CN211670214U - Semiconductor light emitting diode assembly structure - Google Patents
Semiconductor light emitting diode assembly structure Download PDFInfo
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- CN211670214U CN211670214U CN201922123815.XU CN201922123815U CN211670214U CN 211670214 U CN211670214 U CN 211670214U CN 201922123815 U CN201922123815 U CN 201922123815U CN 211670214 U CN211670214 U CN 211670214U
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Abstract
The utility model relates to a semiconductor light emitting diode technical field just discloses a semiconductor light emitting diode subassembly structure, the on-line screen storage device comprises a base, the top fixed mounting of base has the dustcoat, fixed mounting has the fixed plate between the left side wall of dustcoat and the right side wall, the positive left side fixed mounting of fixed plate has first electricity piece that connects, the positive right side fixed mounting of fixed block has the second to connect the electricity piece, the first top fixed mounting who connects the electricity piece has the connecting wire, the second connects the top fixed mounting who connects the electricity piece to have luminous chip, the first equal fixed mounting in bottom that connects electricity piece and second to connect the electricity piece has the conduction piece. The semiconductor light-emitting diode assembly structure avoids the situation that when the distance between two pins needs to be changed, the pins need to be forcibly moved to cause the pins to be broken or fall off by arranging the socket, and the semiconductor light-emitting diode cannot be damaged when the pins are installed.
Description
Technical Field
The utility model relates to a semiconductor light emitting diode technical field specifically is a semiconductor light emitting diode subassembly structure.
Background
The semiconductor light emitting diode is also a PN junction, and emits light by injecting electrons into the PN junction by using an external power source, and is referred to as an LED, and is composed of a P layer formed of a P-type semiconductor, an N layer formed of an N-type semiconductor, and an active layer formed of a double hetero junction in the middle.
The semiconductor light-emitting diode is simple in structure, small in size, small in working current, convenient to use and low in cost, but the distance between two pins of the traditional semiconductor light-emitting diode in the installation process is inconvenient to change, the distance between the two pins needs to be manually moved when the traditional semiconductor light-emitting diode is inserted into two mounting holes with different distances, the pins of the semiconductor light-emitting diode are easily broken or poorly contacted, the heat dissipation effect of the semiconductor light-emitting diode is poor, the internal temperature is high after the traditional semiconductor light-emitting diode is used for a long time, and the burning loss of a light-emitting chip is easily caused, so that the semiconductor light-emitting diode assembly structure.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a semiconductor light emitting diode subassembly structure, possess pin distance can change with advantages such as long service life, the inconvenient change of distance between two pins of traditional semiconductor light emitting diode at the in-process of installation has been solved, need manually move the distance between two pins when inserting two mounting holes of different distances inside, cause semiconductor light emitting diode pin rupture or contact failure easily, and semiconductor light emitting diode radiating effect is relatively poor moreover, the higher problem that causes luminescent chip scaling loss of inside temperature after permanent use easily.
(II) technical scheme
For the purpose that realizes that above-mentioned pin distance can change and long service life, the utility model provides a following technical scheme: a semiconductor light-emitting diode assembly structure comprises a base, wherein an outer cover is fixedly installed at the top of the base, a fixed plate is fixedly installed between the left side wall and the right side wall of the outer cover, a first electricity-receiving block is fixedly installed at the front left side of the fixed plate, a second electricity-receiving block is fixedly installed at the front right side of the fixed plate, a connecting wire is fixedly installed at the top of the first electricity-receiving block, a light-emitting chip is fixedly installed at the top of the second electricity-receiving block, conducting pieces are fixedly installed at the bottoms of the first electricity-receiving block and the second electricity-receiving block respectively, connecting blocks are movably installed at the front sides of the two conducting pieces respectively, pins are fixedly installed at the bottoms of the two connecting blocks respectively, sockets are arranged at the left side and the right side of the bottom of the base respectively, sliding grooves are formed in the rear side walls of the two sockets respectively, and sliding, the louvre has been seted up in the outside of dustcoat, the inside fixed mounting of louvre has the dead lever, the back fixed mounting of dead lever has the fixed block, the back movable mounting of fixed block has the installation piece, the outside fixed mounting of installation piece has the flabellum.
Preferably, the right end of the connecting wire is electrically connected with the light emitting chip, the fixing plate is an insulating plate, and the two pins are electrically connected with the first power connection block and the second power connection block through the conducting pieces respectively.
Preferably, the bottom ends of the two pins respectively penetrate through the two sockets and extend to the bottom of the base, and the two sliding blocks are respectively movably mounted inside the two sliding grooves.
Preferably, the sliding groove is fan-shaped, and the heat dissipation holes are equidistantly arranged on the outer side of the outer cover.
Preferably, the diameter of the conduction piece is larger than that of the connection block, and the left side and the right side of the inner wall of the insertion opening are inclined planes.
Preferably, the fan blades are equidistantly arranged on the outer side of the mounting block, and the heat dissipation holes are respectively located below the first power connection block and the second power connection block.
