CN211694799U - Vertical reflection white light mirror cooling structure for synchrotron radiation beam line - Google Patents
Vertical reflection white light mirror cooling structure for synchrotron radiation beam line Download PDFInfo
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- CN211694799U CN211694799U CN202020201746.XU CN202020201746U CN211694799U CN 211694799 U CN211694799 U CN 211694799U CN 202020201746 U CN202020201746 U CN 202020201746U CN 211694799 U CN211694799 U CN 211694799U
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- cooling structure
- gallium solution
- indium gallium
- indium
- optical element
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- 238000001816 cooling Methods 0.000 title claims abstract description 97
- 230000005469 synchrotron radiation Effects 0.000 title claims abstract description 22
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 75
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 54
- 229910052738 indium Inorganic materials 0.000 claims abstract description 54
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000013078 crystal Substances 0.000 claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 39
- 239000010703 silicon Substances 0.000 claims abstract description 39
- 230000003287 optical effect Effects 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004874 x-ray synchrotron radiation Methods 0.000 description 1
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Abstract
The utility model discloses a vertical reflection white light mirror cooling structure used on a synchrotron radiation beam line, which is characterized by comprising an optical element silicon crystal (1), a first cooling structure (2) and a second cooling structure (3); the upper surface of the optical element silicon crystal (1) is used as a mirror surface, and a first indium gallium solution tank (4) and a second indium gallium solution tank (5) are arranged on the upper surface of the optical element silicon crystal (1); one end of the first cooling structure (2) is used for being immersed into the indium gallium solution injected into the first indium gallium solution tank (4) to cool the silicon crystal (1) of the optical element; one end of the second cooling structure (3) is used for being immersed into the indium gallium solution injected into the second indium gallium solution tank (5) to cool the optical element silicon crystal (1). The utility model discloses can control vibration and mechanical clamping problem that below 0.1ura and no rivers lead to thermal deformation.
Description
Technical Field
The utility model belongs to the technical field of the synchrotron radiation, a vertical reflection white light mirror cooling structure for on synchrotron radiation bunch is related to.
Background
The white light mirror is a core component of the synchrotron radiation device, and is used as a first optical element on a beam line, when synchrotron radiation light grazes and enters the white light mirror, a part of the synchrotron radiation light is reflected out, but most of photons are deposited on the white light mirror to bring huge heat load. After the white light mirror absorbs the heat power of the light source, the white light mirror is heated to generate temperature rise, temperature gradient is caused due to uneven irradiation of the light source, and finally thermal deformation is caused, as shown in fig. 1, the surface or crystal face of the white light mirror generates distortion, and finally the transmission efficiency and the transmission quality of synchronous light are reduced.
The fourth generation high-energy synchrotron radiation light source is characterized by high brightness, high flux and low emittance, and the high-precision wavefront surface shape of the fourth generation high-energy synchrotron radiation light source becomes one of bottlenecks which limit the further improvement of the performance of the X-ray synchrotron radiation light source. Several synchronous radiation light sources at home and abroad are designed to meet the requirement of a cooling structure according to the thermal load and the thermal deformation index thereof born by the white light mirror. According to the requirement of corresponding beam lines, the French ESRF compares the effects of several cooling schemes of bottom cooling, side full cooling, side partial cooling and upper surface partial cooling, finally selects side partial cooling, and optimizes parameters such as grooving position, depth and size to ensure that the surface thermal deformation under the action of specific thermal load is minimum, the effect of light spot and mirror body equal length is best, but the cooling structure has clamping mechanical deformation and vibration caused by cooling pipeline fluid can be conducted on the mirror body. Compared with two schemes of direct cooling inside the mirror body and indirect cooling of the side part, the American APSU light source has high manufacturing cost and high sealing difficulty, and the American APSU light source also has the problems of clamping deformation and vibration. The Spanish ALBS light source white light mirror adopts the structure that the upper surface of the mirror body is provided with a groove, and indium gallium solution is injected, so that the problems of mechanical deformation of a cooling structure and clamping and vibration caused by cooling pipeline fluid are solved, but a stress slow release groove is not formed in the side surface, and the thermal deformation cannot be modulated. The Shanghai SSRF light source white light mirror adopts a structure that the side surface is partially cooled but is not provided with a stress slow release groove, a groove is formed at the contact part of an oxygen-free copper pipeline and a mirror body, the cooled mirror body is unequal to a light spot, and the error of the thermal deformation slope is 0.77urad at the minimum.
SUMMERY OF THE UTILITY MODEL
In order to overcome the vibration and clamping problems of the conventional synchronous radiation vertical reflection white light mirror cooling structure and the problem of insufficient thermal deformation inhibition, the application provides a vertical reflection white light mirror cooling structure for a synchronous radiation beam line.
