circuit board 11 and interface module set up in the inner chamber of second support section 2, interface module electric connection circuit board 11.

Be provided with air inlet structure 5 and air-out structure 3 on first support section 1's the casing respectively, fan 12 sets up in first support section 1's inner chamber, and is located between air inlet structure 5 and the air-out structure 3, and first support section 1 is used for supporting electronic equipment's surface and is the leading flank, and air-out structure 3 sets up in the leading flank. Wherein the number of fans 12 is one or more, fig. 4 shows an embodiment in which the number of fans 12 is 2.

As shown in fig. 5, at the joint between the first supporting section 1 and the second supporting section 2, the inner cavity of the first supporting section 1 is communicated with the inner cavity of the second supporting section 2, so that the inner cavities between the first supporting section 1 and the second supporting section 2 jointly form a V-shaped cavity. It should be noted that the communication between the inner cavity of the first support section 1 and the inner cavity of the second support section 2 is only a preferred embodiment, which enables the fan 12 to blow a part of the air flow into the inner cavity of the second support section 2 to dissipate heat of the circuit board 11 and the interface assembly. In other embodiments, the inner cavity of the first supporting section 1 and the inner cavity of the second supporting section 2 may also be separated, and heat dissipation holes are directly formed in the casing of the second supporting section 2, so as to dissipate heat of the circuit board 11 and the interface assembly.

As shown in fig. 2-5, the side of the first support section 1 facing the second support section 2 is the rear side, and the air intake structure 5 is disposed at the rear side of the first support section 1.

In this embodiment, the air outlet structure 3 includes a plurality of air outlet grid holes formed on the front side surface, the air inlet structure 5 includes an air inlet plate 10, the air inlet plate 10 is movably disposed on the rear side of the first supporting section 1, and the air inlet plate 10 is provided with a plurality of air inlet grid holes.

Therefore, the side surface V-shaped form is combined with ergonomics, so that the electronic equipment such as a notebook computer and the like can be placed to generate the most comfortable inclination angle, the specific height of the electronic equipment can be adjusted according to personal conditions, and the application range is wide. Moreover, the first supporting section 1 and the second supporting section 2 are respectively provided with an inner cavity, one is used for radiating heat for the electronic equipment, and the other is used for setting an interface component so as to expand the function of the radiating support. On the one hand, the circuit board 11 and the interface assembly which generate heat are relatively separated from the fan 12, so that the fan 12 can guide wind with lower temperature to help the electronic equipment to dissipate heat better. Moreover, the first supporting section 1 is inclined upwards relative to the second supporting section 2 so that the first supporting section and the second supporting section form a V-shaped structure, and when the first supporting section and the second supporting section have the same or even more functional parts, the whole space of the table board is occupied by the heat dissipation support to a lower degree, so that the heat dissipation support is more miniaturized.

In this embodiment, a sliding slot (not shown) is formed at the rear side of the first support section 1, and the air inlet plate 10 is slidably disposed in the sliding slot, so that the air inlet plate 10 can be pulled out from the rear side of the first support section 1 (as shown in fig. 3). Therefore, a user can pull the air inlet plate 10 to clean dust in daily use, grid holes in the air inlet plate 10 are prevented from being blocked, and the heat dissipation support can be used for a long time.

Preferably, the air inlet plate 10 is flush with the rear shell of the first support section 1, and the outer edge of the rear shell of the first support section 1 is provided with a groove 6 for a user to insert fingers into the groove 6 to clamp the air inlet plate 10.

In this embodiment, the interface assembly includes a plurality of interfaces, and each interface interval distribution is on the casing of second support section 2, and each interface includes the multiple in interface, audio interface, TF/SD card interface, net gape, the TV interface that charges, and the interface that charges includes USB interface 7, Type-C interface or Lighting interface. Therefore, the heat dissipation support in the embodiment has multiple interface functions, can meet multiple functions of audio and video transmission, communication, charging and the like, and can not influence the heat dissipation function of the fan 12 even if more interfaces are arranged in the inner cavity of the second support section 2 due to the fact that the circuit board 11 and the interface assembly which generate heat are relatively separated from the fan 12.

