CN211629305U

CN211629305U - Nested radiation array

Info

Publication number: CN211629305U
Application number: CN201922082385.1U
Authority: CN
Inventors: 黄勇; 马红侠; 汪杰; 张霄鹏
Original assignee: Suzhou Bohai Chuangye Micro System Co ltd
Current assignee: Suzhou Bohai Chuangye Micro System Co ltd
Priority date: 2019-11-27
Filing date: 2019-11-27
Publication date: 2020-10-02
Anticipated expiration: 2029-11-27

Abstract

The utility model provides a nested formula radiation array, include: the metal outer frame is provided with an accommodating cavity with an opening at the upper part; the metal mounting plate is arranged in the containing cavity of the metal outer frame and comprises a metal substrate, and the metal substrate divides the containing cavity into a first containing cavity positioned below and a second containing cavity positioned above; a plurality of low frequency antenna arrays vertically inserted in the accommodating cavity; a plurality of high frequency antenna arrays vertically inserted in the accommodating cavity; the high-frequency antenna array is nested in the low-frequency antenna array; several high-frequency power synthesis modules, which are arranged at the bottom side of the high-frequency antenna array and comprise metal frames; the energy storage material pieces are arranged between the metal frame of the high-frequency power synthesis module and the metal mounting plate; and a low-frequency receiving and transmitting component which consists of a power amplifier, a low-noise amplifier, a switch and an amplitude-phase control circuit and is horizontally arranged in the first accommodating cavity, and a connector of each low-frequency antenna array penetrates through the substrate and is electrically connected with the low-frequency receiving and transmitting component. Compact structure and is beneficial to miniaturization.

Description

Nested radiation array

Technical Field

The utility model relates to a radio signal's transmission equipment especially relates to radar and mobile communication system.

Background

The existing antenna is limited by the difficult layout of the system and the heat dissipation requirement under the condition of high power, and generally has the problems of large volume, complex structure, difficult maintenance and the like, is difficult to miniaturize, and is difficult to realize multi-frequency phase scanning and multi-frequency combination.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to prior art's above-mentioned defect, provide a nested formula radiation array, compact structure is favorable to the miniaturization to can realize that multi-frequency sweeps mutually, and multi-frequency makes up.

The utility model provides a technical scheme that its technical problem adopted includes: there is provided a nested radiating array comprising:

the metal outer frame is provided with an accommodating cavity with an opening at the upper part;

the metal mounting plate is arranged in the containing cavity of the metal outer frame and comprises a metal substrate, and the metal substrate divides the containing cavity into a first containing cavity positioned below and a second containing cavity positioned above;

several low frequency antenna arrays, insert in this accepting the cavity vertically, including: the first circuit comprises a filter arranged on the inner side of the first metal frame and a low-frequency passive radiator arranged at the top of the first metal frame;

several high-frequency antenna arrays vertically inserted in the receiving cavity, including: the second circuit comprises a receiving and transmitting circuit which is arranged on the inner side of the second metal frame and consists of a high-frequency power amplifier, a low-noise amplifier, a switch and an amplitude-phase control circuit, and a high-frequency passive radiator on the top of the second metal frame;

several high-frequency power synthesis modules, which are arranged at the bottom side of the high-frequency antenna array and comprise a high-frequency power synthesis circuit electrically connected with the high-frequency transceiver circuit of the high-frequency antenna array and a metal frame arranged at the outer side of the high-frequency processing circuit;

the energy storage material pieces are arranged between the metal frame of the high-frequency power synthesis module and the metal mounting plate; and

the low-frequency receiving and transmitting assembly is horizontally arranged in the first accommodating cavity and comprises a plurality of power amplifiers, a plurality of low-noise amplifiers, a plurality of switches and a plurality of amplitude-phase control circuits, and connectors of the low-frequency antenna arrays penetrate through the substrate and are electrically connected with the low-frequency receiving and transmitting circuits.

In some embodiments, two high-frequency antenna arrays are arranged in parallel between two adjacent low-frequency antenna arrays, and the two high-frequency antenna arrays in parallel share one high-frequency power combining module.

In some embodiments, the first metal frame is provided at both ends thereof with fixing members integrated with the first metal frame.

In some embodiments, the metal outer frame comprises a rectangular bottom plate and four side plates extending upwards from four sides of the bottom plate; two step parts are formed between the bottom plate and the two side plates extending longitudinally; the fixing piece is correspondingly fixed on the step part.

