CN211555630U

CN211555630U - Accommodating device of inductance element

Info

Publication number: CN211555630U
Application number: CN202020448435.3U
Authority: CN
Inventors: 吴勇; 何金金
Original assignee: Shenzhen Shengnengjie Technology Co ltd
Current assignee: Shenzhen Shengnengjie Technology Co ltd
Priority date: 2020-03-31
Filing date: 2020-03-31
Publication date: 2020-09-22
Anticipated expiration: 2030-03-31

Abstract

The utility model discloses a holding device of inductance element is applicable to one to a plurality of inductance element of holding, and this holding device includes: a bottom wall; the side walls surround and are connected with the bottom wall, the bottom wall and the side walls surround an accommodating space, and one side of the side walls, which is far away from the bottom wall, surrounds an opening; at least one of the side walls has a non-flat inner side surface facing the accommodating space. The utility model discloses can be at low cost, install and firmly hold inductance element under the simple condition.

Description

Accommodating device of inductance element

Technical Field

The present invention relates to a receiving device, and more particularly, to a receiving device for an inductance element used in a photovoltaic inverter.

Background

In the field of solar power generation, photovoltaic inverters can convert direct current generated by solar cells into alternating current that can be directly incorporated into a power grid or load through power electronic conversion techniques. Therefore, for solar power supply, the photovoltaic inverter is an indispensable core device.

In a photovoltaic inverter, an inductor device responsible for boosting or filtering belongs to a high-power device and generates high heat, so that the conventional method is to place a plurality of inductor devices in an inductor housing, and then inject a heat-dissipating colloid into the inductor housing to fix the inductor and dissipate the heat generated by the inductor.

In order to prevent the heat dissipation adhesive and the encapsulated inductor component from accidentally falling out of the inductor housing, the heat dissipation adhesive must have sufficient viscosity to adhere to the wall surface of the inductor housing, but the higher the viscosity, the higher the price of the heat dissipation adhesive is, thereby increasing the installation cost.

Another way to strengthen the fixing of the inductance element is to add additional auxiliary components to the inductance housing, which, however, requires additional labor cost and one more installation step, which also increases the possibility of human error.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems of the prior art, the present invention provides a receiving device for an inductance component, which can stably receive the inductance component under the conditions of low cost and simple installation.

In order to achieve the above object, a receiving device for an inductance element is adapted to receive one or more inductance elements, the receiving device comprising: a bottom wall; and

the side walls surround and are connected with the bottom wall, the bottom wall and the side walls surround an accommodating space, and one side of the side walls, which is far away from the bottom wall, surrounds an opening;

at least one of the side walls has a non-flat inner side surface facing the accommodating space.

Preferably, the bottom wall is a rectangular plate body and has two opposite long sides and two opposite short sides, each of the side walls includes two first side walls connected to the two long sides and two second side walls connected to the two short sides, and at least one of the two first side walls has the non-flat inner side surface.

Preferably, the non-flat inner side surface has a plurality of strip-shaped grooves, each strip-shaped groove extending from the opening to the bottom wall.

Preferably, the inductor further comprises a heat dissipation adhesive covering the inductor elements and filled in the accommodating space, the heat dissipation adhesive has a top surface, a distance between the top surface and the bottom wall is represented as D1, a length of each strip-shaped groove is represented as L, a distance between the opening and the bottom wall is represented as D2, and D1 > D2-L.

Preferably, the strip-shaped grooves are distributed in a step shape.

Preferably, the heat sink further comprises a plurality of heat dissipation fins arranged on the outer side of one of the two first side walls.

The utility model discloses an inductance element's holding device produces extra effort and reaction force because of having the uneven medial surface to filling the heat dissipation colloid on the uneven medial surface to make inductance element set up in the accommodation space more firmly. Utilize the utility model discloses an inductance element's holding device comes holding inductance element, can need not necessarily adopt expensive high stickness heat dissipation colloid or use extra manpower to install the assistor additional, just can set up inductance element firmly, consequently the utility model discloses an inductance element's holding device has the efficiency of saving cost and installation simplicity.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1A is a schematic view of an accommodating device of an inductance element and a plurality of inductance elements;

fig. 1B is a schematic cross-sectional view illustrating a heat dissipating colloid filled in a container of an inductor;

in the figure: 100 accommodating devices of the inductance element, 110 bottom walls, 111 long sides, 112 short sides, 120 side walls, 121 non-flat inner side surfaces, 1211 strip-shaped grooves, 122 first sides, 123 second side walls, 130 openings, 140 heat dissipation fins, 141 top surfaces, 150 heat dissipation fins, 200 inductance elements, distances D1 and D2, lengths L and S accommodating spaces.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

The first embodiment is as follows: referring to fig. 1A and fig. 1B, the accommodating apparatus 100 of the inductance element of the present embodiment includes a bottom wall 110 and a plurality of side walls 120. The sidewalls 120 surround and are connected to the bottom wall 110, and the bottom wall 110 and the sidewalls 120 surround an accommodating space S for accommodating one or more inductance elements 200, and one side of the sidewall 120 away from the bottom wall 110 surrounds an opening 130. At least one of the sidewalls 120 has a non-flat inner side 121 facing the receiving space S.

