CN211559627U - Liquid cooling and heating cup - Google Patents
Liquid cooling and heating cup Download PDFInfo
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- CN211559627U CN211559627U CN201922336328.1U CN201922336328U CN211559627U CN 211559627 U CN211559627 U CN 211559627U CN 201922336328 U CN201922336328 U CN 201922336328U CN 211559627 U CN211559627 U CN 211559627U
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Abstract
The utility model relates to a liquid cooling and heating cup. The cup comprises a cup body, a cup cover and a temperature regulator, wherein the cup body comprises an inner container, heat preservation cotton and a shell, the bottom of the inner container is exposed out of the bottom of the shell, a semiconductor cooling and heating assembly is arranged at the top of the temperature regulator, a first water sealing ring is arranged between the top of the inner container and the shell, a second water sealing ring is arranged between the bottom of the inner container and the shell, and the working surface of the semiconductor cooling and heating assembly is located in the second water sealing ring. The utility model discloses a space between the top of inner bag and the shell has been sealed to first water sealing washer and second water sealing washer, the utility model discloses a space between semiconductor changes in temperature subassembly and the inner bag bottom has still been sealed to second water sealing washer to make in the comdenstion water between inner bag and the shell, the condensation water between semiconductor changes in temperature subassembly and the inner bag bottom all can't flow in the temperature regulator, because of the utility model discloses a sealed effectual, can prevent effectively that the comdenstion water from contacting electrified device, safe in utilization.
Description
Technical Field
The utility model relates to a technical field of liquid heating cup, in particular to liquid cooling and heating cup.
Background
A combined semiconductor cold and hot vacuum cup comprises a base and an upper cup body, wherein a metal heat conducting plate is arranged on the upper surface of the base, the lower inner surface of the metal heat conducting plate is attached to one surface of a semiconductor refrigerating sheet, the other surface of the semiconductor refrigerating sheet is attached to a heat radiating plate, a heat radiating fan is arranged below the heat radiating plate, a heat insulating material is arranged between the metal heat conducting plate and the heat radiating plate around the semiconductor refrigerating sheet, an adjusting switch and a temperature control circuit are arranged in the base, and the whole base is supported by a base frame. The upper cup body is cylindrical, the inner container is a metal cup with a sealed bottom, the bottom of the inner container is thick and flat, and the outside of the column is provided with a heat-insulating layer, a packaging layer and an upper heat-insulating cover and a lower heat-insulating cover. The upper cup body and the base can be stably connected in a matching mode, and the metal bottom of the inner container of the upper cup body can be well attached to the metal heat conducting plate on the base. However, when the cold and warm cup works, condensed water is easily generated on the outer wall of the upper cup body and easily enters the base with the electric parts, and the electric parts are easily damaged and easily leak electricity, so that potential safety hazards exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sealed effectual, can prevent effectively that the comdenstion water from contacting electrified device, safe in utilization's liquid changes in temperature cup.
The purpose of the utility model is realized like this:
a liquid cooling and heating cup comprises a cup body, a cup cover and a temperature regulator, wherein the temperature regulator is detachably connected with the bottom of the cup body, the top of the cup body is provided with a cup opening, the cup cover is detachably arranged at the cup opening of the cup body, the cup body comprises an inner container, heat preservation cotton and a shell, the inner container is sleeved in the shell, the bottom of the inner container is exposed out of the bottom of the shell, the heat insulation cotton is arranged between the inner container and the shell, the top of the inner container is provided with the cup opening, the top of the temperature regulator is provided with a semiconductor cooling and heating component, the bottom of the inner container is propped against the semiconductor cooling and heating component, a first water sealing ring is arranged between the top of the inner container and the shell, a second water sealing ring is arranged between the bottom of the inner container and the shell, the second water sealing ring is abutted against the top of the temperature regulator, and the working surface of the semiconductor cooling and heating assembly is positioned in the second water sealing ring. The utility model discloses a space between the top of inner bag and the shell has been sealed to first water sealing washer and second water sealing washer, the utility model discloses a space between semiconductor changes in temperature subassembly and the inner bag bottom has still been sealed to second water sealing washer to make in the comdenstion water between inner bag and the shell, the condensation water between semiconductor changes in temperature subassembly and the inner bag bottom all can't flow in the temperature regulator, because of the utility model discloses a sealed effectual, can prevent effectively that the comdenstion water from contacting electrified device, safe in utilization.
