CN211605108U

CN211605108U - Wafer reading equipment

Info

Publication number: CN211605108U
Application number: CN202020490792.6U
Authority: CN
Inventors: 吕晓晨; 张浩冉; 吴健健
Original assignee: SiEn Qingdao Integrated Circuits Co Ltd
Current assignee: SiEn Qingdao Integrated Circuits Co Ltd
Priority date: 2020-04-07
Filing date: 2020-04-07
Publication date: 2020-09-29
Anticipated expiration: 2030-04-07

Abstract

The invention provides a wafer reading device and a reading method. The equipment comprises a fixed frame, a lower guide rail, an upper guide rail, a base, a first driving device, a second driving device and a control device; the fixing frame is used for placing the wafer box; the lower guide rail is positioned below the wafer box, and a cam is arranged on the lower guide rail and provided with a large end face and a small end face; the upper guide rail is positioned above the wafer box, and a reading device is arranged on the upper guide rail; the fixed frame, the lower guide rail and the upper guide rail are all positioned on the base; the first driving device is connected with the lower guide rail and used for driving the lower guide rail to horizontally move and rotate so as to drive the cam to horizontally move and rotate around the lower guide rail; the second driving device is connected with the upper guide rail and used for driving the upper guide rail to move horizontally so as to drive the reading device to move along the horizontal direction; the control device is connected with the first driving device, the second driving device and the reading device; when the big end face of the cam lifts the wafer, the reading device reads. The invention can effectively reduce the production cost and improve the production efficiency.

Description

Wafer reading equipment

Technical Field

The present invention relates to the field of integrated circuit manufacturing, and more particularly, to a wafer reading apparatus and a wafer reading method.

Background

In the manufacturing process of semiconductor chips, when the wafer is sliced, the wafer cassette is replaced and the alarm of wafer error transmission is processed, the ID and serial number of the wafer are required to be read and identified. In the prior art, an optical lens in a sorter (a kind of transmission equipment) is generally used to photograph and identify the ID and serial number of a wafer, and the process generally includes: a wafer box (such as POD/Foup) to be identified is placed on a sorter SMIF (standard mechanical interface), then a transfer robot carries out single wafer transfer on the wafer, the wafer is aligned and edge-searched firstly, and then the wafer is transferred to a detection stack point of an optical lens to carry out one-time photographing identification on the ID and the serial number of the wafer by means of a U-shaped mechanical arm/a double-optical lens/a reflector. This method has several disadvantages, such as only one wafer can be read at a time, and the wafer is transferred back to the cassette after the reading is finished, which has very low reading efficiency (the cassette can generally hold 25 wafers in a batch, and 360s is usually required after the reading of a batch). In addition, the ordinary sorters cannot process the sheets, the sheets are easy to be broken and scratched in the conveying process, the sheets are required to be realized by mechanical arms such as Bernoulli, and the special equipment is expensive, so that the production cost is increased.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer reading apparatus and a wafer reading method, which are used to solve the problems of low wafer reading efficiency, easy wafer breakage, and high production cost in the prior art.

In order to achieve the above and other related objects, the present invention provides a wafer reading apparatus, which includes a fixing frame, a lower guide rail, an upper guide rail, a base, a first driving device, a second driving device and a control device; the fixing frame is used for placing a wafer box, and the wafer box is used for bearing wafers; the lower guide rail is positioned below the wafer box, a cam is arranged on the lower guide rail, and the cam is provided with a large end face and a small end face opposite to the large end face; the upper guide rail is positioned above the wafer box, and a reading device is arranged on the upper guide rail and used for reading serial numbers on the surface of the wafer; the fixed frame, the lower guide rail and the upper guide rail are all positioned on the base; the first driving device is connected with the lower guide rail and used for driving the lower guide rail to horizontally move and rotate so as to drive the cam to horizontally move and rotate around the lower guide rail; the second driving device is connected with the upper guide rail and used for driving the upper guide rail to move horizontally so as to drive the reading device to move along the horizontal direction; the control device is connected with the first driving device, the second driving device and the reading device and is used for controlling the driving operation of the first driving device and the second driving device and controlling the reading direction of the reading device; when the cam rotates to the position below the wafer and the wafer is lifted up through the large end face, the number of the wafer is read by the reading device.

