CN211580302U

CN211580302U - 5G communication high frequency multilayer PCB board

Info

Publication number: CN211580302U
Application number: CN202020726876.5U
Authority: CN
Inventors: 林中炽; 周华峰; 丁吉平
Original assignee: Shenzhen Deren Electronic Co Ltd
Current assignee: Shenzhen Deren Electronic Co Ltd
Priority date: 2020-05-05
Filing date: 2020-05-05
Publication date: 2020-09-25
Anticipated expiration: 2030-05-05

Abstract

The utility model discloses a 5G communication high frequency multilayer PCB board, including the PCB board body, the bottom of PCB board body is provided with stabilizing mean, stabilizing mean is including cup jointing card strip two on the PCB board body, the equal fixedly connected with in both ends of two front sides of card strip is spacing, and the inner chamber swing joint of two spacing has the fly leaf, the fixedly connected with connecting strip of center department at fly leaf top, the top fixedly connected with fender bracket of connecting strip, the center department threaded connection of fly leaf front side has the locking spiral shell round pin. The utility model discloses a stabilizing mean's setting is at first unscrewed locking bolt, then installs the chip, presses the fly leaf backward and moves, until the fender bracket laminating on the chip, moves locking bolt and twists the inner chamber in bolt groove with locking bolt and fix twisting the inner chamber to make the fender bracket laminate the surface at the chip always, thereby form the protection to the chip, also play stable effect to the chip simultaneously.

Description

5G communication high frequency multilayer PCB board

Technical Field

The utility model relates to a PCB technical field specifically is a 5G communication high frequency multilayer PCB board.

Background

The PCB, which is called a printed circuit board in chinese, is an important electronic component, a support for electronic components, a carrier for electrical connection of electronic components, and is called a "printed" circuit board because it is manufactured by electronic printing.

In 5G communication equipment, install the chip on the PCB board, and the position of installing the chip does not have the structure that is used for protecting chip and stable chip, and then though can not become flexible under normal circumstances and drop after the chip mounting, nevertheless under the condition of violent shock, still can appear dropping and receive the condition of damage, not only can shorten the life of chip, make the chip scrap even to increase cost of maintenance.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a 5G communication high frequency multilayer PCB board, possess the advantage that can play protection and stable chip to the chip, solved in 5G communication equipment, install the chip on the PCB board, and install the position of chip, do not have the structure that is used for protecting chip and stable chip, and then can not become flexible under normal circumstances and drop after the chip mounting, but under the circumstances of acutely shaking, still can appear dropping and receive the circumstances of damage, not only can shorten the life of chip, make the chip scrap even, thereby increase cost of maintenance's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a 5G communication high frequency multilayer PCB board, includes the PCB body, the bottom of PCB body is provided with stabilizing mean, stabilizing mean is including cup jointing the card strip two on the PCB body, the equal fixedly connected with spacing in both ends of two front sides of card strip, the inner chamber swing joint of two spacing has the fly leaf, the fixedly connected with connecting strip of center department at fly leaf top, the top fixedly connected with fender bracket of connecting strip, the center department threaded connection of fly leaf front side has the locking screw pin, the center department of two front sides of card strip offers the bolt groove with locking screw pin looks adaptation, the rear side fixedly connected with spring of spacing inner chamber, the equal fixed connection of front end of two springs is on the fly leaf, the bolt hole with locking screw pin looks adaptation is seted up in the center department of fly leaf front side.

The utility model discloses as above be used for 5G communication high frequency multilayer PCB board, further: the second clamping strip is fixedly installed on the PCB body through an installation pin, and a first clamping groove matched with the PCB body is formed in the top of the second clamping strip.

The utility model discloses as above be used for 5G communication high frequency multilayer PCB board, further: the installation strip is fixedly installed on the two sides of the PCB body, the installation strip comprises a first clamping strip sleeved on the two sides of the PCB body, through holes used for installing bolts are formed in the top and the bottom of the front side of the first clamping strip, reserved installation holes located on the outer sides of the two through holes are formed in the front side of the first clamping strip, and a second clamping groove matched with the PCB body is formed in one side, close to the PCB body, of the first clamping strip.

