CN211578935U - High-frequency cross-plate feed connecting device - Google Patents
High-frequency cross-plate feed connecting device Download PDFInfo
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- CN211578935U CN211578935U CN202020234502.1U CN202020234502U CN211578935U CN 211578935 U CN211578935 U CN 211578935U CN 202020234502 U CN202020234502 U CN 202020234502U CN 211578935 U CN211578935 U CN 211578935U
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Abstract
The embodiment of the utility model discloses board feed connecting device is striden to high frequency, this board feed connecting device is striden to high frequency includes: the high-frequency signal feed connector, the first high-frequency signal conversion socket and the second high-frequency signal conversion socket; one end of the high-frequency signal feed connecting sheet is inserted into the first high-frequency signal conversion socket; the other end of the high-frequency signal feed connecting sheet is inserted into the second high-frequency signal conversion socket. Therefore, the utility model discloses avoided among the prior art matching conversion between coaxial transmission and the plane transmission, reduced the design complexity, realized low cost, still reduced the processing requirement, especially first high frequency signal conversion socket and second high frequency signal conversion socket do not have the upper and lower extreme and distinguish, have also reduced the material kind, and application scope is extensive.
Description
Technical Field
The utility model relates to the field of communication technology, concretely relates to board feed connecting device is striden to high frequency.
Background
The modern wireless communication device is generally designed by adopting a modularized design method, a circuit unit with certain independent functions is packaged into a module, different modules are connected through a feed connection assembly to form a whole, and the functions of the whole system are further realized. The modular concept has become a basic idea of modern industry because the modular concept has great advantages in each stage of design, production and maintenance.
The feed connection assembly realizes communication transmission in aspects including power supply, control, signals and the like, but the high-frequency feed transmission assembly generally adopts a coaxial transmission scheme, and the coaxial connector is generally formed by metal processing of a good conductive material and has higher processing requirements on processing precision, so the weight of the coaxial connection assembly is larger, and the price is generally higher.
At present, base station products are core devices in a mobile communication network, and the quality of signals transmitted by a radio frequency channel is an important basis for verifying the function and performance of a base station. In the process of moving from 4G to 5G, multi-channel base station products with more than 8 channels gradually become mainstream. As the number of radio frequency channels increases, the production verification process of the base station product tends to be complicated. At present, downlink signal detection methods of multi-channel base station products mainly include the following two types:
1) a coaxial cable straddle assembly is provided. The coaxial feed connection cable is a basic connection scheme and consists of a conversion seat from a planar microstrip to a coaxial, a coaxial butting connector and a coaxial feed connection cable. The conversion seat and the coaxial butting connector adopt a male-female head design mode so as to facilitate good electrical communication and butting of an inner conductor in a coaxial system, and an outer conductor ensures that two mechanical connection parts have certain mechanical strength and electrical connection connectivity through a high-damping plugging or threaded engagement mode. The coaxial cable is directly and electrically interconnected with the coaxial butting connector in a crimping or welding mode.
2) A coaxial hard connection assembly. The assembly comprises three parts, namely a clamping conversion seat, a coaxial connecting rod and a guide conversion seat. The clamping conversion seat and the guide conversion seat complete conversion between coaxial and planar transmission lines, and meanwhile the clamping conversion seat has a high-damping clamping function, so that the coaxial connecting rod can be fixed on the base, and the connecting rod is convenient to keep upright. The guide conversion seat is provided with a guide disc, and the coaxial connecting rod within a certain deviation range can be guided into the conversion seat in a deviation correcting mode to complete vertical butt joint.
However, the disadvantages of the above connection scheme are:
1) high cost. The connecting components are made of metal materials, and the machining precision requirement is high.
2) The conversion matching is complex. Due to the conversion between the microstrip planar circuit and the coaxial circuit, the matching requirement on the conversion circuit part is high.
3) The weight is large. The coaxial transmission systems are all formed by processing heavy metals, and the whole set of conversion device is heavy.