Optionally, the fixing frame includes two fixing rods arranged in parallel at intervals and an auxiliary rod connected between the two fixing rods, the fixing rods are oppositely provided with grooves, the grooves have inclined slopes, and when the wafer cassette is placed in the grooves of the fixing frame, the wafers are inclined in the same direction.

Optionally, the wafer reading apparatus further includes a supporting column located on the lower surface of the base, and the inclination of the base can be adjusted by adjusting the height of the supporting column, so that the wafer tilts in the same direction when the wafer cassette is placed on the fixing frame.

Optionally, the reading device includes an OCR lens, the serial number of the wafer includes an identification number and a material number, and the serial number of the wafer is located on two opposite surfaces of the wafer; and the reading device reads the serial number of the wafer along the vertical direction.

Optionally, a groove is formed in a large end face of the cam and used for bearing a wafer, and a material of a surface of the groove includes PEI.

Optionally, the large end face and the small end face of the cam are both arc-shaped faces, the maximum distance from the large end face to the rotation center of the cam is 2-4 cm, the depth of each groove is 0.2-0.4 cm, the transverse distance from the large end face to the wafer is 2-4 cm, and the maximum distance from the small end face of the cam to the rotation center of the cam is 0.5-1 cm.

Optionally, the wafer reading apparatus further includes a support frame located on the base, the upper guide rail, the lower guide rail and the fixing frame are connected to the support frame, and the height of the support frame is adjustable.

Optionally, the cam is made of PEEK, and the upper guide rail, the lower guide rail, the fixing frame and the supporting frame are made of stainless steel.

Optionally, the wafer reading apparatus further includes a sensor located on the lower guide rail, where the sensor is connected to the control device, and is configured to drive the lower guide rail to move in the horizontal direction when the sensor senses that there is no wafer on the cam, and otherwise, control the lower guide rail to rotate so that the large end surface of the cam rotates to a position below the wafer to lift the wafer.

The invention also provides a wafer reading method which is carried out based on the wafer reading equipment in any scheme.

As described above, the wafer reading apparatus and the wafer reading method of the present invention have the following advantages: through the improved structural design, the wafer is jacked from the wafer box through the cam in the wafer reading process, the serial number of the wafer can be read, the wafer can be placed back in situ after the reading is finished, the complex wafer transferring process is not needed, the reading efficiency is greatly improved, and the risk of wafer damage can be effectively reduced. The wafer reading equipment has the advantages of simple structure, low cost and convenient use. By adopting the wafer reading equipment and the reading method, the production cost can be effectively reduced, and the production efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a wafer reading apparatus according to the present invention.

Fig. 2 is a schematic structural diagram of a holder of the wafer reading apparatus of the present invention.

Fig. 3 is a partially enlarged schematic view of a portion a of fig. 1.

Fig. 4 is a schematic structural diagram of a cam in the wafer reading apparatus of the present invention.

FIG. 5 is a schematic view showing a state where the wafer is lifted by the cam.

Fig. 6 shows a schematic view of the connection of the sensor and the lower rail.

Description of the element reference numerals

11 fixed mount

111 fixing rod

112 auxiliary rod

113 groove

12 wafer box

13 wafer

131 cut

14 lower guide rail

15 cam

16 upper guide rail

17 reading device

18 base

19 support frame

20 sensor

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.

Please refer to fig. 1 to 6. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship may be made without substantial technical changes.

