CN211555862U - Heat radiation structure of ceramic circuit board integrated IGBT - Google Patents
Heat radiation structure of ceramic circuit board integrated IGBT Download PDFInfo
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- CN211555862U CN211555862U CN202020526935.4U CN202020526935U CN211555862U CN 211555862 U CN211555862 U CN 211555862U CN 202020526935 U CN202020526935 U CN 202020526935U CN 211555862 U CN211555862 U CN 211555862U
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Abstract
The utility model relates to a IGBT technical field especially relates to an integrated IGBT's of ceramic circuit board heat radiation structure. Through set up the opening that can inlay the ceramic plate on the individual layer circuit board, the ceramic plate is exclusively used in and sets up the IGBT and is used for playing the radiating action to the IGBT, can be as little as possible influence the electric demand of circuit board moreover, the fixed setting of IGBT on the ceramic plate and the pin and the circuit board welding of IGBT realize ceramic plate and circuit board fixed connection, form compound ceramic circuit board. Through adopting the mode that the ceramic plate replaces the insulating radiating pad for product hardness is harder relatively, and thickness is also thicker relatively, thereby can not stop the IGBT and be punctured the risk because of foreign matter or the insulating radiating pad damage of assembling process circumstances such as crushing, arranges and goes up from the heat-conducting glue of taking two-sided viscose, the installation of not only being convenient for, and coefficient of heat conductivity is greater than the insulating radiating pad simultaneously, reaches good radiating effect.
Description
Technical Field
The utility model relates to a IGBT technical field especially relates to an integrated IGBT's of ceramic circuit board heat radiation structure.
Background
At present, with the global requirements of energy conservation and emission reduction, an electric automobile is a new direction for automobile development, and a PTC (Positive Temperature Coefficient) heater can be used for auxiliary heating and defrosting in winter and is an indispensable part of the electric automobile. IGBT devices are important as PTC heaters, and their heat dissipation problem is receiving attention.
The heat radiation structure of the existing IGBT device is that the IGBT device is arranged on an aluminum sheet, the IGBT device and the aluminum sheet are isolated and communicated by adopting an insulating heat radiation pad, and then the IGBT device is fixed by using a screw locking method, wherein the thickness of the insulating heat radiation pad is 0.15mm, and the insulating heat radiation pad is made of a composite heat conduction material formed by Pi and silica gel.
The heat dissipation structure of the IGBT device has the following disadvantages: 1. the insulating heat dissipation pad is thin and is easy to be punctured by foreign matters; 2. the insulating heat dissipation pad is installed in a viscose mode, the whole product is fixed in a screw locking mode, and the product is soft and difficult to assemble; 3. the foreign matter on the surface of the insulating heat dissipation pad is easy to cause the IGBT to be broken down in the working state.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: a heat dissipation structure of a ceramic circuit board integrated IGBT is provided.
In order to solve the technical problem, the utility model discloses a technical scheme be:
the utility model provides an integrated IGBT's of ceramic circuit board heat radiation structure, the IGBT sets up on the aluminum sheet, including ceramic circuit board and heat conduction glue, the ceramic circuit board passes through the heat conduction glue and affixes to the aluminum sheet on the surface, the ceramic circuit board comprises individual layer circuit board and ceramic plate, be equipped with on the individual layer circuit board and can inlay and establish the opening of ceramic plate, the non-metallic face and the heat conduction glue contact of individual layer circuit board, a ceramic plate side bonds with the heat conduction that corresponds the open position of individual layer circuit board, the IGBT is fixed to be set up on ceramic plate another side just the pin of IGBT strides across behind the junction of individual layer circuit board and ceramic plate with set up the binding post welding on the metal covering.
Furthermore, another side of the ceramic plate is plated with gold material for welding and fixing with the IGBT.
Further, the opening is located at the edge of the single-layer circuit board.
