CN211662379U - Material frame clamping device of wafer cutting machine and wafer cutting machine - Google Patents
Material frame clamping device of wafer cutting machine and wafer cutting machine Download PDFInfo
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- CN211662379U CN211662379U CN201921603532.9U CN201921603532U CN211662379U CN 211662379 U CN211662379 U CN 211662379U CN 201921603532 U CN201921603532 U CN 201921603532U CN 211662379 U CN211662379 U CN 211662379U
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Abstract
The utility model provides a material frame clamping device of a wafer cutting machine, which comprises a mounting seat, a material frame and a pressing component; the mounting seats are at least two and are used for synchronously rotating with the vacuum ceramic suckers of the wafer cutting machine; the material frame is placed on the mounting seat, is used for being arranged on the vacuum ceramic sucker in a surrounding mode and is matched with the ceramic surface of the vacuum ceramic sucker to horizontally place the wafer; the pressing assembly comprises a clamping piece, a driving piece and an adjusting piece; the driving piece is fixed on the mounting seat; the clamping piece is connected on the output shaft of driving piece to can be under the drive of driving piece rotatory keep away from or be close to the side of placing the wafer at the material frame, the one end of regulating part is contradicted in the clamping piece towards the side of material frame, and the other one end of regulating part is rotated and is connected on mount pad or driving piece, the utility model also provides a wafer cutting machine for adjust the clamping piece and expect the interval of frame contact, make the wafer press from both sides tightly more stable at the material frame.
Description
Technical Field
The utility model belongs to the technical field of the wafer cutting, more specifically say, relate to a wafer cutting machine material frame clamping device and wafer cutting machine.
Background
Wafer dicing is an important part of the post-wafer process, and the wafer from the pre-wafer process is diced into small chips, which requires extremely high equipment precision and stability. After cutting, one crystal grain can be arranged in a well-ordered way and pasted on the adhesive tape, and the adhesive tape is supported on a material frame of the wafer cutting machine, so that the crystal grain can be prevented from being collided due to the wrinkle of the adhesive tape, and the crystal grain is favorably conveyed.
The material frame is also provided with a notch which is used for calibrating the visual initial position of the visual system of the wafer cutting machine. The rotary clamping structure for clamping the wafer is arranged on one side of the material frame and comprises at least two fixing blocks, at least two rotary cylinders and at least two pressing plates, wherein the fixing blocks are arranged on the device body, the rotary cylinders are arranged on the fixing blocks, and the pressing plates are arranged on the axes of the rotary cylinders and can rotate 90 degrees. However, the material frame is thin and large in size, so that deformation is easily caused during installation, and the rotary clamping structure is influenced to clamp the wafer on the material frame.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a material frame clamping device of wafer cutting machine to solve exist among the prior art because the material frame is thinner, the size is great, easily produces the deformation during the installation, influences the rotary clamping structure and presss from both sides the technical problem of tight wafer clamp on the material frame.
In order to realize one of the above purposes, the utility model adopts the technical scheme that: the clamping device for the material frame of the wafer cutting machine comprises a mounting seat, the material frame and a pressing assembly;
the number of the mounting seats is at least two, and the mounting seats are used for synchronously rotating with the vacuum ceramic suckers of the wafer cutting machine;
the material frame is placed on the mounting seat, is arranged on the vacuum ceramic sucker in a surrounding mode and is matched with the ceramic surface of the vacuum ceramic sucker to horizontally place the wafer;
the compression assembly comprises a clamping piece, a driving piece and an adjusting piece;
the driving piece is fixed on the mounting seat;
the clamping piece is connected to an output shaft of the driving piece and can rotate to be far away from or close to the side face, used for placing the wafer, of the material frame under the driving of the driving piece, one end of the adjusting piece is abutted to the side face, facing the material frame, of the clamping piece, and the other end of the adjusting piece is connected to the mounting seat or the driving piece in a rotating mode.
The utility model provides a pair of wafer cutting machine material frame clamping device's beneficial effect lies in: compared with the prior art, the utility model discloses a material frame and ceramic surface play the effect of supporting the wafer jointly, improve wafer cutting's stability. Because the material frame can take place to warp after repetitious usage, the interval with the material frame when clamping piece presss from both sides tight wafer has changed promptly, through the interval with the material frame when adjusting part control clamping piece presss from both sides tight wafer, prevents that the clamping piece from excessively pressing from both sides tight wafer and destroying the wafer, plays the effect of protection wafer.
Further, the mounting seat is detachably connected to the vacuum ceramic sucker.
Further, the driving piece is a swing cylinder or a motor.
Further, when the driving piece is a swing cylinder, the adjusting piece is located at the end of the swing cylinder, and one end of the adjusting piece is rotatably connected to the swing cylinder.