(III) advantageous effects
Compared with the prior art, the utility model provides a semiconductor light emitting diode subassembly structure possesses following beneficial effect:
the semiconductor light-emitting diode assembly structure has the advantages that through the arrangement of the socket, when the semiconductor light-emitting diode is installed, if the distance between the two pins is smaller than the distance between the two installation holes, the distance between the two pins needs to be changed to install the semiconductor light-emitting diode, at the moment, the two pins only need to be respectively rotated outwards to enable the sliding blocks at the back sides of the two pins to move in the sliding grooves, at the moment, the connecting blocks at the top ends of the two pins can rotate on the front side of the conducting sheet, so that the distance between the two pins can be changed as required, the situation that the pins are broken or fall off due to the fact that the pins need to be forcibly moved when the distance between the two pins needs to be changed is avoided by setting the pins into a rotatable connecting mode, and the semiconductor light-emitting diode cannot be damaged when the pins are installed, and the semiconductor light-emitting diode can also radiate heat through the radiating holes, and the fan blades can rotate to send more air into the semiconductor light-emitting diode during heat radiation, so that the semiconductor light-emitting diode can be better radiated, and the service life of the semiconductor light-emitting diode is effectively prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is an enlarged view of the structure at a position of the present invention.
In the figure: the fan comprises a base 1, an outer cover 2, a fixing plate 3, a first 4 electricity connecting block, a second 5 electricity connecting block, a connecting wire 6, a light-emitting chip 7, a conducting piece 8, a connecting block 9, pins 10, a socket 11, a sliding chute 12, a sliding block 13, heat dissipation holes 14, a fixing rod 15, a fixing block 16, an installation block 17 and fan blades 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a semiconductor light emitting diode assembly structure includes a base 1, an outer cover 2 is fixedly installed on the top of the base 1, a fixing plate 3 is fixedly installed between the left side wall and the right side wall of the outer cover 2, a first power receiving block 4 is fixedly installed on the left side of the front surface of the fixing plate 3, a second power receiving block 5 is fixedly installed on the right side of the front surface of the fixing plate 3, a connecting wire 6 is fixedly installed on the top of the first power receiving block 4, a light emitting chip 7 is fixedly installed on the top of the second power receiving block 5, conductive sheets 8 are fixedly installed on the bottoms of the first power receiving block 4 and the second power receiving block 5, connecting blocks 9 are movably installed on the front surfaces of the two conductive sheets 8, pins 10 are fixedly installed on the bottoms of the two connecting blocks 9, the right end of the connecting wire 6 is electrically connected with the light emitting chip 7, the fixing plate 3 is an insulating plate, the two pins 10 are respectively electrically connected with, the left side and the right side of the bottom of the base 1 are both provided with sockets 11, the diameter of the conducting piece 8 is larger than that of the connecting block 9, the left side and the right side of the inner wall of the socket 11 are both inclined planes, the inner part of the base 1 and the rear side wall of the two sockets 11 are both provided with chutes 12, the back surfaces of the two pins 10 are both fixedly provided with sliders 13, the bottom ends of the two pins 10 respectively penetrate through the two sockets 11 and extend to the bottom of the base 1, the two sliders 13 are respectively and movably arranged in the two chutes 12, the outer side of the outer cover 2 is provided with radiating holes 14, the chutes 12 are fan-shaped, the radiating holes 14 are equidistantly arranged on the outer side of the outer cover 2, the inner parts of the radiating holes 14 are fixedly provided with fixing rods 15, the back surfaces of the fixing rods 15 are fixedly provided with fixing blocks 16, the back surfaces of, the heat dissipation holes 14 are respectively positioned below the first power connection block 4 and the second power connection block 5, when a semiconductor light emitting diode is mounted, if the distance between the two pins 10 is smaller than the distance between the two mounting holes, then the distance between the two pins 10 needs to be changed to mount the semiconductor light emitting diode, at this time, only the two pins 10 need to be respectively rotated outwards to enable the sliding blocks 13 at the back sides of the two pins 10 to move in the sliding grooves 12, at this time, the connecting blocks 9 at the top ends of the two pins 10 will rotate on the front sides of the conducting sheets 8, so that the distance between the two pins 10 can be changed according to needs, by setting the pins 10 into a rotatable connecting mode, the situation that the pins 10 are broken or dropped due to forced movement of the pins 10 when the distance between the two pins 10 needs to be changed is avoided, and the semiconductor light emitting diode cannot be damaged when the pins 10 are mounted, moreover, the semiconductor light emitting diode can also dissipate heat through the heat dissipation hole 14, and the fan blade 18 rotates to send more air into the semiconductor light emitting diode during heat dissipation, so that the heat of the semiconductor light emitting diode can be better dissipated, and the service life of the semiconductor light emitting diode is effectively prolonged.
In use, when mounting a semiconductor light emitting diode, if the distance between the two leads 10 is smaller than the distance between the two mounting holes, at this time, the distance between the two pins 10 needs to be changed to mount the semiconductor light emitting diode, and at this time, the two pins 10 need to be respectively rotated outwards to enable the sliding blocks 13 on the back surfaces of the two pins 10 to move in the sliding grooves 12, the connection block 9 at the top end of the two pins 10 will now rotate on the front side of the conductive sheet 8, so that the distance between the two pins 10 can be changed as desired, by arranging the pins 10 in a rotatable connection, and the semiconductor light emitting diode can also dissipate heat through the heat dissipation holes 14, during heat dissipation, the fan blade 18 rotates to send more air into the semiconductor light emitting diode, so that the semiconductor light emitting diode can be better cooled.