In some embodiments, the longitudinal dimension of the mount corresponds to a sum of a longitudinal dimension of the low frequency antenna array and a longitudinal dimension of two of the high frequency antenna arrays respectively located on opposite sides of the low frequency antenna array.

In some embodiments, the first metal frame is composed of two metal pieces located outside the first circuit, the metal pieces having a laterally thickened base; the high-frequency power combining module is supported on the top side of the base.

In some embodiments, the base of the first metal frame is correspondingly matched with the step protruding downwards formed by the metal frame of the high-frequency power combining module.

In some embodiments, the metal mounting plate further includes a plurality of heat dissipation teeth protruding upward from the metal substrate, and the top and bottom ends of the energy storage material respectively contact the metal frame of the high-frequency power combining module and the heat dissipation teeth.

In some embodiments, further comprising: the low-frequency control circuit module, the high-frequency control circuit module, the low-frequency conversion transceiving component and the high-frequency conversion transceiving component are arranged below the low-frequency transceiving component and are positioned in the first accommodating cavity.

In some embodiments, the first circuit includes a first circuit board and a filter and a number of low frequency passive radiators formed on the first circuit board; the second circuit comprises a second circuit board, a receiving and transmitting circuit and a plurality of high-frequency passive radiators, wherein the receiving and transmitting circuit and the high-frequency passive radiators are formed on the second circuit board and are composed of a plurality of high-frequency power amplifiers, a plurality of low-noise amplifiers, a plurality of switches and a plurality of amplitude-phase control circuits.

Compared with the prior art, the utility model discloses a nested formula radiation array, ingenious cooperation through metal frame, metal mounting panel, a plurality of low frequency antenna array, a plurality of high frequency power synthesis module, a plurality of energy storage material spare and low frequency receiving and dispatching subassembly, compact structure is favorable to the miniaturization to realize that multi-frequency sweeps mutually, and multi-frequency makes up.

Drawings

Fig. 1 is a schematic sectional structure of the nested radiation array of the present invention.

Fig. 2 is the utility model discloses a nested formula radiation array look sideways at structural schematic.

Fig. 3 is a schematic view of the nested radiation array of the present invention.

Fig. 4 is an enlarged schematic view of the local structure of the nested radiation array of the present invention.

Fig. 5 is a schematic diagram of a combination structure of the low frequency antenna array and the low frequency transceiving module according to the present invention.

Fig. 6 is a schematic side view of the low frequency antenna array of the present invention.

Fig. 7 and 8 are schematic diagrams of the combined structure of the high frequency antenna array and the high frequency power combining module according to the present invention from two different viewing angles.

Wherein the reference numerals are as follows: 10 nested radiation array 1 metal outer frame 11 bottom plate 12 side plate 13 step 19 containing cavity 191 first containing cavity 192 second containing cavity 2 metal mounting plate 21 base plate 22 heat dissipation tooth 3 low frequency antenna array 31 first circuit 32

first metal frame

321, 322

metal piece

3211, 3221

base

3212, 3222 body 33 connector 4 high frequency antenna array 41 second circuit 42 second metal frame 5 high frequency power synthesis module 53 step 6 energy storage material 7 low frequency transceiver module 8 radio frequency connector 9 mounting.

Detailed Description

For the purpose of illustrating the structure and features of the present invention in detail, the following preferred embodiments are described in conjunction with the accompanying drawings.

Referring to fig. 1 to 4, fig. 1 is a schematic cross-sectional structure of the nested radiation array of the present invention. Fig. 2 is the utility model discloses a nested formula radiation array look sideways at structural schematic. Fig. 3 is a schematic view of the nested radiation array of the present invention. Fig. 4 is an enlarged schematic view of the local structure of the nested radiation array of the present invention. The utility model provides a many nested formula radiation array 10, it includes: the device comprises a metal outer frame 1, a metal mounting plate 2, a plurality of low-frequency antenna arrays 3, a plurality of high-frequency antenna arrays 4, a plurality of high-frequency power synthesis modules 5, a plurality of energy storage material pieces 6, a low-frequency transceiving component 7, a plurality of radio-frequency connectors 8 and a plurality of fixing pieces 9.

The metal frame 1 has an accommodation cavity 19 with an upper opening. The housing cavity 19 is partitioned by the upper and lower portions of the metal mounting plate into a first lower housing cavity 191 and a second upper housing cavity 192.