4) The assembly precision requirement is high. In the coaxial hard connection system, a two-dimensional deviation exists between the coaxial connecting rod and the standard normal direction, and a structural design precision positioning system is required during the assembly of the whole machine so as to ensure good electrical connection of the inner conductor and the outer conductor of the coaxial system.
5) The size is large. Due to the adoption of the mode of the coaxial cable cross-plate connection assembly, the butt joint of the conversion socket, the coaxial butting connector and the coaxial feed connection cable all needs space size, and the connection system has higher requirement on structural space in order to ensure the tight connection and separation of the conversion socket and the coaxial butting connector and the smooth connection of the coaxial cable and the coaxial butting connector.
SUMMERY OF THE UTILITY MODEL
Because there is above-mentioned problem in current method, the embodiment of the utility model provides a board feed connecting device is striden to high frequency is proposed, board feed connecting device is striden to high frequency includes: the high-frequency signal feed connector, the first high-frequency signal conversion socket and the second high-frequency signal conversion socket;
one end of the high-frequency signal feed connecting sheet is inserted into the first high-frequency signal conversion socket; the other end of the high-frequency signal feed connecting sheet is inserted in the second high-frequency signal conversion socket
Optionally, a high-frequency cross-board feed connection device according to claim 1, wherein the high-frequency signal feed connection pad is a microstrip line based high-frequency signal feed connection pad.
Optionally, the microstrip line morphology comprises: one side of the dielectric substrate is in contact connection with the conductor strip, and the other side of the dielectric substrate is in contact connection with the grounding metal flat plate.
Optionally, the high-frequency signal feed connection pad is a high-frequency signal feed connection pad based on a coplanar waveguide morphology.
Optionally, the coplanar waveguide form comprises: one surface of the dielectric substrate is in contact connection with a first grounding metal flat plate, a conductor strip and a second grounding metal flat plate, and the first grounding metal flat plate and the second grounding metal flat plate are positioned on two sides of the conductor strip and have gaps with the conductor strip; the other side of the medium substrate is in contact connection with a third grounding metal flat plate.
Optionally, the high-frequency signal feed connection pad is a high-frequency signal feed connection pad based on a stripline shape.
Optionally, the stripline shape comprises: the conductor strip is positioned in the dielectric substrate; one side of the dielectric substrate is in contact connection with one grounding metal flat plate, and the other side of the dielectric substrate is in contact connection with the other grounding metal flat plate.
Optionally, the first high-frequency signal conversion socket and the second high-frequency signal conversion socket are both coplanar waveguide-based high-frequency signal conversion sockets;
the high-frequency conversion socket based on the coplanar waveguide is used for performing direction conversion in a coplanar waveguide mode, enabling signals to be transmitted along a continuous impedance path, and converting field distribution of the signals from transmission of a parallel substrate to transmission direction distribution through terminal adaptation.
Optionally, the high frequency signal conversion socket of the coplanar waveguide comprises: a housing and electrical contact pins; the electrical contact pins include a signal feed pin and a signal reference ground through pin;
wherein the shell is made of a material with a low dielectric constant;
the electric contact pin is made of a material with high conductivity and high elasticity, and is subjected to corresponding surface treatment.
Optionally, the high-frequency signal feed connection piece is a high-frequency signal feed connection piece based on a microstrip line form or a strip line form;
when the gap between the conductor strip of the coplanar waveguide-based high-frequency signal conversion socket and the grounded metal plates on the two sides of the conductor strip is larger than the set multiple of the width of the conductor strip, continuous smooth transition is carried out through the through holes of the grounded metal plates on the two sides.
