CN209345420U - Insulating heat conduction structure - Google Patents

Abstract

The utility model discloses an insulating heat conduction structure, include: the electrode plate is provided with an electrode plate (1) of a positive temperature coefficient chip (3) and a heat dissipation device, wherein the outer edge part of the electrode plate (1) is wrapped by silica gel (2) and exposes out of an electrode plate terminal (11), and the heat dissipation device is arranged on the surface of the electrode plate (1). The utility model discloses a silica gel parcel electrode slice can ensure closely laminating, has promoted the heat exchange efficiency of PTC heat dissipation core effectively, practices thrift the power battery energy. Meanwhile, the hardness of the silica gel is enough, so that the damage risk can be avoided.

Description

A kind of insulating heat-conductive structure

Technical field

The utility model relates to electric vehicle correlative technology field, especially a kind of insulating heat-conductive structure.

Background technique

Electric vehicle heating system positive temperature coefficient (Positive temperature coefficient, PTC) air Heater.For PTC air heater using the power supply of power battery, voltage is generally 350V or so, and PTC air heater is logical Air is directly heated after electricity to heat to driver's cabin.PTC air heater need to design insulating heat-conductive structure.Existing PTC radiating core Body insulating heat-conductive organization plan are as follows: PTC chip is bonded on electrode slice by bonding agent, is then wrapped up in electrode slice outer surface 0.5mm thick polyimide film, the electrode slice after package only expose electrode slice terminal and connect with PCBA board, and Kapton is tight Electrode slice surface is pasted, insulating heat-conductive is played the role of.Electrode slice after package Kapton is put into heat sink strip, is then flattened Heat sink strip, heat sink strip and Kapton gap are maintained at 0.5mm or so (controlling heat sink strip pressure to control gap).

However, due to there is gap between heat sink strip and Kapton, so that the heat exchange efficiency of PTC declines.In addition, by In Kapton and electrode slice using package by hand, can not ensure completely in engineering between electrode slice and Kapton It is close to, so can also reduces the heat exchange efficiency of PTC.When pressing heat sink strip, heat sink strip cannot be allowed tight with Kapton Closely connected conjunction, because of Kapton thickness thin (0.5mm) and more crisp, if pressure is slightly larger when pressure heat sink strip, allow heat sink strip with Kapton fits closely, and Kapton has damaged risk, and PTC electrode slice is caused directly to contact with heat sink strip, Reduce the insulation resistance of PTC.

Utility model content

Based on this, it is necessary to and the technology that is easily damaged not high for the heat transfer effect of the insulating heat-conductive structure of the prior art Problem provides a kind of insulating heat-conductive structure.

The utility model provides a kind of insulating heat-conductive structure, comprising: be provided with positive temperature coefficient chip electrode slice and Radiator, the electrode slice outer edge wrap up silica gel and expose electrode slice terminal, and the radiator is arranged in the electrode The surface of piece.

Further, the silica gel and the electrode slice are integrally formed.

Further, plane where the electrode slice outer edge is lower than plane where electrode slice middle part, the silica gel packet It wraps up in the outer edge and is in same level with the middle part.

Further, the radiator includes: heat-radiating substrate, and the table of the electrode slice is arranged in the heat-radiating substrate Face.

Further, the heat-radiating substrate is ceramic substrate.

Further, the radiator further includes the radiating fin that the heat-radiating substrate surface is arranged in.

Further, including two electrode slices, two electrode slices clamp the positive temperature coefficient chip.

The utility model wraps up electrode slice by silica gel, it can be ensured that fits closely, PTC radiating core is effectively promoted Heat exchange efficiency, save the power battery energy.Meanwhile the hardness of silica gel is enough, is avoided that breakage risk.

Detailed description of the invention

Fig. 1 is a kind of structural schematic diagram of insulating heat-conductive structure of the utility model；

Fig. 2 is electrode slice scheme of installation；

Fig. 3 is silica gel scheme of installation；

Fig. 4 is heat-radiating substrate schematic diagram；

Fig. 5 is radiating fin schematic diagram.

Specific embodiment

The utility model is described in more detail in the following with reference to the drawings and specific embodiments.

It is as shown in Figure 1 a kind of structural schematic diagram of insulating heat-conductive structure of the utility model, comprising: be provided with positive temperature system The electrode slice 1 and radiator of number chip 3,1 outer edge of electrode slice wrap up silica gel 2 and expose electrode slice terminal 11, institute State the surface that the electrode slice 1 is arranged in radiator.