As shown in fig. 1 to 6, the present invention provides a wafer reading apparatus, which includes a fixing frame 11, a lower guide rail 14, an upper guide rail 16, a base 18, a first driving device, a second driving device and a control device; the fixed frame 11 is used for placing a wafer box 12, and the wafer box 12 is used for bearing a wafer 13; in the process of reading the serial number of the wafer 13, the lower guide rail 14 is located below the wafer box 12, a cam 15 is arranged on the lower guide rail 14, and the cam 15 has a large end face and a small end face opposite to the large end face; the upper guide rail 16 is positioned above the wafer box 12, and a reading device 17 is arranged on the upper guide rail 16 and used for reading the serial number of the surface of the wafer 13; the fixed frame 11, the lower guide rail 14 and the upper guide rail 16 are all positioned on the base 18; the first driving device is connected with the lower guide rail 14 and is used for driving the lower guide rail 14 to horizontally move and rotate so as to drive the cam 15 to move along the horizontal direction and rotate around the lower guide rail 14; the second driving device is connected with the upper guide rail 16 and is used for driving the upper guide rail 16 to move horizontally so as to drive the reading device 17 to move along the horizontal direction; the control device is connected with the first driving device, the second driving device and the reading device 17 and is used for controlling the driving operation of the first driving device and the second driving device and controlling the reading direction of the reading device 17; when the cam 15 rotates below the wafer 13 and pushes up the wafer 13 by the large end face, the reading device 17 reads the number of the wafer 13, and after the reading operation of the wafer 13 is completed, the cam 15 rotates to be away from the wafer 13 and then moves to the next wafer 13 to be read under the driving of the lower guide rail 14. Through the improved structural design, the wafer is jacked from the wafer box through the cam in the wafer reading process, the serial number of the wafer can be read, the wafer can be placed back in situ after the reading is finished, the complex wafer transferring process is not needed, the reading efficiency is greatly improved, and the risk of wafer damage can be effectively reduced. The wafer reading equipment has the advantages of simple structure, low cost and convenient use. The wafer reading equipment provided by the invention is used for reading the wafer, so that the production cost can be effectively reduced, and the production efficiency is improved.

The wafer box 12 is provided with a plurality of slots (slot) for placing the wafers 13, the middle of the wafer box is hollowed out, the wafers 13 are erected in the slots, and the lower guide rail 14 is located below the hollowed-out part of the wafer box 12 and preferably located right below, namely the lower guide rail 14 is located below the middle of the wafer box 12.

As shown in fig. 2, the fixing frame 11 includes two fixing rods 111 arranged in parallel at intervals and an auxiliary rod 112 connected between the two fixing rods 111, and the number of the auxiliary rods 112 may be 2 or more than 2, but the distance between the auxiliary rods 112 is preferably larger than the longitudinal dimension of the wafer cassette 12 (i.e., the distance in the arrangement direction of the wafers 13) to avoid interference with the movement of the lower guide 14, or to ensure that the cam 15 is located in the auxiliary rod 112 during the reading operation. The auxiliary rod 112 is connected to prevent the fixing rod 111 from moving and the wafer cassette 12 from slipping off. As an example, the fixing bar 111 is oppositely provided with a groove 113, the groove 113 has an inclined slope surface extending along the length direction of the fixing bar 111 (preferably, a clamping groove is provided at the lowest position of the inclined slope surface to fix the wafer cassette 12, so as to prevent the wafer cassette 12 from slipping and falling, and to make the upper guide rail 16, the lower guide rail 14 and the wafer cassette 12 parallel to each other), when the wafer cassette 12 (the bottom of the wafer cassette usually has a supporting leg, which is placed in the groove) is placed in the groove 113 of the fixing frame 11, the wafer 13 is inclined to the same direction. The groove can be a structure with a concave middle part and a convex circumferential part, namely, the groove can be embedded into the fixing rod 111 to firmly fix the wafer box 12, so that the wafer 13 is prevented from being damaged due to the sliding of the wafer box 12. Of course, in other examples, the groove may be a circumferential incomplete protrusion, which is not strictly limited in this embodiment. By inclining the wafer box 12, the wafer 13 is leaned on the same side of the slot in the wafer box 12, so that the number of the wafer 13 cannot be accurately identified, the phenomenon that the wafer 13 is askew from east to west can be prevented, the phenomenon that the cam 15 generates transverse stress in different directions to cause fragment when jacking up the wafer 13 can be effectively avoided, and the reading device 17 can read the number of the wafer 13 from the vertical direction conveniently. Of course, the tilt angle of the wafer box should not be too large to avoid the wafer from slipping, and a preferred tilt angle is 30 °.