According to the above technical scheme, the utility model provides a board feed connecting device is striden to high frequency comprises high frequency signal feed connection piece, first high frequency signal conversion socket and second high frequency signal conversion socket, and wherein, the one end of high frequency signal feed connection piece is inserted and is located first high frequency signal conversion socket, and the other end is inserted and is located in the second high frequency signal conversion socket to avoided among the prior art matching conversion between coaxial transmission and the plane transmission, reduced the design complexity, realized low cost, still reduced the processing requirement, especially first high frequency signal conversion socket and second high frequency signal conversion socket do not have the upper and lower extreme to distinguish, also reduced the material kind, application scope is extensive.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a high-frequency cross-board feed connection device according to an embodiment of the present invention;
fig. 2 is a simplified model diagram of a high-frequency signal conversion socket according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a high-frequency signal feed connection piece model according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a microstrip line model according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a coplanar waveguide model according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a stripline model according to an embodiment of the present invention;
fig. 7 is a schematic diagram of distributed capacitance of a strip line according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a conversion model from a microstrip line to a coplanar waveguide according to an embodiment of the present invention;
fig. 9 is a schematic diagram of a coplanar waveguide conversion model according to an embodiment of the present invention.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Fig. 1 is a schematic structural diagram of a high-frequency cross-board feed connection device according to an embodiment of the present invention; as shown in fig. 1, the high-frequency cross-board feed connection device includes a high-frequency signal feed connection piece 11, a first high-frequency signal conversion socket 12, and a second high-frequency signal conversion socket 13;
one end of the high-frequency signal feeding connecting sheet 11 is inserted into the first high-frequency signal conversion socket 12;
the other end of the high-frequency signal feed connection piece 11 is inserted into the second high-frequency signal conversion socket 13.
Specifically, as shown in fig. 1, the high-frequency cross-board feed connection device is composed of two high-frequency signal conversion sockets and a high-frequency signal feed connection piece, wherein the two high-frequency signal conversion sockets select appropriate pins according to a transmission direction to define, and cooperate with the high-frequency signal feed connection piece to complete cross-board feed connection of high-frequency signals.
The pin definition of the high-frequency signal conversion socket can be seen in the simplified application model of the high-frequency signal conversion socket shown in fig. 2. As shown in fig. 2, pin 2 and pin 5 may be used as signal feed pins, and the rest are signal reference ground connection pins. Such as: when pin 2 is the signal feed pin, the remaining pins (1, 3, 4, 5, 6) may be signal reference ground pass-through pins. For another example: when pin 5 is used as a signal feed pin, the remaining pins (1, 2, 3, 4, 6) may be signal reference ground pass-through pins.
In addition, as shown in fig. 3, the high-frequency signal feed connection tab 11 may adopt a PCB process, and adopt a microstrip type, a coplanar waveguide type (suitable for a scenario with a low shielding requirement), a stripline type (suitable for a scenario with a high shielding requirement), and the like.
According to the above embodiment, the utility model provides a board feed connecting device is striden to high frequency comprises high frequency signal feed connection piece, first high frequency signal conversion socket and second high frequency signal conversion socket, and wherein, the one end of high frequency signal feed connection piece is inserted and is located first high frequency signal conversion socket, and the other end is inserted and is located in the second high frequency signal conversion socket to avoided among the prior art matching conversion between coaxial transmission and the plane transmission, reduced the design complexity, realized low cost, still reduced the processing requirement, especially first high frequency signal conversion socket and second high frequency signal conversion socket do not have the upper and lower extreme to distinguish, also reduced the material kind, application scope is extensive.
The present invention provides a high frequency straddle board feed connection device described below by way of specific embodiments:
further, it is based on the apparatus shown in fig. 1, and the high-frequency signal feeding connection pad 11 may be a high-frequency signal feeding connection pad based on a microstrip line form.
Specifically, because the high frequency device can adopt SMT (Surface Mounted Technology) Technology and printed circuit board to constitute the circuit equipment board that has high frequency signal processing function, in view of the interval of this Technology and device pin, the mode of microstrip line is generally adopted to the high frequency signal feed transmission mode on the printed circuit board, so the utility model provides a high frequency signal feed connection piece 11 can be based on the high frequency signal feed connection piece of microstrip line form.
Further, based on the above-mentioned apparatus, the microstrip line configuration may include: one side of the dielectric substrate is in contact connection with the conductor strip, and the other side of the dielectric substrate is in contact connection with the grounding metal flat plate.