The utility model can be further improved as follows.
The bottom of shell and temperature regulator threaded connection or turn-buckle are connected to make shell and temperature regulator easy dismounting, the cup washs the convenience.
The bottom annular interval of shell is provided with a plurality of first spinner, thermoregulator's top annular interval is provided with a plurality of second spinner, first spinner and the rotatory lock of second spinner.
The bottom of shell is equipped with the connection foundation ring, the bottom of inner bag is located and is connected the foundation ring, connect the foundation ring and press the inner bag in the shell, the bottom of inner bag exposes on connecting the foundation ring, second water sealing circle is located the bottom of inner bag and is connected between the foundation ring, and second water sealing circle can effectively prevent that the comdenstion water between shell and the inner bag from flowing from the clearance between the bottom of connecting foundation ring and inner bag.
And a third water sealing ring is arranged between the inner side wall of the connecting bottom ring and the shell, and the connecting bottom ring is detachably connected with the temperature regulator. The third water sealing ring can effectively prevent the condensed water between the shell and the liner from flowing out of the gap between the connecting bottom ring and the shell.
The semiconductor cooling and heating assembly comprises a heat exchange block fixing seat, a heat exchange block, a heat insulation ring and a semiconductor cooling and heating sheet, wherein an installation yielding through hole is formed in the heat exchange block fixing seat, the heat exchange block, the semiconductor cooling and heating sheet and the heat insulation ring are arranged in the installation yielding through hole, the upper surface of the heat exchange block is a working surface of the semiconductor cooling and heating assembly, the upper surface of the heat exchange block is exposed out of the installation yielding through hole and is located in a second water sealing ring, the bottom of the inner container is located on the upper surface of the heat exchange block, the lower surface of the heat exchange block is abutted against the top surface of the semiconductor cooling and heating sheet, and the heat insulation ring wraps the outer side wall of the heat. Preferably, the upper surface of the heat exchange block is provided with an abdicating through hole which protrudes upwards. The utility model discloses temperature regulator utilizes the refrigeration of semiconductor refrigeration piece to heat the principle and heat or cool off the inner bag, the utility model discloses a be equipped with function change over switch on the base to the polarity of the working face of switching semiconductor refrigeration piece, so that the working face of semiconductor cooling and heating piece becomes the refrigeration face, and the bottom surface becomes the heating face, perhaps, becomes the heating face with the working face of semiconductor cooling and heating piece, and the bottom surface becomes the refrigeration face, and the produced cold volume of working face of semiconductor cooling and heating piece or heat pass through the heat-transfer piece and transmit for the inner bag, finally realize heating liquid or cooling liquid.
The inside wall annular interval of connecting the foundation ring is provided with a plurality of first spinner, the heat transfer piece fixing base is the type of protruding word form, the upper portion of heat transfer piece is equipped with first connection arch, the installation is stepped down through-hole and heat transfer piece and is located first connection arch, the bellied outside wall annular interval of first connection is provided with a plurality ofly the second spinner, first spinner and the rotatory lock of second spinner, consequently the utility model discloses a cup and temperature regulator easy dismounting, both can assemble into an organic whole, convenient to carry, outward appearance are pleasing to the eye.
The temperature regulator comprises a base, a fan, a circuit board, a semiconductor cooling and heating assembly and a radiator, wherein the heat exchange block fixing seat is arranged on the radiator, the bottom surface of the semiconductor cooling and heating sheet is abutted against the radiator, the radiator is arranged on the base, the fan and the circuit board are arranged in the base, and the circuit board is respectively connected with the semiconductor cooling and heating assembly and the fan
The temperature regulator comprises a base, a fan, a circuit board, a semiconductor cooling and heating assembly, a heat dissipation cylinder and a radiator, wherein the semiconductor cooling and heating assembly is arranged at the top of the heat dissipation cylinder, the bottom of the heat dissipation cylinder is connected with the base, heat dissipation meshes are arranged on the side wall of the heat dissipation cylinder, the heat dissipation cylinder is communicated with the inner cavity of the base, the radiator is arranged on the semiconductor cooling and heating assembly and is positioned in the heat dissipation cylinder, the fan and the circuit board are arranged in the base, and a ventilation hole is formed in the bottom of the base.
