CN211556242U - High-frequency large-current USB socket - Google Patents

Abstract

A high-frequency large-current USB socket comprises a metal middle plate, a first terminal group and a second terminal group which are respectively positioned on two sides of the metal middle plate, and an insulation body which integrates the metal middle plate, the first terminal group and the second terminal group into a whole, wherein the first terminal group and the second terminal group respectively sequentially comprise a grounding terminal, a high-frequency signal terminal, a power terminal, a conventional signal terminal, a power terminal, a high-frequency signal terminal and a grounding terminal in the transverse direction, each conductive terminal of the first terminal group and the second terminal group comprises a contact part, a fixing part formed by extending backwards from the contact part and a welding pin extending out of the insulation body from the fixing part, and the metal middle plate comprises a main body plate part positioned between the high-frequency signal terminals and a protruding part extending out of the outside from the front end of the main body plate part towards the transverse outer side.

Description

High-frequency large-current USB socket

Technical Field

The present application relates to the field of electrical connectors, and more particularly to a high frequency and high current USB socket.

Background

The existing USB3.1 Type C socket generally includes a middle plate, and a first terminal set and a second terminal set respectively disposed on the upper and lower sides of the middle plate. In the standards of the association, the standard for power transmission is only 2A, and the current smart phone basically needs to be charged with large current, so that the standard structure cannot meet the market requirement. And several different kinds of high current versions have been developed, i.e., the middle portion of the midplane is cut away, leaving the outer portions of the midplane directly in contact with the ground terminals for grounding. The structure sacrifices the high-frequency transmission performance of the socket, and because the shielding of the middle plate is lost among high-frequency signals, the high-frequency transmission cannot be realized. In addition, for transmission of high frequency signals, the ground terminal is required to be not connected to the midplane but grounded. The high-frequency large-current socket applied by the republic of china 201821600514.0 solves the technical problems, but after the middle plate extends backwards, the space between the welding leg of the high-frequency signal terminal of the first terminal group and the welding leg of the high-frequency signal terminal of the second terminal group cannot be shielded, and the high-frequency performance cannot be effectively improved; at present, the requirement on the signal transmission performance of each terminal group is higher, part of the conductive terminals require to be electroplated with noble metal rhodium ruthenium, the cost is limited, and the part of the conductive terminals only need to be electroplated with noble metal gold, and the thickness of the terminals is different, so that new requirements are provided for the structure and the manufacturing process; the USB socket disclosed in the patent application No. 201720630490.2 of the people's republic of China is provided with a front section and a rear section on an insulating body, and water resistance is realized by injecting glue into a section difference space, but when glue is injected at the rear end of the insulating body, air bubbles are possibly caused due to the fact that gas cannot be smoothly discharged, and the water resistance is poor.

SUMMERY OF THE UTILITY MODEL

Therefore, there is a need for a high frequency and large current USB socket that supports high frequency transmission and can carry large current for charging.

In order to solve the technical problem, the application provides a high-frequency large-current USB socket, which comprises a metal middle plate, a first terminal group and a second terminal group which are respectively positioned at two sides of the metal middle plate, and an insulation body which integrates the metal middle plate with the first terminal group and the second terminal group, wherein the first terminal group and the second terminal group respectively sequentially comprise a grounding terminal, a high-frequency signal terminal, a power terminal, a conventional signal terminal, a power terminal, a high-frequency signal terminal and a grounding terminal in the transverse direction, each conductive terminal of the first terminal group and the second terminal group comprises a contact part, a fixing part formed by extending backwards from the contact part and a welding pin extending out of the insulation body from the fixing part, the thicknesses of the grounding terminal and the power terminal are larger than those of the high-frequency signal terminal and the conventional signal terminal, the metal middle plate comprises a main plate part positioned between the high-frequency signal terminals and a main plate part extending out of the outside from the front end of the And a projection of a rear end edge of the main body plate portion is located between the fillet of the high-frequency signal terminal of the first terminal group and the fillet of the high-frequency signal terminal of the second terminal group.

Preferably, the insulation body includes a first insulator integrally formed by injection molding of the first terminal group, a second insulator integrally formed by molding of the second terminal group and the metal middle plate, and a third insulator integrally formed by molding of the first and second insulators, the first and second terminal groups are respectively located at the upper and lower sides of the metal middle plate, and the solder tails of the second terminal group are located behind the first terminal group.