In another example, in order to make the wafer box 12 in an inclined state, a plurality of height-adjustable supporting columns, for example, 4 supporting columns, may be disposed on the lower surface of the base 18, and arranged in a pairwise manner, and the inclination of the base 18 may be adjusted by adjusting the height of one side of the supporting columns (for example, the supporting columns may be shock-proof feet with screws, and the inclination is achieved by screwing anchor screws to change the height of one side), so that the wafers 13 are inclined in the same direction when the wafer box 12 is placed on the fixing frame 11. The surface inclination of the susceptor 18 and thus the inclination of the wafer cassette 12 can be very conveniently achieved by height adjustment of the support columns.

As an example, the wafer reading apparatus further includes a supporting frame 19 located on the base 18, and the upper rail 16, the lower rail 14 and the fixing frame 11 are connected to the supporting frame 19. The structure of the supporting frame 19 can be shown in fig. 1, for example, it is a rectangular frame structure, and specifically includes a transverse rod and a longitudinal rod which are connected perpendicularly to each other, the upper guide rail 16 is connected to the transverse rod, the height of the supporting frame 19 can be adjusted, for example, by adjusting the height of the longitudinal rod to achieve height adjustment, and the specific structure can be shown in fig. 3. When the wafer 13 needs to be read and the reading operation is completed, the supporting frame 19 may be raised to place the wafer cassette 12 into the fixing frame 11 or remove the wafer cassette from the fixing frame 11.

As shown in fig. 4 and 5, in an example, the large end surface and the small end surface of the cam 15 are both arc-shaped surfaces (the connecting surface of the large end surface and the small end surface may be a horizontal surface or a curved surface), and a groove is disposed on the large end surface for carrying the wafer 13, and the bottom surface of the groove is preferably a horizontal surface, that is, the depth of the groove gradually increases from two sides to the middle. In one example, the maximum distance from the large end surface to the rotation center of the cam 15, i.e., L1 in fig. 4, is 2-4 cm (including end points, unless otherwise specified, the numerical range of the embodiment includes end points), preferably 3cm, to ensure that the number of the wafer 13 can be fully exposed without causing the wafer 13 to slip; the deepest part of the groove is 0.2-0.4 cm, preferably 0.3cm, and the depth can ensure that the wafer 13 is effectively fixed and can be prevented from sliding left and right in the groove; the lateral distance between the large end face and the wafer 13 is 2-4 cm (i.e. the lateral dimension in the dashed frame of fig. 4), preferably 3cm, to ensure that the wafer 13 is completely fixed in the groove; the maximum distance of the small end face of the cam 15 from the rotation center of the cam 15 is 0.5 to 1cm (i.e., the sum of the distances of L2 and L3 in fig. 4), and preferably, L2 in fig. 4 is 0.5cm and L3 is 0.3cm, so as to ensure that the small end face does not contact the wafer 13 during the rotation of the cam 15. Two opposite end surfaces of the cam 15 are set to be arc-shaped end surfaces, so that the cam 15 can rotate, the large end surface gradually rotates below the wafer 13 until the wafer 13 is jacked up, the wafer 13 can slide into the groove stably, and the wafer 13 is prevented from being damaged to the greatest extent. Because the edge of wafer 13 is sharper, for avoiding wafer 13 to slide into the in-process of recess produces static and/or scratch the recess produces particle impurity and leads to the pollution of wafer 13, the material on recess surface is preferably PEI (polyetherimide), certainly also can be the formation the whole material of recess (promptly the side material of recess) is PEI, and cam 15 except the material of the other parts of recess all is preferably PEEK (polyether ether ketone resin), and PEEK has advantages such as hardness height, high temperature resistant, non-deformable, can avoid causing the damage to the wafer because of cam deformation, is favorable to prolonging the life of equipment.