The metal outer frame 1 includes a rectangular bottom plate 11 and four side plates 12 extending upward from four sides of the bottom plate 11. Two step portions 13 are formed between the bottom plate 11 and the two side plates 12 extending in the longitudinal direction.

The metal mounting plate 2 is installed in the containing cavity 19 of the metal frame 1 and includes a base plate 21 and a plurality of heat dissipation teeth 22 protruding upward from the base plate 21. The substrate 21 separates the receiving cavity 19 into a first receiving cavity 191 and a second receiving cavity 192. Specifically, the base plate 21 is fixed to the metal casing 1 by fasteners such as screws.

A plurality of low frequency antenna arrays 3, vertically inserted in the housing chamber 19, comprising: a first circuit 31, a first metal frame 32 disposed outside the first circuit 31, and a plurality of connectors 33 disposed at a bottom side of the first circuit 31. Specifically, the first circuit 31 includes a first circuit board and a filter disposed inside the first metal frame 32 and a low frequency passive radiator on top of the first metal frame 32.

For example, the first circuit board may be a multi-layered PCB board or a multi-layered LTCC (low temperature co-fired ceramic board). The low-frequency antenna array 3 is a rectangular thin plate (sheet) and is arranged perpendicular to the bottom plate (namely the bottom plate 11 of the metal outer frame 1), and the metal frame (namely the first metal frame 32) is additionally arranged on the radio frequency circuit to form modularization, so that short circuit of the radio frequency circuit is avoided.

A plurality of high frequency antenna arrays 4 vertically inserted in the receiving cavity 19, including: a second circuit 41 and a second metal frame 42 disposed outside the second circuit 41. Specifically, the second circuit 41 includes a second circuit board, a transceiver circuit including a high-frequency power amplifier, a low-noise amplifier, a switch and an amplitude-phase control circuit, and a high-frequency passive radiator disposed on the top of the second metal frame 42. Two high frequency antenna arrays 4 are arranged in parallel between two adjacent low frequency antenna arrays 3.

For example, the second circuit board may be a multilayer PCB board or a multilayer LTCC, the upper portion is a radiator, and the lower portion is a transceiver circuit formed by a power amplifier, a low noise amplifier, a switch, and an amplitude and phase control circuit. The high-frequency antenna array 4 is a rectangular thin plate (sheet) and is arranged perpendicular to the bottom plate, and a metal frame (namely, a second metal frame 42) is additionally arranged on the radio-frequency circuit to form modularization, so that the electromagnetic compatibility is favorably ensured. The second circuit 41 and the second metal frame 42 may be soldered, adhered by conductive adhesive, or fixed by a fastener such as a flat head screw.

And a plurality of high-frequency power synthesis modules 5 which are designed in a modularized way and are arranged at the bottom side of the high-frequency antenna array 4, wherein the high-frequency power synthesis modules comprise a high-frequency power synthesis circuit electrically connected with the high-frequency transceiving circuit of the high-frequency antenna array 4 and a metal frame arranged at the outer side of the high-frequency power synthesis circuit. For example, two high-frequency antenna arrays 4 arranged in parallel share one high-frequency power combining circuit 5.

And the energy storage material pieces 6 are arranged between the metal frame of the high-frequency power synthesis module 5 and the metal mounting plate 2, so that the heat dissipation capacity is improved. Specifically, the energy storage material part 6 is a phase change material, heat generated by the radio frequency circuit is conducted to the energy storage material part 6 through a metal structure, and the energy storage material converts the heat through phase change, so that high-power heat dissipation is realized.

For example, the energy storage material is a phase change energy storage material, such as: the high-thermal-conductivity inorganic phase-change energy storage material comprises the following components in percentage by mass: 80-99.4% of energy storage material, 0.25-10% of nucleating agent, 0.1-15% of modifying agent, 0.1-15% of water and 0.15-19% of heat conduction reinforcing material, wherein the energy storage material is crystalline hydrated salt, the nucleating agent is carbonate or borate, the modifying agent is polyacrylic acid emulsion or thickening powder, and the heat conduction reinforcing material is one or a mixture of more of graphite, carbon powder, copper powder, carbon fiber and silicon carbide powder.

The low frequency transceiver component 7 is horizontally disposed in the first accommodating cavity 191, and includes a plurality of power amplifiers, a plurality of low noise amplifiers, a plurality of switches, and a plurality of amplitude-phase control circuits, wherein the connector 33 of each low frequency antenna array 3 penetrates through the substrate 21 and is electrically connected to the low frequency transceiver circuit.