Preferably, the rear end of the holding portion of the first terminal group is bent downward and then extends in parallel to form a bent portion, the rear end of the main plate portion of the metal middle plate is bent downward at a position corresponding to the bent portion of the first terminal group to form a sinking portion, and the rear end edge of the sinking portion is located between the solder legs of the high-frequency signal terminals of the first and second terminal groups on the vertical projection plane.

Preferably, two flow holes are formed in the sinking portion of the metal middle plate, the insulation body comprises a base portion, a butt joint tongue portion formed by extending the base portion forward and a tail portion formed at the rear end of the base portion, a filling space is formed between the base portion and the tail portion, and the sinking portion at the position of the flow hole is exposed in the filling space.

Preferably, the ground terminal is formed with a groove structure at a position corresponding to the protruding portion so as to avoid the protruding portion and prevent the middle plate from contacting the ground terminal, the sinking portion extends laterally outward to form an extending portion extending outward, and the extending portion passes through between the ground terminals of the first and second terminal groups and extends out of the insulating body to connect the material strap.

Preferably, the high-frequency signal terminal and the conventional signal terminal are integrally formed in a stamping mode, the thickness of the terminal is between 0.09mm and 0.13mm, the two power supply terminals are integrally formed in a stamping mode, the thickness of the terminal is between 0.19 and 0.21, and the two grounding terminals are integrally formed in a stamping mode, and the thickness of the terminal is between 0.19 and 0.21.

Preferably, the high-frequency signal terminal and the conventional signal terminal are integrally formed in a stamping mode, the thickness of the terminal is between 0.09mm and 0.13mm, the two power supply terminals are integrally formed in a stamping mode, the thickness of the terminal is between 0.24 and 0.26, and the two ground terminals are integrally formed in a stamping mode, and the thickness of the terminal is between 0.24 and 0.26.

Preferably, the metal intermediate plate is formed with an inclined portion at a bent position of the depressed portion, and the main plate portion is partially cut away at a position between the ground terminals in front of the inclined portion.

Preferably, the metal middle plate is located between the power supply terminal, the high-frequency signal terminal and the normal signal terminal, and is cut off so that the metal middle plate forms two independent parts at the left and the right.

Preferably, the high-frequency large-current USB socket further includes a drawing shell sleeved outside the insulating body, the periphery of the filling space is surrounded by the drawing shell, and glue is injected into the filling space to fill the drawing shell, the insulating body, the first terminal group, the second terminal group, and the metal middle plate with glue to achieve water resistance.

Compare in prior art, this application is with the integrative injection moulding of metal medium plate and the second terminal group that is located the row of going up, because of sinking the soldering lug of portion and second terminal group is in different positions in the plug direction, even the cladding sink the portion can not influence exposing of the soldering lug of second terminal group yet.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a perspective assembly view of a high-frequency large-current USB socket according to the present application;

FIG. 2 is an exploded perspective view of the high frequency high current USB socket of the present application;

FIG. 3 is a perspective view of the connector of the high frequency large current USB socket of the present application;

FIG. 4 is an exploded perspective view of the high frequency high current USB socket connector of the present application;

fig. 5 is a perspective view of the high-frequency large-current USB socket according to the present invention, in which the second terminal group, the metal middle plate and the second insulator are integrally formed;

FIG. 6 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 7 is a perspective view of a metal middle plate of the high-frequency large-current USB socket of the present application;

fig. 8 is a top view of a first terminal set of the high frequency high current USB socket of the present application;

fig. 9 is a top view of the first and second terminal sets and the metal middle plate of the high-frequency large-current USB socket of the present application;

fig. 10 is a top view of a first terminal set and a metal middle plate of the high-frequency large-current USB socket of the present application;

fig. 11 is a left side view of the first and second terminal sets and the metal middle plate of the high-frequency large-current USB socket of the present application;

FIG. 12 is a cross-sectional view taken along line B-B of FIG. 9;

FIG. 13 is a perspective view of a high frequency high current USB socket of the present application at a second angle;