The edge of the wafer 13 usually has a notch 131(notch) or other marks for identifying the crystal orientation of the wafer 13 and for positioning, and the number of the wafer 13 is usually located below the positioning mark, and the number and specific format of the numbers are different according to the requirements of each chip manufacturer, but generally includes an identification number (such as a number for identifying the product category to which the wafer 13 belongs) and a material number (such as a number for identifying the factory order of the wafer 13), which are usually located on two opposite surfaces of the wafer 13, and the reading operation of the wafer 13 is to read the two numbers located on the front and back surfaces of the wafer 13. Before the reading operation, it is usually necessary to perform an alignment operation so that the notches 131 of all the wafers 13 face upward (in the direction of 12 dots). The reading device 17 is preferably an OCR (optical character recognition) lens, and the reading device 17 is preferably configured to read the serial number of the wafer 13 in the vertical direction, so as to avoid that the recognition accuracy is affected by the character deformation caused by the depth of field, the wafer surface reflection, and the like. In the reading operation process, the reading distance (i.e. the linear distance of the OCR distance number) of the OCR lens is 15-40 cm, preferably 20 cm.

For example, the upper rail 16, the lower rail 14, the fixing frame 11, and the supporting frame 19 are preferably made of an alloy material such as stainless steel to ensure stability of the entire structure. The dimensions of the upper rail 16, the lower rail 14, the holder 11 and the support 19 may be set according to the needs, for example, according to the size of the wafer cassette 12. For example, when the wafer cassette 12 is placed on the fixing frame 11, the horizontal distance between the two end points of the upper guide rail 16 and the wafer cassette 12 is greater than or equal to 20cm, so as to ensure that the reading device 17 can keep a proper reading distance with the wafer 13 during both front-side reading and back-side reading of the wafer 13; the lower rail 14 has a length slightly longer than the distance of the wafer cassette 12. Taking an 8-inch wafer box with a length of 202.55 + -0.1 mm, a width (widest part) of 235 + -0.7 mm and a height of 219 + -0.45 mm as an example, the dimensions of the respective structures can be designed according to the following table.

TABLE 1 size table

As an example, as shown in fig. 6, the wafer reading apparatus further includes a sensor 20 located on the lower rail 14, and the sensor 20 is connected to the control device, so that when the sensor 20 senses that there is no wafer 13 on the cam 15, the first driving device drives the lower rail 14 to move in the horizontal direction, and otherwise, the lower rail 14 is controlled to rotate so that the large end face of the cam 15 rotates to below the wafer 13 to lift or separate the wafer 13 from the wafer 13. The sensor 20 includes, but is not limited to, a gravity sensor. Through setting up the sensor, can effectively avoid when the wafer is located on the big terminal surface of cam the lower rail takes place horizontal migration suddenly and leads to the fragmentation.

By way of example, the first driving device and the second driving device include, but are not limited to, motors, and the first driving device and the second driving device may be integrated, that is, the upper rail 16 and the lower rail 14 may be driven by the same motor or by different motors, and the first driving device and the second driving device are defined in this specification only for convenience of description and are not strictly limited in entity. The control device includes but is not limited to a microcontroller such as a single chip microcomputer or a computer.

In order to make the technical solution and advantages of the present invention more clear, an exemplary description is given below of a wafer 13 reading process of the wafer reading apparatus of the present invention.

Preparation work: performing alignment and edge finding operation on all the wafers 13 to enable the openings of the notches 131 of all the wafers 13 to be located in the 12-point direction, then placing the wafers 13 in the wafer box 12 (after being placed in the wafer box 12, calibration can be performed again to ensure that the openings of the notches 131 of all the wafers 13 are located right above), and adjusting the position and the direction of the reading device 17 to ensure that the reading device can read the serial numbers of the wafers 13 in the vertical direction;

