CN211673775U - Tea set is boiled in intelligence control by temperature change - Google Patents
Tea set is boiled in intelligence control by temperature change Download PDFInfo
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- CN211673775U CN211673775U CN201921856082.4U CN201921856082U CN211673775U CN 211673775 U CN211673775 U CN 211673775U CN 201921856082 U CN201921856082 U CN 201921856082U CN 211673775 U CN211673775 U CN 211673775U
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Abstract
The utility model provides an intelligence control by temperature change boils tea set, includes tea table, teapot, teacup, installs teapot heating device, teapot cooling heat preservation device, teacup heat preservation device and controlling means at tea table, and teapot heating device includes heat preservation insulating housing, heat-conducting plate, electrical heating subassembly, and teapot cooling heat preservation device includes heat preservation insulating housing, heat-conducting plate, semiconductor refrigeration piece, fin, fan assembly, teapot determine module, temperature sensor, and teacup heat preservation device includes heat preservation insulating housing, heat-conducting plate, electrical heating subassembly. The utility model discloses a teapot cooling heat preservation device will boil the teapot temperature fast and fall down, makes the person of drinking tea can drink the tea that the temperature is suitable very fast, and teapot cooling heat preservation device and teacup heat preservation device have guaranteed again that the tea temperature remains the invariant throughout in teapot or the teacup above placing simultaneously, guarantee that the person of drinking tea can drink the tea that the temperature is suitable at any time.
Description
Technical Field
The utility model belongs to the tea set field specifically relates to a but tea set of cooking of intelligence control by temperature change.
Background
The water temperature of tea making is very important for the color and taste of tea soup, and the water temperature is determined according to tea. The temperature of the tea water just soaked is as high as 75-100 ℃, but the temperature bearing capacity of the esophagus and gastric mucosa of a human is limited, and the tea water can only bear the temperature of 50-60 ℃, and the mucosa of the esophagus can be scalded when the temperature is over the temperature; in addition, in the process of drinking tea, people often have the situation that a cup of tea is not drunk at one time, and if the cup of tea is continuously drunk after a period of time, the taste of the tea is also influenced if the tea is cooled.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a tea set of ability intelligent control teapot, the interior tea water temperature of teacup.
In order to achieve the purpose, the utility model provides a pair of tea set is boiled in intelligence control by temperature change, including tea platform, teapot, teacup, wherein, tea bench installs teapot heating device, teapot cooling heat preservation device, teacup heat preservation device and controlling means, the equal electricity of teapot heating device, teapot cooling heat preservation device, teapot heat preservation device is connected to controlling means.
Further, the teapot heating device comprises a heat-insulating shell, a heat-conducting plate and an electric heating component; the heat-insulating shell surrounds the heat-conducting plate and the electric heating component; the heat conducting plate is above the electric heating component.
Further, the teapot cooling and heat-insulating device comprises a heat-insulating shell, a heat-conducting plate, a semiconductor refrigerating sheet, a radiating fin, a fan assembly, a teapot detection assembly and a temperature sensor; the heat-insulating shell surrounds the heat-conducting plate, the semiconductor refrigerating sheet, the radiating fin and the fan assembly; the heat conducting plate is arranged above the semiconductor refrigerating piece and is in contact with the upper end of the semiconductor refrigerating piece through heat dissipation silicone grease; the radiating fin is arranged below the semiconductor refrigerating piece and is in contact with the lower end of the semiconductor refrigerating piece through radiating silicone grease; the fan assembly is below the heat sink; the teapot detection component and the temperature sensor are both arranged on the heat-insulating shell.
Further, the tea table is a sunken rectangle, the bottom of the tea table is provided with drainage meshes, and the top ends of the teapot heating device, the teapot cooling and heat insulation device, the teacup heat insulation device and the control device are all higher than the bottom of the tea table.
Furthermore, a circle of heat insulation layer is attached to the inner portion of the baffle protruding from the periphery of the tea table, and the tea cup heat insulation device is of a U-shaped structure and is arranged to be attached to the heat insulation layer inside the baffle of the tea table.
Further, the teacup heat insulation device is of a U-shaped structure and comprises a heat insulation shell, a heat conduction plate and an electric heating assembly; the heat-insulating shell surrounds the heat-conducting plate and the electric heating component; the heat conducting plate is above the electric heating component.