FIG. 14 is a third perspective view of the high frequency high current USB socket of the present application;

fig. 15 is a perspective view of the power terminal connection material strap of the second terminal group of the high-frequency large-current USB socket according to the present application;

fig. 16 is a perspective view of the conventional signal terminal and the high-frequency signal terminal connection material tape of the second terminal group of the high-frequency large-current USB socket according to the present application;

fig. 17 is a perspective view of the grounding terminal of the second terminal set of the high-frequency large-current USB socket according to the present application connected to the material tape;

fig. 18 is a perspective view of the high-frequency large-current USB socket according to the present invention, when the second terminal set is connected to the material tape and stacked together for injection molding;

fig. 19 is a perspective view of the high-frequency large-current USB socket according to the present application after the second terminal set is injection molded and a portion of the material strap is cut away;

fig. 20 is a perspective view of the first terminal group and the metal middle plate of the high-frequency large-current USB socket of the present application connected to the material strap and combined together for injection molding;

fig. 21 is a perspective view of the high-frequency large-current USB socket according to the present application after the second terminal set is injection molded and a portion of the material strap is cut away;

fig. 22 is a perspective view of the high-frequency large-current USB socket according to the present invention, in which the first and second terminal sets are assembled together after injection molding and ready for injection molding again;

fig. 23 is a perspective view of the high-frequency large-current USB socket according to the present invention, after the injection molding of the connector, the material strap is connected to the connector.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments.

Referring to fig. 1 to 4, 13 and 14, the high-frequency large-current USB socket of the present invention includes a plug connector a, a drawing shell 50 sleeved outside the plug connector a, fixing shells 71 and 72 fixed outside the drawing shell 50, a waterproof ring 30 disposed on an outer edge of the drawing shell 50, and a metal ring 60 sleeved outside the plug connector a and welded to the drawing shell 50.

The metal ring 60 is manufactured by a drawing process, the metal ring 60 includes an annular main body 61, and a wall portion 62 formed at a front end of the annular main body 61, and the wall portion 62 is perpendicular to the annular main body 51.

The fixed casing includes a first fixed casing 71 and a second fixed casing 72 clamped on the upper and lower sides of the drawing casing 50. The first fixing shell 71 comprises a first fixing portion 711, first ear portions 712 formed by extending the two transverse sides of the first fixing portion 711, a shielding portion 714 formed by extending the rear end of the first fixing portion 711 and covering the tail of the plug connector A, and a window 715 arranged between the shielding cloth 714 and the first fixing portion 711. The first fixing portion 711 further includes a side wrapping portion 713 formed to extend laterally outward and wrap a rear end of each of the two lateral sides of the plug connector a, and the shielding plate 714 is formed to be bent vertically downward from a rear end of the side wrapping portion 713.

The second fixing case 72 includes a second fixing portion 721, and a second ear portion 722 extending from both lateral sides of the second fixing portion 721 and welded and fixed to the first ear portion 712. A supporting boss 723 is formed at the front end of the surface of the second ear portion 722 in a protruding manner, a buckling piece 724 is formed by extending the rear end of the second ear portion 722 inwards, and the first fixing shell 71 and the second fixing shell 72 are fixed with the upper surface and the lower surface of the drawing shell 50 in a spot welding manner respectively.

As shown in fig. 4 to 12, the plug connector a includes a middle metal plate 40, first and second terminal sets 20 and 30 respectively located at upper and lower sides of the middle metal plate 40, and an insulating body 10 integrally formed by the middle metal plate 40 and the first and second terminal sets 20 and 30.

The insulating body 10 includes a first insulator 11 formed by integrally preforming the first terminal group 20, a second insulator 12 formed by integrally preforming the second terminal group 30 and the middle metal plate 40, and a third insulator 13 formed by integrally molding the first insulator 11 and the second insulator 12. The third insulator 13 includes a base 131, a butt tongue 132 formed extending forward from the base 131, and a tail 133 located at the rear end of the base 131 and completely isolated from the base 131. The outer diameter of the base 131 is greater than the outer diameter of the docking tongue 132, and the upper and lower surfaces of the base 131 are provided with the ribs 134, the annular main body 61 of the metal ring 60 is sleeved outside the base 131, the ribs 134 enable the metal ring 60 and the base 131 to be tightly fixed without loosening, and the wall 62 abuts against the front end edge of the base 131 to prevent the plug connector a from moving forward to limit the plug connector a. The first, second and second insulators 11, 12 and 13 each include a base portion 131 and a tail portion 133, and a filling space 135 is formed between the base portion 131 and the tail portion 133. The first, second and third insulators 11, 12 and 13 are connected to the base portion 131 and the tail portion 133 through the first and second terminal sets 20 and 30 exposed in the filling space and the metal middle plate 40. A passage 136 is formed at an upper side of the tail portion 133 of the third insulator 13 corresponding to the window 715 of the first fixing shell 71 to facilitate injection of glue into the filling space 135 through the window 715 and the passage 136.