The utility model discloses as above be used for 5G communication high frequency multilayer PCB board, further: the protection frame is in a shape of a square-back frame, and the surface of the protection frame is coated with an oil light layer.

The utility model discloses as above be used for 5G communication high frequency multilayer PCB board, further: the thickness of the movable plate is one third of the height of the inner cavity of the limiting frame, and the protection frame is located right above the position, where the chip is installed, on the PCB body.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a stabilizing mean's setting, at first unscrew the locking bolt, then install the chip, press the fly leaf backward, until the fender bracket is laminated on the chip, twist and move the locking bolt and twist the locking bolt into the inner chamber of bolt groove and fix, thereby make the fender bracket laminate on the surface of chip all the time, thereby form the protection to the chip, also play stable effect to the chip simultaneously, this 5G communication high frequency multilayer PCB board, possess can play the advantage of protection and stable chip to the chip, solved in 5G communication equipment, the PCB board is installed the chip, and the position of installing the chip, do not have the structure that is used for protecting chip and stable chip, and then even though can not drop under normal circumstances after the chip installation not become flexible, but under the circumstances of violent oscillation, still probably drop and receive the condition of damage, not only can shorten the service life of the chip, but also can even scrap the chip, thereby increasing the maintenance cost.

2. The utility model discloses a setting of mounting bar installs the mounting bar additional in the both sides of PCB body for when installing PCB body, can reduce the damage to PCB body, thereby guarantee the integrality of PCB body, further prolong the life of PCB body, also further improvement the stability when PCB body is installed.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a perspective view of the stabilizing mechanism of the present invention;

FIG. 3 is a perspective sectional view of the limiting frame of the present invention;

fig. 4 is a perspective view of the mounting bar of the present invention.

In the figure: 1. a PCB body; 2. mounting a bar; 3. a stabilizing mechanism; 4. mounting a pin; 5. a first clamping groove; 21. a first clamping strip; 22. a through hole; 23. reserving a mounting hole; 24. a second clamping groove; 31. a second clamping strip; 32. a limiting frame; 33. a movable plate; 34. a connecting strip; 35. a protection frame; 36. locking the screw pin; 37. a bolt slot; 38. a spring; 39. bolt holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution, a 5G communication high frequency multilayer PCB, comprising a PCB body 1, a stabilizing mechanism 3 is disposed at the bottom of the PCB body 1, the stabilizing mechanism 3 includes a second clamping strip 31 sleeved on the PCB body 1, the second clamping strip 31 is fixedly mounted on the PCB body 1 through a mounting pin 4, a first clamping groove 5 adapted to the PCB body 1 is formed at the top of the second clamping strip 31, both ends of the front side of the second clamping strip 31 are fixedly connected with a limiting frame 32, inner cavities of the two limiting frames 32 are movably connected with a movable plate 33, a connecting strip 34 is fixedly connected at the center of the top of the movable plate 33, a protection frame 35 is fixedly connected at the top of the connecting strip 34, the protection frame 35 is a frame shaped like a Chinese character 'hui', the surface of the protection frame 35 is coated with an oil light layer, the surface of the protection frame 35 can have a higher contrast and be smoother, thereby the protection frame 35 is beautiful, the damage to the PCB body 1 is also reduced, the center of the front side of the movable plate 33 is in threaded connection with a locking screw pin 36, the center of the front side of the second clamping strip 31 is provided with a bolt groove 37 matched with the locking screw pin 36, the rear side of the inner cavity of the limiting frame 32 is fixedly connected with a spring 38, the front ends of the two springs 38 are fixedly connected to the movable plate 33, the center of the front side of the movable plate 33 is provided with a bolt hole 39 matched with the locking screw pin 36, both sides of the PCB body 1 are fixedly provided with mounting strips 2, the mounting strips 2 comprise first clamping strips 21 sleeved on both sides of the PCB body 1, the top and the bottom of the front sides of the first clamping strips 21 are provided with through holes 22 for mounting bolts, the front sides of the first clamping strips 21 are provided with mounting holes 23 positioned outside the two through holes 22, one side of the first clamping strips 21 close to the PCB body 1 is provided with second clamping grooves 24 matched with the PCB body 1, through the arrangement of the mounting strips 2, install mounting bar 2 additional in PCB body 1's both sides for when installing PCB body 1, can reduce the damage to PCB body 1, thereby guarantee PCB body 1's integrality, further prolong PCB body 1's life, also further improvement the stability when PCB body 1 installs, the thickness of fly leaf 33 is spacing 32 inner chamber height's third, fender bracket 35 is located PCB body 1 and installs the chip position directly over.