By adopting the scheme, the utility model can set the heating temperature of the teapot heating device to the optimal heating temperature corresponding to different tea leaves through the control device according to the type of tea to be made; when tea is boiled, a teapot can be placed on the teapot cooling and heat-preserving device, a teapot detection component on the device detects that the teapot is placed, meanwhile, a temperature sensor detects that the temperature of the teapot is higher than the set optimal tea inlet temperature, a rapid cooling mode is entered, refrigeration is carried out through a semiconductor refrigeration piece, so that the temperature of the teapot is rapidly reduced, when the temperature of the teapot is reduced to the set temperature, the teapot enters a heat-preserving mode, and the semiconductor refrigeration piece enters a heat-preserving state, so that the teapot is always kept at the set temperature; after the tea water is poured into the tea cup, the tea cup can be placed on the tea cup heat preservation device when the tea cup is not drunk, and the device is always kept at the set optimal inlet temperature of the tea water, so that the optimal inlet temperature can be ensured no matter how long the tea cup is placed on the tea cup and is taken up for drinking at any time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below. It is understood that the following drawings depict only some embodiments of the invention and are therefore not to be considered limiting of its scope, for the person skilled in the art will be able to derive from them other related drawings without inventive faculty.
Fig. 1 is a top view of the intelligent temperature-control tea boiling set provided by the embodiment of the utility model.
Fig. 2 is a perspective view of the intelligent temperature-control tea boiling set provided by the embodiment of the utility model.
Fig. 3 is a top view of the teacup warming device according to the embodiment of the present invention.
Fig. 4 is a sectional view of the teacup warming device according to the embodiment of the present invention.
Fig. 5 is a sectional view of a teapot cooling and warming device provided by the embodiment of the utility model.
Description of the figures
The teapot heating device 101, the teapot cooling and insulating device 102, the teacup insulating device 103, the control device 104, the drain mesh 105, the insulating layer 106, the heat conducting plate 201, the electric heating component 203, the insulating shell 202, the heat conducting plate 301, the semiconductor refrigerating plate 302, the radiating fin 303, the fan component 304, the teapot detection component 305, the temperature sensor 306 and the insulating shell 307.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1, which is a top view of an intelligent temperature-controlled tea boiling set according to an embodiment of the present invention.
In this embodiment, the tea table is in a concave rectangular shape, the bottom of the tea table is provided with drainage meshes 105, and water scattered in the process of tea boiling, tea pouring or tea drinking can be drained through the drainage meshes 105 at the bottom. A circle of the periphery of the tea table is a convex baffle, and a circle of heat insulation layer is pasted in the baffle to prevent heat generated by various heating or heat insulation devices (a teapot heating device and a teacup heat insulation device) arranged in the tea table from heating the baffle. Of course, in other embodiments, the thermal insulation layer may not be attached to the interior of the baffle, so long as the baffle is kept at a sufficient distance from the various heating or thermal insulation devices.
The heat insulating layer material can be ceramic fiber products, hollow microsphere composite materials, floating bead composite materials and the like.
In the embodiment, two teapot heating devices 101 and a teapot cooling and heat preserving device 102 are arranged, the three devices and the control device are arranged on the same high platform which is made of heat preserving and insulating materials, the three devices and the control device are mutually separated by the heat preserving and insulating materials and do not influence each other, and the top of the three devices is higher than the bottom of the tea table. In other embodiments, the number, the mutual positions and the installation modes of the installed teapot heating devices and the teapot cooling and heat preserving devices can be flexibly arranged according to the needs and the requirements of beauty.
The heat-insulating material can be a hollow microsphere composite material, a floating bead composite material and the like.
The control device 104 is internally provided with a control chip, the surface of the control device is provided with a liquid crystal display panel and a temperature adjusting panel, the current temperatures of the teapot heating device 101, the teapot cooling and heat preserving device 102 and the teacup heat preserving device 103 can be displayed, and the temperatures of all the devices can be set. The control means 104 may also display or set only the temperature of the teapot heating means 101 as required, with the holding temperature of the remaining two means set to a fixed value and not displayed or set. Other functions and corresponding control options can be added according to actual needs, such as automatic water feeding and the like.