The bottom surface of the tail portion 133 of the third insulator 13 is further provided with a fastening groove 138 for fastening the fastening piece 724, and the fastening piece 724 and the fastening groove 138 limit the plug connector a to retreat backwards.

The first and second terminal sets 20, 30 include, in order from left to right or from right to left, a ground terminal 201, 301, a high- frequency signal terminal 202, 302, a power supply terminal 203, 303, a normal signal terminal 204, 304, a power supply terminal 203, 303, a high- frequency signal terminal 202, 302, and a ground terminal 201, 301.

The terminal thickness of the grounding terminals 201 and 301 and the terminal thickness of the power supply terminals 203 and 303 are 0.2mm or 0.25 mm; the terminal thickness of the conventional signal terminals 204, 304 and the high- frequency signal terminals 202, 302 is 0.12 mm; this helps to carry a greater current.

Each of the conductive terminals of the first and second terminal sets 20, 30 includes a contact portion 21, 31 exposed on the upper and lower surfaces of the mating tongue 132, a holding portion 22, 32 extending rearward from the contact portion 21, 31, and a solder leg 23, 33 extending rearward from the holding portion 22, 32 and outside the insulating housing 10.

The holding portions 22, 32 of the first or second terminal sets 20, 30 are bent upward at the base 131 of the insulative housing 10 to form a bent portion 221, so that the distance between the portions of the holding portions 22, 32 of the first and second terminal sets 20, 30 located behind the bent portion 221 is increased. In an embodiment, the holding portions 22, 32 of the first and second terminal sets 20, 30 may be bent and extended oppositely to increase the distance between the holding portions 22, 32.

Referring to fig. 7 with emphasis, the portion of the metal middle plate 40 between the power terminals 203, 303 and the conventional signal terminals 204, 304 is completely cut off, thereby forming two independent middle plate structures on the left and right. Each of the individual intermediate metal plates 40 includes a main plate portion 41 extending in the insertion/removal direction, a protruding portion 42 extending laterally outward from the front end of the main plate portion 41, a depressed portion 44 formed at the rear end of the main plate portion 41, and a welded portion 47 extending from the depressed portion 44. The front end edge of the main plate portion 41 is thinned to form a thinned portion 411, and the thinned portion 411 can be bent to avoid the front end edge of the high- frequency signal terminal 202, 302 to leave a space.

The depressed portion 44 is formed by bending downward from the main plate 41 and extending, thereby forming an inclined portion 43. The transverse width of the sinking portion 44 is greater than that of the main board portion 41, two circulation holes 45 are formed in the sinking portion 44, the sinking portion 44 extends transversely outward to form an extending portion 46, and the transverse outer side of the extending portion 46 is used for connecting the material belt so as to facilitate production automation. The welding portion 47 is formed extending from the rear end of the extension portion 46. A locking groove 421 for locking with a plug (not shown) is formed at the outer edge of the protrusion 42, and a through hole 422 is formed on the protrusion 42 for allowing plastic to flow so as to fix the metal middle plate 40. The position of the inclined portion 43 corresponds to the position of the bending portion 221 of the first or second terminal set 20, 30, the bending portion 221 is formed by bending the first terminal set 20 downwards at the position of the holding portion 22, and the inclined portion 43 is formed by bending downwards from the main board portion 41 to avoid contact with the bending portion 221. The flow holes 45 are not closed outside of the one hole structure inside to minimize the space occupied by the sink 44 at the location of the flow holes 45. The sinking portion 44 at the position of the flow hole 45 is exposed to the filling space 135. The sinking portion 44 is adopted to bend at least one conductive terminal 20, so that the gap between the fixing portions 22 and 23 at the position of the filling space 135 and the sinking portion 44 is increased, meanwhile, the arrangement of the circulation hole 45 can also increase the gap, thereby facilitating glue injection, enhancing the fluidity of glue, and preventing poor water resistance caused by the fact that the filling space 135 cannot be completely filled with the glue.

