CN211555502U - Copper particle with porous structure - Google Patents
Copper particle with porous structure Download PDFInfo
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- CN211555502U CN211555502U CN202020563919.2U CN202020563919U CN211555502U CN 211555502 U CN211555502 U CN 211555502U CN 202020563919 U CN202020563919 U CN 202020563919U CN 211555502 U CN211555502 U CN 211555502U
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- copper particle
- particle body
- porous structure
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Abstract
The utility model discloses a porous structure's copper grain, include: the copper particle body, the copper particle body further include wall hole and through hole, the top of copper particle body be provided with the through hole that extends to the bottom from copper particle body top, the shape of through hole be "ten" style of calligraphy, outer lane one side of through hole and copper particle body junction be provided with a plurality of evenly distributed's hole, the outer wall of copper particle body on be provided with and be the wall hole of perpendicular connection with the hole in the through hole outside. The copper grain of this porous structure, in the contact use with electronic components, because the contact surface is great, so electric conductive property is better, compares in the copper grain on the existing market, and the porous structure of this copper grain can carry out diversified connection, and structure application range is wide.
Description
Technical Field
The utility model relates to a copper subassembly field especially relates to a porous structure's copper grain.
Background
The copper particles are a conductive product, are suitable for electrical engineering of high and low voltage electrical appliances, switch contacts, power distribution equipment, bus ducts and the like, and are also widely used for super-large current electrolytic smelting engineering of metal smelting, electrochemical plating, chemical caustic soda and the like. The copper particles used in the electronic element have higher requirements on the conductivity and the connectivity, so the copper particles in the current market have the characteristic of poor conductivity.
At present, a copper particle with a porous structure is urgently needed in the market.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a porous structure's copper grain, can have better electric conductive property.
In order to solve the technical problem, the utility model discloses a technical scheme be: provided is a porous-structured copper particle including: the copper particle body, the copper particle body further include wall hole and through hole, the top of copper particle body be provided with the through hole that extends to the bottom from copper particle body top, the shape of through hole be "ten" style of calligraphy, outer lane one side of through hole and copper particle body junction be provided with a plurality of evenly distributed's hole, the outer wall of copper particle body on be provided with a plurality of wall holes that are perpendicular connection with the hole in the through hole outside.
In a preferred embodiment of the present invention, the copper particle body is a cylindrical body.
In a preferred embodiment of the present invention, the through holes have a uniform diameter on four sides.
In a preferred embodiment of the present invention, the surface of the copper particle body is provided with anti-slip lines.
In a preferred embodiment of the present invention, the number of the wall holes is 4-6.
The utility model has the advantages that: the utility model discloses porous structure's copper grain, this porous structure's copper grain, in the contact use with electronic components, because the contact surface is bigger, so electric conductive property is better, compares in the copper grain on the existing market, and the porous structure of this copper grain can carry out diversified connection, and structure application range is wide.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic perspective view of a preferred embodiment of the copper pellet with porous structure of the present invention.
The parts in the drawings are numbered as follows: 1. copper particle body, 2, through hole, 3, wall hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic perspective view of a preferred embodiment of a copper pellet with a porous structure according to the present invention.
The utility model relates to a porous structure's copper grain, include: a porous structured copper particle comprising: the copper particle comprises a copper particle body 1, wherein the copper particle body 1 further comprises a wall hole 3 and a through hole 2, the top of the copper particle body 1 is provided with the through hole 2 extending from the top to the bottom of the copper particle body 1, and the through hole
2 is cross, and through hole 2 can increase the area of contact of components and parts, outer lane one side of through hole 2 and copper grain body 1 junction be provided with a plurality of evenly distributed's hole, the outer wall of copper grain body 1 on be provided with a plurality of and the hole in the through hole 2 outside be perpendicular wall hole of being connected
And 4-6 wall holes are formed, and copper wires can penetrate through the holes of the copper particle body 1 from the wall holes 3 in the connection process of the component.
Preferably, the copper particle body 1 is cylindrical.
Preferably, the diameter of the four sides of the through hole 2 is consistent.
Preferably, the surface of the copper particle body 1 is provided with anti-skid lines, so that the anti-skid function can be achieved in the using process.
The utility model discloses abnormal shape copper bar has solved the defect in the technical scheme, and this porous structure's copper grain is in the contact use with electronic components, because the contact surface is bigger, so electric conductive property is better, compares the copper grain on the existing market, and the porous structure of this copper grain can carry out diversified connection, and structure application range is wide.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all utilize the equivalent structure or equivalent flow transformation that the content of the specification does, or directly or indirectly use in other related technical fields, all including in the same way the patent protection scope of the present invention.
Claims (5)
1. A porous structured copper particle, comprising: a copper particle body, the copper particle body further comprising a wall hole and a through hole,
the top of copper grain body be provided with the through hole that extends to the bottom from copper grain body top, the shape of through hole be "ten" style of calligraphy, outer lane one side of through hole and copper grain body junction be provided with a plurality of evenly distributed's hole, the outer wall of copper grain body on be provided with a plurality of and the hole in the through hole outside be the wall hole of perpendicular connection.
2. The porous structured copper particle of claim 1, wherein the body of the copper particle is cylindrical.
3. The porous structured copper particle according to claim 1, wherein the diameter of each of four sides of the through-hole is uniform.
4. The copper grain of claim 1, wherein the surface of the copper grain body is provided with anti-slip lines.
5. A porous structured copper particle in accordance with claim 1 wherein said wall pores are 4 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020563919.2U CN211555502U (en) | 2020-04-16 | 2020-04-16 | Copper particle with porous structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020563919.2U CN211555502U (en) | 2020-04-16 | 2020-04-16 | Copper particle with porous structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211555502U true CN211555502U (en) | 2020-09-22 |
Family
ID=72496504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020563919.2U Active CN211555502U (en) | 2020-04-16 | 2020-04-16 | Copper particle with porous structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211555502U (en) |
-
2020
- 2020-04-16 CN CN202020563919.2U patent/CN211555502U/en active Active
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