The radiator is arranged on the inner surface of the heat exchange block fixing seat, the bottom surface of the semiconductor cooling and heating sheet is abutted against the radiator, and the heat insulation ring, the heat exchange block and the semiconductor cooling and heating sheet are pressed on the upper surface of the radiator by the heat exchange block fixing seat.
The utility model has the advantages as follows:
(one) the utility model discloses a space between the top of inner bag and the shell has been sealed to first water sealing washer and second water sealing washer, the utility model discloses a space between semiconductor changes in temperature subassembly and the inner bag bottom has still been sealed to second water sealing washer to make in the comdenstion water between inner bag and the shell, the comdenstion water between semiconductor changes in temperature subassembly and the inner bag bottom can't all flow and flow into temperature regulator, because of the utility model discloses a sealed effectual, can prevent effectively that the comdenstion water from contacting the electrified device in the temperature regulator, use very safety.
In addition, the cup body and the temperature regulator can be independently connected up and down and can be effectively connected closely, and the cup body and the temperature regulator can be assembled into a whole and are attractive and more portable.
And (III) when the cup body of the cold and warm cup is cleaned, the temperature regulator and the cup body can be separated, water and electricity are separated, and safety is guaranteed.
Furthermore, the utility model discloses a heat dissipation mesh on the temperature regulator accessible heat dissipation section of thick bamboo to realize 360 air-out heat dissipations, the radiating effect is good.
Drawings
Fig. 1 is a schematic view of the exploded structure of the cooling and heating cup of the present invention.
Fig. 2 is an exploded schematic view of another state of the cooling and heating cup of the present invention.
Fig. 3 is a sectional view of the cooling and heating cup of the present invention.
Fig. 4 is a sectional view of the cooling and heating cup of the present invention in a disassembled state.
Fig. 5 is a schematic structural view of the combination of the cup body and the cup base of the cooling and heating cup of the present invention.
Fig. 6 is an exploded view of fig. 5.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
In the first embodiment, as shown in fig. 1 to 6, a liquid cooling and heating cup comprises a cup body 2, a cup cover 3, a temperature regulator 1 and a cup seat 4, wherein the temperature regulator 1 is detachably connected to the bottom of the cup body 2, a cup opening is formed in the top of the cup body 2, the cup cover 3 is detachably arranged at the cup opening of the cup body 2, the cup body 2 comprises an inner container 20, heat-insulating cotton 22 and a shell 21, the inner container 20 is sleeved in the shell 21, the bottom of the inner container is exposed out of the bottom of the shell, the heat-insulating cotton 22 is in a cylindrical shape, the heat-insulating cotton 22 is sleeved between the inner container 20 and the shell 21, the cup opening is formed in the top of the inner container 20, a semiconductor component 10 is arranged at the top of the temperature regulator 1, the bottom of the inner container 20 abuts against the semiconductor cooling and heating component 10, a first water sealing ring 23 is arranged between the top of the inner container 20 and the shell 21, a second water sealing ring 24 is arranged between the bottom, the second water sealing ring 24 is abutted against the top of the temperature regulator 1, and the working surface of the semiconductor cooling and heating assembly 10 is positioned in the second water sealing ring. The utility model discloses a cup can use with temperature regulator and 4 combinations of cup holder respectively, the utility model discloses a when cup and temperature regulator combined use, be a liquid changes in temperature cup, two, the utility model discloses a when cup and 4 combinations of cup holder used, be a ordinary cup.
As a more specific technical solution of the present invention.
The bottom of the shell 21 is provided with a connecting bottom ring 25, part of the bottom of the inner container 20 is seated on the connecting bottom ring, the connecting bottom ring presses the inner container into the shell, the bottom of the inner container is exposed out of the connecting bottom ring, the second water sealing ring 24 is positioned between the bottom of the inner container 20 and the connecting bottom ring 25, a third water sealing ring 26 is arranged between the connecting bottom ring 25 and the inner side wall of the shell 21, and the connecting bottom ring is detachably connected with the temperature regulator.