As shown in fig. 6, the first and second insulators 11 and 12 are stacked to form an air gap 137 penetrating in the inserting and extracting direction, when the third insulator 13 is injection molded, plastic does not fill the air gap 137, when glue 81 is injected from the window 175 during glue injection, the glue 81 extrudes air in the filling space 135, most of the air is discharged from the exposed portion of the outer periphery of the filling space 135, but if the tail portion 133 is located on one side of the filling space 135 and is closed, the space is extremely small, air bubbles may be formed inside the tail portion 133, and the air gap 137 may enable the air to be discharged from the filling space 135 backwards to ensure that the glue fills the filling space 135.

Referring to fig. 9 to 12, the main plate 41 and the sinking portion 44 are disposed between the high- frequency signal terminals 202, 302 of the first and second terminal sets 20, 30 to shield the interference between the high-frequency signals between the two rows of high- frequency signal terminals 202, 302.

The holding portions 22, 32 of the first or second terminal sets 20, 30 are bent and extended away from each other such that there is a sufficient distance between the holding portions 22, 32 to allow the desired lateral outer side of the sinking portion 44 to extend and connect the carrier tape.

In an embodiment, the middle metal plate 40 is not provided with the sunken part 44, and the sunken part 44 is only a part of the main plate part 41, that is, the main plate part 41 and the sunken part 44 are located on the same horizontal plane. And the holding portions 22, 32 of the first and second terminal sets 20, 30 are formed by bending and extending in a direction away from each other, so that a space for the metal middle plate 40 to extend transversely is reserved for the distance between the holding portions 22, 32 of the first and second terminal sets 20, 30.

Referring to fig. 4 and 5, the front end of the ground terminal 201, 301 is thinned to form a slot structure 2011, 3011 towards the position of the protruding portion 42, so that the protruding portion 42 extends laterally outward beyond the position of the ground terminal 201, 301 without contacting the ground terminal. While the sinker 44 is already at a sufficient distance to allow the sinker 44 to extend laterally.

Referring to fig. 7 and 8, except for the position where the protrusion 42 of the metal middle plate 40 extends outward to pass through the slot structure 2011, 3011 of the ground terminals 201, 301, the metal middle plate 40 is not present between the ground terminals 201, 301 of the first and second terminal sets 20, 30, so that the ground terminals 201, 301 may be thickened to 0.19 mm-0.21 mm or 0.24 mm-0.26 mm to carry larger current. The metal middle plate 40 is not arranged between the power terminals 203, 303 of the first and second terminal groups 20, 30, and the power terminals 203, 303 can also be thickened to 0.19 mm-0.21 mm or 0.24 mm-0.26 mm to bear larger current.

The conventional signal terminals 204, 304 transmit the conventional signal therebetween without shielding the conventional signal between the first and second terminal sets 20, 30, i.e. there is no metal midplane 40 between the conventional signal terminals 204, 304.

As shown in fig. 11 and 12, the solder fillets 23 and 33 of the first and second terminal sets 20 and 30 are respectively arranged in two rows in the inserting and extracting direction, the solder fillet 33 of the second terminal set 30 located at the upper side is located behind the solder fillet 23 of the first terminal set 20, and the rear end edge of the sinking portion 44 is located between the solder fillet 33 of the second terminal set 33 and the solder fillet 23 of the first terminal set 20 or is flush with the rear end edge of the solder fillet 23 of the first terminal set 20 in the vertical projection direction. Thus, the main plate portion 41 and the sinking portion 44 are completely isolated from the high- frequency signal terminals 202, 302, and include the solder fillets 23, 33 extending backward, so that the high-frequency transmission performance can be effectively improved.

Compared with the prior art, the metal middle plate 40 cannot shield the upper and lower rows of solder fillets 23, 33 of the first and second terminal sets 20, 30, and thus the high frequency performance is reduced. In the prior art, the middle metal plate 40 and the first terminal set 20 located in the lower row are integrally injection-molded, so that the rear end of the sinking portion 44 needs to be coated, and the solder tails 23 of the first terminal set 20 need to be exposed, so that the solder tails 23 of the first terminal set 20 cannot be shielded.

