CN211605124U - Screen plate sucker for producing semiconductor diode - Google Patents
Screen plate sucker for producing semiconductor diode Download PDFInfo
- Publication number
- CN211605124U CN211605124U CN202020750204.8U CN202020750204U CN211605124U CN 211605124 U CN211605124 U CN 211605124U CN 202020750204 U CN202020750204 U CN 202020750204U CN 211605124 U CN211605124 U CN 211605124U
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- China
- Prior art keywords
- sucking disc
- main part
- semiconductor diode
- disc main
- seted
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 241001233242 Lontra Species 0.000 claims abstract description 11
- 210000003437 trachea Anatomy 0.000 claims abstract description 11
- 238000001179 sorption measurement Methods 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 241000208682 Liquidambar Species 0.000 abstract description 3
- 235000006552 Liquidambar styraciflua Nutrition 0.000 abstract description 3
- 235000013399 edible fruits Nutrition 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 235000012054 meals Nutrition 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000012271 agricultural production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000012824 chemical production Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Abstract
The utility model discloses a production otter board sucking disc for semiconductor diode relates to semiconductor diode production technical field, specifically is a production otter board sucking disc for semiconductor diode, the gas circuit passageway has been seted up to the inside of sucking disc main part, the absorption hole has been seted up to the inboard of sucking disc main part, the circular slot has been seted up in the outside in absorption hole, the outside fixedly connected with ring groove of sucking disc main part, the outside fixedly connected with annular buckle of cushion, the inboard of cushion is seted up flutedly, the outer lane fixedly connected with card pad of recess, tracheal one end UNICOM has the shunt tubes, link fixed connection is in the upper end of sucking disc main part. This otter board sucking disc for production semiconductor diode sets up through the cooperation of trachea, shunt tubes gentleness sweetgum fruit passageway, forms the negative pressure in the inside of sucking disc main part, utilizes this net sucking disc control chip to remove, and avoids hindering the link at sucking disc main part top and the cooperation of jack catch, conveniently removes the net sucking disc to accomplish the sabot of chip fast, have high-efficient stable effect.
Description
Technical Field
The utility model relates to a semiconductor diode produces technical field, specifically is a production otter board sucking disc for semiconductor diode.
Background
With the continuous development of scientific technology, electrical equipment applied by people rises, so that semiconductors are developed, and the semiconductors play an important role in a plurality of circuits. For example: in the fields of metallurgical industry, chemical production, electric power engineering, paper industry, mechanical manufacturing, food processing and the like, people need various machines and equipment for carrying out debugging control; diodes are found in agricultural production, grain storage, computer rooms, household appliances, and the like. Therefore, diodes which are very valuable for new societies of various devices and equipment are made of semiconductors of III-IV group compounds, such as gallium arsenide, gallium phosphide, gallium arsenide phosphide and the like, and the core of the diodes is PN junction. Therefore, the characteristics of forward conduction, reverse cut-off and breakdown are obtained. Good anti-seismic performance, low power consumption, low cost and the like.
The existing diode production process mainly comprises the following steps: welding, acid washing, gluing, mould pressing, curing and the like. The purpose of welding is to connect the chip and the metal lead by using a welding sheet at a certain temperature to form an ohmic antenna. The auxiliary process of the process consists of direction discharging, filling, furnace entering, furnace discharging and conversion. Wherein the process of filling loads the chip and goes between the upper end of the lead wire in the welding groove, and this process still is the completion of pure artifical manual loading among the prior art, and work efficiency is low, consuming time and consuming labor, and the manual work is carried the chip with the chip suction pen and is transported the assigned position, takes place easily and omit etc. it does not have a suitable sucking disc to make things convenient for the absorption of chip to can link together with automation equipment and use, this is the problem that we need to solve urgently.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a be not enough to prior art, the utility model provides a production otter board sucking disc for semiconductor diode has solved the problem of proposing among the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a production otter board sucking disc for semiconductor diode, includes sucking disc main part, cushion, trachea, link, the sucking disc main part is squarely, the gas circuit passageway has been seted up to the inside of sucking disc main part, the absorption hole has been seted up to the inboard of sucking disc main part, the circular slot has been seted up in the outside in absorption hole, the outside fixedly connected with ring groove of sucking disc main part, the outside fixedly connected with annular buckle of cushion, the inboard of cushion is seted up flutedly, the outer lane fixedly connected with card of recess fills up, tracheal one end UNICOM has the shunt tubes, and link fixed connection is in the upper end of sucking disc main part.