Specifically, as shown in Fig. 2, positive temperature coefficient (Positive temperature coefficient, PTC) core After piece 3 is bonded on electrode slice 1 by bonding agent.As shown in figure 3, PTC electrode slice outer surface is no longer with Kapton packet It wraps up in, by selecting thermal coefficient good, the excellent silica gel of insulation performance is wrapped in the outer edge of electrode slice, and may insure to be close to electricity Pole piece outer surface.Then radiator is used into such as bonding mode, the surface of silica gel 2 is set.Wherein, silica gel 2 closely wraps Wrap up in the surrounding of electrode slice, it is ensured that the insulation of electrode slice surrounding exposed parts, electrode slice middle part applies silica gel, then that heat-radiating substrate is straight It connects and is sticked on electrode slice, electrode slice terminal exposes.

The utility model wraps up electrode slice by silica gel, it can be ensured that fits closely, PTC radiating core is effectively promoted Heat exchange efficiency, save the power battery energy.Meanwhile the hardness of silica gel is enough, is avoided that breakage risk.

The silica gel 2 is integrally formed with the electrode slice 1 in one of the embodiments,.

Plane is flat lower than where 1 middle part of electrode slice where 1 outer edge of electrode slice in one of the embodiments, Face, the silica gel 2 wrap up the outer edge and are in same level with the middle part.

As can be seen from Figure 2 there are a small stair, surrounding and silica gel integrated injection molding, note in electrode slice surrounding and intermediate position Silica Surface and electrode slice centre position are in same level after modeling.

The present embodiment silica gel 2 is integrally formed with the electrode slice 1 may insure that silica gel 2 is close to electrode slice outer surface.

The radiator includes: heat-radiating substrate 4 in one of the embodiments, and the heat-radiating substrate 4 is arranged described The surface of electrode slice 1.

The present embodiment improves heat dissipation effect by heat-radiating substrate 4.

The heat-radiating substrate 4 is ceramic substrate in one of the embodiments,.

The radiator further includes the radiating fin that 4 surface of heat-radiating substrate is arranged in one of the embodiments, Piece 5.

Radiating fin 5 is set on heat-radiating substrate 4 again in the present embodiment, further increases heat dissipation effect.

As shown in Fig. 2, in one of the embodiments, including two electrode slices 1, two electrode slices 1 clamp described Positive temperature coefficient chip 3.

As the best embodiment of the utility model, as shown in Figure 1, a kind of insulating heat-conductive structure, comprising: be bonded with positive temperature Two electrode slices 1, ceramic heat-dissipating substrate 4 and the radiating fin 5 of coefficient chip 3, the step package of 1 outer edge of electrode slice Silica gel 2 simultaneously exposes electrode slice terminal 11, and the silica gel 2 is integrally formed with the electrode slice 1, and two heat-radiating substrates 4 divide It is not bonded in the surface of two electrode slices, radiating fin 5 is bonded in 4 surface of heat-radiating substrate.

Installation process is as shown in Figure 2-5:

Firstly, as shown in Fig. 2, two electrode slices 1 clamp the positive temperature coefficient chip 3, and by positive temperature coefficient core Piece 3 is Nian Jie with electrode slice 1；

Then, as shown in figure 3, selecting thermal coefficient good, the excellent silica gel 2 of insulation performance wraps up the outer rim of electrode slice 1, silica gel With electrode slice integrated injection molding, silica gel after molding is wrapped in the outer rim of electrode slice, it is ensured that 1 surrounding exposed parts of electrode slice are exhausted Edge, and may insure to be close to electrode slice outer surface.1 middle part of electrode slice applies silica gel, then heat-radiating substrate as shown in Figure 4 4 are adhered directly on electrode slice 1, and electrode slice terminal 11 exposes.Radiating fin 5 as shown in Figure 5 is finally adhered to heat-radiating substrate 4 On.

Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.

Claims (7)

1. a kind of insulating heat-conductive structure characterized by comprising be provided with positive temperature coefficient chip (3) electrode slice (1), with And radiator, electrode slice (1) outer edge wrap up silica gel (2) and expose electrode slice terminal (11), the radiator is set Set the surface in the electrode slice (1).

2. insulating heat-conductive structure according to claim 1, which is characterized in that the silica gel (2) and the electrode slice (1) are infused Modeling is integrally formed.

3. insulating heat-conductive structure according to claim 1, which is characterized in that plane where electrode slice (1) outer edge Lower than plane where electrode slice (1) middle part, the silica gel (2) wraps up the outer edge and is in same water with the middle part Plane.

4. insulating heat-conductive structure according to claim 1, which is characterized in that the radiator includes: heat-radiating substrate (4), surface of heat-radiating substrate (4) setting in the electrode slice (1).

5. insulating heat-conductive structure according to claim 4, which is characterized in that the heat-radiating substrate (4) is ceramic substrate.

6. insulating heat-conductive structure according to claim 4, which is characterized in that the radiator further includes being arranged described The radiating fin (5) on heat-radiating substrate (4) surface.

7. described in any item insulating heat-conductive structures according to claim 1~6, which is characterized in that including two electrode slices (1), two electrode slices (1) clamp the positive temperature coefficient chip (3).