The teapot heating device 101 is composed of a heat-insulating shell, a heat-conducting plate and an electric heating component, wherein the heat-insulating shell surrounds the heat-conducting plate and the electric heating component, and the heat-conducting plate is arranged above the electric heating component. The electric heating component can be heated by electromagnetic induction or resistance. The tea pot heating means are electrically connected to the control means 104, and the control means 104 can set each tea pot heating means to heat to a different temperature depending on the tea to be brewed.
The teapot cooling and heat-insulating device 102 is composed of a heat-insulating shell, a heat-conducting plate, a semiconductor refrigerating sheet, a radiating fin, a fan assembly, a teapot detection assembly and a temperature sensor. The teapot temperature-reducing and heat-preserving device 102 is electrically connected to the control device 104, signals of the teapot detection component and the temperature sensor are transmitted to the control device 104 in real time, and the control device 104 judges and issues instructions to complete the automatic temperature regulation and control function. The teapot cooling and heat preserving device 102 can also be internally provided with a control chip, and appoints the semiconductor refrigeration piece to be in different working modes (fast cooling, heat preservation and stop working) according to signals of the temperature sensor and the teapot detection component.
In this embodiment, a U-shaped heat insulating device 103 for a tea cup is installed in close contact with the heat insulating layer inside the tea table baffle, and the heat insulating device 103 for a tea cup is composed of a heat insulating housing, a heat conducting plate and an electric heating assembly, wherein the heat insulating housing surrounds the heat conducting plate and the electric heating assembly, and the heat conducting plate is arranged above the electric heating assembly. The electric heating component can be heated by electromagnetic induction, resistance or semiconductor refrigerating sheet. The cup warming device 103 is electrically connected to the control device 104. In other embodiments, teacup heat preservation devices with different shapes can be arranged according to aesthetic requirements.
Please refer to fig. 2, which is a perspective view of an intelligent temperature-controlled tea boiling set according to an embodiment of the present invention.
In this embodiment, the top ends of the teapot heating device 101, the teapot temperature-reducing and heat-preserving device 102, the control device 104 and the teacup heat-preserving device 103 are all higher than the drainage mesh 105 at the bottom of the tea table, so that water scattered in the process of tea boiling, tea pouring or tea drinking can be discharged through the drainage mesh 105 at the bottom.
Please refer to fig. 3, which is a top view of the thermal insulation device for a teacup according to an embodiment of the present invention.
In this embodiment, the teacup insulation device is a U-shaped structure, and includes insulating shell 202, heat-conducting plate 201, electric heating element, and insulating shell 202 encloses in heat-conducting plate 201, the outside of electric heating element, and heat-conducting plate 201 is above the electric heating element.
The whole teacup heat-insulating device can be formed by splicing a whole U-shaped heat-conducting plate and a whole U-shaped electric heating component, can also be formed by splicing a plurality of small heat-conducting plates and an electric heating component, and can also be formed by splicing a whole U-shaped heat-conducting plate and a plurality of small electric heating components below.
The teapot heat preservation device is set to be at a fixed temperature (generally 50-60 ℃), so that a tea cup placed on the teapot is guaranteed to be kept at the temperature all the time.
Please refer to fig. 4, which is a sectional view of a heat preservation device for a teacup according to an embodiment of the present invention.
In the present embodiment, the heat insulating housing 202 surrounds the heat conducting plate 201 and the electric heating assembly 203, and the heat conducting plate 201 is above the electric heating assembly 203.
Please refer to fig. 5, which is a cross-sectional view of a cooling and warming device for a teapot according to an embodiment of the present invention.
In this embodiment, the teapot cooling and warming device is composed of a warming insulation casing 307, a heat conducting plate 301, a semiconductor refrigerating sheet 302, a heat sink 303, a fan assembly 304, a teapot detection assembly 305 and a temperature sensor 306.
The heat-insulating shell 307 surrounds the heat-conducting plate 301, the semiconductor refrigerating plate 302, the heat radiating fin 303 and the fan assembly 304; the heat conducting plate 301 is arranged above the semiconductor refrigerating sheet 302 and is in contact with the upper end of the semiconductor refrigerating sheet 302 through heat dissipation silicone grease; the radiating fin 303 is arranged below the semiconductor refrigerating piece 302 in the morning and is in contact with the lower end of the semiconductor refrigerating piece 302 through radiating silicone grease; the fan assembly is below the heat sink 303; a teapot detection component 305 and a temperature sensor 306 are also mounted on the insulated housing 307.