Optionally, the air passage channels are arranged inside the sucker main body in a matrix grid shape, and the air passage channels are communicated with the three shunt tubes.
Optionally, the trachea sets up the side at the sucking disc main part, the upper end of link is provided with the spread groove.
Optionally, the cushion passes through the inside of annular buckle joint at the ring groove in the sucking disc main part outside.
Optionally, the number of the adsorption holes is several, and the adsorption holes are respectively located at the intersection point of each matrix grid.
Optionally, a filter screen is arranged inside the groove, and the clamping pad is clamped inside the circular groove.
(III) advantageous effects
The utility model provides a production otter board sucking disc for semiconductor diode possesses following beneficial effect:
1. this otter board sucking disc for production semiconductor diode, through the trachea, shunt tubes and the cooperation setting of sweetgum fruit passageway, form the negative pressure in the inside of sucking disc main part, through adsorbing the absorption operation of hole completion chip, thereby utilize this net sucking disc control chip to remove, in addition, trachea and shunt tubes set up the side in the sucking disc main part, thereby avoid hindering the link at sucking disc main part top and the cooperation of jack catch, the convenience is removed the net sucking disc, thereby accomplish the sabot of chip fast, high-efficient stable effect has.
2. This otter board sucking disc for production semiconductor diode, through the cushion, annular buckle and ring groove's cooperation sets up, make the soft meal can the joint in the inboard bottom of sucking disc main part, the recess docks in the outside in each absorption hole, and the card pad is pegged graft in the inside of circular slot, make the bottom at the sucking disc main part of closely laminating of whole cushion, thereby during the absorption chip, the chip pastes the surface at the cushion, and indirect and sucking disc main part contact, the wearing and tearing to the chip have been prevented, make whole absorption and the more safety and stability of removal process.
Drawings
FIG. 1 is a schematic structural view of the connection end and the suction cup main body of the present invention;
FIG. 2 is a schematic cross-sectional structural view of the present invention;
FIG. 3 is a schematic structural view of the gas path channel of the present invention;
FIG. 4 is a schematic structural view of the suction cup body and the soft pad of the present invention;
fig. 5 is an enlarged schematic view of a portion a of fig. 2 according to the present invention;
fig. 6 is an enlarged schematic view of the structure of fig. 4 at B according to the present invention;
fig. 7 is an enlarged schematic view of the structure at C in fig. 4 according to the present invention.