Furthermore, the wiring terminal on the metal surface of the single-layer circuit board is arranged close to the connection position of the single-layer circuit board and the ceramic board.
Furthermore, the single-layer circuit board is provided with a mounting hole, a threaded hole is formed in the aluminum sheet corresponding to the mounting hole, and a screw penetrates through the mounting hole to be in threaded connection with the threaded hole.
The beneficial effects of the utility model reside in that:
the utility model provides an integrated IGBT's of ceramic circuit board heat radiation structure can inlay the opening of establishing the ceramic plate through setting up on the individual layer circuit board, and the ceramic plate is exclusively used in and sets up the IGBT and is used for playing the radiating action to the IGBT, can be as little as possible influence the electric demand of circuit board moreover, and the fixed setting of IGBT is on the ceramic plate and the pin and the circuit board welding of IGBT, realizes ceramic plate and circuit board fixed connection, forms compound ceramic circuit board. Through adopting the mode that the ceramic plate replaces the insulating radiating pad for product hardness is harder relatively, and thickness is also thicker relatively, thereby can not stop the IGBT and be punctured the risk because of foreign matter or the insulating radiating pad damage of assembling process circumstances such as crushing, arranges and goes up from the heat-conducting glue of taking two-sided viscose, the installation of not only being convenient for, and coefficient of heat conductivity is greater than the insulating radiating pad simultaneously, reaches good radiating effect.
Drawings
Fig. 1 is an exploded schematic view of a heat dissipation structure of a ceramic circuit board integrated IGBT according to the present invention;
fig. 2 is an assembly schematic diagram of the heat dissipation structure of the ceramic circuit board integrated IGBT of the present invention;
fig. 3 is a top view of the heat dissipation structure of the ceramic circuit board integrated IGBT of the present invention;
FIG. 4 is a cross-sectional view taken at A-A of FIG. 3;
description of reference numerals:
1. an IGBT; 2. aluminum sheets; 3. a ceramic circuit board; 4. heat conducting glue;
31. a single-layer circuit board; 311. an opening; 32. a ceramic plate.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Please refer to fig. 1-4, the utility model provides a pair of integrated IGBT's of ceramic circuit board heat radiation structure, the IGBT sets up on the aluminum sheet, glue including ceramic circuit board and heat conduction, the ceramic circuit board passes through the sticky adhesion of heat conduction glue on the aluminum sheet is on the surface, the ceramic circuit board comprises individual layer circuit board and ceramic plate, be equipped with on the individual layer circuit board and can inlay the establishment the opening of ceramic plate, the non-metallic face and the heat conduction of individual layer circuit board contact, a ceramic plate side bonds with the heat conduction of corresponding the open position of individual layer circuit board, the IGBT is fixed to be set up on ceramic plate another side just the pin of IGBT strides across behind the junction of individual layer circuit board and ceramic plate with set up the binding post welding on the metal covering.
From the above description, the beneficial effects of the present invention are:
the utility model provides an integrated IGBT's of ceramic circuit board heat radiation structure can inlay the opening of establishing the ceramic plate through setting up on the individual layer circuit board, and the ceramic plate is exclusively used in and sets up the IGBT and is used for playing the radiating action to the IGBT, can be as little as possible influence the electric demand of circuit board moreover, and the fixed setting of IGBT is on the ceramic plate and the pin and the circuit board welding of IGBT, realizes ceramic plate and circuit board fixed connection, forms compound ceramic circuit board. Through adopting the mode that the ceramic plate replaces the insulating radiating pad for product hardness is harder relatively, and thickness is also thicker relatively, thereby can not stop the IGBT and be punctured the risk because of foreign matter or the insulating radiating pad damage of assembling process circumstances such as crushing, arranges and goes up from the heat-conducting glue of taking two-sided viscose, the installation of not only being convenient for, and coefficient of heat conductivity is greater than the insulating radiating pad simultaneously, reaches good radiating effect.