Specifically, as shown in the microstrip line model of fig. 4, microstrip line transmission refers to: on a dielectric substrate with a metallization thickness hThe transmission line structure is formed by manufacturing a conductor strip with width W and thickness t on one surface and manufacturing a grounded metal flat plate on the other surface, and is a plate open type transmission line structure. The Field is quasi-TEM (Transverse Electric and Magnetic Field), whose Field distribution is substantially the same as the Field in the static case. The power line on the microstrip line is partially in the dielectric substrate and partially in the air, so that the characteristic impedance Z of the microstrip line0Can be approximated by equation 1 and equation 2.
When in use
When the temperature of the water is higher than the set temperature,
when in use
When the temperature of the water is higher than the set temperature,
wherein W is the width of the conductor strip, h is the thickness of the dielectric substrate,ris the relative dielectric constant, Z, of the slab medium0Is the characteristic impedance of the microstrip line.
It can be seen from the above embodiments that the high frequency signal feed connection piece can be a high frequency signal feed connection piece based on a microstrip line form, and the high frequency signal feed connection piece designed by a printed circuit board based on a dielectric substrate realizes low cost and also reduces processing requirements.
Further, based on the device shown in fig. 1, the high-frequency signal feeding connection pad 11 may be a high-frequency signal feeding connection pad based on a coplanar waveguide configuration.
Further, based on the above-mentioned apparatus, the coplanar waveguide configuration may include: one surface of the dielectric substrate is in contact connection with a first grounding metal flat plate, a conductor strip and a second grounding metal flat plate, and the first grounding metal flat plate and the second grounding metal flat plate are positioned on two sides of the conductor strip and have gaps with the conductor strip; the other side of the medium substrate is in contact connection with a third grounding metal flat plate.
Specifically, in the coplanar waveguide model shown in fig. 5, coplanar waveguide transmission refers to: all conductors (i.e., first grounded metal plate, conductor strip, second grounded metal plate) are located in the same plane (i.e., on the same surface of the dielectric substrate). And, an important advantage of the coplanar waveguide transmission is that it is very convenient to install the active or passive device set total parameter devices in parallel or series, increases the flexibility of circuit design, and can improve the performance of some functional circuits.
The coplanar waveguide can support the propagation of a quasi-TEM mode, and the characteristic impedance of the coplanar waveguide can be calculated by using the following formula. The width W of the conductor strip is 2a, and the gap S between the transmission line and GND is b-a.
It can be seen from the above embodiments that the high-frequency signal feed connection piece can be a high-frequency signal feed connection piece based on a coplanar waveguide form, and the high-frequency signal feed connection piece designed by a printed circuit board based on a dielectric substrate realizes low cost and also reduces processing requirements.
Further, based on the device shown in fig. 1, the high-frequency signal feeding connection pad 11 may be a high-frequency signal feeding connection pad based on a strip line shape.
Further, based on the above-mentioned device, the strip line shape may include: the conductor strip is positioned in the dielectric substrate; one side of the dielectric substrate is in contact connection with one grounding metal flat plate, and the other side of the dielectric substrate is in contact connection with the other grounding metal flat plate.
Specifically, as shown in the stripline model of fig. 6, a stripline is a high-frequency transmission conductor disposed between two parallel ground planes. If the material permittivity between two conductive planes is controllable, the impedance of the transmission conductor can be controlled by adjusting the thickness and width of the transmission conductor. The strip line has continuous GND references on both sides, and has good shielding performance. The primary mode of the stripline is the TEM mode.
Because the transmission lead of the strip line is located in the medium and cannot be conductively connected with the surface device, the intercommunication from the strip line to the surface circuit and the device needs to be realized by the handling interconnection technology, and the intercommunication is usually realized by adopting a PCB through hole (or blind hole) design from the strip line to the surface.
In general, the impedance solution of the strip line is a solution using the concept of distributed capacitance, and as shown in fig. 7, in actual calculation, the impedance solution is divided into two cases, namely, a wide conductor band and a narrow conductor band, according to the size parameter of the strip line.