The technical scheme of the utility model is that:
a vertical reflection white light mirror cooling structure used on a synchrotron radiation beam line is characterized by comprising an optical element silicon crystal 1, a first cooling structure 2 and a second cooling structure 3; taking the upper surface of the optical element silicon crystal 1 as a mirror surface, wherein the upper surface of the optical element silicon crystal 1 is provided with a first indium gallium solution tank 4 and a second indium gallium solution tank 5; one end of the first cooling structure 2 is used for being immersed into the indium gallium solution injected into the first indium gallium solution tank 4 to cool the optical element silicon crystal 1; one end of the second cooling structure 3 is used for immersing the indium gallium solution injected into the second indium gallium solution tank 5 to cool the optical element silicon crystal 1.
Further, the first indium gallium solution tank 4 and the second indium gallium solution tank 5 are parallel to the incident light direction.
Further, the depth and width of the first indium gallium solution tank 4 and the second indium gallium solution tank 5 are 10mm and 5mm, respectively.
Further, the depth of the indium-gallium solution which is immersed into the first indium-gallium solution tank 4 by the first cooling structure 2 is 6mm, the liquid level of the indium-gallium solution in the first indium-gallium solution tank 4 is 2mm lower than the upper surface of the optical element silicon crystal 1, the distance between the side surface of the first indium-gallium solution tank 4 and the outer edge of the immersed end of the first cooling structure 2 is 1.5mm, and the distance between the bottom of the first indium-gallium solution tank 4 and the bottom of the immersed end of the first cooling structure 2 is 2 mm; the depth of the second cooling structure 3 immersed into the indium-gallium solution in the second indium-gallium solution tank 5 is 6mm, the liquid level of the indium-gallium solution in the second indium-gallium solution tank 5 is 2mm lower than the upper surface of the optical element silicon crystal 1, the distance between the side surface of the second indium-gallium solution tank 5 and the outer edge of the immersed end of the second cooling structure 3 is 1.5mm, and the distance between the bottom of the second indium-gallium solution tank 5 and the bottom of the immersed end of the second cooling structure 3 is 2 mm.
Furthermore, two side surfaces of the optical element silicon crystal 1 parallel to the direction of the indium gallium solution tank are respectively provided with a stress slow release tank.
Further, the stress slow-release groove is parallel to the first indium gallium solution groove 4 and the second indium gallium solution groove 5, and the opening width and the depth of the stress slow-release groove are respectively 10mm and 9.5 mm.
Furthermore, the first cooling structure 2 and the second cooling structure 3 have the same structure and comprise a columnar structure, one side of the columnar structure is provided with a protruding structure, a cooling channel is arranged in the columnar structure, and the protruding structure is immersed in the groove filled with the indium-gallium solution.
Further, the first cooling structure 2 and the second cooling structure 3 are both cooling structure oxygen-free copper.
Further, the length of the optical element silicon crystal 1 is equal to the lighting length of the incident light, and the lengths of the first cooling structure 2 and the second cooling structure 3 are equal to the lighting length of the incident light.
The vertical reflection white light mirror cooling structure comprises an optical element silicon crystal, a cooling structure oxygen-free copper, an indium gallium solution tank and a cooling channel, and the geometric dimensions and the structural arrangement of the cooling structure oxygen-free copper, the indium gallium solution tank and the cooling channel.
The length, width and height of the optical element silicon crystal 1 are equal to the lighting length of the incident light, and are respectively as follows: 544mm, 60mm, two grooves (i.e. a first indium gallium solution groove 4 and a second indium gallium solution groove 5) are opened on the upper surface (surface as a mirror surface) of the optical element silicon crystal 1 for injecting indium gallium solution, and the depth and width of the grooves are respectively: 10mm and 5mm, the depth of the stress slow-release groove is formed on the side surface of the silicon crystal 1 of the optical element, the calculation optimization is needed, and the height is 10 mm.
The length of the oxygen-free copper of the cooling structure is equal to the lighting length of incident light, is 544mm, and is immersed into the indium gallium solution for 6 mm.
The liquid level of the indium-gallium solution is 2mm lower than the surface of the optical element silicon crystal 1, the distance between the side surface of the groove on the upper surface of the optical element silicon crystal 1 and the outer edge of the oxygen-free copper of the cooling structure is 1.5mm, and the distance between the bottom of the groove and the bottom of the oxygen-free copper of the cooling structure is 2 mm.
The cooling channel is a circular pipeline with the diameter of 6mm and the length equal to that of the silicon crystal 1 of the optical element.