Furthermore, another side of the ceramic plate is plated with gold material for welding and fixing with the IGBT.
As can be known from the above description, the ceramic plate and the IGBT are fixed by welding, so that the connection stability is improved.
Further, the opening is located at the edge of the single-layer circuit board.
It can be known from the above description that open-ended border can be for totally closed or semi-enclosed, if the structure for after the assembly is more stable, chooses for use totally closed, if for handheld ceramic plate that assembly personnel can be convenient in operation process, chooses for use semi-enclosed, can be convenient place it in the opening.
Furthermore, the wiring terminal on the metal surface of the single-layer circuit board is arranged close to the connection position of the single-layer circuit board and the ceramic board.
According to the description, the length of the pins of the IGBT is met, the length of the pins of the IGBT does not need to be lengthened, and the shorter the pins of the IGBT, the stronger the structure is, the difficulty in breaking and damaging is caused, and the electrical performance is affected.
Furthermore, the single-layer circuit board is provided with a mounting hole, a threaded hole is formed in the aluminum sheet corresponding to the mounting hole, and a screw penetrates through the mounting hole to be in threaded connection with the threaded hole.
According to the description, on the basis, the single-layer circuit board is further fixed on the aluminum sheet through the screws, so that the stability of the whole structure is improved, and the anti-seismic requirement of the vehicle equipment in the using process is met.
Referring to fig. 1-4, a first embodiment of the present invention is:
in the air conditioning and heating system PTC of the automobile, the driving is mainly realized by means of the IGBT device, however, the heat dissipation structure of the conventional IGBT device has the defects, and the defects in the conventional method are improved by the following scheme.
The utility model provides a heat radiation structure of ceramic circuit board integrated IGBT, set up IGBT 1 on aluminum sheet 2, the heat radiation structure includes ceramic circuit board 3 and heat-conducting glue 4, wherein, the heat-conducting glue adopts the production of Shanghai Yidi factory, its model number is TA1024, the thickness of heat-conducting glue is 0.1mm-0.2 mm; both side surfaces of the heat-conducting glue are provided with viscose;
The single-layer circuit board 31 is provided with an opening 311 capable of embedding the ceramic board, preferably, the opening is located at an edge of the single-layer circuit board. In the operation process, an assembler can conveniently hold the ceramic plate and place the ceramic plate in the opening.
The non-metal surface of the single-layer circuit board 31 is contacted with the heat-conducting glue 4, and one side surface of the ceramic plate 32 is bonded with the heat-conducting glue corresponding to the opening position of the single-layer circuit board;
the IGBT 1 is fixedly disposed on the other side surface of the ceramic plate 32, specifically: another side of the ceramic plate is plated with gold material and is used for being welded and fixed with the IGBT, and connection stability is improved. The gold material is of a layered structure, the thickness of the gold material is 0.1mm, and the welding conditions of the gold material and an IGBT device can be met.
The pins of the IGBT 1 cross the joints between the single-layer wiring board 31 and the ceramic board 32 and are soldered to terminals provided on the metal surface of the single-layer wiring board 31. And the wiring terminal on the metal surface of the single-layer circuit board is arranged close to the joint of the single-layer circuit board and the ceramic board. This structure can satisfy IGBT's pin length, need not to lengthen IGBT's pin length, and IGBT's pin is shorter, and the structure is stronger and harder, is difficult for losing, influences electrical properties.
In order to further improve the stability of the whole structure and meet the anti-seismic requirement of the vehicle equipment in the using process, the single-layer circuit board is provided with four mounting holes which are respectively distributed at four corners of the single-layer circuit board, the aluminum sheet is provided with threaded holes corresponding to the mounting holes, and screws penetrate through the mounting holes and are in threaded connection with the threaded holes.