As shown in fig. 2 and 4, a mesh opening groove 8 and a groove cover 9 are provided on the housing of the second support section 2, a network interface is provided in the mesh opening groove 8, and the groove cover 9 is configured to open or close the mesh opening groove 8. But flip formula net gape can make whole size compacter, makes the product lighter and more handy.

In this embodiment, the front side surface of the first support section 1 is provided with a rubber pad 4 for contacting the electronic device, and the bottom surface of the second support section 2 for contacting the table top is also provided with a rubber pad 4. Therefore, the electronic equipment such as the notebook computer and the like can be placed more stably and reliably.

Those skilled in the art will appreciate that the drawings are merely schematic representations of one preferred implementation scenario and that the blocks or flow diagrams in the drawings are not necessarily required to practice the present invention.

Those skilled in the art will appreciate that the modules in the devices in the implementation scenario may be distributed in the devices in the implementation scenario according to the description of the implementation scenario, or may be located in one or more devices different from the present implementation scenario with corresponding changes. The modules of the implementation scenario may be combined into one module, or may be further split into a plurality of sub-modules.

The sequence numbers of the present invention are only for description, and do not represent the advantages and disadvantages of the implementation scenario.

The above disclosure is only a few specific implementation scenarios of the present invention, however, the present invention is not limited thereto, and any changes that can be considered by those skilled in the art shall fall within the protection scope of the present invention.

Claims

1. The heat dissipation support for the electronic equipment is characterized by comprising a support shell, a circuit board and an interface assembly, wherein the support shell comprises a first support section and a second support section which are connected with each other, the first support section is used for supporting the electronic equipment, the second support section is used for supporting a table board, the first support section and the second support section are respectively provided with an inner cavity, the first support section inclines upwards relative to the second support section to enable the first support section and the second support section to form a V-shaped structure, the circuit board and the interface assembly are arranged in the inner cavity of the second support section, and the interface assembly is electrically connected with the circuit board;

2. The heat dissipation support of electronic device of claim 1, wherein at a junction between the first support section and the second support section, an inner cavity of the first support section and an inner cavity of the second support section are in communication, such that the inner cavities between the first support section and the second support section together form a V-shaped cavity.

3. The heat dissipation bracket of electronic equipment according to claim 1, wherein the first support section and the second support section are an integrally formed structure.

4. The heat dissipating bracket of an electronic device according to claim 2, wherein a side of the first supporting section facing the second supporting section is a rear side, and the air inlet structure is disposed at the rear side of the first supporting section.

5. The heat dissipating bracket of an electronic device as recited in claim 4, wherein the air outlet structure comprises a plurality of air outlet grille holes formed in the front side surface, and the air inlet structure comprises an air inlet plate movably disposed at a rear side of the first support section, the air inlet plate having a plurality of air inlet grille holes disposed therein.

6. The heat dissipating bracket of an electronic device as recited in claim 5, wherein a sliding groove is formed at a rear side of the first supporting section, and the air inlet plate is slidably disposed in the sliding groove so that the air inlet plate can be pulled out from the rear side of the first supporting section.

7. The heat dissipating bracket of an electronic device as recited in claim 6, wherein the air inlet plate is flush with the rear housing of the first support section, and a groove is provided in an outer edge of the rear housing of the first support section for a user to insert a finger into the groove to hold the air inlet plate.

8. The heat dissipation bracket of electronic equipment according to claim 1, wherein the electronic equipment comprises a notebook computer, the interface assembly comprises a plurality of interfaces, each of the interfaces is distributed on the housing of the second support section at intervals, each of the interfaces comprises a plurality of charging interfaces, an audio interface, a TF/SD card interface, a network interface, and a television interface, and the charging interfaces comprise USB interfaces, Type-C interfaces, or Lighting interfaces.

9. The heat dissipation bracket of electronic equipment according to claim 8, wherein a mesh slot and a slot cover are provided on the housing of the second support section, the mesh slot having a network interface disposed therein, the slot cover being configured to open or close the mesh slot.

10. The heat dissipation bracket of electronic equipment according to claim 1, wherein a rubber pad for contacting the electronic equipment is disposed on a front side surface of the first support section;