Wide conductor strip case
vpIs the phase velocity, v0Is the transmission speed of electromagnetic waves in free space,ris the relative dielectric constant of the fill medium.
The distributed point capacitance between the central conductor strip and the reference surfaces at two sides is divided into an edge capacitance Cf(non-uniform electric field between conductor strip edge and ground plate) and plate capacitance Cp(uniform electric field between conductor strip and ground plate). The total distributed capacitance of the strip line is thus
C＝2CP+4Cf
Thus, the impedance of the strip line can be calculated as ZcI.e. by
Narrow conductor strip condition
Impedance Z of strip linecIs calculated as follows
It can be seen from the above embodiments that the high-frequency signal feed connection piece can be a high-frequency signal feed connection piece based on a strip line state, and the high-frequency signal feed connection piece designed by a printed circuit board based on a dielectric substrate realizes low cost and also reduces processing requirements.
Further, based on the device shown in fig. 1, the first high-frequency signal conversion socket 12 and the second high-frequency signal conversion socket 13 are both coplanar waveguide-based high-frequency signal conversion sockets;
the high-frequency conversion socket based on the coplanar waveguide is used for performing direction conversion in a coplanar waveguide mode, enabling signals to be transmitted along a continuous impedance path, and converting field distribution of the signals from transmission of a parallel substrate to transmission direction distribution through terminal adaptation.
Further, based on the above-mentioned device, the high-frequency signal conversion socket of the coplanar waveguide comprises: a housing and electrical contact pins; the electrical contact pins include a signal feed pin and a signal reference ground through pin;
wherein the shell is made of a material with a low dielectric constant;
the electric contact pin is made of a material with high conductivity and high elasticity, and is subjected to corresponding surface treatment.
Specifically, as shown in fig. 2, the housing of the high frequency signal conversion socket of the coplanar waveguide uses a low dielectric constant material as a support, fixes the position of the 6 electrical contact pins, and provides support (and may also support the shield housing). The 6 electrical contact pins can be made of beryllium copper and other similar materials with high conductivity and high elasticity, and are subjected to corresponding surface treatment such as conductivity, easy welding, corrosion resistance and the like.
Further, based on the above-mentioned device, the high-frequency signal feed connection piece is a high-frequency signal feed connection piece based on a microstrip line form or a strip line form; when the gap between the conductor strip of the coplanar waveguide-based high-frequency signal conversion socket and the grounded metal plates on the two sides of the conductor strip is larger than the set multiple of the width of the conductor strip, continuous smooth transition is carried out through the through holes of the grounded metal plates on the two sides.
In particular, a microstrip to coplanar waveguide transition model as shown in figure 8. Because the transmission reference surfaces of the microstrip line and the strip line are different, but are based on a planar transmission mode, especially a coplanar waveguide transmission line with a GND surface, under the condition that the width W of the transmission line (i.e. a conductor strip) is certain, when the value of the slot S1 is greater than a certain multiple of W, the calculation mode is close to the calculation mode of the microstrip transmission line. Therefore, continuity of the attribute of the reference plane can be realized through the via holes of the grounding metal plates on the two sides of the transmission line, and the characterization function of the linear transformation curve L in the graph 8 is optimized to realize continuous smooth transition of the two transmission modes. Where the characterization function of L can be in linear, exponential, and step function form.
In the coplanar waveguide conversion model shown in fig. 9, the transmission reference plane of the coplanar waveguide is the GND plane (i.e., the grounded metal plate) on both sides of the transmission line (i.e., the conductor strip), and therefore, the direction conversion is performed in the form of the coplanar waveguide, so that the signal is transmitted along a continuous impedance path, and the reflection and transmission loss are reduced. The signal is transmitted from the plane of the medium substrate to the transmission direction conversion position, terminal adaptation is needed, and the field distribution of the signal is converted from parallel substrate transmission to transmission direction distribution by optimizing the size of the terminal adaptation distance D (or realized in a circular radius R mode).