reading operation: the lower guide rail 14 drives the cam 15 to horizontally move 0.5 slot/time from a starting point (for example, at 0slot position of the wafer cassette 12) to reach below the first wafer 13 (if the first wafer 13 is located in the first 1 slot), then the cam 15 rotates to make the large end surface reach below the wafer 13 until the wafer 13 is jacked up to expose the serial number on the surface of the wafer 13, the reading device 17 reads, after the reading operation is finished (for example, the sensor 20 senses that the wafer 13 is completely separated from the cam 15), the cam 15 rotates to make the large end surface leave the wafer 13, the cam 15 continues to move to the next wafer 13 after the wafer 13 is completely not contacted, and the reading device 17 horizontally moves to ensure that the reading distance between the reading device and the next wafer 13 is within a preset range, and the process is circulated for multiple times until all the serial numbers (for example, the front faces of the wafers) on the same surface of all the wafers 13 are completely read, then, the reading device 17 is accelerated to move to the end point of the upper guide rail 16 and automatically rotates by 180 °, and starts relative stationary movement simultaneously with the lower guide rail 14 (i.e., the horizontal movement of the reading device 17 and the horizontal movement of the lower guide rail 14 are kept consistent), and the identification of the other surface number (e.g., the back surface of the wafer) is completed by referring to the above process.

Compared with the prior art, the wafer reading equipment can directly identify the serial number of the wafer in the wafer box, does not need to perform complex wafer taking and transferring operations by means of a wafer conveying device, can greatly reduce the risks of scratching and breaking in the wafer transferring process, can perform sheet reading operation without expensive equipment, can identify all wafers (usually more than 25 wafers) in the wafer box at one time, does not need a U-shaped mechanical arm or a double-lens, and can realize the bidirectional identification of the front identification number and the back serial number of the wafer by means of a single reading device. The wafer reading equipment can be used for incoming/outgoing/Inline batch or virtual batch operation, can perform batch unidirectional reading or bidirectional reading, can effectively reduce the production cost and improve the production efficiency.

The invention further provides a wafer reading method, which is performed based on the wafer reading device according to any of the above schemes, so that the description of the wafer reading device is referred to the above contents, and is not repeated for brevity. Specifically, the wafer reading method of the present invention includes that the cam 15 moves below the wafer 13 under the driving of the lower guide rail 14, and rotates to move the large end face of the cam 15 below the wafer 13 until the wafer 13 is jacked up to identify the serial number of the wafer 13, after the identification operation of the first surface (such as the front surface of the wafer) of the wafer 13 is completed, the large end face of the cam 15 leaves the wafer (such as the sensor 20 senses that the wafer completely leaves the cam 15), and then the cam 15 moves to the next wafer 13 under the driving of the lower guide rail 14 to perform the reading operation of the next wafer 13 (in the process, the horizontal movement of the reading device 17 and the horizontal movement of the lower guide rail 14 are kept consistent, or the two are kept relatively still); after the reading of the numbers on the first surfaces of all the wafers 13 is completed, the reading device 17 is accelerated to move to the end point of the upper guide rail 16 and automatically rotates 180 degrees, and starts relative stationary movement with the lower guide rail 14, and the identification of the number on the other surface (for example, the back surface of the wafer) is completed by referring to the above process. For more details, please refer to the foregoing, which is not repeated for brevity.

In summary, the present invention provides a wafer reading apparatus and a reading method. The wafer reading equipment comprises a fixed frame, a lower guide rail, an upper guide rail, a base, a first driving device, a second driving device and a control device; the fixing frame is used for placing a wafer box, and the wafer box is used for bearing wafers; the lower guide rail is positioned below the wafer box, a cam is arranged on the lower guide rail, and the cam is provided with a large end face and a small end face opposite to the large end face; the upper guide rail is positioned above the wafer box, and a reading device is arranged on the upper guide rail and used for reading serial numbers on the surface of the wafer; the fixed frame, the lower guide rail and the upper guide rail are all positioned on the base; the first driving device is connected with the lower guide rail and used for driving the lower guide rail to horizontally move and rotate so as to drive the cam to horizontally move and rotate around the lower guide rail; the second driving device is connected with the upper guide rail and used for driving the upper guide rail to move horizontally so as to drive the reading device to move along the horizontal direction; the control device is connected with the first driving device, the second driving device and the reading device and is used for controlling the driving operation of the first driving device and the second driving device and controlling the reading direction of the reading device; when the cam rotates to the position below the wafer and the wafer is lifted up through the large end face, the number of the wafer is read by the reading device. The wafer reading equipment and the reading method have the following beneficial effects: through the improved structural design, the wafer is jacked from the wafer box through the cam in the wafer reading process, the serial number of the wafer can be read, the wafer can be placed back in situ after the reading is finished, the complex wafer transferring process is not needed, the reading efficiency is greatly improved, and the risk of wafer damage can be effectively reduced. The wafer reading equipment has the advantages of simple structure, low cost and convenient use. By adopting the wafer reading equipment and the reading method, the production cost can be effectively reduced, and the production efficiency is improved. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A wafer reading apparatus, comprising:

the fixing frame is used for placing a wafer box, and the wafer box is used for bearing wafers;

the lower guide rail is positioned below the wafer box, and is provided with a cam, and the cam is provided with a large end face and a small end face opposite to the large end face;

the upper guide rail is positioned above the wafer box, and a reading device is arranged on the upper guide rail and used for reading serial numbers on the surface of the wafer;

the fixing frame, the lower guide rail and the upper guide rail are all positioned on the base;

the first driving device is connected with the lower guide rail and used for driving the lower guide rail to horizontally move and rotate so as to drive the cam to horizontally move and rotate around the lower guide rail;

the second driving device is connected with the upper guide rail and used for driving the upper guide rail to move horizontally so as to drive the reading device to move along the horizontal direction;

the control device is connected with the first driving device, the second driving device and the reading device and is used for controlling the driving operation of the first driving device and the second driving device and the reading direction of the reading device;

when the cam rotates to the position below the wafer and the wafer is lifted up through the large end face, the number of the wafer is read by the reading device.

2. The wafer reading apparatus of claim 1, wherein: the fixing frame comprises two fixing rods arranged in parallel at intervals and an auxiliary rod connected between the two fixing rods, grooves are oppositely arranged on the fixing rods, the grooves are provided with slope surfaces, and when the wafer box is placed in the grooves of the fixing frame, wafers are inclined towards the same direction.

3. The wafer reading apparatus of claim 1, wherein: the wafer reading equipment further comprises a supporting column, the supporting column is located on the lower surface of the base, and the inclination of the base can be adjusted by adjusting the height of the supporting column, so that when the wafer box is placed on the fixing frame, wafers incline towards the same direction.

4. The wafer reading apparatus of claim 1, wherein: the reading device comprises an OCR lens, the serial number of the wafer comprises an identification number and a material number, and the serial number and the material number are positioned on two opposite surfaces of the wafer; and the reading device reads the serial number of the wafer along the vertical direction.

5. The wafer reading apparatus of claim 1, wherein: a groove is formed in the large end face of the cam and used for bearing a wafer, and the material of the surface of the groove comprises PEI.

6. The wafer reading apparatus of claim 5, wherein: the large end face and the small end face of the cam are arc-shaped faces, the maximum distance from the large end face to the rotation center of the cam is 2-4 cm, the depth of the groove is 0.2-0.4 cm, the transverse distance from the large end face to the wafer is 2-4 cm, and the maximum distance from the small end face of the cam to the rotation center of the cam is 0.5-1 cm.

7. The wafer reading apparatus of claim 1, wherein: the wafer reading equipment further comprises a support frame positioned on the base, the upper guide rail, the lower guide rail and the fixing frame are connected with the support frame, and the height of the support frame can be adjusted.

8. The wafer reading apparatus of claim 7, wherein: the material of cam includes PEEK, the material of upper guideway, lower guideway, mount and support frame includes the stainless steel.

9. The wafer reading apparatus according to any one of claims 1 to 8, wherein: the wafer reading equipment further comprises a sensor which is positioned on the lower guide rail, the sensor is connected with the control device and used for driving the lower guide rail to move along the horizontal direction when the sensor senses that no wafer exists on the cam, and otherwise, the lower guide rail is controlled to rotate so that the large end face of the cam rotates to the position below the wafer to jack up the wafer.