In summary, in the semiconductor light emitting diode assembly structure, by providing the socket 11, when the semiconductor light emitting diode is mounted, if the distance between the two pins 10 is smaller than the distance between the two mounting holes, the distance between the two pins 10 needs to be changed to mount the semiconductor light emitting diode, at this time, only the two pins 10 need to be rotated outward respectively, so that the sliders 13 at the back sides of the two pins 10 move inside the sliding grooves 12, at this time, the connecting blocks 9 at the top ends of the two pins 10 will rotate on the front side of the conducting sheet 8, so that the distance between the two pins 10 can be changed as required, by setting the pins 10 in a rotatable connection manner, the situation that the pins 10 are broken or dropped due to the need to forcibly move the pins 10 when the distance between the two pins 10 needs to be changed is avoided, and the semiconductor light emitting diode is not damaged when the pins 10 are mounted, and semiconductor emitting diode can also dispel the heat through louvre 14, flabellum 18 will rotate and send into semiconductor emitting diode's inside with more air in the radiating, can be better dispel the heat to semiconductor emitting diode, the effectual life who improves semiconductor emitting diode, the inconvenient change of distance between two pins of traditional semiconductor emitting diode in the installation process has been solved, need manually move the distance between two pins when inserting two mounting holes of different distances inside, cause semiconductor emitting diode pin rupture or contact failure easily, and semiconductor emitting diode radiating effect is relatively poor, the higher problem that causes the burning loss of emitting chip easily of inside temperature after long-term the use.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A semiconductor light emitting diode assembly construction comprising a base (1), characterized in that: the solar photovoltaic power generation device is characterized in that an outer cover (2) is fixedly mounted at the top of the base (1), a fixing plate (3) is fixedly mounted between the left side wall and the right side wall of the outer cover (2), a first power connection block (4) is fixedly mounted at the front left side of the fixing plate (3), a second power connection block (5) is fixedly mounted at the front right side of the fixing plate (3), a connecting wire (6) is fixedly mounted at the top of the first power connection block (4), a light-emitting chip (7) is fixedly mounted at the top of the second power connection block (5), conductive pieces (8) are fixedly mounted at the bottoms of the first power connection block (4) and the second power connection block (5), connecting blocks (9) are movably mounted at the front sides of the two conductive pieces (8), pins (10) are fixedly mounted at the bottoms of the two connecting blocks (9), sockets (11) are formed in the left side and the right side of the base (1, spout (12), two have all been seted up to the inside of base (1) and the back lateral wall that is located two sockets (11) the equal fixed mounting in back of pin (10) has slider (13), louvre (14) have been seted up in the outside of dustcoat (2), the inside fixed mounting of louvre (14) has dead lever (15), the back fixed mounting of dead lever (15) has fixed block (16), the back movable mounting of fixed block (16) has installation piece (17), the outside fixed mounting of installation piece (17) has flabellum (18).
2. A semiconductor light emitting diode assembly construction as claimed in claim 1 wherein: the right end of the connecting wire (6) is electrically connected with the light-emitting chip (7), the fixing plate (3) is an insulating plate, and the two pins (10) are electrically connected with the first power connection block (4) and the second power connection block (5) through the conducting pieces (8) respectively.
3. A semiconductor light emitting diode assembly construction as claimed in claim 1 wherein: the bottom ends of the two pins (10) penetrate through the two sockets (11) respectively and extend to the bottom of the base (1), and the two sliding blocks (13) are movably mounted inside the two sliding grooves (12) respectively.
4. A semiconductor light emitting diode assembly construction as claimed in claim 1 wherein: the sliding groove (12) is fan-shaped, and the heat dissipation holes (14) are arranged on the outer side of the outer cover (2) at equal intervals.
5. A semiconductor light emitting diode assembly construction as claimed in claim 1 wherein: the diameter of the conduction piece (8) is larger than that of the connection block (9), and the left side and the right side of the inner wall of the insertion opening (11) are inclined planes.
6. A semiconductor light emitting diode assembly construction as claimed in claim 1 wherein: the fan blades (18) are arranged on the outer side of the mounting block (17) at equal intervals, and the heat dissipation holes (14) are respectively located below the first power connection block (4) and the second power connection block (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922123815.XU CN211670214U (en) | 2019-12-02 | 2019-12-02 | Semiconductor light emitting diode assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922123815.XU CN211670214U (en) | 2019-12-02 | 2019-12-02 | Semiconductor light emitting diode assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211670214U true CN211670214U (en) | 2020-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922123815.XU Active CN211670214U (en) | 2019-12-02 | 2019-12-02 | Semiconductor light emitting diode assembly structure |
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| Country | Link |
|---|---|
| CN (1) | CN211670214U (en) |
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2019
- 2019-12-02 CN CN201922123815.XU patent/CN211670214U/en active Active
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