For example, the low frequency transceiver component 7 is disposed parallel to the backplane and has a slightly smaller size than the metal backplane. The low-frequency transceiving component 7 is a multilayer PCB board or LTCC low-temperature co-fired ceramic board, can adopt a modular design, is additionally provided with a metal frame, and is fixed on the metal outer frame 1 by screws.

It should be noted that the nested radiation array 10 further includes: a frequency control circuit module, a high frequency control circuit module, a low frequency conversion transceiving component, and a high frequency conversion transceiving component (not shown), which are disposed below the low frequency transceiving component 7 and located in the first receiving cavity 191.

And the radio frequency connectors 8 are arranged on the side plates 12 of the metal outer frame 1 and are used for communicating the circuits inside the nested radiation array 10 with external circuits.

A plurality of fixing members 9, which are arranged to extend in the vertical direction (see fig. 3), are fixed to the step portion 13 of the metal outer frame 1 by using a fastening member such as a screw. For example, both ends of the first metal frame 32 are provided with the fixing pieces 9 integrated with the first metal frame 32, that is, the two fixing pieces 9 are integrally formed at both ends of the first metal frame 32. Referring to fig. 4, the longitudinal dimension of the fixing member 9 corresponds to the sum of the longitudinal dimension of one low frequency antenna array 3 and the longitudinal dimensions of two high frequency antenna arrays 4 respectively located on both sides of the low frequency antenna array 3.

Referring to fig. 5, fig. 5 is a schematic diagram of a combination structure of a low frequency antenna array and a low frequency transceiving module according to the present invention. The low frequency transceiving module 7 is disposed on the bottom side of the low frequency antenna array 1, and the low frequency transceiving module 7 is electrically connected to the connector 33 of the low frequency antenna array 3. The first circuit 31 includes a radiator formed on the first circuit board. The first metal frame 32 is thin plate-shaped and has a stepped portion formed at the bottom.

Referring to fig. 6, fig. 6 is a schematic side view structure of the low frequency antenna array of the present invention. The first metal frame 32 is composed of two

metal pieces

321 and 322 located outside the first circuit 31, and the

metal pieces

321 and 322 have laterally thickened

bases

3211 and 3221. A high frequency power combining module 5 is supported on the top side of the

bases

3211, 3221. The first circuit 31 is connected at the bottom side to a connector 33.

Referring to fig. 7 and 8, fig. 7 and 8 are schematic diagrams of the combined structure of the high frequency antenna array and the high power combining module according to the present invention from two different viewing angles. The second circuit 41 includes a radiator formed on the second circuit board. Two high-frequency antenna arrays 4 arranged in parallel share one high-frequency power combining module 5. The metal frame of the high-frequency power combining module 5 is formed with a step portion 53 projecting downward.

The utility model discloses a nested formula radiation array 10's beneficial effect includes but is not limited to: by skillfully matching the metal outer frame 1, the metal mounting plate 2, the low-frequency antenna arrays 3, the high-frequency antenna arrays 4, the high-frequency power synthesis modules 5, the energy storage material pieces 6 and the low-frequency transceiving components 7, the high-frequency transceiving components (surrounded by the second metal frame 42) are vertically arranged, and the low-frequency transceiving components 7 are horizontally arranged, the problem that an active phased array antenna multi-frequency circuit cannot be realized due to complex circuit design can be solved, and the low-frequency antenna arrays 3 and the high-frequency antenna arrays 4 adopt a nested structure, so that the problem of different frequency array spacing of the antenna arrays is solved, and the multi-frequency phased array scanning and multi-frequency combination is realized; meanwhile, the energy storage material piece 6 is added at the joint gap between the transversely arranged circuit and the vertically arranged circuit, so that the high-power tolerance of the active antenna array can be improved, and the problem of high-power heat dissipation is solved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and is not intended to limit the present invention. All such modifications and variations are intended to be included herein within the scope of this disclosure and the present invention.