The semiconductor cooling and heating assembly 10 comprises a heat exchange block fixing seat 11, a heat exchange block 12, a heat insulation ring 13 and a semiconductor cooling and heating sheet 14, wherein an installation abdicating through hole is formed in the heat exchange block fixing seat 11, the heat exchange block 12, the semiconductor cooling and heating sheet 14 and the heat insulation ring 13 are arranged in the installation abdicating through hole, the upper surface of the heat exchange block is a working surface of the semiconductor cooling and heating assembly 10, the upper surface of the heat exchange block 12 is exposed out of the installation abdicating through hole 111 and is positioned in a second water sealing ring 24, the partial bottom of the inner container 20 is positioned on the upper surface of the heat exchange block 12, the lower surface of the heat exchange block 12 is abutted against the top surface of the semiconductor cooling and heating sheet 14, and the outer side walls of the heat exchange. Of course, it is preferable that the upper surface of the heat exchange block 12 is upwardly protrudingly installed with the abdicating through-hole 111.
The inside wall annular interval of connecting the foundation ring is provided with a plurality of first spinner, heat transfer piece fixing base 11 is the type of calligraphy of protruding, the upper portion of heat transfer piece 12 is equipped with first connection arch 110, the installation is stepped down through-hole 111 and heat transfer piece 12 and is located first connection arch 110, the outside wall annular interval of first connection arch 110 is provided with a plurality ofly the second spinner 19, first spinner and the rotatory lock of second spinner.
The temperature regulator 1 comprises a base 18, a fan 15, a circuit board 113, a semiconductor cooling and heating assembly 10, a heat dissipation cylinder 16 and a radiator 17, wherein the semiconductor cooling and heating assembly 10 is arranged at the top of the heat dissipation cylinder 16, the bottom of the heat dissipation cylinder 16 is connected with the base, heat dissipation meshes 161 are arranged on the side wall of the heat dissipation cylinder 16, the heat dissipation cylinder 16 is communicated with the inner cavity of the base 18, the radiator 17 is arranged on the semiconductor cooling and heating assembly 10 and is positioned in the heat dissipation cylinder 16, the fan 15 and the circuit board 113 are arranged in the base 18, and a ventilation hole 114 is formed in the bottom of the base 18. The utility model discloses the during operation, temperature regulator and fan start simultaneously, and external air passes through ventilation hole 114 and gets into the base inner chamber to with the radiator heat transfer, after the heat transfer, discharge from the heat dissipation mesh 161 on the heat dissipation section of thick bamboo 16 again.
The base 18 is provided with a starting switch, and functional keys for refrigeration, heating, temperature setting, timing and the like, so that a user can conveniently control the temperature regulator.
The radiator 17 is arranged on the inner surface of the heat exchange block fixing seat 11, the bottom surface of the semiconductor cold and warm sheet 14 is abutted against the radiator 17, and the heat exchange block fixing seat 11 presses the heat insulation ring, the heat exchange block and the semiconductor cold and warm sheet 14 on the upper surface of the radiator 17.
As a more specific technical solution of the present invention.
The top of the cup base 4 is provided with a second connecting protrusion 41, the outer side wall of the second connecting protrusion 41 is also provided with a plurality of second rotary buckles 19 at annular intervals, so that the cup base 4 can be rotationally buckled with the first rotary buckle on the connecting base ring, the connection between the cup base 4 and a cup is realized, and the cup which is common and general is finally combined is formed.
The second embodiment is similar to the first embodiment, and the only difference is that: the bottom of the housing 21 is directly screwed or screwed to the thermostat 1. The bottom annular interval of shell 21 is provided with a plurality of first spinner 28, the top annular interval of temperature regulator 1 is provided with a plurality of second spinner 19, first spinner 28 and the rotatory lock of second spinner 19.