In the figure: 1. a suction cup main body; 101. an annular neck; 2. a soft cushion; 201. an annular buckle; 3. an air tube; 301. a shunt tube; 4. a connecting end; 401. connecting grooves; 5. a gas path channel; 6. an adsorption hole; 7. a circular groove; 8. a groove; 801. a filter screen; 9. and (6) clamping the pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1 to 7, the present invention provides a technical solution: a mesh plate sucker for producing a semiconductor diode comprises a sucker main body 1, a cushion 2, an air pipe 3 and a connecting end 4, wherein the sucker main body 1 is square, an air channel 5 is arranged in the sucker main body 1, the air channel 5 is arranged in the sucker main body 1 in a matrix grid shape, the air channel 5 is communicated with three shunt tubes 301, adsorption holes 6 are formed in the inner side of the sucker main body 1, the quantity of the adsorption holes 6 is multiple, the adsorption holes 6 are respectively positioned at the intersection point of each matrix grid, circular grooves 7 are formed in the outer sides of the adsorption holes 6, an annular clamping groove 101 is fixedly connected to the outer side of the sucker main body 1, an annular buckle 201 is fixedly connected to the outer side of the cushion 2, the cushion 2 is clamped in the annular clamping groove 101 in the outer side of the sucker main body 1 through the annular buckle 201, a groove 8 is formed in the inner side of the cushion 2, through the matching arrangement of the soft cushion 2, the annular buckle 201 and the annular clamping groove 101, the soft rice 2 can be clamped at the bottom of the inner side of the sucker main body 1, the groove 8 is butted at the outer side of each adsorption hole 6, and the clamping pad 9 is inserted in the circular groove 7, so that the whole soft cushion 2 is tightly jointed at the bottom of the sucker main body 1, when a chip is adsorbed, the chip is pasted on the surface of the soft cushion 1 and is not directly contacted with the sucker main body 1, the abrasion of the chip is prevented, the whole adsorption and moving processes are safer and more stable, the clamping pad 9 is clamped in the circular groove 7, the clamping pad 9 is fixedly connected with the outer ring of the groove 8, one end of the air pipe 3 is communicated with the shunt pipe 301, the air pipe 3 is arranged at the side end of the sucker main body 1, the upper end of the connecting end 4 is provided with the connecting groove 401, the connecting end 4 is fixedly connected at the upper end of the, form the negative pressure in the inside of sucking disc main part 1, through the absorption operation of adsorbing the hole 6 completion chip to utilize this net sucking disc control chip to remove, in addition, trachea 3 and shunt tubes 301 set up the side at sucking disc main part 1, thereby avoid hindering the cooperation of link 4 at 1 top of sucking disc main part and jack catch, conveniently remove the net sucking disc, thereby accomplish the sabot of chip fast, have high-efficient stable effect.
When the automatic sucking disc is used, the connecting end 4 is connected with a clamping jaw of automatic equipment, so that the whole sucking disc machine is controlled to move, the air pipe 3 is arranged on one side of the sucking disc main body 1, the air channel pipeline 5 in a matrix net shape is formed in the sucking disc main body 1 and communicated with the inside of the air channel pipeline 5 through the flow dividing pipe 301, air is sucked in the air channel pipeline 5, and the suction hole 6 in the inner side of the sucking disc main body 1 generates suction force to adsorb a chip; in addition, the inboard lock joint of sucking disc main part 1 has cushion 2, and the recess 8 of cushion 2 upper end is corresponding with adsorbing hole 6, card pad 9 joint is in the inside of circular slot 7 for cushion 2 hugs closely in the bottom of sucking disc main part 1, just so when making the chip adsorbed, paste the upper end at cushion 2, and the non-direct contacts with sucking disc main part 1, avoided the damage to the semiconductor diode chip, thereby steady safe remove the chip to the assigned position.
In summary, the following steps: this otter board sucking disc for producing semiconductor diode, through trachea 3, shunt tubes 301 and the cooperation setting of sweetgum fruit passageway 5, form the negative pressure in the inside of sucking disc main part 1, accomplish the absorption operation of chip through adsorbing hole 6, thereby utilize this net sucking disc control chip to remove, in addition, trachea 3 and shunt tubes 301 set up the side of sucking disc main part 1, thereby avoid hindering the cooperation of link 4 and the jack catch at sucking disc main part 1 top, conveniently remove the net sucking disc, thereby accomplish the sabot of chip fast, high-efficient stable effect has, through the cooperation setting of cushion 2, ring buckle 201 and ring channel 101, make soft meal 2 can the joint in the inboard bottom of sucking disc main part 1, recess 8 docks in the outside of each adsorbing hole 6, and the inside at circular slot 7 is pegged graft to card pad 9, make whole cushion 2 closely laminate in the bottom of sucking disc main part 1, thereby when adsorbing the chip, the chip pastes on the surface of cushion 1, and the non-direct contact with sucking disc main part 1 has prevented the wearing and tearing to the chip for whole absorption and the more safety and stability of removal process.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a production otter board sucking disc for semiconductor diode, includes sucking disc main part (1), cushion (2), trachea (3) and link (4), its characterized in that: sucking disc main part (1) is squarely, gas circuit passageway (5) have been seted up to the inside of sucking disc main part (1), adsorption hole (6) have been seted up to the inboard of sucking disc main part (1), circular slot (7) have been seted up in the outside of adsorption hole (6), outside fixedly connected with ring groove (101) of sucking disc main part (1), outside fixedly connected with ring buckle (201) of cushion (2), the inboard of cushion (2) is seted up flutedly (8), outer lane fixedly connected with card pad (9) of recess (8), the one end UNICOM of trachea (3) has shunt tubes (301), and link (4) fixed connection is in the upper end of sucking disc main part (1).
