CN211722782U

CN211722782U - Electric kettle with semiconductor refrigerating device

Info

Publication number: CN211722782U
Application number: CN201922190064.3U
Authority: CN
Inventors: 夏永丰
Original assignee: Zhongshan Shundian Electronic Co ltd
Current assignee: Zhongshan Shundian Electronic Co ltd
Priority date: 2019-12-10
Filing date: 2019-12-10
Publication date: 2020-10-23
Anticipated expiration: 2029-12-10

Abstract

The utility model discloses an electric kettle with a semiconductor refrigerating device, which comprises a kettle body and a base, wherein the kettle body comprises a kettle body shell and an inner container, and a clearance cavity is arranged between the kettle body shell and the inner container; the gap cavity is communicated from the upper end of the kettle body to the outer side of the lower end; the gap cavity is sequentially provided with a water-tilting prevention device and a semiconductor refrigerating device from top to bottom; the water-tilting prevention device is hollow cylindrical and is sleeved on the outer wall of the inner container, and the circular surface of the upper end and the opening of the inner container are positioned on the same horizontal plane. The utility model has the function of preventing water from inclining and leaking by arranging the anti-water-tipping device and the semiconductor refrigerating device which are provided with openings positioned on the outer side of the circumference of the kettle mouth and the outer side of the kettle mouth between the kettle body shell and the inner container from top to bottom, and effectively solves the problem that boiled water easily overflows or flows out of the outer side of the kettle body when in use; meanwhile, the water-cooling and refrigerating device has the functions of cooling and refrigerating, can quickly cool and refrigerate boiled water to achieve the purpose of timely drinking, and is convenient and quick to use and high in practicability.

Description

Electric kettle with semiconductor refrigerating device

Technical Field

The utility model relates to an electric kettle technical field especially relates to an electric kettle with semiconductor refrigerating plant.

Background

In the prior art, an electric kettle generally has basic functions of water boiling, heat preservation and the like, the boiled water is too high in temperature and is not suitable for direct drinking, and the water can be drunk only after the water temperature is reduced, so that great inconvenience is brought to people who are suitable for fast-paced life in modern times, and the practicability is lacked;

after the existing electric kettle is boiled with boiled water, a user holds the handle to move, the electric kettle can incline, the boiled water is easy to overflow or flow out of the outer side of the kettle body and splash on a table or the ground, inconvenience is brought to life of people, and the user can be scalded.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide an electric kettle with a semiconductor refrigerating device, which has the function of preventing water from inclining and leaking by arranging a water-inclining-preventing device and a semiconductor refrigerating device between a shell and an inner container, wherein the openings of the water-inclining-preventing device and the semiconductor refrigerating device are positioned on the outer side of the circumference of a kettle opening and the outer side of a kettle mouth from top to bottom, thereby effectively solving the problem that boiled water easily overflows or flows out of the outer side of a kettle body when; meanwhile, the water-cooling and refrigerating device has the functions of cooling and refrigerating, can quickly cool and refrigerate boiled water to achieve the purpose of timely drinking, and is convenient and quick to use and high in practicability.

The utility model discloses the technical scheme who adopts as follows:

an electric kettle with a semiconductor refrigerating device comprises a kettle body and a base, and is characterized in that the kettle body comprises a kettle body shell and an inner container, and a gap cavity is arranged between the kettle body shell and the inner container; the gap cavity is communicated from the upper end of the kettle body to the outer side of the lower end; the gap cavity is sequentially provided with a water-tilting prevention device and a semiconductor refrigerating device from top to bottom; the water-dumping prevention device is hollow cylindrical and is sleeved on the outer wall of the inner container, and the circular surface of the upper end of the water-dumping prevention device and the opening of the inner container are positioned on the same horizontal plane; the circular surface of the upper end of the water-dumping-preventing device is provided with a water storage cavity penetrating to the inner side of the bottom of the water-dumping-preventing device; the water diversion grooves are formed in the outer sides of the periphery of the spout and are communicated with the water storage cavity;

the semiconductor refrigerating device is in a hollow cylindrical shape and is sleeved on the outer wall of the middle lower part of the inner container; the semiconductor refrigerating device comprises a cold surface and a hot surface, the cold surface is tightly attached to the outer wall of the inner container, and radiating fins are arranged on the hot surface.

Preferably, the base comprises a heating module matched with the bottom of the inner container, a cooling fan used for cooling the semiconductor refrigerating device and a base shell connected with the bottom of the kettle body shell in sequence from top to bottom.

Preferably, the heating module is in a plano-convex lens shape, and the diameter of the heating module is equal to the outer diameter of the inner container; the plane of the heating module is connected with the bottom of the inner container; a plurality of support columns are arranged between the heating module and the base shell, the support columns are uniformly distributed along the radial circumference of the axis of the heating module, one end of each support column is connected with the convex surface of the heating module, and the other end of each support column is connected with the inner side of the bottom of the base shell; the cooling fan is fixedly arranged on the inner side of the bottom of the base shell and is coaxial with the heating module.