As can be seen from the above embodiments, the first high-frequency signal conversion socket 12 and the second high-frequency signal conversion socket 13 are both high-frequency signal conversion sockets based on coplanar waveguide, and the high-frequency signal feed connection piece 11 may be a high-frequency signal feed connection piece based on a coplanar waveguide form or a high-frequency signal feed connection piece based on a stripline form, so that high-frequency feed connection between the high-frequency signal conversion sockets based on coplanar waveguide and the high-frequency signal feed connection pieces of different forms is achieved, the application range of the high-frequency cross-board feed connection device is expanded, and the practicability of the high-frequency cross-board feed connection device is improved.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
It should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A high frequency cross-board feed connection, comprising: the high-frequency signal feed connector, the first high-frequency signal conversion socket and the second high-frequency signal conversion socket;
one end of the high-frequency signal feed connecting sheet is inserted into the first high-frequency signal conversion socket;
the other end of the high-frequency signal feed connecting sheet is inserted into the second high-frequency signal conversion socket.
2. A high-frequency span plate feed connection device according to claim 1, wherein said high-frequency signal feed connection piece is a high-frequency signal feed connection piece based on a microstrip line form.
3. A high frequency flying plate feed connection device according to claim 2, wherein said microstrip line shape comprises: one side of the dielectric substrate is in contact connection with the conductor strip, and the other side of the dielectric substrate is in contact connection with the grounding metal flat plate.
4. A high-frequency cross-board feed connection arrangement according to claim 1, wherein the high-frequency signal feed connection tab is a coplanar waveguide morphology based high-frequency signal feed connection tab.
5. A high frequency span plate feed connection arrangement according to claim 4, wherein said coplanar waveguide form comprises: one surface of the dielectric substrate is in contact connection with a first grounding metal flat plate, a conductor strip and a second grounding metal flat plate, and the first grounding metal flat plate and the second grounding metal flat plate are positioned on two sides of the conductor strip and have gaps with the conductor strip; the other side of the medium substrate is in contact connection with a third grounding metal flat plate.
6. A high-frequency flying plate feed connection device according to claim 1, wherein said high-frequency signal feed connection piece is a high-frequency signal feed connection piece based on a stripline pattern.
7. A high frequency straddle mount feed connection according to claim 6, wherein said stripline configuration comprises: the conductor strip is positioned in the dielectric substrate; one side of the dielectric substrate is in contact connection with one grounding metal flat plate, and the other side of the dielectric substrate is in contact connection with the other grounding metal flat plate.
8. A high-frequency cross-board feed connection device according to claim 1, wherein the first high-frequency signal conversion socket and the second high-frequency signal conversion socket are both coplanar waveguide based high-frequency signal conversion sockets;
the high-frequency conversion socket based on the coplanar waveguide is used for performing direction conversion in a coplanar waveguide mode, enabling signals to be transmitted along a continuous impedance path, and converting field distribution of the signals from transmission of a parallel substrate to transmission direction distribution through terminal adaptation.
9. A high frequency span plate feed connection device according to claim 8 wherein the high frequency signal transition receptacle of the coplanar waveguide comprises: a housing and electrical contact pins; the electrical contact pins include a signal feed pin and a signal reference ground through pin;
wherein the shell is made of a material with a low dielectric constant;
the electric contact pin is made of a material with high conductivity and high elasticity, and is subjected to corresponding surface treatment.
10. The high-frequency flying plate feed connection device according to claim 8, wherein said high-frequency signal feed connection piece is a high-frequency signal feed connection piece based on a microstrip line form or a strip line form;
when the gap between the conductor strip of the coplanar waveguide-based high-frequency signal conversion socket and the grounded metal plates on the two sides of the conductor strip is larger than the set multiple of the width of the conductor strip, continuous smooth transition is carried out through the through holes of the grounded metal plates on the two sides.
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| CN202020234502.1U CN211578935U (en) | 2020-02-28 | 2020-02-28 | High-frequency cross-plate feed connecting device |
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| CN202020234502.1U CN211578935U (en) | 2020-02-28 | 2020-02-28 | High-frequency cross-plate feed connecting device |
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