Claims

1. A nested radiating array (10), comprising:

a metal outer frame (1) having an accommodating cavity (19) with an opening at the upper part;

the metal mounting plate (2) is arranged in the containing cavity (19) of the metal outer frame (1) and comprises a metal substrate (21), and the metal substrate (21) divides the containing cavity (19) into a first containing cavity (191) positioned at the lower part and a second containing cavity (192) positioned at the upper part;

a plurality of low frequency antenna arrays (3) vertically inserted in the housing chamber (19), comprising: the antenna comprises a first circuit (31), a first metal frame (32) arranged on the outer side of the first circuit (31) and a plurality of connectors (33) arranged on the bottom side of the first circuit (31), wherein the first circuit (31) comprises a filter arranged on the inner side of the first metal frame (32) and a low-frequency passive radiator arranged on the top of the first metal frame (32);

a plurality of high-frequency antenna arrays (4) vertically inserted in the housing chamber (19), comprising: the second circuit (41) comprises a high-frequency power amplifier, a low-noise amplifier, a switch, a transceiving circuit consisting of an amplitude and phase control circuit and a high-frequency passive radiator on the top of the second metal frame (42), wherein the high-frequency power amplifier, the low-noise amplifier, the switch and the amplitude and phase control circuit are arranged on the inner side of the second metal frame (42);

a plurality of high-frequency power synthesis modules (5) which are arranged at the bottom side of the high-frequency antenna array (4) and comprise high-frequency power synthesis circuits electrically connected with the high-frequency transceiving circuits of the high-frequency antenna array (4) and metal frames arranged at the outer sides of the high-frequency power synthesis circuits;

the energy storage material pieces (6) are arranged between the metal frame of the high-frequency power synthesis module (5) and the metal mounting plate (2); and

the low-frequency receiving and transmitting assembly (7) is horizontally arranged in the first accommodating cavity (191) and comprises a plurality of power amplifiers, a plurality of low-noise amplifiers, a plurality of switches and a plurality of amplitude-phase control circuits, and a connector (33) of each low-frequency antenna array (3) penetrates through the substrate (21) and is electrically connected with the low-frequency receiving and transmitting assembly.

2. The nested radiation array (10) according to claim 1, characterized in that: two high-frequency antenna arrays (4) which are arranged in parallel are arranged between two adjacent low-frequency antenna arrays (3), and the two high-frequency antenna arrays (4) which are arranged in parallel share one high-frequency power combining module (5).

3. The nested radiation array (10) according to claim 1, characterized in that: the two ends of the first metal frame (32) are provided with fixing pieces (9) integrated with the first metal frame (32).

4. The nested radiation array (10) according to claim 3, characterized in that: the metal outer frame (1) comprises a rectangular bottom plate (11) and four side plates (12) which extend upwards from four sides of the bottom plate (11); two step parts (13) are formed between the bottom plate (11) and the two side plates (12) extending longitudinally; the fixing piece (9) is correspondingly fixed on the step part (13).

5. The nested radiation array (10) according to claim 4, characterized in that: the longitudinal dimension of the fixing piece (9) corresponds to the sum of the longitudinal dimension of one low-frequency antenna array (3) and the longitudinal dimensions of two high-frequency antenna arrays (4) respectively positioned at two sides of the low-frequency antenna array (3).

6. The nested radiation array (10) according to claim 1, characterized in that: the first metal frame (32) is composed of two metal pieces (321, 322) positioned at the outer side of the first circuit (31), and the metal pieces (321, 322) are provided with bases (3211, 3221) which are thickened transversely; the high-frequency power combining module (5) is supported on the top side of the base (3211, 3221).

7. The nested radiation array (10) according to claim 6, characterized in that: the bases (3211, 3221) of the first metal frame (32) are correspondingly matched with the step (53) which protrudes downwards and is formed by the metal frame of the high-frequency power combining module (5).

8. The nested radiation array (10) according to claim 1, characterized in that: the metal mounting plate (2) further comprises a plurality of heat dissipation teeth (22) which protrude upwards from the base plate (21), and the top end and the bottom end of the energy storage material piece (6) are respectively abutted against the metal frame of the high-frequency power synthesis module (5) and the heat dissipation teeth (22).

9. The nested radiation array (10) according to claim 1, characterized in that: further comprising: a low-frequency control circuit module, a high-frequency control circuit module, a low-frequency conversion transceiving component and a high-frequency conversion transceiving component, which are arranged below the low-frequency transceiving component (7) and positioned in the first accommodating cavity 191.

10. The nested radiating array of any one of claims 1 to 9, wherein: the first circuit (31) comprises a first circuit board, a filter and a plurality of low-frequency passive radiators, wherein the filter and the low-frequency passive radiators are formed on the first circuit board; the second circuit (41) comprises a receiving and transmitting circuit which is arranged on the inner side of the second metal frame (42) and consists of a high-frequency power amplifier, a low-noise amplifier, a switch and an amplitude-phase control circuit, and a high-frequency passive radiator on the top of the second metal frame (42).