Claims (8)
1. The liquid cooling and heating cup comprises a cup body and a temperature regulator, wherein the temperature regulator is detachably connected to the bottom of the cup body, and the liquid cooling and heating cup is characterized in that the cup body comprises an inner container, heat preservation cotton and a shell, the inner container is sleeved in the shell, the heat preservation cotton is sleeved between the inner container and the shell, the bottom of the inner container is exposed out of the bottom of the shell, a semiconductor cooling and heating assembly is arranged at the top of the temperature regulator, the bottom of the inner container is abutted against the semiconductor cooling and heating assembly, a first water sealing ring is arranged between the top of the inner container and the shell, a second water sealing ring is arranged between the bottom of the inner container and the shell, the second water sealing ring is abutted against the top of the temperature regulator, and the working face of the semiconductor cooling and heating assembly is located in.
2. The liquid cooling and heating cup as claimed in claim 1, wherein the bottom of the casing is screwed or screwed with the temperature regulator.
3. The liquid cooling and heating cup as claimed in claim 1, wherein a connecting bottom ring is disposed at the bottom of the casing, the connecting bottom ring presses the inner container into the casing, the bottom of the inner container is exposed out of the connecting bottom ring, the second water sealing ring is disposed between the bottom of the inner container and the connecting bottom ring, a third water sealing ring is disposed between the connecting bottom ring and the inner side wall of the casing, and the connecting bottom ring is detachably connected to the temperature regulator.
4. The liquid cooling and heating cup as claimed in claim 1 or 3, wherein the semiconductor cooling and heating assembly comprises a heat exchange block fixing seat, a heat exchange block, a heat insulation ring and a semiconductor cooling and heating sheet, wherein an installation abdicating through hole is formed in the heat exchange block fixing seat, the heat exchange block, the semiconductor cooling and heating sheet and the heat insulation ring are arranged in the installation abdicating through hole, the upper surface of the heat exchange block is a working surface of the semiconductor cooling and heating assembly, the upper surface of the heat exchange block is exposed out of the installation abdicating through hole and is located in the second water sealing and sealing ring, the bottom of the liner is located on the upper surface of the heat exchange block, the lower surface of the heat exchange block is abutted against the top surface of the semiconductor cooling and heating sheet, and the outer side.
5. The liquid cooling and heating cup as claimed in claim 4, wherein a plurality of first fasteners are disposed at annular intervals on the inner sidewall of the connection base ring, the heat exchange block fixing seat is in a convex shape, a first connection protrusion is disposed on the upper portion of the heat exchange block, the installation abdicating through hole and the heat exchange block are disposed on the first connection protrusion, a plurality of second fasteners are disposed at annular intervals on the outer sidewall of the first connection protrusion, and the first fasteners and the second fasteners are rotatably fastened.
6. The liquid cooling and heating cup as claimed in claim 4, wherein the temperature regulator comprises a base, a fan, a circuit board, the semiconductor cooling and heating assembly, a heat dissipating cylinder and a heat sink, the semiconductor cooling and heating assembly is disposed on the top of the heat dissipating cylinder, the bottom of the heat dissipating cylinder is connected to the base, the side wall of the heat dissipating cylinder is provided with heat dissipating meshes, the heat dissipating cylinder is communicated with the inner cavity of the base, the heat sink is disposed on the semiconductor cooling and heating assembly and is located in the heat dissipating cylinder, and the fan and the circuit board are disposed in the base.
7. The liquid cooling and heating cup as claimed in claim 6, wherein the heat sink is disposed on the inner surface of the heat exchange block fixing base, and the bottom surface of the semiconductor cooling and heating fin abuts against the heat sink.
8. The liquid cooling and heating cup as claimed in claim 4, wherein the upper surface of the heat exchange block is provided with an abdicating through hole in a protruding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922336328.1U CN211559627U (en) | 2019-12-22 | 2019-12-22 | Liquid cooling and heating cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922336328.1U CN211559627U (en) | 2019-12-22 | 2019-12-22 | Liquid cooling and heating cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211559627U true CN211559627U (en) | 2020-09-25 |
Family
ID=72550280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922336328.1U Active CN211559627U (en) | 2019-12-22 | 2019-12-22 | Liquid cooling and heating cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211559627U (en) |
-
2019
- 2019-12-22 CN CN201922336328.1U patent/CN211559627U/en active Active
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