Compared with the prior art, the utility model the advantage lie in:
the application provides a cooling structure of a high-precision vertical reflection white light mirror, the thermal deformation of the cooling structure can be controlled below 0.1urad, and the problems of vibration and mechanical clamping caused by water flow do not exist, wherein the problems of vibration and clamping are solved through a liquid indium gallium solution; the thermal deformation is small through the optimized design of the stress slow-release groove.
Drawings
FIG. 1 is a thermal deformation distribution diagram on a central line of a light receiving surface of a silicon crystal of a white light mirror;
fig. 2 is a front view of the cooling structure of the white mirror of the present application.
In the figure: 1. the device comprises an optical element silicon crystal, 2, first cooling structure oxygen-free copper, 3, second cooling structure oxygen-free copper, 4, a first indium gallium solution tank, 5, a second indium gallium solution tank, 6, a cooling channel, 7, a first stress slow-release tank, 8 and a second stress slow-release tank.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples, but the present application is not limited thereto.
As shown in fig. 2, the cooling structure of the vertical reflection white light mirror on the synchrotron radiation beam line comprises an optical element silicon crystal 1, a first cooling structure oxygen-free copper 2, a second cooling structure oxygen-free copper 3, a first indium gallium solution tank 4, and a second indium gallium solution tank 5; the upper part of the oxygen-free copper of the cooling structure is a columnar structure, one side of the columnar structure is provided with a convex structure, a cooling channel 6 is arranged in the columnar structure, and the convex structure is immersed in the groove filled with the indium-gallium solution; an indium gallium solution is added into a groove on the upper surface (as a mirror surface) of the silicon crystal 1 of the optical element, and the water in the cooling channel carries away the heat conducted by the silicon crystal 1 to the oxygen-free copper 2 of the cooling structure. Stress slow-release grooves are formed in the side face, parallel to the incident light direction, of the silicon crystal 1, and thermal deformation of the white light mirror can be controlled by optimizing the depth of the grooves. The indium gallium solution can be used for better conducting heat, and stress deformation generated when the cooling structure is directly clamped on the silicon crystal 1 and vibration caused by water flow in the cooling pipeline are prevented from being conducted to the silicon crystal 1.
The utility model discloses a size and the structural arrangement of optical element silicon crystal, cooling structure oxygen-free copper, indium gallium solution and cooling channel have been optimized through finite element software, and this cooling structure can slowly-release fourth generation high energy synchrotron radiation light source beam on the vertical reflection white light mirror heat load and the requirement that the shape of face error can be controlled within 0.1 ura's scope, and this cooling structure is simple, has avoided clamping and vibration problem, can reduce discharge.
The foregoing is a more detailed description of the present application in connection with specific embodiments thereof, and it is not intended that the present application be limited to the specific embodiments thereof. For those skilled in the art to which the present application pertains, a number of simple deductions or substitutions can be made without departing from the inventive concept of the present application.
Claims (9)
1. A vertical reflection white light mirror cooling structure used on a synchrotron radiation beam line is characterized by comprising an optical element silicon crystal (1), a first cooling structure (2) and a second cooling structure (3); the upper surface of the optical element silicon crystal (1) is used as a mirror surface, and a first indium gallium solution tank (4) and a second indium gallium solution tank (5) are arranged on the upper surface of the optical element silicon crystal (1); one end of the first cooling structure (2) is used for being immersed into the indium gallium solution injected into the first indium gallium solution tank (4) to cool the silicon crystal (1) of the optical element; one end of the second cooling structure (3) is used for being immersed into the indium gallium solution injected into the second indium gallium solution tank (5) to cool the optical element silicon crystal (1).
2. The cooling structure of the vertical reflection white mirror used in the synchrotron radiation beam line of claim 1, wherein the first indium gallium solution tank (4) and the second indium gallium solution tank (5) are parallel to the incident light direction.
3. The cooling structure of the vertical reflection white mirror used in the synchrotron radiation beam line of claim 1 or 2, wherein the depth and width of the first indium gallium solution tank (4) and the second indium gallium solution tank (5) are 10mm and 5mm, respectively.
4. The cooling structure of the vertical reflection white mirror used in a synchrotron radiation beam line according to claim 3, wherein the depth of the first cooling structure (2) immersed in the indium gallium solution in the first indium gallium solution tank (4) is 6mm, the liquid level of the indium gallium solution in the first indium gallium solution tank (4) is 2mm lower than the upper surface of the optical element silicon crystal (1), the distance between the side surface of the first indium gallium solution tank (4) and the outer edge of the immersed end of the first cooling structure (2) is 1.5mm, and the distance between the bottom of the first indium gallium solution tank (4) and the bottom of the immersed end of the first cooling structure (2) is 2 mm; the depth of the indium-gallium solution in the second indium-gallium solution groove (5) immersed by the second cooling structure (3) is 6mm, the liquid level of the indium-gallium solution in the second indium-gallium solution groove (5) is 2mm lower than the upper surface of the optical element silicon crystal (1), the distance between the side surface of the second indium-gallium solution groove (5) and the outer edge of the immersed end of the second cooling structure (3) is 1.5mm, and the distance between the bottom of the second indium-gallium solution groove (5) and the bottom of the immersed end of the second cooling structure (3) is 2 mm.