Furthermore, a locking piece is arranged between the adjusting piece and the swing cylinder, and when the locking piece is unlocked, the adjusting piece rotates on the swing cylinder; when the locking piece is locked, the adjusting piece is fixed on the swing cylinder.
Further, the locking member is respectively screwed with the adjusting member and the swing cylinder.
Furthermore, the clamping piece comprises a clamping plate and a connecting rod, one end of the connecting rod is detachably connected to the clamping plate, and the other end of the connecting rod is detachably connected to an output shaft of the swing cylinder.
Furthermore, the clamping piece still includes first splint and second splint, the one end of first splint with the one end body coupling in of second splint keep away from of connecting rod the one end of pinch-off blades, first splint with the second splint interval sets up, the one side of first splint that is close to the second splint is equipped with first recess, the one side of second splint that is close to first splint is equipped with the second recess, swing cylinder's output shaft press from both sides tightly in first recess with between the second recess.
Further, be connected with the retaining member between the first splint with the second splint, the retaining member is used for adjusting first splint with interval between the second splint, the retaining member wears to locate first splint with the second splint, retaining member threaded connection in first splint with the second splint.
The second objective of the present invention is to provide a wafer cutting machine, for realizing the second objective, the utility model discloses a technical scheme is: a wafer cutting machine is provided, which comprises the above-mentioned material frame clamping device.
The utility model provides a pair of wafer cutting machine's beneficial effect lies in: compared with the prior art, the utility model discloses guarantee wafer cutting's stability, the wafer is difficult destroyed at the tight in-process of clamp, improves wafer cutting's quality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural view of a material frame clamping device of a wafer cutting machine according to an embodiment of the present invention;
fig. 2 is an enlarged view of fig. 1 at a.
Wherein, in the figures, the respective reference numerals:
1. a mounting seat; 2. material frame; 3. a compression assembly; 31. a clamping member; 311. a clamping plate; 312. a connecting rod; 313. a first splint; 3131. a first groove; 314. a second splint; 3141. a second groove; 32. a drive member; 33. an adjustment member; 4. a locking member; 5. a locking member; 6. a vacuum ceramic chuck; 7. and (5) a ceramic surface.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 and fig. 2, a material frame holding device of a wafer cutting machine according to the present invention will now be described. A material frame clamping device of a wafer cutting machine comprises a mounting seat 1, a material frame 2 and a pressing assembly 3;
the mounting seats 1 are at least two, and the mounting seats 1 are used for synchronously rotating with a vacuum ceramic sucker 6 of the wafer cutting machine;
the material frame 2 is placed on the mounting base 1, the material frame 2 is arranged on the vacuum ceramic sucker 6 in a surrounding mode, and the material frame and a ceramic surface 7 of the vacuum ceramic sucker 6 are used for horizontally placing a wafer;
the pressing assembly 3 comprises a clamping member 31, a driving member 32 and an adjusting member 33;
the driving piece 32 is fixed on the mounting seat 1;
the clamping piece 31 is connected to an output shaft of the driving piece 32 and can rotate away from or close to the side surface of the material frame 2, on which the wafer is placed, under the driving of the driving piece 32, one end of the adjusting piece 33 is abutted against the side surface of the clamping piece 31 facing the material frame 2, and the other end of the adjusting piece 33 is rotatably connected to the mounting seat 1 or the driving piece 32.
The use process comprises the following steps: placing the material frame 2 on the mounting seat 1, and then placing the wafer on the ceramic surface 7 and the material frame 2; one end of the adjusting piece 33 is adjusted to be flush with the surface of the wafer, which is far away from the ceramic surface 7, and the driving piece 32 is controlled to enable the clamping piece 31 to move towards the material frame 2, so that the clamping piece 31 simultaneously abuts against the wafer and the adjusting piece 33, and the clamping piece 31 compresses the wafer on the material frame 2 and the ceramic surface 7. When the cut direction of the wafer needs to be changed, the vacuum ceramic chuck 6 is controlled to rotate by a certain angle, so that the mounting seat 1 and the vacuum ceramic chuck 6 rotate synchronously, and the cut direction of the wafer is rotationally adjusted.
The utility model provides a pair of wafer cutting machine material frame clamping device compares with prior art, and material frame 2 and ceramic face 7 play the effect of supporting the wafer jointly, improve wafer cutting's stability. Because the material frame 2 can be deformed after being used for many times, namely the distance between the clamping piece 31 and the material frame 2 is changed when the clamping piece clamps the wafer, the distance between the clamping piece 31 and the material frame 2 when the clamping piece clamps the wafer is controlled by the adjusting piece 33, the wafer is prevented from being damaged due to the fact that the clamping piece 31 excessively clamps the wafer, and the wafer is protected.