Preferably, a heat dissipation cavity is formed between the inner side of the base shell and the convex surface of the heating module, and the heat dissipation cavity is communicated with the gap cavity.

Preferably, a plurality of radiating grids which are uniformly distributed along the radial circumference of the axis of the kettle body shell are arranged at the positions of the kettle body shell corresponding to the radiating fins; the side of the base shell is provided with a plurality of air inlet grids which are uniformly distributed along the radial circumference of the axis of the base shell.

Preferably, the bottom of the water-tilting prevention device is provided with a water outlet, the water outlet is perpendicular to the axis of the kettle body and penetrates through the kettle body shell to the outer side; the water outlet is provided with a sealing plug.

Preferably, the heat sink is provided with heat dissipation fins facing the heat dissipation grid.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model has the function of preventing water from inclining and leaking by arranging the anti-water-tipping device and the semiconductor refrigerating device which are provided with openings positioned on the outer side of the circumference of the kettle mouth and the outer side of the kettle mouth between the kettle body shell and the inner container from top to bottom, and effectively solves the problem that boiled water easily overflows or flows out of the outer side of the kettle body when in use; meanwhile, the water-cooling and refrigerating device has the functions of cooling and refrigerating, can quickly cool and refrigerate boiled water to achieve the purpose of timely drinking, and is convenient and quick to use and high in practicability.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a top view of the present invention;

FIG. 3 is a schematic view of the cross-sectional structure A-A of FIG. 2;

FIG. 4 is a schematic view of the cross-sectional structure B-B in FIG. 1;

FIG. 5 is an enlarged schematic view at C in FIG. 4;

wherein: the kettle body 1, the base 2, the spout 3, the inner container 4, the kettle body shell 5, the water-tilting prevention device 6, the radiating fins 7, the semiconductor refrigerating device 8, the gap cavity 9, the base shell 21, the heating module 22, the radiating fan 23, the supporting column 24, the radiating cavity 25, the water guide groove 31, the radiating grid 51, the water storage cavity 61, the water outlet 62, the sealing plug 63, the radiating fins 71, the air inlet grid 210, the hot surface 8a, the cold surface 8b, the plane 22a and the convex surface 22 b.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "front," "back," "left," "right," "up," "down," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The invention will be further described with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1-5, an electric kettle with a semiconductor refrigeration device comprises a kettle body 1 and a base 2, and is characterized in that the kettle body 1 comprises a kettle body shell 5 and an inner container 4, and a gap cavity 9 is arranged between the kettle body shell 5 and the inner container 4; the gap cavity 9 is communicated from the upper end of the kettle body 1 to the outer side of the lower end; the gap cavity 9 is sequentially provided with a water-tilting prevention device 6 and a semiconductor refrigerating device 8 from top to bottom; the water-dumping prevention device 6 is hollow cylindrical and is sleeved on the outer wall of the inner container 4, and the circular surface of the upper end and the opening of the inner container 4 are positioned on the same horizontal plane; the circular surface of the upper end of the water-dumping-preventing device 6 is provided with a water storage cavity 61 penetrating to the inner side of the bottom of the water-dumping-preventing device 6; the diversion grooves 31 are formed in the outer sides of the periphery of the spout 3 of the water-tilting prevention device 6, and the diversion grooves 31 are communicated with the water storage cavity 61; when in use, boiled water flows out of the kettle body 1 and directly flows into the water storage cavity 61 and the water diversion groove 31, thereby preventing the boiled water from flowing onto the kettle body shell 5.

The semiconductor refrigerating device 8 is in a hollow cylindrical shape and is sleeved on the outer wall of the middle lower part of the inner container 4; the semiconductor refrigerating device 8 comprises a cold surface 8b and a hot surface 8a, the cold surface 8b is tightly attached to the outer wall of the inner container 4, and the hot surface 8a is provided with a radiating fin 7.

In the embodiment, when the boiled water is required to be used as the sound, the cold energy generated by the cold surface 8b of the semiconductor refrigerating device 8 is transmitted to the boiled water through the inner container, and the cold energy absorbs the heat of the boiled water, so that the purposes of cooling and refrigerating the boiled water and drinking quickly are achieved; in addition, heat generated by the operation of the hot side 8a of the semiconductor refrigeration device 8 is dissipated by the heat sink 7.

Further, the base 2 comprises, from top to bottom, a heating module 22 matched with the bottom of the inner container 4, a cooling fan 23 for cooling the semiconductor cooling device 8, and a base housing 21 connected with the bottom of the kettle body housing 5.

Further, the heating module 22 is in a shape of a plano-convex lens, and the diameter of the heating module is equal to the outer diameter of the inner container 4; the plane 22a of the heating module 22 is connected with the bottom of the inner container 4; a plurality of support columns 24 are arranged between the heating module 22 and the base shell 21, the support columns 24 are uniformly distributed along the radial circumference of the axis of the heating module 22, one end of each support column is connected with the convex surface 22b of the heating module 22, and the other end of each support column is connected with the inner side of the bottom of the base shell 21; the heat dissipation fan 23 is fixedly disposed at the inner side of the bottom of the base housing 21 and is disposed coaxially with the heating module 22.