Referring to fig. 15 to 23, a method for manufacturing a high-frequency large-current USB socket according to the present invention is described in detail, which includes the following steps:

s10, stamping the ground terminals 201, 301, the signal terminals (including the high- frequency signal terminals 202, 302 and the regular signal terminals 203, 303) and the power terminals 203, 303 of the first and second terminal sets 20, 30 respectively; simultaneously, punch forming the metal middle plate 40;

in this step, two terminals of the ground terminals 201 and 301 are respectively connected to the front end and the rear end of the first front material belt 2011 and the first rear material belt 2012; the front end and the rear end of the signal terminals are respectively connected with a second front material belt 2021 and a second rear material belt 2022; the front end and the rear end of the power terminals 203, 303 are connected with a third front material belt 2031 and a third rear material belt 2032. The metal middle plate 40 is connected with a middle plate material belt 401, the middle plate material belt 401 extends through the lateral outer side of the extending portion 46 to form a first connecting portion 402, and a second connecting portion 403 connected with the middle plate material belt 401 is arranged at the front end of the main body plate portion 41.

A space for accommodating the power supply terminal 203, 303 is provided between the normal signal terminal 204, 304 and the high- frequency signal terminal 202, 302, and the ground terminals 201, 301 are respectively located on both lateral sides of the high- frequency signal terminal 202, 302. The rear ends of the holding parts 22, 32 of the ground terminals 201, 301 extend laterally outward to form tape connecting parts 2013, 2014, and the first rear tape 2012 is connected by the tape connecting parts 2013, 2014; the tape connecting portion includes a first extension portion 2013 extending outwardly from the lateral outer side of the holding portion 22, 32 and a second extension portion 2014 extending rearwardly from the end of the first extension portion 2013 and linking with the first rear tape 2012. The tape connecting parts 2013, 2014 are designed to have enough space for accommodating the power terminals 203, 303 and the tape connecting parts at the rear ends of the signal terminals. The thickness of the ground terminals 201, 301 and the power terminals 203, 303 is larger than the thickness of the signal terminals 202, 302, 204, 304.

S20, electroplating the power terminals 203 and 303 and the signal terminals respectively, wherein the electroplated layer comprises rhodium ruthenium; electroplating the grounding terminals 201 and 301, wherein the electroplated layer comprises gold;

in this step, the power terminals 203, 303 and the signal terminals have higher requirements for transmission capability, and require noble metal rhodium ruthenium with better electroplating performance, and the power terminals 203, 303 and the signal terminals may be electroplated separately or simultaneously; the ground terminals 201 and 301 have lower requirements for signal or current transmission capability, and only noble metal gold is plated.

S30, stacking the ground terminal 201, the power terminal 203, and the signal terminals 202 and 204 of the first terminal group 20 together, and electroplating to form the first insulator 11; the second insulator 12 is injection molded by dropping the ground terminal 301, the power terminal 303, the signal terminals 302 and 304 of the second terminal group 30 and the metal middle plate 40 together;

when the first insulator 11 is molded, the second front material belt 2021 and the third front material belt 2031 are overlapped together, and the first front material belt 2011 is located at the periphery of the second front material belt 2021 and the third front material belt 2031; the first to third back material belts 2012, 2022, 2032 are overlapped together and fixed, and in order to accurately overlap the ground terminal 201, the power terminal 203 and the signal terminal, a plurality of riveting holes are arranged in the first to third back material belts 2012, 2022, 2032 and riveted into a whole for injection molding. When the second insulator 12 is molded, the metal intermediate plate 40 and the second terminal group 30 may be fixed together. When the material belts are required to be overlapped during injection molding, the grounding terminal, the power supply terminal and the signal terminal can still keep a preset plane position when the material belts are required to be bent and overlapped.

S40, cutting off the first to third front tapes 2011, 2021, 2031 and the second and third back tapes 2022, 2032 of the first terminal set 20; the first to third front tape strips 3011, 3021, 3031 and the first to third rear tape strips 3021, 3022, 3023 of the second terminal group 30 are cut off, and the second connecting portions 403 of the middle boards 401 are cut off at the same time.

S50, overlapping and fixing the first terminal set 20 and the first insulator 11 thereof with the second terminal set 30, the metal middle plate 40 and the second insulator 12 thereof, and injection molding again to form the third insulator 13;

the surface of the second insulator 12 close to the first insulator 11 is provided with a supporting boss 121 and a terminal groove 122, and the conductive terminals of the first terminal set 20 are positioned and limited in the supporting boss 121 and the terminal groove 122.