Further, please refer to fig. 1 and fig. 2 together, as a specific implementation manner of the material frame clamping device of the wafer cutting machine of the present invention, the mounting seat 1 can be detachably connected to the vacuum ceramic chuck 6, and the mounting and dismounting are convenient.
Further, referring to fig. 1 and fig. 2 together, as an embodiment of the material frame clamping device of the wafer cutting machine of the present invention, the driving member 32 is a swing cylinder or a motor.
The swing cylinder and the motor can control the clamping piece to rotate and move, and the clamping device is very convenient. The oscillating cylinder has low noise and is not easy to vibrate, and the stability and the accuracy of wafer cutting are ensured.
Further, referring to fig. 1 and fig. 2 together, as a specific embodiment of the material frame clamping device of the wafer cutting machine of the present invention, when the driving member 32 is a swing cylinder, the adjusting member 33 is located at an end of the swing cylinder, and one end of the adjusting member 33 is rotatably connected to the swing cylinder.
On the regulating part 33 rotated and connects the swing cylinder, reduced the length that regulating part 33 set up, improved the convenience of regulating part 33 installation, regulating part 33 adjusts the convenience, has improved the convenience that clamping device used.
Further, referring to fig. 1 and fig. 2 together, as a specific embodiment of the material frame clamping device for a wafer cutting machine according to the present invention, a locking member 4 is disposed between the adjusting member 33 and the swing cylinder, and when the locking member 4 is unlocked, the adjusting member 33 rotates on the swing cylinder; when the locking member 4 is locked, the adjusting member 33 is fixed to the swing cylinder.
When 4 unblocks of locking piece, regulating part 33 can rotate at swing cylinder, locking piece 4 is adjusted smoothly and conveniently, when 4 locks of locking piece, regulating part 33 is fixed and can not take place the activity on swing cylinder, thereby the clamping piece contradicts back on regulating part 33, and regulating part 33 can not take place the activity, guarantees that the clamping piece can not change with the distance between the material frame 2 when pressing from both sides tight wafer.
Further, please refer to fig. 1 and fig. 2 together, as a specific embodiment of the material frame clamping device of the wafer cutting machine of the present invention, the locking member 4 is respectively connected with the adjusting member 33 and the swing cylinder by screw threads, and the locking member 4 has a simple structure, a low cost, and is very practical.
Further, please refer to fig. 1 and fig. 2 together, as a specific embodiment of the present invention, the clamping member 31 includes a clamping plate 311 and a connecting rod 312, one end of the connecting rod 312 can be detached from the clamping plate 311, and the other end of the connecting rod 312 can be detached from the output shaft of the swing cylinder.
The clamping piece passes through connecting rod 312 and can dismantle the connection on the output shaft of swing cylinder, improves the convenience of being connected and dismantling of clamping piece and swing cylinder. The clamping plate 311 has a larger contact area with the wafer, so that the clamping plate 311 can better press the wafer on the material frame 2.
Further, please refer to fig. 1 and fig. 2 together, as a specific embodiment of the present invention, the clamping member 31 further includes a first clamping plate 313 and a second clamping plate 314, one end of the first clamping plate 313 and one end of the second clamping plate 314 are integrally connected to one end of the connecting rod 312 far away from the clamping plate 311, the first clamping plate 313 and the second clamping plate 314 are arranged at an interval, a first groove 3131 is arranged on one side of the first clamping plate 313 near the second clamping plate 314, a second groove 3141 is arranged on one side of the second clamping plate 314 near the first clamping plate 313, and the output shaft of the oscillating cylinder is clamped between the first groove 3131 and the second groove 3141.
The output shaft of the oscillating cylinder is inserted between the first groove 3131 and the second groove 3141, and the oscillating cylinder is clamped between the first clamping plate 313 and the second clamping plate 314 under the elastic deformation of the first clamping plate 313 and the second clamping plate 314. The first and second grooves 3131 and 3141 allow the first and second clamp plates 313 and 314 to have a larger contact area with the output shaft of the swing cylinder, thereby ensuring stability of the connection between the output shaft of the swing cylinder and the connecting rod 312.
Further, referring to fig. 1 and 2, as a specific embodiment of the material frame clamping device for the wafer cutting machine of the present invention, a locking member 5 is connected between the first clamping plate 313 and the second clamping plate 314, the locking member 5 is used for adjusting the distance between the first clamping plate 313 and the second clamping plate 314, the locking member 5 is disposed through the first clamping plate 313 and the second clamping plate 314, and the locking member 5 is screwed to the first clamping plate 313 and the second clamping plate 314.