Further, a heat dissipation cavity 25 is formed between the inner side of the base housing 21 and the convex surface 22b of the heating module 22, and the heat dissipation cavity 25 is communicated with the gap cavity 9.

In this embodiment, the airflow generated by the driving of the heat dissipation fan 23 is blown from the heat dissipation cavity 25 to the heat dissipation fins 7 in the gap cavity 9 by the guiding action of the convex surface 22b of the heating module 22, so as to realize effective heat dissipation for the semiconductor refrigeration device 8.

Furthermore, a plurality of radiating grids 51 which are uniformly distributed along the radial circumference of the axis of the kettle body shell 5 are arranged at the positions of the kettle body shell 5 corresponding to the radiating fins 7; the side surface of the base shell 21 is provided with a plurality of air inlet grids 210 which are uniformly distributed along the radial circumference of the axis of the base shell; under the action of the heat dissipation fan 23, the external air enters the heat dissipation cavity 25 from the air inlet grid 210, then enters the gap cavity 9 from the heat dissipation cavity 25, contacts with the heat dissipation fins 7 for heat exchange, and finally is discharged from the heat dissipation grid 51, so that the temperature of the hot surface 8a of the semiconductor refrigeration device 8 is effectively reduced.

Further, a water outlet 62 is arranged at the bottom of the water-tilting prevention device 6, the water outlet 62 is perpendicular to the axis of the kettle body 1 and penetrates through the kettle body shell 5 to the outer side; the drain port 62 is provided with a sealing plug 63; the drain port 62 is used to drain the water stored in the water storage chamber 61 in the anti-toppling device 6.

Further, the heat sink 7 is provided with heat dissipation fins 71 facing the heat dissipation grid 51; the heat dissipation fins 71 can transfer the heat from the hot surface 8a to the heat dissipation grid 51 for dissipation, thereby further increasing the heat dissipation effect of the semiconductor refrigeration device 8.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the present invention.

Claims

1. An electric kettle with a semiconductor refrigerating device comprises a kettle body and a base, and is characterized in that the kettle body comprises a kettle body shell and an inner container, and a gap cavity is arranged between the kettle body shell and the inner container; the gap cavity is communicated from the upper end of the kettle body to the outer side of the lower end; the gap cavity is sequentially provided with a water-tilting prevention device and a semiconductor refrigerating device from top to bottom; the water-dumping prevention device is hollow cylindrical and is sleeved on the outer wall of the inner container, and the circular surface of the upper end of the water-dumping prevention device and the opening of the inner container are positioned on the same horizontal plane; the circular surface of the upper end of the water-dumping-preventing device is provided with a water storage cavity penetrating to the inner side of the bottom of the water-dumping-preventing device; the water diversion grooves are formed in the outer sides of the periphery of the spout and are communicated with the water storage cavity;

2. The electric kettle with the semiconductor refrigerating device as claimed in claim 1, wherein the base comprises a heating module matched with the bottom of the inner container, a heat dissipation fan used for dissipating heat of the semiconductor refrigerating device and a base shell connected with the bottom of the kettle body shell in sequence from top to bottom.

3. The electric kettle with the semiconductor refrigerating device as claimed in claim 2, wherein the heating module is in a plano-convex lens shape, and the diameter of the heating module is equal to the outer diameter of the inner container; the plane of the heating module is connected with the bottom of the inner container; a plurality of support columns are arranged between the heating module and the base shell, the support columns are uniformly distributed along the radial circumference of the axis of the heating module, one end of each support column is connected with the convex surface of the heating module, and the other end of each support column is connected with the inner side of the bottom of the base shell; the cooling fan is fixedly arranged on the inner side of the bottom of the base shell and is coaxial with the heating module.

4. The electric kettle with the semiconductor refrigerating device as claimed in claim 2, wherein a heat dissipation cavity is formed between the inner side of the base shell and the convex surface of the heating module, and the heat dissipation cavity is communicated with the gap cavity.

5. The electric kettle with the semiconductor refrigerating device as claimed in claim 2, wherein a plurality of heat dissipation grids are uniformly distributed along the radial circumference of the axis of the kettle body shell at positions corresponding to the heat dissipation fins on the kettle body shell; the side of the base shell is provided with a plurality of air inlet grids which are uniformly distributed along the radial circumference of the axis of the base shell.

6. The electric kettle with the semiconductor refrigerating device as claimed in claim 1, wherein a water outlet is arranged at the bottom of the water-tilting prevention device, is perpendicular to the axis of the kettle body, and penetrates through the kettle body shell to the outer side; the water outlet is provided with a sealing plug.

7. The electric kettle with the semiconductor refrigerating device as claimed in claim 1, wherein the heat sink is provided with heat dissipating fins facing the heat dissipating grid.