An electrifying experiment is carried out for 1 hour under the conditions that the ambient temperature is 24 ℃, the power is 3000W, the voltage of a fan is 12V, and the high voltage is 125V, and the temperature data (DEG C) of 4 IGBT devices is detected after 1 hour to obtain the related data as shown in the following table 1.
| Sample numbering | 1 | 2 | 3 | 4 |
| Existing solutions | 74.3℃ | 87.4℃ | 81℃ | 85.2℃ |
| This scheme | 65.7℃ | 70℃ | 66.7℃ | 68.6℃ |
TABLE 1
From the above detected temperature data of 4 IGBT devices, it is obvious that: adopt the utility model provides a pair of ceramic circuit board integrated IGBT's heat radiation structure can improve the radiating effect, and then reduces the temperature of IGBT device.
To sum up, the utility model provides a pair of ceramic circuit board integrated IGBT's heat radiation structure can inlay the opening of establishing the ceramic plate through setting up on the individual layer circuit board, and the ceramic plate is exclusively used in and sets up the IGBT and is used for playing the radiating action to the IGBT, and the electric demand of influence circuit board that can be as little as possible moreover, and the fixed setting of IGBT is on the ceramic plate and the pin and the circuit board welding of IGBT, realizes ceramic plate and circuit board fixed connection, forms compound ceramic circuit board. Through adopting the mode that the ceramic plate replaces the insulating radiating pad for product hardness is harder relatively, and thickness is also thicker relatively, thereby can not stop the IGBT and be punctured the risk because of foreign matter or the insulating radiating pad damage of assembling process circumstances such as crushing, arranges and goes up from the heat-conducting glue of taking two-sided viscose, the installation of not only being convenient for, and coefficient of heat conductivity is greater than the insulating radiating pad simultaneously, reaches good radiating effect.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (5)
1. The utility model provides an integrated IGBT's of ceramic circuit board heat radiation structure, the IGBT sets up on the aluminum sheet, and its characterized in that, glue including ceramic circuit board and heat conduction, the ceramic circuit board passes through the adhesive adhesion of heat conduction and is on the aluminum sheet surface, the ceramic circuit board comprises individual layer circuit board and ceramic plate, be equipped with on the individual layer circuit board and can inlay the establishment the opening of ceramic plate, the non-metallic face and the heat conduction of individual layer circuit board are glued and are contacted, a ceramic plate side bonds with the heat conduction of the open position that corresponds the individual layer circuit board, the IGBT is fixed to be set up on ceramic plate another side just the pin of IGBT strides across behind the junction of individual layer circuit board and ceramic plate and sets up the binding post.
2. The heat dissipation structure of the ceramic circuit board integrated IGBT as claimed in claim 1, wherein the other side of the ceramic board is plated with gold material for being soldered and fixed with the IGBT.
3. The heat dissipation structure of the ceramic wiring board integrated IGBT according to claim 1, wherein the opening is located at an edge position of a single-layer wiring board.
4. The heat dissipation structure of the ceramic circuit board integrated IGBT as claimed in claim 1, wherein the terminals on the metal surface of the single-layer circuit board are disposed close to the connection between the single-layer circuit board and the ceramic board.
5. The heat dissipation structure of the ceramic circuit board integrated IGBT as claimed in claim 1, wherein the single-layer circuit board is provided with mounting holes, the aluminum sheet is provided with threaded holes corresponding to the mounting holes, and screws are threaded through the mounting holes and the threaded holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020526935.4U CN211555862U (en) | 2020-04-10 | 2020-04-10 | Heat radiation structure of ceramic circuit board integrated IGBT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020526935.4U CN211555862U (en) | 2020-04-10 | 2020-04-10 | Heat radiation structure of ceramic circuit board integrated IGBT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211555862U true CN211555862U (en) | 2020-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020526935.4U Active CN211555862U (en) | 2020-04-10 | 2020-04-10 | Heat radiation structure of ceramic circuit board integrated IGBT |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211555862U (en) |
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2020
- 2020-04-10 CN CN202020526935.4U patent/CN211555862U/en active Active
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