2. The web chuck for manufacturing a semiconductor diode according to claim 1, wherein: the air channel (5) is arranged inside the sucker main body (1) in a matrix grid shape, and the air channel (5) is communicated with the three shunt tubes (301).
3. The web chuck for manufacturing a semiconductor diode according to claim 1, wherein: trachea (3) set up the side at sucking disc main part (1), the upper end of link (4) is provided with spread groove (401).
4. The web chuck for manufacturing a semiconductor diode according to claim 1, wherein: the soft pad (2) is clamped inside the annular clamping groove (101) on the outer side of the sucker main body (1) through an annular buckle (201).
5. The web chuck for manufacturing a semiconductor diode according to claim 1, wherein: the number of the adsorption holes (6) is a plurality, and the adsorption holes (6) are respectively positioned at the intersection points of each matrix grid.
6. The web chuck for manufacturing a semiconductor diode according to claim 1, wherein: the filter screen (801) is arranged in the groove (8), and the clamping pad (9) is clamped in the circular groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020750204.8U CN211605124U (en) | 2020-05-09 | 2020-05-09 | Screen plate sucker for producing semiconductor diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020750204.8U CN211605124U (en) | 2020-05-09 | 2020-05-09 | Screen plate sucker for producing semiconductor diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211605124U true CN211605124U (en) | 2020-09-29 |
Family
ID=72584827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020750204.8U Expired - Fee Related CN211605124U (en) | 2020-05-09 | 2020-05-09 | Screen plate sucker for producing semiconductor diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211605124U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015369A (en) * | 2021-02-26 | 2021-06-22 | 川北医学院附属医院 | Intelligent integrated module of medical bracelet and processing method thereof |
| CN113183009A (en) * | 2021-04-06 | 2021-07-30 | 安徽禾臣新材料有限公司 | Adsorption pad for electronic display screen thinning and polishing and preparation method thereof |
| CN116571417A (en) * | 2023-07-11 | 2023-08-11 | 苏州双远电子科技有限公司 | Glue curing oven for diode processing |
-
2020
- 2020-05-09 CN CN202020750204.8U patent/CN211605124U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015369A (en) * | 2021-02-26 | 2021-06-22 | 川北医学院附属医院 | Intelligent integrated module of medical bracelet and processing method thereof |
| CN113183009A (en) * | 2021-04-06 | 2021-07-30 | 安徽禾臣新材料有限公司 | Adsorption pad for electronic display screen thinning and polishing and preparation method thereof |
| CN113183009B (en) * | 2021-04-06 | 2023-03-10 | 安徽禾臣新材料有限公司 | Adsorption pad for electronic display screen thinning and polishing and preparation method thereof |
| CN116571417A (en) * | 2023-07-11 | 2023-08-11 | 苏州双远电子科技有限公司 | Glue curing oven for diode processing |
| CN116571417B (en) * | 2023-07-11 | 2023-09-15 | 苏州双远电子科技有限公司 | Glue curing oven for diode processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200929 |