5. The cooling structure of the vertical reflection white light mirror used in the synchrotron radiation beam line of claim 1, wherein two side surfaces of the silicon crystal (1) of the optical element parallel to the indium gallium solution tank are respectively provided with a stress slow-release tank.
6. The cooling structure of the vertical reflection white mirror used in the beam line of synchrotron radiation according to claim 5, wherein the stress slow-release groove is parallel to the first indium gallium solution groove (4) and the second indium gallium solution groove (5), and the opening width and the depth of the stress slow-release groove are 10mm and 9.5mm, respectively.
7. The cooling structure of the vertical reflection white mirror used in the synchrotron radiation beam line of claim 1, wherein the first cooling structure (2) and the second cooling structure (3) are identical in structure and comprise a columnar structure, a convex structure is arranged on one side of the columnar structure, a cooling channel is arranged in the columnar structure, and the convex structure is immersed in a groove filled with the indium gallium solution.
8. The cooling structure for the vertical reflection white light mirror in the synchrotron radiation beam line of claim 1 or 7, wherein the first cooling structure (2) and the second cooling structure (3) are both cooling structure oxygen-free copper.
9. The cooling structure for the vertical reflection white light mirror in synchrotron radiation beam line as set forth in claim 1, wherein the length of said optical element silicon crystal (1) is equal to the lighting length of the incident light, and the lengths of said first cooling structure (2) and said second cooling structure (3) are equal to the lighting length of the incident light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020201746.XU CN211694799U (en) | 2020-02-24 | 2020-02-24 | Vertical reflection white light mirror cooling structure for synchrotron radiation beam line |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020201746.XU CN211694799U (en) | 2020-02-24 | 2020-02-24 | Vertical reflection white light mirror cooling structure for synchrotron radiation beam line |
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| CN211694799U true CN211694799U (en) | 2020-10-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113889836A (en) * | 2021-11-01 | 2022-01-04 | 上海科技大学 | High-precision multi-section cooling type deflection mirror |
| CN113917650A (en) * | 2021-10-19 | 2022-01-11 | 中国科学院高能物理研究所 | Cooling structure and method for improving thermal deformation and vibration stability of reflector |
| CN114924378A (en) * | 2022-05-30 | 2022-08-19 | 深圳综合粒子设施研究院 | Reflector surface shape control structure and beam line device |
| CN114967036A (en) * | 2022-05-30 | 2022-08-30 | 深圳综合粒子设施研究院 | Reflector surface shape control structure and beam line device |
| CN115166931A (en) * | 2022-07-04 | 2022-10-11 | 上海科技大学 | Reflector cooling system |
-
2020
- 2020-02-24 CN CN202020201746.XU patent/CN211694799U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113917650A (en) * | 2021-10-19 | 2022-01-11 | 中国科学院高能物理研究所 | Cooling structure and method for improving thermal deformation and vibration stability of reflector |
| CN113917650B (en) * | 2021-10-19 | 2022-09-09 | 中国科学院高能物理研究所 | Cooling structure and method for improving thermal deformation and vibration stability of reflector |
| CN113889836A (en) * | 2021-11-01 | 2022-01-04 | 上海科技大学 | High-precision multi-section cooling type deflection mirror |
| CN114924378A (en) * | 2022-05-30 | 2022-08-19 | 深圳综合粒子设施研究院 | Reflector surface shape control structure and beam line device |
| CN114967036A (en) * | 2022-05-30 | 2022-08-30 | 深圳综合粒子设施研究院 | Reflector surface shape control structure and beam line device |
| CN114924378B (en) * | 2022-05-30 | 2023-10-27 | 深圳综合粒子设施研究院 | Mirror surface shape control structure and beam line device |
| CN114967036B (en) * | 2022-05-30 | 2024-02-02 | 深圳综合粒子设施研究院 | Mirror surface shape control structure and beam line device |
| CN115166931A (en) * | 2022-07-04 | 2022-10-11 | 上海科技大学 | Reflector cooling system |
| CN115166931B (en) * | 2022-07-04 | 2024-01-30 | 上海科技大学 | Reflector cooling system |
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