Through retaining member 5, make first splint 313 difficult for keeping away from second splint 314, guarantee the stability that the output shaft of swing cylinder is connected with connecting rod 312. When the connecting rod 312 needs to be removed from the output shaft of the swing cylinder, the distance between the first clamping plate 313 and the second clamping plate 314 is increased by the locking member 5, so that the connecting rod 312 is directly separated from the output shaft of the swing cylinder. The locking piece 5 has simple structure and low cost and is very practical.
The utility model also provides a pair of wafer cutting machine, a wafer cutting machine includes foretell arbitrary wafer cutting machine material frame clamping device.
The utility model provides a pair of wafer cutting machine guarantees the stability of wafer cutting, and the wafer is difficult destroyed at the tight in-process of clamp, improves the quality of wafer cutting.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A material frame clamping device of a wafer cutting machine is characterized by comprising an installation seat, a material frame and a pressing assembly;
the number of the mounting seats is at least two, and the mounting seats are used for synchronously rotating with the vacuum ceramic suckers of the wafer cutting machine;
the material frame is placed on the mounting seat, is arranged on the vacuum ceramic sucker in a surrounding mode and is matched with the ceramic surface of the vacuum ceramic sucker to horizontally place the wafer;
the compression assembly comprises a clamping piece, a driving piece and an adjusting piece;
the driving piece is fixed on the mounting seat;
the clamping piece is connected to an output shaft of the driving piece and can rotate to be far away from or close to the side face, used for placing the wafer, of the material frame under the driving of the driving piece, one end of the adjusting piece is abutted to the side face, facing the material frame, of the clamping piece, and the other end of the adjusting piece is connected to the mounting seat or the driving piece in a rotating mode.
2. The wafer cutting machine material frame clamping device as recited in claim 1, wherein the mounting seat is detachably connected to the vacuum ceramic chuck.
3. The wafer cutting machine material frame clamping device as recited in claim 1, wherein the driving member is a swing cylinder or a motor.
4. The wafer cutting machine material frame clamping device as recited in claim 3, wherein when said driving member is a swing cylinder, said adjusting member is located at an end of said swing cylinder, and one end of said adjusting member is rotatably connected to said swing cylinder.
5. The wafer cutting machine material frame clamping device as claimed in claim 4, wherein a locking member is arranged between the adjusting member and the swing cylinder, and when the locking member is unlocked, the adjusting member rotates on the swing cylinder; when the locking piece is locked, the adjusting piece is fixed on the swing cylinder.
6. The wafer cutting machine material frame holding apparatus as set forth in claim 5, wherein said locking member is screw-coupled with said adjusting member and said swing cylinder, respectively.
7. The wafer cutting machine material frame clamping device as recited in claim 4, wherein the clamping member comprises a clamping plate and a connecting rod, one end of the connecting rod is detachably connected to the clamping plate, and the other end of the connecting rod is detachably connected to the output shaft of the swing cylinder.
8. The wafer cutting machine material frame clamping device as recited in claim 7, wherein the clamping member further comprises a first clamping plate and a second clamping plate, one end of the first clamping plate and one end of the second clamping plate are integrally connected to one end of the connecting rod, which is far away from the clamping plate, the first clamping plate and the second clamping plate are arranged at intervals, a first groove is formed in one side of the first clamping plate, which is close to the second clamping plate, a second groove is formed in one side of the second clamping plate, which is close to the first clamping plate, and the output shaft of the swing cylinder is clamped between the first groove and the second groove.
9. The wafer cutting machine material frame clamping device as claimed in claim 8, wherein a locking member is connected between the first clamping plate and the second clamping plate, the locking member is used for adjusting the distance between the first clamping plate and the second clamping plate, the locking member is arranged through the first clamping plate and the second clamping plate, and the locking member is in threaded connection with the first clamping plate and the second clamping plate.
10. A wafer cutting machine comprising a wafer cutting machine material frame holding device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921603532.9U CN211662379U (en) | 2019-09-24 | 2019-09-24 | Material frame clamping device of wafer cutting machine and wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921603532.9U CN211662379U (en) | 2019-09-24 | 2019-09-24 | Material frame clamping device of wafer cutting machine and wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211662379U true CN211662379U (en) | 2020-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921603532.9U Active CN211662379U (en) | 2019-09-24 | 2019-09-24 | Material frame clamping device of wafer cutting machine and wafer cutting machine |
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| Country | Link |
|---|---|
| CN (1) | CN211662379U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115472553A (en) * | 2022-11-11 | 2022-12-13 | 智程半导体设备科技(昆山)有限公司 | High-stability clamping device for etching or cleaning semiconductor wafer |
-
2019
- 2019-09-24 CN CN201921603532.9U patent/CN211662379U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115472553A (en) * | 2022-11-11 | 2022-12-13 | 智程半导体设备科技(昆山)有限公司 | High-stability clamping device for etching or cleaning semiconductor wafer |
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