The working principle is as follows: the utility model discloses during the use, at first, unscrew locking plug screw 36, movable plate 33 can be bounced and be located the front side of spacing 32 inner chamber under spring 38's effect, thereby make fender bracket 35 leave sufficient installation space with the position of installation chip is vacant, then install the chip, press movable plate 33 backward, until fender bracket 35 laminates on the chip, twist locking plug screw 36 and will lock plug screw 36 and twist the inner chamber of bolt groove 37 and fix, thereby make fender bracket 35 laminate the surface at the chip always, thereby form the protection to the chip, also play stable effect to the chip simultaneously.

In summary, the following steps: the 5G communication high-frequency multilayer PCB board is characterized in that through the arrangement of the stabilizing mechanism 3, the locking screw pin 36 is firstly unscrewed, then the chip is installed, the movable plate 33 is pressed backwards until the protection frame 35 is attached to the chip, the locking screw pin 36 is screwed and the locking screw pin 36 is screwed into the inner cavity of the bolt groove 37 for fixing, so that the protection frame 35 is attached to the surface of the chip all the time, the chip is protected, and the chip is also stabilized, the 5G communication high-frequency multilayer PCB board has the advantages of protecting and stabilizing the chip, the problem that in 5G communication equipment, the chip is installed on the PCB board, the position for installing the chip does not have a structure for protecting the chip and stabilizing the chip, and the chip cannot fall loose under normal conditions after being installed, but can fall and be damaged under severe vibration conditions, not only can shorten the service life of the chip, but also can even scrap the chip, thereby increasing the maintenance cost.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a 5G communication high frequency multilayer PCB board, includes PCB board body (1), its characterized in that: the bottom of the PCB body (1) is provided with a stabilizing mechanism (3), the stabilizing mechanism (3) comprises a second clamping strip (31) sleeved on the PCB body (1), both ends of the front side of the second clamping strip (31) are fixedly connected with limiting frames (32), inner cavities of the two limiting frames (32) are movably connected with a movable plate (33), the center of the top of the movable plate (33) is fixedly connected with a connecting strip (34), the top of the connecting strip (34) is fixedly connected with a protecting frame (35), the center of the front side of the movable plate (33) is in threaded connection with a locking screw pin (36), the center of the front side of the second clamping strip (31) is provided with a bolt groove (37) matched with the locking screw pin (36), the rear side of the inner cavity of the limiting frame (32) is fixedly connected with a spring (38), and the front ends of the two springs (38) are fixedly connected on the movable plate (33), the center of the front side of the movable plate (33) is provided with a bolt hole (39) matched with the locking screw pin (36).

2. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein: the second clamping strip (31) is fixedly installed on the PCB body (1) through an installation pin (4), and a first clamping groove (5) matched with the PCB body (1) is formed in the top of the second clamping strip (31).

3. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein: the equal fixed mounting in both sides of PCB edition of books body (1) has mounting bar (2), mounting bar (2) are including cup jointing card strip (21) in PCB edition of books body (1) both sides, through-hole (22) that are used for construction bolt are all offered to the top and the bottom of card strip (21) front side, the front side of card strip (21) is seted up and is located reserve mounting hole (23) in two through-hole (22) outsides, card strip (21) are close to one side of PCB edition of books body (1) and are seted up draw-in groove two (24) with PCB edition of books body (1) looks adaptation.

4. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein: the protection frame (35) is in a shape of a square-clip frame, and the surface of the protection frame (35) is coated with an oil and light layer.

5. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein: the thickness of fly leaf (33) is spacing (32) inner chamber height one third, fender bracket (35) are located PCB board body (1) and are installed the chip position directly over.