In this step, the first rear material strap 2012 is cut off, and neither the first extension portion 2013 nor the second extension portion 2014 is cut off and molded in the first and/or third insulators 13.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (10)

1. A high-frequency large-current USB socket comprises a metal middle plate, a first terminal group and a second terminal group which are respectively positioned at two sides of the metal middle plate, and an insulating body which integrates the metal middle plate, the first terminal group and the second terminal group into a whole, wherein the first terminal group and the second terminal group respectively comprise a grounding terminal, a high-frequency signal terminal, a power terminal, a conventional signal terminal, a power terminal, a high-frequency signal terminal and a grounding terminal in sequence in the transverse direction, each conductive terminal of the first terminal group and the second terminal group comprises a contact part, a fixing part formed by extending backwards from the contact part and a welding pin extending out of the insulating body from the fixing part, the high-frequency large-current USB socket is characterized in that the thicknesses of the grounding terminal and the power terminal are larger than those of the high-frequency signal terminal and the conventional signal terminal, the metal middle plate comprises a main plate part positioned between the high-frequency signal terminals and a protruding part extending out of the outside from, the vertical projection of the rear end edge of the main body plate portion is located between the fillet of the high-frequency signal terminal of the first terminal group and the fillet of the high-frequency signal terminal of the second terminal group.

2. The high-frequency high-current USB socket according to claim 1, wherein the insulator body includes a first insulator integrally injection-molded with the first terminal set, a second insulator integrally injection-molded with the second terminal set and a metal middle plate, and a third insulator integrally injection-molded with the first and second insulators, the first and second terminal sets are respectively located at upper and lower sides of the metal middle plate, and the solder tails of the second terminal set are located behind the first terminal set.

3. The high-frequency large-current USB socket according to claim 2, wherein the rear ends of the holding portions of the first terminal group are bent downward and then extended in parallel to form bent portions, the rear end of the main plate portion of the metal middle plate is bent downward at a position corresponding to the bent portions of the first terminal group to form a sunken portion, and the rear end edge of the sunken portion is located between the solder tails of the high-frequency signal terminals of the first and second terminal groups on the vertical projection plane.

4. The high-frequency large-current USB socket according to claim 3, wherein two flow holes are formed in the depressed portion of the middle metal plate, the insulating body includes a base portion, a butt-joint tongue portion extending forward from the base portion, and a tail portion formed at the rear end of the base portion, a filling space is formed between the base portion and the tail portion, and the depressed portion at the position of the flow hole is exposed in the filling space.

5. The high-frequency large-current USB socket according to claim 4, wherein the ground terminal is formed with a thinned groove structure at a position corresponding to the protrusion to avoid the protrusion from contacting the middle plate, the sinking portion extends laterally outward to form an extension portion extending outward, and the extension portion extends out of the insulating body through a space between the ground terminals of the first and second terminal sets to connect the tape.

6. The high-frequency large-current USB socket according to claim 5, wherein the high-frequency signal terminal and the normal signal terminal are integrally formed by punching and have a terminal thickness of 0.09mm to 0.13mm, the two power terminals are integrally formed by punching and have a terminal thickness of 0.19 to 0.21, and the two ground terminals are integrally formed by punching and have a terminal thickness of 0.19 to 0.21.

7. The high-frequency large-current USB socket according to claim 5, wherein the high-frequency signal terminal and the normal signal terminal are integrally formed by punching and have a terminal thickness of 0.09mm to 0.13mm, the two power terminals are integrally formed by punching and have a terminal thickness of 0.24 to 0.26, and the two ground terminals are integrally formed by punching and have a terminal thickness of 0.24 to 0.26.

8. A high-frequency large-current USB socket according to claim 6 or 7, wherein an inclined portion is formed at a bent position of the depressed portion of said middle metal plate, and said main body plate portion is partially cut away at a position between said ground terminals in front of said inclined portion.

9. The high-frequency large-current USB socket according to claim 8, wherein the metal middle plate is cut between the power supply terminal, the high-frequency signal terminal and the normal signal terminal so that the metal middle plate forms two separate portions on the left and right.

10. The high-frequency large-current USB socket according to claim 9, wherein the high-frequency large-current USB socket further includes a drawing shell sleeved outside the insulating body, the outer periphery of the filling space is surrounded by the drawing shell, and glue is injected into the filling space to fill the drawing shell, the insulating body, the first terminal set, the second terminal set, and the metal middle plate with glue for waterproofing.

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