The teapot detection component 305 can detect the presence of a teapot by infrared detection or by pressure.
The temperature sensor 306 may be a non-contact temperature sensor or may be a temperature sensor that is known by direct contact with the teapot bottom.
When the teapot detection component 305 detects that the teapot is placed on the teapot cooling and heat-preserving device, the temperature sensor detects the temperature of the teapot at the same time, and when the temperature of the teapot is higher than the set temperature (generally 50-60 degrees), the semiconductor refrigerating sheet 302 enters a refrigerating working state, so that the temperature of the teapot is reduced rapidly. When the temperature of the teapot is reduced to the set temperature, the semiconductor refrigeration piece 302 enters a heat preservation working state, the temperature is kept at the set temperature, and therefore the temperature of tea water in the teapot is kept unchanged.
When the teapot detection component detects that the teapot is taken away from the teapot cooling and heat preserving device, the semiconductor refrigeration piece 302 stops working.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims (6)
1. The utility model provides an intelligence control by temperature change boils tea set, includes tea platform, teapot, teacup, its characterized in that:
the teapot heating device, the teapot cooling and heat preserving device, the teacup heat preserving device and the control device are all electrically connected to the control device.
2. The intelligent temperature-controlled tea boiling set according to claim 1, wherein the teapot heating device comprises a heat-insulating shell, a heat-conducting plate and an electric heating component;
the heat-insulating shell surrounds the heat-conducting plate and the electric heating component;
the heat conducting plate is above the electric heating component.
3. The intelligent temperature-controlled tea boiling set according to claim 1, wherein:
the teapot cooling and heat-insulating device comprises a heat-insulating shell, a heat-conducting plate, a semiconductor refrigerating sheet, a radiating fin, a fan assembly, a teapot detection assembly and a temperature sensor;
the heat-insulating shell surrounds the heat-conducting plate, the semiconductor refrigerating sheet, the radiating fin and the fan assembly;
the heat conducting plate is arranged above the semiconductor refrigerating piece and is in contact with the upper end of the semiconductor refrigerating piece through heat dissipation silicone grease;
the radiating fin is arranged below the semiconductor refrigerating piece and is in contact with the lower end of the semiconductor refrigerating piece through radiating silicone grease;
the fan assembly is below the heat sink;
the teapot detection component and the temperature sensor are both arranged on the heat-insulating shell.
4. The intelligent temperature-controlled tea boiling set according to claim 1, wherein the tea table is a concave rectangle, the bottom of the tea table is provided with drainage meshes, and the top ends of the teapot heating device, the teapot temperature-reducing and heat-preserving device, the teacup heat-preserving device and the control device are all higher than the bottom of the tea table.
5. The intelligent temperature-controlled tea boiling set according to claim 4, wherein a circle of insulating layer is adhered to the inside of the baffle protruding around the tea table, and the teacup insulating device is of a U-shaped structure and is arranged to be adhered to the insulating layer inside the baffle of the tea table.
6. The intelligent temperature-controlled tea boiling set according to claim 1, wherein the teacup insulating device is of a U-shaped structure and comprises an insulating shell, a heat conducting plate and an electric heating component;
the heat-insulating shell surrounds the heat-conducting plate and the electric heating component;
the heat conducting plate is above the electric heating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921856082.4U CN211673775U (en) | 2019-10-31 | 2019-10-31 | Tea set is boiled in intelligence control by temperature change |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921856082.4U CN211673775U (en) | 2019-10-31 | 2019-10-31 | Tea set is boiled in intelligence control by temperature change |
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| CN211673775U true CN211673775U (en) | 2020-10-16 |
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| CN201921856082.4U Active CN211673775U (en) | 2019-10-31 | 2019-10-31 | Tea set is boiled in intelligence control by temperature change |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112545291A (en) * | 2020-12-11 | 2021-03-26 | 永城职业学院 | Multifunctional tea set tray for tea art and use method thereof |
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2019
- 2019-10-31 CN CN201921856082.4U patent/CN211673775U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112545291A (en) * | 2020-12-11 | 2021-03-26 | 永城职业学院 | Multifunctional tea set tray for tea art and use method thereof |
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