In the present embodiment, the bottom wall 110 is a rectangular plate body and has two opposite long sides 111 and two opposite short sides 112. The plurality of sidewalls 120 includes two first sidewalls 122 connected to the two long sides 111 and two second sidewalls 123 connected to the two short sides 112. One of the two first sidewalls 122 has a non-flat inner side 121, but not limited thereto, and the non-flat inner side 121 may be located on the other first sidewall 122 and/or any one of the two second sidewalls 123.

In the present embodiment, the non-flat inner side surface 121 has a plurality of strip-shaped grooves 1211, and each strip-shaped groove 1211 extends from the opening 130 to the bottom wall 110. The strip-shaped grooves 1211 may have a step-like distribution. However, the present embodiment is not limited thereto, and in other embodiments, not shown, the non-flat inner side surface 121 may also have a plurality of protrusions or other grooves, and may be distributed regularly or irregularly.

As shown in fig. 1B, the accommodating device 100 of the inductive element of the present embodiment further includes a heat dissipating glue 140 covering the inductive element 200 and filled in the accommodating space S. The heat dissipating gel 140 has a top surface 141. The distance between the top surface 141 and the bottom wall 110 is denoted as D1, the length of each strip 1211 is denoted as L, the distance between the opening 130 and the bottom wall 110 is denoted as D2, and D1 > D2-L. That is, the length D1 of each strip 1211 needs to extend below the top surface 141 of the heat dissipating encapsulant 140, so that the heat dissipating encapsulant 140 can be filled in the strip 1211.

The accommodating device 100 for an inductance component of the present embodiment further includes a plurality of heat dissipation fins 150. The heat dissipation fins 150 may be disposed on the outer side of one of the two first sidewalls 122 to increase the heat dissipation area of the device 100 for accommodating the inductance element.

The accommodating device 100 of the inductance element of the present embodiment has the non-flat inner side 121, and generates an additional acting force and a reaction force on the heat dissipating glue 140 filled on the non-flat inner side, so that the inductance element 200 is more stably disposed in the accommodating space S. The inductance element 200 is accommodated in the accommodating device 100 of the inductance element of the present embodiment, and the inductance element 200 can be stably disposed without using expensive high-viscosity heat-dissipating glue or using additional manpower to install an auxiliary device as in the conventional art, so the accommodating device 100 of the inductance element of the present embodiment has the effects of cost saving and simple installation.

The accommodating device of the inductor element of the present embodiment has the uneven inner side surface, and generates additional acting force and reacting force to the heat dissipating glue filled on the uneven inner side surface, so that the inductor element is more stably disposed in the accommodating device of the inductor element. The inductance element can be stably arranged by utilizing the accommodating device of the inductance element of the creation embodiment without adopting expensive high-viscosity heat dissipation glue or using additional manpower to additionally install an auxiliary device as in the prior art, so that the accommodating device of the inductance element of the creation embodiment has the effects of saving cost and being simple to install.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. An inductance component accommodating device is suitable for accommodating one or more inductance components, and is characterized by comprising: a bottom wall; and

2. The inductance element receiving device according to claim 1, wherein the bottom wall is a rectangular plate body having two opposite long sides and two opposite short sides, each of the side walls includes two first side walls connected to the two long sides and two second side walls connected to the two short sides, and at least one of the two first side walls has the non-flat inner side surface.

3. The accommodating device for inductance elements as claimed in claim 2, wherein the non-flat inner side has a plurality of strip-shaped grooves, each strip-shaped groove extending from the opening to the bottom wall.

4. The device as claimed in claim 3, further comprising a heat dissipating adhesive covering the plurality of inductive elements and filling the receiving space, the heat dissipating adhesive having a top surface, a distance between the top surface and the bottom wall is denoted as D1, a length of each of the plurality of grooves is denoted as L, a distance between the opening and the bottom wall is denoted as D2, and D1 > D2-L.

5. The accommodating apparatus for inductance element according to claim 4, wherein the strip-shaped grooves are distributed in a step shape.

6. The device for receiving an inductance component according to claim 5, further comprising a plurality of heat dissipating fins disposed on an outer side of one of the two first side walls.